DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT uPC4071 LOW NOISE J-FET INPUT OPERATIONAL AMPLIFIER DESCRIPTION FEATURES The J-FET input operational amplifier of the Low noise: en = 18 nV/VHz (TYP.) LPC4071 is designed as low noise version of the Very low input bias and offset currents LPC4081. The features of the uwPC4071 are more Output short circuit protection improved input equivalent noise voltage, input offset High input impedance...J-FET Input stage voltage and input bias current than those of uPC4081. @ internal frequency compensation By these features, the PC4071 is excellent choice for High slew rate...13 V/us (TYP.) wide variety of applications including audio pream- plifier and active filter. CONNECTION DIAGRAM EQUIVALENT CIRCUIT (Top View) . * uPC4071, 4071G2 OV a 3 (7) Oo 9 OFFSET] @ Qs ie on nun [1 SINC i [2 * Qis 7 p> e Vv oh Inf | 6 | OUT OFFSET vi4] 5 NULL OUT | | (6) Wwe * Do _ OV OFFSET (4) NULL ORDERING INFORMATION PART NUMBER PACKAGE QUALITY GRADE uPC4071C 8 PIN PLASTIC DIP (300 mil) Standard uPC4071G2 8 PIN PLASTIC SOP (225 mil) Standard Please refer to Quality grade on NEC Semiconductor Devices (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-1616B (O.D. No. IC-6508B) ! Date Published March 1993 M | Printed in JapanNEC uPC4071 ABSOLUTE MAXIMUM RATINGS (Ta = 25 C) PARAMETER SYMBOL uPC4071 UNIT Voltage between V* and V- (Note1) Vr-V- -0.3 to +36 V Differential Input Voltage Vip +30 Vv Input Voltage (Note 2} VI V- -0.3 to V* 40.3 V Output Voltage (Note 3) Vo V- -0.3 to V+ +0.3 Vv C Package Nete 4) 350 mw Power Dissipation PT G2 Package (Note 5) 440 mW Output Short Circuit Duration {Note 6) Indefinite sec Operating Temperature Range Topt -20 to + 80 C Storage Temperature Range Tstg -55 to + 125 , c Note 1. Reverse connection of supply voltage can cause destruction. Note 2. The input voltage should be allowed to input without damage destruction. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics. Note 3. This specification is the voltage which should be allowed to supply to the output terminal from external without damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics. Note 4. Thermal derating factor is -5.0 mV/C when ambient temperature is higher than 55 C. Note 5. Thermal derating factor is -4.4 mV/C when ambient temperature is higher than 25 C. Note 6. Pay careful atttention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and Note 5. RECOMMENDED OPERATING CONDITIONS CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT Supply Voltage VE 5 + 16 Vv Output Current lo : + 10 mA Capacitive Load (Av=+1) CL 100 pF OFFSET VOLTAGE NULL CIRCUITNEC uPC4071 ELECTRICAL CHARACTERISTICS (Ta = 25 C, V* = +15 V) CHARACTERISTIC SYMBOL] MIN. TYP. MAX. UNIT CONDITION Input Offset Voltage Vio +3 +10.0 mV Rs <50Q Input Offset Current (Note?) lio +5 +50 pA Input Bias Current (Note?) Is 30 200 pA Large Signal Voltage Gain Av 25 200 V/mV Ri 2 2 kQ, Vo = +10 V Supply Current Ice 2.0 2.7 mA l= 0A Common Mode Rejection Ratio CMR 70 86 dB Supply Voltage Rejection Ratio SVR 70 86 , dB Output Voltage Swing Vom +12 +13.5 Vv Re = 10 kQ Output Voltage Swing Vom +10 +12 Vv RiL22kQ Common Mode Input Voltage Range Viem +10 Vv Slew Rate SR 13 Vius Av=1 Unity Gain Frequency funity 3 MHz Input Equivalent Noise Voltage Vn 4 Vine. Rs = 100 Q, f = 10 Hz to 10 kHz Input Equivalent Noise Voltage Density en 18 nV/VHz | Rs= 100, f= 1kHz Input Offset Voltage Vio +13 mV Rs $50Q, Ta = -20 to +70 C Average Vio Temperature Drift AVi0o/ AT +10 BEPC Ta = -20 to +70 C Input Offset Current (Note7} lio +2 nA Ta = -20 to +70 C Input Bias Current (Note7} le 7 nA Ta = ~20 to +70 C Note 7. Input bias currents flow into IC. Because each currents are gate leak current of P-channel J-FET on input stage. And that are temperature sensitive. Short time measuring method is recommendable to maintain the junction temperature close to the ambient temperature.NEC uPC4071 TYPICAL PERFORMANCE CHARACTERISTICS (Ta = 25 C, TYP.) POWER DISSIPATION 600 go oO Oo Q oO Nh OQ oO Pr Total Power Dissipation - mW => WwW Q oS }S S 0 20 40 60 80 100 Ta - Ambient Temperature C LARGE SIGNAL FREQUENCY RESPONSE 30 Vie e15V Ri = 10 kQ & & 20 2 Vi=#10V 6 > 5 ao 10 s \ Vi=45V 5 > NS 0 100 1k 2k 10k 1M 10M f ~ Frequency ~ Hz OUTPUT VOLTAGE SWING 30 Vi=+15V Leen a \ IN Vom - Output Voltage Swing - Ver 100 300 1k 3k 10k Ri - Load Resistance - Q Vom - Output Voltage Swing - Vpp Av - Open Loop Voltage Gain dB Input voltage V/Output Voltage V 120 100 80 60 40 20 40 30 20 10 OPEN LOOP FREQUENCY RESPONSE N\ Vt Rt \ N\ = =2kO 15V N\ N\ \ N\ \ N 10 100 tk 10k 100k 1M 10M f - Frequency - Hz OUTPUT VOLTAGE SWING Ri = 10 kQ Lo Zo ~ +10 V* Supply Voltage - V VOLTAGE FOLLOWER PULSE RESPONSE [ Output - Ve Input Time psNEC uPC4071 INPUT BIAS CURRENT INPUT EQUIVALENT NOISE VOLTAGE DENSITY 100 104 Vi=+15V Vi =+15V < Bn , Rs = 1009 1 10 Skt 10 S Se 5 ol O o> ~~ 1.0 oO 23 10 & ws 5 a 20 2 ZZ 3 --s-__ 0.1 7 ' = 10 fa / o> a 0.01 1 ~20 0 20 40 60 80 10 100 1k 10k 100 k Ta - Ambient Temperature C f ~ Frequency Hz SUPPLY CURRENT 2.5 2.0 | l 2 S| 1.5 5 Oo = 2 1.0 a} ' 8 05 0 +5 +10 +15 +20 V* Supply Voltage - VNEC uPC4071 8PIN PLASTIC DIP (300 mil) 8 5 | M 0~15 P8C-100-300B,C NOTES ITEM MILLIMETERS * INCHES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at A 10.16 MAX. 0.400 MAX. maximum material condition. B 1.27 MAX. 0.050 MAX. Cc 2.54 (T.P.) 0.100 (T.P.)} 2) Item K to center of leads when formed sole you0o4 parallel. D 0.50*: 0.020 =0:005 F 1.4 MIN. 0.055 MIN. G 3.2793 0.126 t-9'2 H 0.51 MIN. 0.020 MIN. | 4.31 MAX. 0.170 MAX. J 5.08 MAX. 0.200 MAX. K 7.62 (T.P.) 0.300 (T.P.) L 6.4 0.252 M 0.25 78:38 0.010 =8:888 N 0.25 0.01 P 0.9 MIN. 0.035 MIN.NEC uPC4071 8 PIN PLASTIC SOP (225 mil) 8 5 detail of lead end HEHE 1 4 A H oO ! | J (| Gopi Pea ot | MIE OS aa Ww L B | N | D S8GM-50-225B-2 NOTE ITEM| MILLIMETERS INCHES Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at A 5.37 MAX. 0.212 MAX. maximum material condition. B 0.78 MAX. 0.031 MAX. C 1.27 (T.P.) 0.050 (T.P.) D 0.4078:38 0.07629-004 E 0.1+0.1 0.004+0.004 F 1.8 MAX. 0.071 MAX. G 1.49 0.059 H 6.50.3 0.256+0.012 | 4.4 0.173 J 1.1 0.043 K 0.157219 0.0068-004 L 0.6+0.2 0.0245:005 M 0.12 . 0.005 N 0.15 | 0.006NEC uPC4071 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (1EI-1207). [ uPC4071G2 ] Soldering Solderi diti Recommended method oldering conditions condition symbol Infrared ray reflow Peak packages surface temperature: 230 C or below, Reflow time: 30 seconds or below (210 C or higher), IR30-00-7 Number of reflow process: 1, Exposure limit*: None VPS Peak packages surface temperature: 215 C or below, Reflow time: 40 seconds or below (200 C or higher), VP 15-00-1 Number of reflow process: 1, Exposure limit*: None Wave soldering Peak packages surface temperature: 260 C or below, Flow time: 10 seconds or below WS 15-00-1 Number of flow process: 1, Exposure limit*: None Partial heating method | Terminal temperature: 300 C or below, Flow time: 10 seconds or below, Exposure limit*: None *: Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 C and relative humidity at 65 % or less. Note: Do not apply more than a single process at once, except for Partial heating method. TYPES OF THROUGH HOLE DEVICE {uPC4071C] Soldering . sg: Recommended method Soldering conditions condition symbol Wave soldering Solder temperature: 260 C or below, Flow time: 10 seconds or belowNEC uPC4071 [MEMO]NEC uPC4071 [MEMO] No part of this document may be copied or reproduced in any from or by any means without the prior written consent of NEC Corporation.NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. The devices listed in this document are not suitable for use in aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. If customers intend to use NEC devices for above applications or they intend to use "Standard" quality grade NEC devices for applications not intended by NEC, please contact our sales people in advance. Application examples recommended by NEC Corporation. Standard: Computer, Office equipment, Communication equipment, Test and Measurement equipment, Machine tools, Industrial robots, Audio and Visual equipment, Other consumer products, etc. Special: Automotive and Transportation equipment, Traffic contro! systems, Antidisaster systems, Anticrime systems, etc. M4 92.6