Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
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salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
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Kind regards,
Team Nexperia
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as USB 2.0 ports against
ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for high-speed signal
lines. It is encapsulated in a small SOT457 (SC-74) Surface-Mounted Device (SMD)
plastic package.
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of 0.85 pF maximum. This configuration provides protection to downstream
component s from ESD voltages up to 12 kV contact according to IEC 61000-4-2, level 4.
1.2 Features and benefits
System ESD protection for USB 2.0
All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 12 kV according to IEC 61000-4-2, level 4
Line capacitance of 0.85 pF maximum for each channel
1.3 Applications
The device is designed for receiver and transmitter port protection in:
Portable devices
TVs, monitors
DVD recorders and players
Notebooks, mother boards, graphic cards and ports
Set-top boxes and game consoles
PUSB2X4D
ESD protection for high-speed interfaces
Rev. 1 — 5 November 2013 Product data sheet
SOT457
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 2 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
2. Pinning information
3. Ordering information
4. Marking
5. Limiting values
Table 1. Pinning
Pin Description Simplified outline Graphic symbol
1 ESD protection for I/O signals
2 ground
3 ESD protection for I/O signals
4 ESD protection for I/O signals
5n.c.
6 ESD protection for I/O signals
132
4
56
34
2
1 6
018aaa176
Tabl e 2. Ordering information
Type number Package
Name Description Version
PUSB2X4D SC-74 plastic surface-mounted package; 6 leads SOT457
Table 3. Marking codes
Type number Marking code
PUSB2X4D DE
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VIinput voltage 0.5 +5.5 V
VESD electrostatic discharge
voltage pins 1, 3, 4 and 6 to ground;
IEC 61000-4-2, level 4
contact discharge 12 +12 kV
air discharge 15 +15 kV
Tamb ambient temperature 40 +85 C
Tstg storage temperature 55 +125 C
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 3 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
6. Characteristics
[1] This parameter is guaranteed by design.
[2] According to IEC 61000-4-5 (8/20 s current waveform).
[3] 100 ns Transmission Line Pulse (TLP); 50 ; pulser at 80 ns.
Table 5. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VBR breakdown voltage II=1mA 6- 9V
IRM reverse leakage curre nt per channel; VI=5V--1A
VFforward voltage II=1mA -0.7-V
Cline line capacitance f = 1 MHz [1]
VI=0V - 0.7 0.85 pF
VI=2.5V - 0.6 0.75 pF
Cline line capacitance
difference f=1MHz; V
I=2.5V [1] --0.1pF
rdyn dynamic resistance surge [2]
positive transient - 0.41 -
negative transient - 0.34 -
TLP [3]
positive transient - 0.48 -
negative transient - 0.34 -
VCL clamping voltage positive transient [2]
IPP =4.8A - 4.3 - V
negative transient
IPP =5.2 A - 2.7 - V
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 4 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
Fig 1. Insertion loss; typical values Fig 2. Crosstalk; typical values
Fig 3. Relat iv e ca pacitance as a func tion of inp ut volt a ge; typical valu e s
aaa-009805
-6
-4
-8
-2
0
S21
(dB)
-10
f (MHz)
110
4
103
10 102
aaa-009806
-60
-30
0
S21
(dB)
-90
f (MHz)
10 104
103
102
VI (A)
054231
aaa-009807
0.4
0.8
1.2
a
0
aCline
Cline VI0 V=
---------------------------------
=
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 5 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
The device uses an advanced clamping structure, which shows a negative dynamic
resistance. This snap-back behavior strongly reduces the clamping voltage to the system
behind the ESD protection during an ESD event. Do not connect unlimited DC current
sources to the data lines to avoid keeping the ESD protection device in snap-back state
after exceeding breakdown voltage (due to an ESD pulse for instance).
IEC 61000-4-5; tp=8/20s; positive pulse IEC 61000-4-5; tp=8/20s; negative pulse
Fig 4. Dynamic resistance with positive clamping;
typical valu e s Fig 5. Dynamic resistance with negative clamping ,
typical values
tp= 100 ns; Transmission Line Pulse (TLP) tp= 100 ns; Transmission Line Pulse (TLP)
Fig 6. Dynamic resistance with positive clamping,
typical valu e s Fig 7. Dynamic resistance with negative clamping;
typical values
VCL (V)
054231
aaa-009808
2
4
6
IPP
(A)
0
VCL (V)
-3 0-1-2
aaa-009809
-4
-2
0
IPP
(A)
-6
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 6 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
7. Package outline
Fig 8. Package outline SOT457 (SC-74)
04-11-08Dimensions in mm
3.0
2.5 1.7
1.3
3.1
2.7
pin 1 index
1.9
0.26
0.10
0.40
0.25
0.95
1.1
0.9
0.6
0.2
132
4
56
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 7 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
8. Soldering
Fig 9. Reflow soldering footprint SOT457 (SC-74)
Fig 10. Wave soldering footprint SOT457 (SC-74)
solder lands
solder resist
occupied area
solder paste
sot457_fr
3.45
1.95
2.8253.3
0.45
(6×)0.55
(6×)
0.7
(6×)
0.8
(6×)2.4
0.95
0.95
Dimensions in mm
sot457_fw
5.3
5.05
1.45
(6×)
0.45
(2×)
1.5
(4×)
2.85
1.475
1.475 solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 8 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
9. Revision history
Table 6. Revision history
Document ID Release date Data sheet status Change no tice Supersedes
PUSB2X4D v.1 20131105 Product data sheet - -
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 9 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
10.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipme nt, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if presen t) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyri ghts, patents or
other industrial or intellectual property right s.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
PUSB2X4D All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 1 — 5 November 2013 10 of 11
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qualif ied nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in au tomotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standard s, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
10.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PUSB2X4D
ESD protection for high-speed interfaces
© NXP B.V. 2013. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: sa lesaddresses@nxp.com
Date of release: 5 November 2013
Document identifier: PUSB2X 4D
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
11 Contact information. . . . . . . . . . . . . . . . . . . . . 10
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11