  
  
SLOS058C – OCTOBER 1979 – REVISED DECEMBER 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DµA741 Operating Characteristics
DLow Supply-Current Drain . . . 0.6 mA Typ
(per amplifier)
DLow Input Offset Voltage
DLow Input Offset Current
DClass AB Output Stage
DInput/Output Overload Protection
DDesigned to Be Interchangeable With
Industry Standard LM148, LM248, and
LM348
description/ordering information
The LM148, LM248, and LM348 are quadruple,
independent, high-gain, internally compensated
operational amplifiers designed to have operating
characteristics similar to the µA741. These
amplifiers exhibit low supply-current drain and
input bias and offset currents that are much less
than those of the µA741.
ORDERING INFORMATION
T
V
IO
max
PACKAGE
ORDERABLE TOP-SIDE
TA
VIOmax
AT 25°CPACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (N) Tube of 25 LM348N LM348N
0°Cto70°C
6mV
SOIC (D)
Tube of 50 LM348D
LM348
0°C to 70°C6 mV SOIC (D) Reel of 2500 LM348DR LM348
SOP (NS) Reel of 2000 LM348NSR LM348
PDIP (N) Tube of 25 LM248N LM248N
–25°C to 85°C6 mV
SOIC (D)
Tube of 50 LM248D
LM248
SOIC (D) Reel of 2500 LM248DR LM248
55°C to 125°C
5mV
CDIP (J) Tube of 25 LM148J LM148J
–55°C to 125°C5 mV
LCCC (FK)
Tube of 50
LM148FK
LM148FK
LCCC (FK) Tube of 50 LM148FK LM148FK
Package drawings, standard packing quantities, thermal data, symboliztion, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
        
         
       
   
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN–
1 IN+
VCC+
2IN+
2IN–
2OUT
4OUT
4IN–
4IN+
VCC–
3IN+
3IN–
3OUT
LM148 ...J PACKAGE
LM248 ...D OR N PACKAGE
LM348 . . . D, N, OR NS PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
4IN+
NC
VCC–
NC
3IN+
1IN+
NC
VCC+
NC
2IN+
LM148 . . . FK PACKAGE
(TOP VIEW)
1IN–
1OUT
NC
3IN– 4IN–
2IN–
2OUT
NC
NC – No internal connection
3OUT 4OUT
        
       
        
  
  
SLOS058C OCTOBER 1979 REVISED DECEMBER 2002
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
symbol (each amplifier)
+
OUT
IN
IN+
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, VCC+ (see Note 1): LM148 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LM248, LM348 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VCC (see Note 1): LM148 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LM248, LM348 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2): LM148 44 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LM248, LM348 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, VI (either input, see Notes 1 and 3): LM148 22 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LM248, LM348 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short circuit (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature,TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 5 and 6):D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJC (see Notes 7 and 8):FK package 5.61°C/W. . . . . . . . . . . . . . . . . . . . . . . . .
J package 15.05°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Case temperature for 60 seconds: FK package 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: J package 300°C. . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, N, or NS package 260°C. . . . . . . . . . . .
Storage temperature range, Tstg 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between VCC+ and VCC.
2. Differential voltages are at IN+ with respect to IN.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or the value specified in the table,
whichever is less.
4. The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure that
the dissipation rating is not exceeded.
5. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
6. The package thermal impedance is calculated in accordance with JESD 51-7.
7. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable
ambient temperautre is PD = (TJ(max) TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
8. The package thermal impedance is calculated in accordance with MIL-STD-883.
recommended operating conditions
MIN MAX UNIT
Supply voltage, VCC+ 4 18 V
Supply voltage, VCC418 V


SLOS058C OCTOBER 1979 REVISED FEBRUAR Y 2002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
3
electrical characteristics at specified free-air temperature, VCC± = ±15 V (unless otherwise noted)
PARAMETER
LM148 LM248 LM348
UNIT
PARAMETER TEST CONDITIONS
MIN TYP MAX MIN TYP MAX MIN TYP MAX UNIT
V
Inp t offset oltage
V0
25°C 1 5 1 6 1 6
mV
VIO Input offset voltage VO = 0 Full range 6 7.5 7.5 mV
I
Input offset current
V0
25°C 4 25 4 50 4 50
nA
IIO Input offset current VO = 0 Full range 75 125 100 nA
I
Inp t bias c rrent
V0
25°C 30 100 30 200 30 200
nA
IIB Input bias current VO = 0 Full range 325 500 400 nA
VICR Common-mode input voltage range Full range ±12 ±12 ±12 V
RL = 10 k25°C±12 ±13 ±12 ±13 ±12 ±13
V
Maximum peak output volta
g
eRL 10 kFull range ±12 ±12 ±12
V
VOM
Maximum
eak
out ut
voltage
swing RL = 2 k25°C±10 ±12 ±10 ±12 ±10 ±12 V
g
RL 2 kFull range ±10 ±10 ±10
A
Lar
g
e-si
g
nal differential volta
g
e V
O
= ±10 V
,
25°C 50 160 25 160 25 160
V/mV
AVD
Large
-
signal
differential
voltage
amplification
VO
=
±10
V
,
RL= 2 kFull range 25 15 15 V/mV
riInput resistance25°C 0.8 2.5 0.8 2.5 0.8 2.5 M
B1Unity-gain bandwidth AVD = 1 25°C 1 1 1 MHz
φmPhase margin AVD = 1 25°C 60°60°60°
CMRR
Common mode rejection ratio
V
IC
= V
ICR
min
,
25°C 70 90 70 90 70 90
dB
CMRR Common-mode rejection ratio
VIC
=
VICRmin
,
VO = 0 Full range 70 70 70 dB
k
Suppl
y
-volta
g
e re
j
ection ratio V
CC±
= ±9 V to ±15 V
,
25°C 77 96 77 96 77 96
dB
kSVR
Su ly
-
voltage
rejection
ratio
(VCC±/VIO)
VCC±
=±9
V
to
±15
V
,
VO = 0 Full range 77 77 77 dB
IOS Short-circuit output current 25°C±25 ±25 ±25 mA
I
S ppl c rrent (fo r amplifiers)
No load
VO = 0
25°C
2.4 4.5 2.4 4.5
mA
ICC Supply current (four amplifiers) No load VO = VOM 25°C2.4 3.6 mA
VO1/VO2 Crosstalk attenuation f = 1 Hz to 20 kHz 25°C 120 120 120 dB
All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. Full range for TA is 55°C to 125°C for
LM148, 25°C to 85°C for LM248, and 0°C to 70°C for LM348.
This parameter is not production tested.
  
  
SLOS058C OCTOBER 1979 REVISED FEBRUARY 2002
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
operating characteristics, VCC± = ±15 V, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SR Slew rate at unity gain RL = 2 kΩ, CL = 100 pF, See Figure 1 0.5 V/µs
PARAMETER MEASUREMENT INFORMATION
+
VICL = 100 pF RL = 2 k
Figure 1. Unity-Gain Amplifier
+
10 k
100
VI
RL = 2 kCL = 100 pF
AVD = 100
Figure 2. Inverting Amplifier
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
LM148FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
LM148J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
LM148JB ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
LM248D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM248DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM248DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM248DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM248DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM248DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM248N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LM248NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LM348D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM348DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM348DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM348DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM348DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM348DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM348N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LM348NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LM348NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM348NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LM348NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM248DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM348DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM348DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LM348NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM248DR SOIC D 14 2500 367.0 367.0 38.0
LM348DR SOIC D 14 2500 333.2 345.9 28.6
LM348DR SOIC D 14 2500 367.0 367.0 38.0
LM348NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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