CPC1986
i4-PAC™ Power Relay
www.clare.com
DS-CPC1986-R04 1
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RoHS
2002/95/EC
Applications
Features
Description
Ordering Information
Parameter Rating Units
Blocking Voltage 1000 VP
Load Current, T
A=25ºC
With 5ºC/W Heat Sink 1.6 Arms
No Heat Sink 0.65
On-resistance 3 Ω
RθJC 0.35 °C/W
Pin Configuration
Part Number Description
CPC1986J i4-PAC 25 per tube
Switching Characteristics of
Normally Open (Form A) Devices
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of high power Solid State Relays.
As part of this family, the CPC1986J single pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 1.6Arms continuous load current with a
5ºC/W heat sink.
The CPC1986J employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of
high performance switching applications.
The unique i4-PAC package pioneered by IXYS
allows Solid State Relays to achieve the highest load
current and power ratings. This package features
a unique IXYS process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low thermal resistance (0.35 °C/W).
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
CONTROL
ILOAD
10%
90%
T
ON
T
OFF
+
+
Approvals
• UL recognized component: File # E69938
• Certified to: UL 508
• Compact i4-PAC Power Package
• Low Thermal Resistance (0.35 °C/W)
• 1.6Arms Load Current with 5ºC/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500Vrms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
www.clare.com
2
CPC1986
R04
Absolute Maximum Ratings
Parameter Ratings Units
Blocking Voltage 1000 VP
Reverse Input Voltage 5 V
Input Control Current 100 mA
Peak (10ms) 1 A
Input Power Dissipation 150 mW
Isolation Voltage Input to Output 2500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
Electrical absolute maximum ratings are at 25°C
Electrical Characteristics
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics TA=25°C
Load Current 1
Peak t ≤ 10ms
IL--
10 AP
Continuous No Heat Sink 0.65
Arms
Continuous TC=25ºC 6.5
Continuous TC=99ºC IL(99) 0.75
On-Resistance 2IL = 1A, IF=10mA RON - 2.4 3 Ω
Off-State Leakage Current VL=1000V ILEAK --1 µA
Switching Speeds
Turn-On IF=20mA, VL=10V TON --20
ms
Turn-Off TOFF --5
Output Capacitance V=25V, f=1MHz COUT - 330 - pF
Input Characteristics TA=25°C
Input Control Current 3IL=120mA IF- - 10 mA
Input Dropout Current - IF0.6 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Common Characteristics TA=25°C
Capacitance Input to Output - CI/O -1-pF
1 Higher load currents possible with proper heat sinking.
2 Measurement taken within 1 second of on time.
3 For applications requiring high temperature operation (greater than 60oC) an LED drive current of 20mA is recommended.
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
CPC1986
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R04
Parameter Conditions Symbol Min Typ Max Units
Thermal Resistance (junction to case) - RθJC - - 0.35 °C/W
Thermal Resistance (junction to ambient) Free air RθJA - 33 - °C/W
Junction Temperature (operation) - TJ-40 - 100 °C
Thermal Characteristics
Thermal Management
Device high current characterization was performed using Kunze heat sink P/N KU-159. The heat sink was secured
using Kunze transistor clip KU-499. Between the device and heat sink, Kunze's phase change thermal conductive
interface material, part number KU-ALF5 was used.
Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
RθCA =
(TJ - TA) IL(99)
2 • RθJC
IL
2
- RθJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (Arms)
IL = Desired Operating Load Current (Arms), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
* Elevated junction temperature reduces semiconductor lifetime.
Heat Sink Rating
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CPC1986
R04
PERFORMANCE DATA*
25
20
15
10
5
0
1.3250 1.3275 1.3300 1.3325 1.3350
LED Forward Voltage (V)
Device Count (N)
CPC1986
Typical LED Forward Voltage Drop
(N=50, TA=25ºC, IF=10mA)
25
20
15
10
5
0
2.76 2.78 2.80 2.842.82 2.86
Device Count (N)
On-Resistance (Ω)
CPC1986
Typical On-Resistance Distribution
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
35
30
25
20
15
10
5
0
1070 1080 1090 1100 1110 1120
Blocking Voltage (VP)
Device Count (N)
CPC1986
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
7.5 12.5 17.55.0 10.0 15.0
Turn-On (ms)
Device Count (N)
30
25
20
15
10
5
0
CPC1986
Typical Turn-On Time
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
0.085 0.095 0.1050.080 0.090 0.100
Turn-Off (ms)
Device Count (N)
20
15
10
5
0
CPC1986
Typical Turn-Off Time
(N=50, TA=25ºC, IL=1ADC, IF=10mA)
-40
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Leakage (µA)
Temperature (ºC)
CPC1986
Typical Leakage vs. Temperature
at Maximum Rated Voltage
(Measured Across Pins 1 & 2)
Blocking Voltage (VP)
-40
1180
1160
1140
1120
1100
1080
1060
1040
1020
1000 -20 0 20 40 60 80 100
CPC1986
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Turn-On (ms)
-40
10
9
8
7
6
5
4
3
2
1
0
-20 0 20 40 60 80 100
IF = 10mA
CPC1986
Typical Turn-On vs. Temperature
(IL=0.4ADC)
Temperature (ºC)
Turn-Off (ms)
-40
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
-20 0 20 40 60 80 100
IF = 10mA
CPC1986
Typical Turn-Off vs. Temperature
(IL=0.4ADC)
Temperature (ºC)
LED Forward Voltage Drop (V)
CPC1986
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
IF = 50mA
IF = 20mA
IF = 10mA
Temperature (ºC)
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
18
16
14
12
10
8
6
4
2
1
0
50
CPC1986
Typical Turn-On vs. LED Forward Current
(IL=0.4ADC)
Temperature (ºC)
0 20 40 60 80 100
Load Current (Arms)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
CPC1986
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
1ºC/W
5ºC/W
10ºC/W
Free Air
Unless otherwise specifi ed, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
CPC1986
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R04
PERFORMANCE DATA*
LED Forward Current (mA)
Turn-Off (ms)
05 1015202530354045
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
50
CPC1986
Typical Turn-Off vs. LED Forward Current
(IL=0.4ADC)
-40
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
-20 0 20 40 60 80 100
Temperature (ºC)
On-Resistance (Ω)
CPC1986
Typical On-Resistance vs. Temperature
(IL=max rated)
LED Current (mA)
-40
9.0
7.0
5.0
3.0
1.0
-20 0 20 40 60 80 100
CPC1986
Typical IF for Switch Operation
vs. Temperature
(IL=0.4ADC)
Temperature (ºC)
Load Voltage (V)
Load Current (A)
-2.0 -1.33 -0.66 0.66 1.33
02.0
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
CPC1986
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
Time
12
10
8
6
4
2
0
1ms10µs 100µs 100ms 10s10ms 1s 100s
Load Current (AP)
CPC1986
Energy Rating Curve
(Free Air, No Heat Sink)
Unless otherwise specifi ed, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1986-R04
©Copyright 2007, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
i4-PAC™ is a trademark of IXYS Corporation
All rights reserved. Printed in USA.
3/22/07
For additional information please visit our website at: www.clare.com
6
CPC1986
Dimensions
inches
(mm)
MECHANICAL DIMENSIONS
0.300 BSC
(7.62 BSC)
0.150 BSC
(3.81 BSC)
0.819 MIN - 0.840 MAX
(20.80 MIN - 21.34 MAX)
0.780 MIN - 0.840 MAX
(19.81 MIN - 21.34 MAX)
0.020 MIN - 0.029 MAX
(0.51 MIN - 0.74 MAX)
0.102 MIN - 0.118 MAX
(2.59 MIN - 3.00 MAX)
NOTE: Bottom heatsink meets 2500Vrms isolation to the other pins.
0.058 MIN - 0.068 MAX
(1.47 MIN - 1.73 MAX)
0.045 MIN - 0.055 MAX
(1.14 MIN - 1.40 MAX)
0.770 MIN - 0.799 MAX
(19.56 MIN - 20.29 MAX)
0.210 MIN - 0.244 MAX
(5.33 MIN - 6.20 MAX)
0.190 MIN - 0.205 MAX
(4.83 MIN - 5.21 MAX)
0.046 MIN - 0.085 MAX
(1.17 MIN - 2.16 MAX)
0.065 MIN - 0.080 MAX
(1.65 MIN - 2.03 MAX)
0.660 MIN - 0.690 MAX
(16.76 MIN - 17.53 MAX)
ISOLATED HEAT SINK
0.590 MIN - 0.620 MAX
(14.99 MIN - 15.75 MAX)
0.100 MIN - 0.180 MAX
(2.54 MIN - 4.57 MAX)
0.083 MIN - 0.102 MAX
(2.11 MIN - 2.59 MAX)
MANUFACTURING INFORMATION
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
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2002/95/EC
