THIN FILM SURFACE MOUNT RESISTORS WATF SERIES MECHANICAL DA TA DAT W T L Full Wrap Around W L T W 0.040" x 0.020" x 0.010" 0.035" x 0.035" x 0.010" 0.075" x 0.050" x 0.010" 0.050" x 0.050" x 0.010" 0.126" x 0.063" x 0.010" 0.100" x 0.050" x 0.010" 0.020" x 0.020" x 0.010" 0.055" x 0.025" x 0.010" 0.153" x 0.050" x 0.010" 99.6% ALUMINA, ALUMINUM NITRIDE NICHROME OR TTANT ANT ALUM NITRIDE ANTALUM SERIES WATF - 1 WATF - 2 WATF - 3 WATF - 4 WATF - 5 WATF - 6 WATF - 7 WATF - 8 WATF - 9 SUBSTRA TE SUBSTRATE RESISTOR BOND PADS AND WRAPAROUND TERMINA TIONS TERMINATIONS TOLERANCE (0.003") (0.003") (0.003") (0.003") (0.003") (0.003") (0.003") (0.003") (0.003") GOLD WITH NICKEL BARRIER ST ANDARD. STANDARD. OPTIONAL WITH SOLDER; OR HALF-WRAP TERMINA TION TERMINATION ELECTRICAL DA TA DAT T L Half-Wrap SERIES WATF WATF WATF WATF WATF WATF WATF WATF WATF ABSOLUTE T.C.R. POWER RA TING RATING OHMIC VALUE @ 70C 125mW 2 - 18K 18K 250mW 2 - 150K 150K 250mW 2 - 400K 400K 250mW 2 - 400K 400K 500mW 2 - 700K 700K 250mW 2 - 625K 625K 125mW 2 - 51K 51K 250mW 2 - 100K 100K 500mW 2 - 1M 1M 0.1%, 0.5%, 1%, 2%, 5%, 10% 25ppm/C ST ANDARD (NiCr); 100ppm/ ANDARD (T aN) STANDARD 100ppm/C ST STANDARD (TaN) OPTIONAL TO 25ppm/C -1 -2 -3 -4 -5 -6 -7 -8 -9 TOLERANCE SERIES DA TA DAT 101 TO 250K : -40dB 101 250K 100 , 250K : -30dB 100 250K 400 V MIN. 1012 MIN. 100 V MAX. 5X RA TED POWER, 25 0. RATED 25 C, 5 SEC., 0. 0.225% MAX. R/R: 0.1% MSI TYPICAL 03 % MSI TYPICAL 150C, 100 HRS., 0.25% 0.25% MAX. R/R: 0. 0.03 03% MIL-STD 202, METHOD 107F 0.25% MAX. R/R: 0.1% MSI TYPICAL 107F,, 0.25% MIL-STD 202, METHOD 106, 0. 0. 0.55% MAX. R/R: 0. 0.11% MSI TYPICAL 1000 HRS., 70 C, 100% POWER 0.5% MAX. R/R: 0.1% MSI TYPICAL 70C, POWER,, 0.5% -5 -555C TO +150C DC THROUGH 20 GHz CURRENT NOISE DIELECTRIC BREAKDOWN INSULA TION RESIST ANCE INSULATION RESISTANCE OPERA TING VOL TAGE OPERATING VOLT SHORT TERM OVERLOAD HIGH TEMP EXPOSURE THERMAL SHOCK MOISTURE RESIST ANCE RESISTANCE ST ABILITY STABILITY OPERA TING TEMP RANGE OPERATING FREQUENCY STRAY DISTRIBUTED CAP ACIT ANCE CAPACIT ACITANCE 0.06pF (NiCr); 0.08pF (T aN) (TaN) PART NUMBER DESIGNA TION DESIGNATION MINI-SYSTEMS, INC. THIN FILM DIVISION 45 FRANK MOSSBERG DRIVE, ATTLEBORO, MA 02703 508-226-2111 FAX: 508-226-2211 DCN TF 111-E-0403 WATF X X XXXXX X X SERIES SUBSTRA TE SUBSTRATE OHMIC VALUE TOLERANCE OPTION 1, 2 3, 4 5, 6 7, 8 9 A = Alumina N = Aluminum Nitride RESISTIVE FILM N = Nichrome T = Tantalum Nitride 5-Digit Number: 1st 4 Digits Are Significant With "R" As Decimal Point When Required. 5th Digit Represents Number of Zeros. B D F G J K = 0.1%* = 0.5%* = 1% = 2% = 5% = 10% Consult Sales for power capabilities on Aluminum Nitride. * Value Dependent ** For Conductive Epoxy Mount. *** For Solder Mount. **** Consult Sales for Availability. EXAMPLE: WATF 1AN-50R00F-T = 0.040" x 0.020" x 0.010", Alumina Substrate, Nichrome Resistor , 1% TTol., ol., 25ppm/C, w/ Solder rap Around. Resistor,, 50 50 Solder.. Full W Wrap A = 50ppm/C B = 25ppm/C HWU = Half-Wrap Untinned T = With SN62 Solder *** TR = Tape and Reel **** U = Untinned** HWT = Half-Wrap Tinned. (Solder option applies to all Conductor Surfaces) 35