TCD1209D TOSHIBA CCD LINEAR IMAGE SENSOR CCD (Charge Coupled Device) TCD1209D The TCD1209D is a high speed and low dark current 2048 elements CCD image sensor. The sensor is designed for facsimile, imagescanner and OCR. The device contains a row of 2048 elements photodiodes which provide a 8 lines / mm (200 DPI) across a B4 size paper. The device is operated by 5 V (pulse), and 12 V power supply. FEATURES Number of Image Sensing Elements : 2048 elements Image Sensing Element Size : 14 m by 14 m on 14 m centers Photo Sensing Region : High sensitive and low voltage dark signal pn photodiode Clock : 2 phase (5 V) Package : 22pin Cerdip PIN CONNECTION MAXIMUM RATINGS (Note 1) CHARACTERISTIC SYMBOL RATING UNIT Clock Pulse Voltage V Shift Pulse Voltage VSH Reset Pulse Voltage VRS Clamp Pulse Voltage VCP Power Supply Voltage VOD -0.3~15 Operating Temperature Topr -25~60 C Storage Temperature Tstg -40~100 C -0.3~8 V Note 1: All voltage are with respect to SS terminals (Ground). (TOP VIEW) 1 2001-10-15 TCD1209D CIRCUIT DIAGRAM PIN NAMES 1 Clock (Phase 1) 2 Clock (Phase 2) 2B Final Stage Clock (Phase 2) SH Shift Gate RS Reset Gate CP Clamp Gate OS Signal Output OD Power SS Ground NC Non Connection 2 2001-10-15 TCD1209D OPTICAL / ELECTRICAL CHARACTERISTICS (Ta = 25C, VOD = 12V, V = VSH = VRS = VCP = 5V (PULSE), f = 1MHz, tINT (INTEGRATION TIME) = 10ms, LIGHT SOURCE = DAYLIGHT FLUORESCENT LAMP, LOAD RESISTANCE = 100 k) CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT R 25 31 37 V/ (lx*s) PRNU 3 10 % (Note 2) PRNU (3) 4 10 mV (Note 8) VSAT 1.5 2.0 V (Note 3) Saturation Exposure SE 0.04 0.06 lx*s (Note 4) Dark Signal Voltage VDRK 1.0 2.5 mV (Note 5) Dark Signal Non Uniformity DSNU 1.0 2.5 mV (Note 5) Sensitivity Photo Response Non Uniformity Saturation Output Voltage NOTE DC Power Dissipation PD 160 400 mW Total Transfer Efficiency TTE 92 98 % Output Impedance Zo 0.2 1 k Dynami Range DR 2000 (Note 6) DC Signal Output Voltage VOS 4.0 5.5 7.0 V (Note 7) Random Noise ND 0.6 mV (Note 9) Note 2: Measured at 50% of SE (Typ.) Definition of PRNU : PRNU = x 100(%) Where is average of total signal outputs and is maximum deviation from under uniform illumination. Note 3: VSAT is defined as minimum saturation output voltage of all effective pixels. Note 4: Definition of SE : SE = VSAT (lx*s) R 3 2001-10-15 TCD1209D Note 5: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage. Note 6: Definition of DR : DR = V SAT V DRK VDRK is proportional to tINT (Integration Time). So the shorter tINT condition makes wider DR values. Note 7: DC signal output voltage and DC compensation output voltage are defined as follows: Note 8: PRNU (3) is defined as maximum voltage with next pixel, where measured 5% of SE (Typ.) 4 2001-10-15 TCD1209D Note 9: Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. dark condition) calculated by the following procedure. 1) Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points. 2) Each of the output levels at video output periods averaged over 200 nanosecond period to get Vn and Vn + 1. 3) Vn + 1 is subtracted from Vn to get. V. V = Vn-Vn+1 4) The standard deviation of V is calculated after procedure 2) and 3) are repeated 30 times (30 readings). V = 1 30 i V 30 i=1 = ( ) 1 30 2 Vi - V 30 i=1 5) Procedure 2), 3) and 4) are repeated 10 times to get 10 sigma values. = 1 10 10 j j= 1 6) value calculated using the above procedure is observed 2 times larger than that measured relative to the ground level. So we specify the random noise as follows. Random noise = 1 2 5 2001-10-15 TCD1209D OPERATING CONDITION CHARACTERISTIC Clock Pulse Voltage Final Stage Clock Voltage Shift Pulse Voltage Reset Pulse Voltage Clamp Pulse Voltage SYMBOL MIN TYP. MAX "H" Level V 1 4.5 5 5.5 "L" Level V 2 0 0.5 4.5 5 5.5 0 0.5 4.5 5 5.5 0 0.5 4.5 5 5.5 0 0.5 4.5 5 5.5 0 0.5 11.4 12.0 13.0 V "H" Level "L" Level "H" Level "L" Level "H" Level "L" Level "H" Level "L" Level Power Supply Voltage V2B VSH VRS VCP VOD UNIT V V V V V CLOCK CHARACTERISTICS (Ta = 25C) CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT Clock Pulse Frequency f 1 20 MHz Reset Pulse Frequency fRS 1 20 MHz C1 200 C2 200 Final Stage Clock Capacitance CB 10 20 pF Shift Gate Capacitance CSH 30 pF Reset Gate Capacitance CRS 10 20 pF Clamp Gate Capacitance CCP 10 20 pF Clock Capacitance Note 10: (Note 10) pF VOD = 12 V 6 2001-10-15 TIMING CHART TCD1209D 7 2001-10-15 TCD1209D TIMING REQUIREMENTS NOTE 11: Each RS and CP pins put to Low level during this period 8 2001-10-15 TCD1209D SYMBOL MIN TYP. (Note12) MAX UNIT Pulse Timing of SH and 1 t1, t5 200 500 ns SH Pulse Rise Time, Fall Time t2, t4 0 50 ns t3 1000 1500 ns 2B Pulse Rise Time, Fall Time t6, t7 0 100 ns RS Pulse Rise Time, Fall Time t8, t10 0 20 ns t9 10 100 ns t11 15 ns t12, t14 0 20 ns CP Pulse Width t13 10 100 ns Pulse Timing of2B and CP t15 0 50 ns t16 0 100 t17 10 100 Pulse Timing of SH and CP t18 200 ns Pulse Timing of SH and RS t19 200 ns CHARACTERISTIC SH Pulse Width RS Pulse Width Video Data Delay Time (Note 13) CP Pulse Rise Time, Fall Time Pulse Timing of RS and CP Note 12: Note 13: ns TYP. is the case of fRS = 1.0 MHz Load Resistance is 100 k 9 2001-10-15 TCD1209D CAUTION 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB. 5. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C. 10 2001-10-15 TCD1209D PACKAGE DIMESIONS Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n = 1.5) 11 2001-10-15 TCD1209D RESTRICTIONS ON PRODUCT USE 000707EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 12 2001-10-15