Ericsson Internal
PRODUCT SPECIFICATION 1 (4)
Prepared (also subject responsible if other) No.
EFEIDEN 1/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) 2008-8-28 D
Key Features
• Low profile SMD
50.2 x 46.0 x 8.1 mm (1.98 x 1.81 x 0.32 in.)
• Low profile, max 8.7mm (0.343 in.)
• High efficiency, typ. 87 % at full load
• Functional input to output isolation on 78V output
• Operates in direct parallel configuration for higher
power
• More than 2.7 million hours MTBF
• Designed for POTS applications
General Characteristics
• Suited for narrow board pitch applications
(15 mm/0.6 in)
• Input under voltage shut-down
• Over temperature protection
• Over current protection
• Soft start
• Remote Control
• ISO 9001/14001 certified supplier
Design for Environment
Meets requirements in high-
temperature lead-free soldering
processes.
Ericsson Internal
TABLE OF CONTENTS 1 (1)
Prepared (also subject responsible if other) No.
SEC/S Thomas Deng 00152- EN/LZT146393
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Natalie) MICJOHN 2008-3-13 A
Contents
General Information ............................................................. 2
Safety Specification ............................................................. 3
Absolute Maximum Ratings ............................................................. 4
BMR 603 1203/1
78/-52/-33V Electrical Specification ............................................................. 5
EMC Specification ............................................................. 9
Operating Information ........................................................... 10
Thermal Consideration ........................................................... 11
Connections ........................................................... 12
Mechanical Information ........................................................... 13
Soldering Information ........................................................... 15
Delivery Information ........................................................... 16
Product Qualification Specification ........................................................... 17
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
Ericsson Internal
PRODUCT SPECIFICATION 2 (4)
Prepared (also subject responsible if other) No.
EFEIDEN 1/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) 2008-8-28 D
General Information
Ordering Information
See Contents for individual product ordering numbers.
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (TA) of
+40°C, which is a typical condition in Information and
Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses one method Telcordia
SR332.
Predicted MTBF for the series is:
- 2.7 million hours according to Telcordia SR332, issue
1, Black box technique.
The Ericsson failure rate data system is based on field
tracking data. The data corresponds to actual failure rates
of components used in Information Technology and
Telecom (IT&T) equipment in temperature controlled
environments (TA = -5...+65°C).
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in IT&T equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Compatibility with RoHS requirements
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
- Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
- Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
- Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
2
Ericsson Internal
PRODUCT SPECIFICATION 3 (4)
Prepared (also subject responsible if other) No.
EFEIDEN 1/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
SEC/D (Julia You) 2008-8-28 D
Safety Specification
General information
Ericsson Power Modules DC/DC converters and DC/DC
regulators are designed in accordance with safety
standards IEC/EN/UL60950, Safety of Information
Technology Equipment.
IEC/EN/UL60950 contains requirements to prevent injury
or damage due to the following hazards:
• Electrical shock
• Energy hazards
• Fire
• Mechanical and heat hazards
• Radiation hazards
• Chemical hazards
On-board DC-DC converters are defined as component
power supplies. As components they cannot fully comply
with the provisions of any Safety requirements without
“Conditions of Acceptability”. It is the responsibility of the
installer to ensure that the final product housing these
components complies with the requirements of all
applicable Safety standards and Directives for the final
product.
Component power supplies for general use should comply
with the requirements in IEC60950, EN60950 and
UL60950 “Safety of information technology equipment”.
There are other more product related standards, e.g.
IEEE802.3af “Ethernet LAN/MAN Data terminal equipment
power”, and ETS300132-2 “Power supply interface at the
input to telecommunications equipment; part 2: DC”, but
all of these standards are based on IEC/EN/UL60950 with
regards to safety.
Ericsson Power Modules DC/DC converters and DC/DC
regulators are UL60950 recognized and certified in
accordance with EN60950.
The flammability rating for all construction parts of the
products meets requirements for V-0 class material
according to IEC 60695-11-10.
The products should be installed in the end-use
equipment, in accordance with the requirements of the
ultimate application. Normally the output of the DC/DC
converter is considered as SELV (Safety Extra Low
Voltage) and the input source must be isolated by
minimum Double or Reinforced Insulation from the primary
circuit (AC mains) in accordance with IEC/EN/UL60950.
24 V DC systems
The input voltage to the DC/DC converter is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
48 and 60 V DC systems
If the input voltage to the DC/DC converter is 75 Vdc or
less, then the output remains SELV (Safety Extra Low
Voltage) under normal and abnormal operating conditions.
Single fault testing in the input power supply circuit should
be performed with the DC/DC converter connected to
demonstrate that the input voltage does not exceed
75 Vdc.
If the input power source circuit is a DC power system, the
source may be treated as a TNV2 circuit and testing has
demonstrated compliance with SELV limits and isolation
requirements equivalent to Basic Insulation in accordance
with IEC/EN/UL60950.
Non-isolated DC/DC regulators
The input voltage to the DC/DC regulator is SELV (Safety
Extra Low Voltage) and the output remains SELV under
normal and abnormal operating conditions.
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
3
Ericsson Internal
PRODUCT SPECIFICATION 1 (5)
Prepared (also subject responsible if other) No.
MICMALE 2/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 D
Absolute Maximum Ratings
Characteristics min typ max Unit
Tref Operating Temperature (see Thermal Consideration section) -40 +105 °C
TS Storage temperature -55 +125 °C
VI Input voltage -0.5 +75 V
Positive logic option -0.5 +75 V
VRC Remote Control pin voltage
(see Operating Information section)
Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are
normally tested with one parameter at a time exceeding the limits of Output data or Electrical Characteristics. If exposed to stress above these limits, function and
performance may degrade in an unspecified manner.
Fundamental Circuit Diagram
GND
GND
RC
Bias Regulator,
Control and
Supervision
OUT3
OUT2
OUT1
RETURN1
-IN
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
4
Ericsson Internal
PRODUCT SPECIFICATION 2 (5)
Prepared (also subject responsible if other) No.
MICMALE 2/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 D
78V, -52V, -33V / 32W Electrical Specification
Tref = -30 to +95ºC, VI = 40 to 72 V, unless otherwise specified under Conditions.
Typical values given at: Tref = +25°C, VI= 53 V, max IO unless otherwise specified under Conditions.
Characteristics Conditions min typ max Unit
VI Input voltage range 40 53 72 V
VIoff Turn-off input voltage Decreasing input voltage 33 V
VIon Turn-on input voltage Increasing input voltage 34.5 V
CI Internal input capacitance 2 μF
PO max Output power 32 W
Efficiency at 50% of max power IO1 = 0,015 A, IO2 = 0,25 A,
IO3 = 0,090A 80
η
Efficiency at max power IO1 = 0,015 A, IO2 = 0,50 A,
IO3 = 0,090A 84
%
Pd Power Dissipation at max power IO1 = 0,015 A, IO2 = 0,50 A,
IO3 = 0,090A 6.1 W
Pli Input idling power IO = 0 A, VI = 53 V 2.5 W
PRC Input standby power VI = 53 V (turned off with RC) 0.12 W
fs Switching frequency 510 kHz
Characteristics Conditions min / typ / max Output 1 Output 2 Output 3 Unit
VOi Output voltage initial setting and
accuracy
Tref =+25°C, VI = 53 V,
IO1, IO2, IO3 = 0.1 x Inom typ 78.0
+/- 2%
-52.7
+/- 1%
-33.2
+/- 1% V
min 71.6 -49,0 -30.9 V
Output Voltage IO1, IO2, IO3 ≥ 0.1 x Inom max 81.6 -54.2 -33.83 V
Idling voltage IO = 0 A typ 77 -52.5 -33.3 V
Line regulation IO = IO max, VI = 42....72 V typ 1 0.6 0.5 %
VO
Load regulation output TA = +25°C , VI = 53 V, IO=20mA
to 200 mA max - 110 50 mV
Vtr Load transient
voltage deviation typ - 250 200 mV
ttr Load transient recovery time
IO = 30…60 mA, 10Hz on output
2&3
VI = 53 V
Slew rate = 0.01A/ μs typ - 150 150 μs
tr Ramp-up time (from 10-90% of VOi) IO = IO max, V O = 0.1…0.9 x V O typ 2.5 2.5 2.5 ms
ts Start-up time
(from VI connection to 90% of VOi)
IO =0.1…1.0 x IO max, VI = 53 V
from VI connection to Vo = 0.9 x
V O
typ 7 7 7 ms
tRC RC start-up time IO1 = IO2 = 50 % of max IO typ 7 7 7 ms
IO Output current (continuous) max 80 500 800 mA
Ilim Current limit threshold TC < TC max min 200mA Total power limitation
35 W
Isc Short circuit current Tref = 25ºC typ - 1.2 2 A
VOac Output ripple & noise See ripple & noise section,
max IO, VOi, 20Hz ….5MHz max 100 100 100 mVp-p
OVP Over voltage protection Tref = +25 °C, VI = 53 V,
0-100 % of max PO typ 90 -60 -38 V
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
5
Ericsson Internal
PRODUCT SPECIFICATION 3 (5)
Prepared (also subject responsible if other) No.
MICMALE 2/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 D
78V, -52V, -33V / 32W Electrical Specification
Efficiency Power Dissipation
70
75
80
85
90
95
0,0 0,1 0,2 0,3 0,4 0,5 0,6 [A]
[%]
40 V
53 V
72 V
0
2
4
6
8
10
0,0 0,1 0,2 0,3 0,4 0,5 0,6 [A]
[W]
40 V
53 V
72 V
Efficiency vs. load current (Io2) and input voltage.
Tref = +25°C, Io1=15mA, Io3=90mA
Dissipated power vs. load current (Io2) and input voltage.
Tref = +25°C, Io1=15mA, Io3=90mA
Current Limit Characteristic, Vo2 Current Limit Characteristic, Vo3
0,0
10,0
20,0
30,0
40,0
50,0
0,5 0,6 0,7 0,8 0,9 1,0 1,1 1,2 1,3 1,4 1,5 [A]
[V]
40 V
53 V
72 V
0,0
10,0
20,0
30,0
0,5 0,6 0,7 0,8 0,9 1,0 1,1 1,2 1,3 1,4 1,5 [A]
[V]
40 V
53 V
72 V
Vo2 vs. load current (Io2)and input voltage.
Tref = +25°C, Io1=Io3=0
Vo3 vs. load current (Io3)and input voltage.
Tref = +25°C, Io1=Io2=0
Output Voltage Temperature Characteristics, Vo3 Thermal current derating
31,0
32,0
33,0
34,0
-40 -20 0 20 40 60 80 100
Vi min
Vi nom
Vi max
T her mal output curr ent derat ing
0
0,1
0,2
0,3
0,4
0,5
0,6
40 50 60 70 80 90 100
Ambient Temperat ure [deg C]
Max available output current
(Io 3 ) i n [A]
Natural
convection
1 m/s
Vo3 vs. ref. temperature, Io1= 50mA, Io2=250mA, Io3=400mA
Maximum output current (Io3) vs. ambient temperature. VI = 53 V,
Io1=0.08A, Io2=0.2A. See also Thermal Consideration section.
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
6
Ericsson Internal
PRODUCT SPECIFICATION 4 (5)
Prepared (also subject responsible if other) No.
MICMALE 2/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 D
Place your
graph here
78V, -52V, -33V / 32W Electrical Specification
Start-up Shut-down
Start-up enabled by connecting VI at:
Tref = +25°C, VI = 53 V,
IO1 = 80 mA, IO2 = 250 mA , Io3=400 mA,
resistive load.
Top trace: output voltage 1 (50 V/div.).
Second trace: output voltage 2 (50 V/div.).
Third trace: output voltage 3 (50 V/div.).
Bottom trace: input voltage (100 V/div.).
Time scale: (5 ms/div.).
Shut-down enabled by disconnecting VI at:
Tref = +25°C, VI = 53 V,
IO1 = 80 mA, IO2 = 250 mA , Io3=400 mA,
resistive load.
Top trace: output voltage 1 (50 V/div.).
Second trace: output voltage 2 (50 V/div.).
Third trace: output voltage 3 (50 V/div.).
Bottom trace: input voltage (100 V/div.).
Time scale: (5 ms/div.).
Output Ripple & Noise, Vo1 Output Ripple & Noise, Vo2
Output voltage ripple at:
Tref = +25°C, VI = 53 V,
IO1 = 80 mA, IO2 = 250 mA , Io3=400 mA,
resistive load.
Top trace: output voltage 1 (50mV/div.).
Time scale: (1 μs/div.).
Output voltage ripple at:
Tref = +25°C, VI = 53 V,
IO1 = 80 mA, IO2 = 250 mA , Io3=400 mA,
resistive load.
Top trace: output voltage 2 (50mV/div.).
Time scale: (1 μs/div.).
Output Ripple & Noise, Vo3
Output voltage ripple at:
Tref = +25°C, VI = 53 V,
IO1 = 80 mA, IO2 = 250 mA , Io3=400 mA,
resistive load.
Top trace: output voltage 3 (50mV/div.).
Time scale: (1 μs/div.).
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
7
Ericsson Internal
PRODUCT SPECIFICATION 5 (5)
Prepared (also subject responsible if other) No.
MICMALE 2/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 D
Output Load Transient Response, Vo2 Output Load Transient Response, Vo3
Output voltage response to load current step-
change, output 2 (30mA-60mA-30mA)
dI/dt=0,01A/us
Tref =+25°C, VI = 53 V IO1 =8mA, Io3=80mA.
Top trace: output voltage 2 (500 mV/div.).
Mid trace: output voltage 3 (500 mV/div.).
Bottom trace: load current (20 mA/div.).
Time scale: (0.1 ms/div.).
Output voltage response to load current
step-change, output 3 (30mA-60mA-30mA)
dI/dt=0,01A/us
Tref =+25°C, VI = 53 V IO1 =8mA, Io2=50mA.
Top trace: output voltage 2 (200 mV/div.).
Mid trace: output voltage 3 (200 mV/div.).
Bottom trace: load current (20 mA/div.).
Time scale: (0.1 ms/div.).
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
8
Ericsson Internal
PRODUCT SPECIFICATION 1 (5)
Prepared (also subject responsible if other) No.
MICMALE 3/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 C
EMC Specification
Conducted EMI measured according to EN55022, CISPR 22
and FCC part 15J (see test set-up). See Design Note 009 for
further information. The fundamental switching frequency is
510 kHz for BMR 603 1203/1 @ VI = 53 V, max IO.
Conducted EMI Input terminal value (typ)
EMI without filter
External filter (class B)
Required external input filter in order to meet class B in
EN 55022, CISPR 22 and FCC part 15J.
Filter components:
C1,2,3 = 1 μF
C4 = 100 μF
L1,2 = 10 μH
EMI with filter
Test set-up
Layout recommendation
The radiated EMI performance of the DC/DC converter will
depend on the PCB layout and ground layer design.
It is also important to consider the stand-off of the DC/DC
converter.
If a ground layer is used, it should be connected to the output
of the DC/DC converter and the equipment ground or
chassis.
A ground layer will increase the stray capacitance in the PCB
and improve the high frequency EMC performance.
Output ripple and noise
Output ripple and noise measured according to figure below.
See Design Note 022 for detailed information.
Output ripple and noise test setup
-Vin
DC-DC
C1 C2 C3 C4
L1 L2
-Vin
DC-DC
C1 C2 C3 C4
L1 L2
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
9
Ericsson Internal
PRODUCT SPECIFICATION 2 (5)
Prepared (also subject responsible if other) No.
MICMALE 3/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 C
Operating information
Input Voltage
The input voltage range 36 to 75Vdc meets the requirements
of the European Telecom Standard ETS 300 132-2 for normal
input voltage range in —48 and —60 Vdc systems, -40.5 to -
57.0 V and —50.0 to -72 V respectively.
At input voltages exceeding 75 V, the power loss will be
higher than at normal input voltage and Tref must be limited to
absolute max +105°C. The absolute maximum continuous
input voltage is 75 Vdc.
Turn-off Input Voltage
The DC/DC converters monitor the input voltage and will turn
on and turn off at predetermined levels.
The minimum hysteresis between turn on and turn off input
voltage is 1V.
Remote Control (RC)
The products are fitted with a
remote control function referenced
to the primary negative input
connection (- In). The RC function
allows the converter to be turned
on/off by an external device like a
semiconductor or mechanical
switch. The RC pin has an internal
pull up resistor to + In.
The maximum required sink current is 1 mA. When the RC pin
is left open, the voltage generated on the RC pin varies
between 9V and 17V depending on input voltage. The module
has a “positive logic” remote control, i.e. the converter will
turn on when the input voltage is applied with the RC pin
open. Turn off is achieved by connecting the RC pin to the -
In. To ensure safe turn off the voltage difference between RC
pin and the - In pin shall be less than 1V. The converter will
restart automatically when this connection is opened.
See Design Note 021 for detailed information.
Input and Output Impedance
The impedance of both the input source and the load will
interact with the impedance of the DC/DC converter. It is
important that the input source has low characteristic
impedance. The converters are designed for stable operation
without external capacitors connected to the input or output.
The performance in some applications can be enhanced by
addition of external capacitance as described under External
Decoupling Capacitors. If the input voltage source contains
significant inductance, the addition of a 100 μF capacitor
across the input of the converter will ensure stable operation.
The capacitor is not required when powering the DC/DC
converter from an input source with an inductance below
10 μH.
External Decoupling Capacitors
When powering loads with significant dynamic current
requirements, the voltage regulation at the point of load can
be improved b
y
addition of decouplin
g
capacitors at the load.
The most effective technique is to locate low ESR ceramic
and electrolytic capacitors as close to the load as possible,
using several parallel capacitors to lower the effective ESR.
The ceramic capacitors will handle high-frequency dynamic
load changes while the electrolytic capacitors are used to
handle low frequency dynamic load changes. Ceramic
capacitors will also reduce any high frequency noise at the
load.
It is equally important to use low resistance and low
inductance PCB layouts and cabling.
External decoupling capacitors will become part of the
control loop of the DC/DC converter and may affect the
stability margins. As a “rule of thumb”, 100 μF/A of output
current can be added without any additional analysis. The
ESR of the capacitors is a very important parameter. Power
Modules guarantee stable operation with a verified ESR value
of >10 mΩ across the output connections.
For further information please contact your local Ericsson
Power Modules representative.
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
10
Ericsson Internal
PRODUCT SPECIFICATION 3 (5)
Prepared (also subject responsible if other) No.
MICMALE 3/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 C
Operating information continued
Parallel Operation
Two or more converters may be paralleled for increased
power capability. No external current sharing circuits are
required. The direct paralleling is possible thanks to high
initial output voltage accuracy and decreasing temperature
characteristics of the output voltages.
Over Temperature Protection (OTP)
The converters are protected from thermal overload by an
internal over temperature shutdown circuit.
When Tref as defined in thermal consideration section
exceeds 115°C the converter will shut down. The DC/DC
converter will make continuous attempts to start up (non-
latching mode) and resume normal operation automatically
when the temperature has dropped >10°C below the
temperature threshold.
Over Voltage Protection (OVP)
The converters have output over voltage protection that will
shut down the converter in over voltage conditions. The
converter will make continuous attempts to start up (non-
latching mode) and resume normal operation automatically
after removal of the over voltage condition.
Over Load Protection (OLP)
The converters include load limiting circuitry for protection at
continuous overload. This function is implemented on the
primary side of the module.
The output voltages will decrease towards zero if the total
output power (sum of loads on all three outputs) exceeds the
maximum allowed output power.
Note that output 1 (78V) is not short circuit protected in case
of low loads on outputs 2 and 3.
The load distribution should be designed for the maximum
output short circuit current specified.
Thermal Consideration
General
The converters are designed to operate in different thermal
environments and sufficient cooling must be provided to
ensure reliable operation.
Cooling is achieved mainly by conduction, from the pins to
the host board, and convection, which is dependant on the
airflow across the converter. Increased airflow enhances the
cooling of the converter.
The Output Current Derating graph found in the Output
section for each model provides the available output current
vs. ambient air temperature and air velocity at Vin = 53 V.
The DC/DC converter is tested on a 254 x 254 mm,
35 μm (1 oz), 8-layer test board mounted vertically in a wind
tunnel with a cross-section of 305 x 305 mm.
Proper cooling of the DC/DC converter can be verified by
measuring case temperature close to the reference point.at
positions P1, P2 and P3. The temperature at these positions
should not exceed the max values provided in the table
below.
Note that the max value is the absolute maximum rating
(non destruction) and that the electrical Output data is
guaranteed up to Tref +95°C.
See Design Note 019 for further information.
Position Device Designation max value
P1 MOSFET T1 120º C
P2 Diode D4 110º C
P3 Diode D5 110º C
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
11
Ericsson Internal
PRODUCT SPECIFICATION 4 (5)
Prepared (also subject responsible if other) No.
MICMALE 3/1301-BMR 603 1203/1 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie Johansson) (MICANWO) 2008-09-05 C
Thermal Consideration continued
Definition of reference temperature (Tref)
The reference temperature is used to monitor the temperature
limits of the product. Temperatures above maximum Tref are
not allowed and may cause degradation or permanent
damage to the product. Tref is also used to define the
temperature range for normal operating conditions.
Tref is defined by the design and used to guarantee safety
margins, proper operation and high reliability of the module.
Connections
24
12
1
13
Pin Designation Function
1 GND Ground
2 GND Ground
3 -IN Input voltage -48V
4 -IN Input voltage -48V
5 RC Remote control
6 GND Ground
7 GND Ground
8 N/C Not connected
9 Return1 Output 78V return
10 Out1 Output +78V
11 GND Ground
12 GND Ground
13 GND Ground
14 GND Ground
15 Out2 Output —52V
16 Out2 Output —52V
17 N/C Not connected
18 Out3 Output —33V
19 Out3 Output —33V
20 N/C Not connected
21 N/C Not connected
22 GND Ground
23 GND Ground
24 GND Ground
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
12
Ericsson Internal
PRODUCT SPEC. MECHANICAL 1 (3)
Prepared (also subject responsible if other) No.
MICKAOV 4/1301-BMR 603 1203 Uen
Approved Checked Date Rev Reference
SEC/D/T (Julia You) See §1 2008-07-10 C
Mechanical Information (assembly information, see next page)
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
13
Ericsson Internal
PRODUCT SPEC. MECHANICAL 2 (3)
Prepared (also subject responsible if other) No.
MICKAOV 4/1301-BMR 603 1203 Uen
Approved Checked Date Rev Reference
SEC/D/T (Julia You) See §1 2008-07-10 C
Assembly Information
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
14
Ericsson Internal
PROD. SPECIFICATION MECHANICAL 1 (4)
Prepared (also subject responsible if other) No.
MICKAOV 5/1301-BMR 603 1203 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie J) See §1 2008-06-05 B
Soldering Information
The product is intended for convection reflow or vapor phase
reflow in Pb-free reflow processes.
The reflow profile should be optimised to avoid excessive
heating of the product. It is recommended to have a
sufficiently extended preheat time to ensure an even
temperature across the host PCB and to minimize the time in
reflow.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board, since cleaning residues may
affect long time reliability and isolation voltage.
Reflow process specifications1 SnPb eutectic Pb-free
Average ramp-up rate N/A 3°C/s max
Typical solder melting (liquidus)
temperature
TL N/A +221°C
Minimum reflow time above TL N/A 30 s
Minimum pin temperature TPIN N/A +235°C
Peak product temperature TPRODUCT N/A +260°C
Average ramp-down rate N/A 6°C/s max
Maximum time 25°C to peak N/A 8 minutes
1 Note: for mixed SnPb / Pb-free soldering, special recommendations apply
TPRODU CT maximum
TPIN minimu
m
Time
Pin
profi le
Pr od uct
prof ile
TL
Time in
reflow
Time in preheat
/ s o a k z o n e
Ti me 25°C to p eak
Temperatur e
General reflow profile (min pin and max product temperature)
Mixed Solder Process Recommendations
When using products with Pb-free solder bumps with SnPb
paste on the host board, and thereby mixing SnPb with Pb-
free solder, and reflowing at SnPb process temperatures
(backwards compatibility), special recommendations apply:
An extended preheat time between +170°C and +180°C for
60 to 90s and a pin reflow temperature (TPIN) between +220°C
and +225°C for 30 to 60 s is recommended. Ramp-up, ramp-
down and time limitations should be according to Pb-free
reflow process specifications.
The extended preheat time and soak at reflow temperature
will minimize temperature
g
radients and maximize the wettin
g
and solder mixing in the final solder joints. The use of nitro
g
en
reflow atmosphere will further improve the solder joint quality.
30-60 s
221°C to 225°C
60-90 s
170°C to 180°C
Solder bump
Profile
Temperature
Time
Reflow profile for mixed soldering (pin temperature = solder joint temperature)
Thermocoupler Attachment
Pin Temperature Recommendations
Pin number 6/7 and 18/19 are chosen as reference locations
for the minimum pin temperature recommendations since
these will likely be the coolest solder joints during reflow
Pb-free Solder Processes
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, +217 to +221 °C
for SnAgCu solder alloys) for more than 30 seconds, and a
peak temperature of +235°C on all solder joints is
recommended to ensure a reliable solder joint.
Maximum Product Temperature Requirements
Top of the product PCB near pin 1 is chosen as reference
location for the maximum (peak) allowed product temperature
(TPRODUCT), since this will likely be the warmest part of the
product during the reflow process.
Pb-free Solder Processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, TPRODUCT must not exceed +260 °C at any time.
1
12 13
Top of PCB at pin 1
for measurement of
maximum product
temperature, TPRODUCT
Pin 6/7 or pin 18/19 for
measurement of
minimum pin (solder
j
oint) temperature,
T
PIN
(attach sensors as
close as possible to
actual solder joint)
Component outline
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
15
Ericsson Internal
PROD. SPECIFICATION MECHANICAL 2 (4)
Prepared (also subject responsible if other) No.
MICKAOV 5/1301-BMR 603 1203 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie J) See §1 2008-06-05 B
Surface Mount Assembly and Repair
The solder bumps of the product require particular care
during assembly since the solder bumps are hidden between
the host board and the product’s PCB. Special procedures
are required for successful rework of these products.
Assembly
Automatic pick and place equipment should be used to
mount the product on the host board. The use of a vision
system, utilizing the fiducials on the bottom side of the
product, will ensure adequate accuracy. Manual mounting of
solder bump products is not recommended.
Note that the actual position of the pick up surface may vary
between variants within the product program and is not
necessarily in the center of the product outline.
If necessary, it is recommended to fine tune the solder print
aperture size to optimize the amount of deposited solder with
consideration to screen thickness and solder print capability.
Repair
For a successful repair (removal and replacement) of a solder
bump product, a dedicated rework system should be used.
The rework system should preferably utilize a bottom side
heater and a dedicated hot air nozzle to heat the solder
bumps to reflow temperature.
The product is an open frame design with a pick up surface
on a lar
g
e central component. This pick up surface can not be
used for removal with a vacuum nozzle since the component
solder joints may have melted during the removal reflow.
In order not to damage the product and nearby components
during removal and replacement with a new product, it is
recommended to use a double wall design of the hot air
nozzle to direct the air flow only to the edges of the product,
see ‘Assembly Information’ in the mechanical drawing.
Dry Pack Information
Products intended for Pb-free reflow processes are delivered
in standard moisture barrier bags according to IPC/JEDEC
standard J-STD-033 (Handling, packing, shipping and use of
moisture/reflow sensitivity surface mount devices). The SnPb
option of this product is also delivered in dry packing.
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
modules must be baked according to J-STD-033.
Delivery Package Information
The surface mount version of the product is delivered in
antistatic injection molded trays (Jedec design guide 4.10D
standard).
Tray Specifications
Material Antistatic PPE
Surface resistance 105 < Ohm/square < 1012
Baking The trays can be baked at maximum 125°C
for maximum 48 hours
Tray capacity 10 products / tray
Tray thickness 12.19 mm [0.480 inch]
Tray weight 115 g empty, max 365 g full
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
16
Ericsson Internal
PROD. SPECIFICATION MECHANICAL 3 (4)
Prepared (also subject responsible if other) No.
MICKAOV 5/1301-BMR 603 1203 Uen
Approved Checked Date Rev Reference
EAB/FJB/GKF (Natalie J) See §1 2008-06-05 B
Product Qualification Specification
Characteristics
External visual inspection IPC-A-610
Change of temperature
(Temperature cycling)
IEC 60068-2-14 Na Temperature range
Number of cycles
Dwell/transfer time
-40 to +100°C
1000
15 min/0-1 min
Cold (in operation) IEC 60068-2-1 Ad Temperature TA
Duration
-45°C
72 h
Damp heat IEC 60068-2-67 Cy Temperature
Humidity
Duration
+85°C
85 % RH
1000 hours
Dry heat IEC 60068-2-2 Bd Temperature
Duration
+125°C
1000 h
Electrostatic discharge
susceptibility
IEC 61340-3-1, JESD 22-A114
IEC 61340-3-2, JESD 22-A115
Human body model (HBM)
Machine Model (MM)
Class 2, 2000 V
Class 3, 200 V
Immersion in cleaning solvents IEC 60068-2-45 XA
Method 2
Water
Glycol ether
Isopropanol
+55°C
+35°C
+35°C
Mechanical shock IEC 60068-2-27 Ea Peak acceleration
Duration
100 g
6 ms
Moisture reflow sensitivity 1 J-STD-020C level 1 (SnPb-eutectic)
level 3 (Pb Free)
225°C
260°C
Operational life test MIL-STD-202G method 108A Duration 1000 h
Resistance to soldering heat 2 IEC 60068-2-20 Tb
Method 1A
Solder temperature
Duration
270°C
10-13 s
Robustness of terminations
IEC 60068-2-21 Test Ua1
IEC 60068-2-21 Test Ue1
Through hole mount products
Surface mount products
All leads
All leads
Solderability
IEC 60068-2-58 test Td 1
IEC 60068-2-20 test Ta 2
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
Preconditioning
Temperature, SnPb Eutectic
Temperature, Pb-free
150°C dry bake 16 h
215°C
235°C
Steam ageing
235°C
245°C
Vibration, broad band random IEC 60068-2-64 Fh, method 1 Frequency
Spectral density
Duration
10 to 500 Hz
0.07 g2/Hz
10 min in each perpendicular
direction
Note 1: Only for products intended for reflow soldering (surface mount products)
Note 2: Only for products intended for wave soldering (hole mounted products)
E
BMR 603 1203/1
DC/DC converters, Input 40-72 V, Output 78/-52/-33 V/32W
EN/LZT 146 393 R1E September 2008
© Ericsson Power Modules AB
Technical Specification
17
