Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Ring
Metal Plate Electrode (Inner)
Electrode(Outer)
E
1
Y
2
F
3
3
4
C
5
U
6
Product Code Dimensions (mm)
2.0×1.2
3.2×1.6
Packaging Methods
UEmbossed Carrier Taping
3C
6C
8C
Chip Ring 1.6×0.8
L
D
H
L
D
H
L
D
H
Plating Plating Plating Plating Plating Plating
Butted end Butted end Butted end
Gap : 0.1 max.
Aberration : 0.15 max.
Gap : 0.1 max.
Aberration : 0.15 max.
Gap : 0.1 max.
Aberration : 0.15 max.
EYF3CU EYF6CU EYF8CU
Chip Ring
Type: EYF 3CU, 6CU, 8CU
● High reliability ............The folded metal sheet structure provides high robustness and a reliable connection
suitable for a signal measuring terminal.
● Ease of placement ..... The taping package supports automatic placement machines.
● Soldering ...................Supports refl ow and fl ow soldering.
● To be mounted on printed circuit boards of general electronic equipment as a signal measuring terminal.
Features
The electrodes (internal and external electrodes) of EYF3CU
are entirely formed on the outer surface by plating.
The inner wall and the end surfaces are not plated.
EYF8CU EYF6CU EYF3CU
Part Number Dimensions (mm) Mass
(Weight)
[mg/pc.]
LDH
EYF3CU 1.60+0.15 0.80±0.10 1.15±0.15 6
EYF6CU 2.00+0.20 1.25±0.15 1.45±0.15 12
EYF8CU 3.20±0.20 1.60±0.20 1.25±0.15 18
Part Number Rated Current (A) Conductor (mΩ)
EYF3CU
250EYF6CU
EYF8CU
Recommended Applications
Explanation of Part Numbers
Construction
Dimensions in mm (not to scale)
Ratings
–0.10
–0.10
Nov. 201702
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Chip Ring
FE
W
P1P2P0
T2
T
A
B
Sprocket hole
Chip component
Compartment
Tape running direction
fD0
fB
W
T
fA
fC
Packaging Methods (Taping)
Part Number Kind of Taping Pitch (P1) Quantity
EYF3CU
Embossed Carrier Taping 4 mm 2,000 pcs./ reel
EYF6CU
EYF8CU
Dimensions
(mm)
0A0B0CW
T
180.0–3.0 60 min. 13.0±1.0 9.0±1.0 11.4±2.0
0
Dimensions
(mm)
Part No.
ABWFEP
1
3C
1.20±0.10 1.80±0.10
8.00±0.30 3.50±0.05 1.75±0.10 4.00±0.10
6C
1.65±0.10 2.20±0.10
8C
1.85±0.10 3.45±0.10
0
Dimensions
(mm)
Part No.
P2P00D0TT
2
3C
2.00±0.05 4.00±0.10 1.50+0.10 0.27±0.05
1.60±0.10
6C 1.90±0.10
8C 1.80±0.10
● Standard Quantity
● Embossed Carrier Taping ● Taping Reel
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors in
this catalog.
1. As the chip ring surface is conductive, it cannot connect conductor traces if solder resists are not provided for
the traces. As a result, it cannot serve as a jumper chip.
2. Check the mounting conditions before use. The inside of the chip ring is hollow. Some mounters have various
component detection functions in order to maximize the mounting ac cu ra cy. Since the chip ring is hollow, it
may cause misjudgment during the component detection, pre vent ing it from being mounted.
3. The maximum soldering temperature should be 300 °C. Otherwise, solder may adhere to por tions that are not
plated.
4. After mounting, the maximum load applied to the chip ring by a probe or a measuring nee dle should be 9.8 N.
Nov. 201702
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Fixed Resistors
Safety Precautions (Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject to
change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products under the actual conditions for use.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as
damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment,
electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention
equipment.
✽ Systems equipped with a protection circuit and a protection device.
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single
fault.
✽ Systems equipped with an arresting the spread of fire or preventing glitch.
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general elec tron ic equipment.
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
For applications in which special quality and reliability are required, or if the failure or malfunction of the
products may directly jeopardize life or cause threat of personal injury (such as for aircraft and aerospace
equipment, traffic and transport equipment, combustion equipment, medical equipment, accident prevention
and anti-theft devices, and safety equipment), please be sure to consult with our sales representative in
advance and to exchange product specifications which conform to such applications.
• These products are not intended for use in the following special conditions. Before using the products, carefully
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent.
2. In direct sunlight, outdoors, or in dust.
3. In salty air or air with a high concentration of corrosive gas, such as Cl2，H2S，NH3，SO2，or NOX .
4. Electric Static Discharge (ESD) Environment.
These components are sensitive to static electricity and can be damaged under static shock (ESD).
　　 Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic and Radioactive Environment.
Avoid any environment where strong electromagnetic waves and radiation exist.
6. In an environment where these products cause dew condensation.
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials.
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range
due to the effects of neighboring heat-generating components. Do not mount or place heat-generating
components or inflammables, such as vinyl-coated wires, near these products.
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to
leave water residues. Otherwise, the insulation performance may be deteriorated.
• Do not apply flux to these products after soldering. The activity of flux may be a cause of failures in these
products.
• Refer to the recommended soldering conditions and set the soldering condition. High peak temperature or
long heating time may impair the performance or the reliability of these products.
• Recommended soldering condition is for the guideline for ensuring the basic characteristics of the products,
not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual
conditions.
01. Oct. 2019
Fixed Resistors
• Do not reuse any products after removal from mounting boards.
• Do not drop these products. If these products are dropped, do not use them. Such products may have
received mechanical or electrical damage.
• If any doubt or concern to the safety on these products arise, make sure to inform us immediately and
conduct technical examinations at your side.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of
arrival at your company, provided that they remain packed as they were when delivered and stored at
a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the following conditions.
Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging
materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2，H2S，NH3，SO2，or NOX .
2. In direct sunlight.
＜Package markings＞
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
01. Oct. 2019