a
Preliminary Technical Data
Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc.
Blackfin
®
Embedded Processor
ADSP-BF522C/ADSP-BF525C/ADSP-BF527C
Rev. PrB
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 © 2007 Analog Devices, Inc. All rights reserved.
FEATURES
Up to 600 MHz high-performance Blackfin processor
Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs,
40-bit shifter
RISC-like register and instruction model for ease of
programming and compiler-friendly support
Advanced debug, trace, and performance monitoring
tbd V to tbd V core V
DD
with on-chip voltage regulation
1.8V, 2.5V, or 3.3V I/O operation
Embedded low power audio CODEC
289-ball MBGA package
MEMORY
132K bytes of on-chip memory:
48K bytes of instruction SRAM
16K bytes of instruction SRAM/cache
32K bytes of data SRAM
32K bytes of data SRAM/cache
4K bytes of scratchpad SRAM
External memory controller with glueless support for SDRAM
and asynchronous 8-bit and 16-bit memories
Nand flash controller
Flexible booting options from external flash, SPI and TWI
memory or from SPI, TWI, and UART host devices
One-time programmable memory for security
Two dual-channel memory DMA controllers
Memory management unit providing memory protection
PERIPHERALS
Refer to the published ADSP-BF522/ADSP-BF525/ADSP-
BF527 Revision PrB datasheet for additional peripherals
CODEC FEATURES
Stereo 24-bit A/D and D/A converters
DAC
100 dB (A-weighted) signal-to-noise ratio at 3.3 V
95 dB (A-weighted) signal-to-noise ratio at 1.8 V
ADC
90 dB (A-weighted) signal-to-noise ratio at 3.3 V
85dB (A-weighted) signal-to-noise ratio at 1.8 V
Audio sample rates
8 kHz, 44.1 kHz or 88.2 kHz–XTI/MCLK frequency 11.2896
MHz (256 × F
S
) or 16.9344 MHz (384 × F
S
)
8 kHz, 32 kHz, 48 kHz or 96 kHz–XTI/MCLK frequency
12.288 MHz (256 × F
S
) or 18.432 MHz (384 × F
S
)
Highly efficient headphone amplifier
Complete stereo/mono or microphone/line interface
Normal and USB modes programmed under software control
Low power
8 mW stereo playback (1.8 V all power supplies)
20 mW record and playback (1.8 V all power supplies))
Low supply voltages
1.8 V to 3.6 V analog supply range
1.8 V to 3.6 V digital supply range
Figure 1. Functional Block Diagram
EMAC/HDMA
UART 0-1
TIMERS 0-7
PPI
NAND
SPI
TWI
SPORT1-0
PORTS
USB
EXTERNAL PORT
FLASH, SDRAM CONTROL
JTAG TEST AND EMULATION
VOLTAGE REGULATOR
DMA
CONTROLLER
L1
INSTRUCTION
MEMORY
L1
DATA
MEMORY
INTERRUPT
CONTROLLER
PERIPHERAL ACCESS
BUS
EXTERNAL ACCESS BUS
DMA CORE BUS
DMA
EXTERNAL
BUS
B
WATCHDOG TIMER
RTC
BOOT
ROM
OTP
16
CODEC
Rev. PrB | Page 2 of 12 | June 2007
ADSP-BF522C/ADSP-BF525C/ADSP-BF527C Preliminary Technical Data
REVISION HISTORY
6/07—Revision PrB: Changes from PrA to PrB
Corrects SS/PG and VRSEL 289-Ball Mini-BGA Ball Assign-
ment (Alphabetically by Signal) ................................... 7
Corrects SS/PG and VRSEL 289-Ball Mini-BGA Ball Assign-
ment (Numerically by Ball Number) ............................. 8
3/07—Revision PrA: Initial Version
ADSP-BF522C/ADSP-BF525C/ADSP-BF527CPreliminary Technical Data
Rev. PrB | Page 3 of 12 | June 2007
GENERAL DESCRIPTION
This document describes the differences between the ADSP-
BF522C/ADSP-BF525C/ADSP-BF527C and the ADSP-
BF522/ADSP-BF525/ADSP-BF527 standard product. Please
refer to the published ADSP-BF522/ADSP-BF525/ADSP-BF527
Revision PrC datasheet for general description and specifica-
tions. This document only describes the exceptions to that
datasheet.
The ADSP-BF522C/ADSP-BF525C/ADSP-BF527C adds a ste-
reo CODEC to the standard product and changes the package
labeling.
STEREO CODEC
The CODEC in the ADSP-BF522C/ADSP-BF525C/ADSP-
BF527C is a low power, high quality stereo audio CODEC for
portable digital audio application. It features two 24-bit A/D
converter channels and two 24-bit D/A converter channels.
In normal mode, the XMI/MCLK oscillator is set up according
to the desired sample rates of the ADC and DAC. For ADC or
DAC sampling rates of 8 kHz, 32 kHz, 48 kHz or 96 kHz, MCLK
frequencies of either 12.288 MHz (256 × FS) or 18.432 MHz
(384 × FS) can be used. For ADC or DAC sampling rates of
8 kHz, 44.1 kHz or 88.2 kHz, MCLK frequencies of either
11.2896 MHz (256 × FS) or 16.9344 MHz (384 × FS) can be
used.
In USB mode, the XTI/MCLK frequency is only 12MHz allow-
ing for ADC and DAC sampling rates of 8 kHz, 44.1 kHz or 88.2
kHz.
The CODEC can operate with power supplies as low as 1.8 V for
the analog part and 1.8 V for digital port. The maximum voltage
is 3.6 V for all power supplies.
The device is controlled by a 2- or 3-wire serial interface which
provides access to all features including volume controls, mutes
and extensive power management facilities.
Figure 2. Audio CODEC Block Diagram
MUX ADC DAC
MUX ADC DAC
RLINEIN
MICBIAS
MICIN
LLINEIN
ATTENUATOR
ATTENUATOR
ATTENUATOR
ATTENUATOR
+
+
DIGITAL
FILTERS
RHPOUT
ROUT
LOUT
LHPOUT
CLK DIGITAL AUDIO INTERFACE CONTROL INTERFACE
XTI/MCLK XTO CCLKOUT DACDAT ADCDAT BCLK DACLRCADCLRC CMODE CSB CSDA CSCL
Rev. PrB | Page 4 of 12 | June 2007
ADSP-BF522C/ADSP-BF525C/ADSP-BF527C Preliminary Technical Data
PIN DESCRIPTIONS
The ADSP-BF522C/ADSP-BF525C/ADSP-BF527C processor
adds CODEC signals as listed in Table 1.
Table 1. Pin Descriptions
Pin Name Type Function Pull-Up/Down
CCLKOUT O CODEC Clock Output None
BCLK I/O CODEC Digital Audio Bit Clock Internal Pull-down
1
DACDAT I CODEC DAC Sample Rate Left/Right Clock None
DACLRC I/O CODEC I/O DAC Sample Rate Left/Right Clock Internal Pull-down
1
ADCDAT O CODEC ADC Digital Audio Data Output None
ADCLRC I/O CODEC ADC Sample Rate Left/Right Clock Internal Pull-down
1
CMODE I CODEC Control Interface Selection Internal Pull-up
1
CSB I CODEC MPU Chip Select/MPU Interface Address Selection Internal Pull-up
1
CSDA I/O CODEC MPU Data Input None
CSCL I CODEC MPU Clock None
XTI/MCLK I CODEC Crystal Input/MPU Clock Input None
XTO O CODEC Crystal Output None
LHPOUT O CODEC Left Channel Headphone Output (Analog Output) None
RHPOUT O CODEC Right Channel Headphone Output (Analog Output) None
LOUT O CODEC Left Channel Line Output (Analog Output) None
ROUT O CODEC Right Channel Line Output (Analog Output) None
VMID O CODEC Mid-rail Reference Decoupling Point (Analog Output) None
MICBIAS O CODEC Electret Microphone Bias (Analog Output) None
MICIN I CODEC Microphone Input; (Analog Input, AC Coupled) None
RLINEIN I CODEC Right Channel Line Input (Analog Input, AC Coupled) None
LLINEIN I CODEC Left Channel Line Input (Analog Input, AC Coupled) None
GND P CODEC Digital Core Ground N/A
AVDD P CODEC Analog V
DD
N/A
AGND P CODEC Analog Ground N/A
HPVDD P CODEC Headphone V
DD
(Analog) N/A
HPGND P CODEC Headphone Ground N/A
1
Pull-up/pull-down is only present when the control register interface ACTIVE = 0 to conserve power.
ADSP-BF522C/ADSP-BF525C/ADSP-BF527CPreliminary Technical Data
Rev. PrB | Page 5 of 12 | June 2007
SPECIFICATIONS
Component specifications are subject to change
without notice.
OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
Parameter Conditions Min Typical Max Unit
CV
DD
Digital Core V
DD
1.8 3.6 V
AV
DD
Analog V
DD
1.8 3.6 V
HPV
DD
Headphone V
DD
(Analog) 1.8 3.6 V
V
ILC
CODEC Low Level Input Voltage
1
1
Parameter value applies to digital signal pins (ADCDAT, ADCLRC, BCLK, CSB, CCLKOUT, CMODE, DACDAT, DACLRC, CSCL, CSDA, XTI/MCLK, XTO).
0.3 × CV
DD
V
V
IHC
CODEC High Level Input Voltage
1
0.7 × CV
DD
V
V
OLC
CODEC Low Level Output Voltage
1
0.1 × CV
DD
V
V
OHC
CODEC Low Level Output Voltage
1
0.9 × CV
DD
V
T
J
Junction Temperature 289-Ball Chip Scale Ball Grid Array (Mini-BGA)
@ T
AMBIENT
= 0°C to +70°C
0+105°C
Parameter Conditions Min Typical Max Unit
Line Input to ADC
SNR Signal to Noise Ratio A-weighted, 0 dB Gain @ F
S
= 48 kHz tbd 85 dB
SNR Signal to Noise Ratio A-weighted, 0 dB Gain @ F
S
= 96 kHz 85 dB
DR Dynamic Range A-weighted, –60 dB Full Scale Input tbd 88 dB
THD Total Harmonic Distortion –1 dB Input, 0 dB Gain –76 tbd dB
Microphone Input to ADC 0 dB Gain, F
S
= 48 kHz, 40 kΩ Source Impedance
SNR Signal to Noise Ratio A-weighted, 0 dB Gain 80 dB
DR Dynamic Range A-weighted, –60 dB Full Scale Input 70 dB
THD Total Harmonic Distortion 0 dB Input, 0 dB Gain –55 dB
Line Output for DAC Playback Only Load = 10 kΩ, 50 pF
SNR Signal to Noise Ratio A-weighted, 0 dB Gain @ F
S
= 48 kHz tbd 95 dB
SNR Signal to Noise Ratio A-weighted, 0 dB Gain @ F
S
= 96 kHz 93 dB
DR Dynamic Range A-weighted, –60 dB Full Scale Input tbd 90 dB
THD Total Harmonic Distortion 1 kHz, 0 dB –80 tbd dB
THD Total Harmonic Distortion 1 kHz, –3 dB –90 dB
Analog Line Input to Line Output Load = 10 k Ω, 50 pF, No Gain on Input, Bypass Mode
SNR Signal to Noise Ratio tbd 90 dB
THD Total Harmonic Distortion 1 kHz, 0 dB –83 tbd dB
THD Total Harmonic Distortion 1 kHz, –3 dB –92 dB
Stereo Headphone Output
PO Maximum Output Power R
L
= 32 Ω9mW
PO Maximum Output Power R
L
= 16 Ω18 mW
SNR Signal to Noise Ratio A-weighted tbd 95 dB
THD Total Harmonic Distortion 1 kHz, –5 dB, R
L
= 32 Ω, Full Scale Input –62 tbd dB
THD Total Harmonic Distortion 1 kHz,–2 dB, R
L
= 32 Ω, Full Scale Input tbd dB
Microphone Input to Headphone Output Side Tone Mode
SNR Signal to Noise Ratio tbd 90 dB
Rev. PrB | Page 6 of 12 | June 2007
ADSP-BF522C/ADSP-BF525C/ADSP-BF527C Preliminary Technical Data
DIGITAL FILTER CHARACTERISTICS
PACKAGE INFORMATION
The information presented in Figure 3 and Table 2 provides
details about the package branding for the ADSP-
BF522C/ADSP-BF525C/ADSP-BF527C processor. For a com-
plete listing of product availability, see Ordering Guide on
Page 12.
Parameter Conditions Min Typical Max Unit
ADC Filter
Passband ±0.05 dB tbd × F
S
tbd × F
S
Passband –6 dB 0.5 × F
S
Passband Ripple tbd dB
Stopband tbd × F
S
Stopband Attenuation F > 0.5465 × F
S
tbd dB
High Pass Filter Corner Frequency –3 dB 3.7 Hz
High Pass Filter Corner Frequency –0.5 dB 10.4 Hz
High Pass Filter Corner Frequency –0.1 dB 21.6 Hz
DAC Filter
Passband ±0.03 dB tbd × F
S
tbd × F
S
Passband –6 dB 0.5 × F
S
Passband Ripple tbd dB
Stopband tbd × F
S
Stopband Attenuation F > 0.5465 × F
S
tbd dB
Figure 3. Product Information on Package
Table 2. Package Brand Information
Brand Key Field Description
t Temperature Range
pp Package Type
Z Lead Free Option
ccc See Ordering Guide
vvvvvv.x Assembly Lot Code
n.n Silicon Revision
yyww Date Code
vvvvvv.x n.n
tppZccc
B
ADSP-BF525C
a
yyww country_of_origin
ADSP-BF522C/ADSP-BF525C/ADSP-BF527CPreliminary Technical Data
Rev. PrB | Page 7 of 12 | June 2007
289-BALL MINI-BGA PINOUT
Table 3 lists the mini-BGA pinout by signal mnemonic. Table 4
on Page 8 lists the mini-BGA pinout by ball number.
Table 3. 289-Ball Mini-BGA Ball Assignment (Alphabetically by Signal)
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
ABE0/SDQM0 AB9 CSB D23 GND L14 PF5 B10 RESET V22 VDDEXT R17 VDDMEM U8
ABE1/SDQM1 AC9 CSCL B23 GND L15 PF6 B12 RHPOUT B21 VDDEXT T17 VDDMEM U9
ADCDAT A16 CSDA C23 GND M9 PF7 B13 RLINEIN F23 VDDEXT U17 VDDMEM U10
ADCLRC A15 DACDAT A18 GND M10 PF8 B16 ROUT G22 VDDINT B5 VDDMEM U11
ADDR1 AB8 DACLRC A17 GND M11 PF9 A20 RTXI U23 VDDINT H8 VDDMEM U12
ADDR2 AC8 DATA0 Y1 GND M12 PF10 B15 RTXO V23 VDDINT H9 VDDMEM U13
ADDR3 AB7 DATA1 V2 GND M13 PF11 B17 SA10 AC10 VDDINT H10 VDDMEM U14
ADDR4 AC7 DATA2 W1 GND M14 PF12 B18 SCAS AC11 VDDINT H11 VDDMEM U15
ADDR5 AC6 DATA3 U2 GND M15 PF13 B19 SCKE AB13 VDDINT H12 VDDMEM U16
ADDR6 AB6 DATA4 V1 GND N9 PF14 A9 SCL B22 VDDINT H13 VDDOTP AC12
ADDR7 AB4 DATA5 U1 GND N10 PF15 A10 SDA C22 VDDINT H14 VDDRTC W23
ADDR8 AB5 DATA6 T2 GND N11 PG0 H2 SMS AC13 VDDINT H15 VDDUSB W22
ADDR9 AC5 DATA7 T1 GND N12 PG1 G1 SRAS AB12 VDDINT H16 VDDUSB Y23
ADDR10 AC4 DATA8 R1 GND N13 PG2 H1 SS/PG AC20 VDDINT J8 VMID G23
ADDR11 AB3 DATA9 P1 GND N14 PG3 F1 SWE AB10 VDDINT J16 VROUT AC18
ADDR12 AC3 DATA10 P2 GND N15 PG4 D1 TCK L1 VDDINT K8 VRSEL AB22
ADDR13 AB2 DATA11 R2 GND P9 PG5 D2 TDI J1 VDDINT K16 XTAL P23
ADDR14 AC2 DATA12 N1 GND P10 PG6 C2 TDO K1 VDDINT L8 XTI/MCLK A22
ADDR15 AA2 DATA13 N2 GND P11 PG7 B1 TMS L2 VDDINT L16 XTO A21
ADDR16 W2 DATA14 M2 GND P12 PG8 C1 TRST K2 VDDINT M8
ADDR17 Y2 DATA15 M1 GND P13 PG9 B2 USB_DM AB21 VDDINT M16
ADDR18 AA1 EMU J2 GND P14 PG10 B4 USB_DP AA22 VDDINT N8
ADDR19 AB1 EXT_WAKE AC19 GND P15 PG11 B3 USB_ID Y22 VDDINT N16
AGND G17 GND A1 GND R9 PG12 A2 USB_RSET AC21 VDDINT P8
AGND H22 GND A23 GND R10 PG13 A3 USB_VBUS AB20 VDDINT P16
AMS0 AC17 GND B6 GND R11 PG14 A4 USB_VREF AC22 VDDINT R8
AMS1 AB16 GND J9 GND R12 PG15 A5 USB_XTALIN AB23 VDDINT R16
AMS2 AC16 GND J10 GND R13 PH0 A11 USB_XTALOUT AA23 VDDINT T8
AMS3 AB15 GND J11 GND R14 PH1 A12 VDDEXT G7 VDDINT T9
AOE AC15 GND J12 GND R15 PH2 A13 VDDEXT G8 VDDINT T10
ARDY AC14 GND J13 GND T22 PH3 B14 VDDEXT G9 VDDINT T11
ARE AB17 GND J14 GND AC1 PH4 A14 VDDEXT G10 VDDINT T12
AVDD G16 GND J15 GND AC23 PH5 K23 VDDEXT G11 VDDINT T13
AVDD J22 GND K9 LHPOUT B20 PH6 K22 VDDEXT G12 VDDINT T14
AWE AB14 GND K10 LLINEIN E23 PH7 L23 VDDEXT G13 VDDINT T15
BCLK A19 GND K11 LOUT F22 PH8 L22 VDDEXT G14 VDDINT T16
BMODE0 G2 GND K12 MICBIAS H23 PH9 T23 VDDEXT G15 VDDMEM J7
BMODE1 F2 GND K13 MICIN J23 PH10 M22 VDDEXT H7 VDDMEM K7
BMODE2 E1 GND K14 NMI U22 PH11 R22 VDDEXT H17 VDDMEM L7
BMODE3 E2 GND K15 OTPVPP AB11 PH12 M23 VDDEXT J17 VDDMEM M7
CCLKOUT D22 GND L9 PF0 A7 PH13 N22 VDDEXT K17 VDDMEM N7
CLKBUF AB19 GND L10 PF1 B8 PH14 N23 VDDEXT L17 VDDMEM P7
CLKIN R23 GND L11 PF2 A8 PH15 P22 VDDEXT M17 VDDMEM R7
CLKOUT AB18 GND L12 PF3 B9 PPICLK/TMRCLK A6 VDDEXT N17 VDDMEM T7
CMODE E22 GND L13 PF4 B11 PPIFS1/TMR0 B7 VDDEXT P17 VDDMEM U7
Rev. PrB | Page 8 of 12 | June 2007
ADSP-BF522C/ADSP-BF525C/ADSP-BF527C Preliminary Technical Data
Table 4. 289-Ball Mini-BGA Ball Assignment (Numerically by Ball Number)
Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal Ball
No.
Signal
A1 GND B23 CSCL H22 AGND L22 PH8 P22 PH15 U22 NMI AC5 ADDR9
A2 PG12 C1 PG8 H23 MICBIAS L23 PH7 P23 XTAL U23 RTXI AC6 ADDR5
A3 PG13 C2 PG6 J1 TDI M1 DATA15 R1 DATA8 V1 DATA4 AC7 ADDR4
A4 PG14 C22 SDA J2 EMU M2 DATA14 R2 DATA11 V2 DATA1 AC8 ADDR2
A5 PG15 C23CSDA J7 VDDMEMM7 VDDMEMR7 VDDMEMV22 RESET AC9 ABE1/SDQM1
A6 PPICLK/TMRCLK D1 PG4 J8 VDDINT M8 VDDINT R8 VDDINT V23 RTXO AC10 SA10
A7 PF0 D2 PG5 J9 GND M9 GND R9 GND W1 DATA2 AC11 SCAS
A8PF2 D22CCLKOUTJ10GNDM10GNDR10GNDW2ADDR16 AC12VDDOTP
A9 PF14 D23 CSB J11 GND M11 GND R11 GND W22 VDDUSB AC13 SMS
A10 PF15 E1 BMODE2 J12 GND M12 GND R12 GND W23 VDDRTC AC14 ARDY
A11 PH0 E2 BMODE3 J13 GND M13 GND R13 GND Y1 DATA0 AC15 AOE
A12 PH1 E22 CMODE J14 GND M14 GND R14 GND Y2 ADDR17 AC16 AMS2
A13 PH2 E23 LLINEIN J15 GND M15 GND R15 GND Y22 USB_ID AC17 AMS0
A14 PH4 F1 PG3 J16 VDDINT M16 VDDINT R16 VDDINT Y23 VDDUSB AC18 VROUT
A15 ADCLRC F2 BMODE1 J17 VDDEXT M17 VDDEXT R17 VDDEXT AA1 ADDR18 AC19 EXT_WAKE
A16 ADCDAT F22 LOUT J22 AVDD M22 PH10 R22 PH11 AA2 ADDR15 AC20 SS/PG
A17 DACLRC F23 RLINEIN J23 MICIN M23 PH12 R23 CLKIN AA22 USB_DP AC21 USB_RSET
A18 DACDAT G1 PG1 K1 TDO N1 DATA12 T1 DATA7 AA23 USB_XTALOUT AC22 USB_VREF
A19 BCLK G2 BMODE0 K2 TRST N2 DATA13 T2 DATA6 AB1 ADDR19 AC23 GND
A20 PF9 G7 VDDEXT K7 VDDMEM N7 VDDMEM T7 VDDMEM AB2 ADDR13
A21 XTO G8 VDDEXT K8 VDDINT N8 VDDINT T8 VDDINT AB3 ADDR11
A22 XTI/MCLK G9 VDDEXT K9 GND N9 GND T9 VDDINT AB4 ADDR7
A23 GND G10 VDDEXT K10 GND N10 GND T10 VDDINT AB5 ADDR8
B1 PG7 G11 VDDEXT K11 GND N11 GND T11 VDDINT AB6 ADDR6
B2 PG9 G12 VDDEXT K12 GND N12 GND T12 VDDINT AB7 ADDR3
B3 PG11 G13 VDDEXT K13 GND N13 GND T13 VDDINT AB8 ADDR1
B4 PG10 G14 VDDEXT K14 GND N14 GND T14 VDDINT AB9 ABE0/SDQM0
B5 VDDINT G15 VDDEXT K15 GND N15 GND T15 VDDINT AB10 SWE
B6 GND G16 AVDD K16 VDDINT N16 VDDINT T16 VDDINT AB11 OTPVPP
B7 PPIFS1/TMR0 G17 AGND K17 VDDEXT N17 VDDEXT T17 VDDEXT AB12 SRAS
B8 PF1 G22 ROUT K22 PH6 N22 PH13 T22 GND AB13 SCKE
B9 PF3 G23 VMID K23 PH5 N23 PH14 T23 PH9 AB14 AWE
B10 PF5 H1 PG2 L1 TCK P1 DATA9 U1 DATA5 AB15 AMS3
B11 PF4 H2 PG0 L2 TMS P2 DATA10 U2 DATA3 AB16 AMS1
B12 PF6 H7 VDDEXT L7 VDDMEM P7 VDDMEM U7 VDDMEM AB17 ARE
B13 PF7 H8 VDDINT L8 VDDINT P8 VDDINT U8 VDDMEM AB18 CLKOUT
B14 PH3 H9 VDDINT L9 GND P9 GND U9 VDDMEM AB19 CLKBUF
B15 PF10 H10 VDDINT L10 GND P10 GND U10 VDDMEM AB20 USB_VBUS
B16 PF8 H11 VDDINT L11 GND P11 GND U11 VDDMEM AB21 USB_DM
B17 PF11 H12 VDDINT L12 GND P12 GND U12 VDDMEM AB22 VRSEL
B18 PF12 H13 VDDINT L13 GND P13 GND U13 VDDMEM AB23 USB_XTALIN
B19 PF13 H14 VDDINT L14 GND P14 GND U14 VDDMEM AC1 GND
B20 LHPOUT H15 VDDINT L15 GND P15 GND U15 VDDMEM AC2 ADDR14
B21 RHPOUT H16 VDDINT L16 VDDINT P16 VDDINT U16 VDDMEM AC3 ADDR12
B22 SCL H17 VDDEXT L17 VDDEXT P17 VDDEXT U17 VDDEXT AC4 ADDR10
ADSP-BF522C/ADSP-BF525C/ADSP-BF527CPreliminary Technical Data
Rev. PrB | Page 9 of 12 | June 2007
Figure 5 shows the top view of the mini-BGA ball configuration.
Figure 4 shows the bottom view of the mini-BGA
ball configuration.
Table 5. Thermal Characteristics (BC-289)
Parameter Condition Typical Unit
θ
JA
0 linear m/s air flow tbd C/W
θ
JMA
1 linear m/s air flow tbd C/W
θ
JMA
2 linear m/s air flow tbd C/W
θ
JB
tbd C/W
θ
JC
tbd C/W
Figure 4. 289-Ball Mini-BGA Ball Configuration (Top View)
TOP VIEW
A1 BALL
PAD CORNER
3456789 101112131415161 2 17 18 19 20 21 22 23
M
B
C
D
E
F
G
H
J
K
L
N
R
T
A
U
V
W
Y
AA
AB
AC
P
KEY:
V
DDINT GND
V
DDEXT I/O VDDMEM
AGND
AVDD
Rev. PrB | Page 10 of 12 | June 2007
ADSP-BF522C/ADSP-BF525C/ADSP-BF527C Preliminary Technical Data
Figure 5. 289-Ball Mini-BGA Ball Configuration (Bottom View)
KEY:
V
DDINT GND
V
DDEXT I/O VDDMEM
AGND
AVDD
BOTTOM VIEW
A1 BALL
PAD CORNER
345678910111213141516 1217181920212223
M
B
C
D
E
F
G
H
J
K
L
N
R
T
A
U
V
W
Y
AA
AB
AC
P
ADSP-BF522C/ADSP-BF525C/ADSP-BF527CPreliminary Technical Data
Rev. PrB | Page 11 of 12 | June 2007
OUTLINE DIMENSIONS
Dimensions in the outline dimension figures are shown in
millimeters.
SURFACE MOUNT DESIGN
Table 6 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
Figure 6. 289-Ball Chip Scale Package Ball Grid Array (Mini-BGA)
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MO-195, VARIATION AJ AND EXCEPTION TO PACKAGE HEIGHT
AND BALL HEIGHT.
3. MINIMUM BALL HEIGHT 0.20
CL
CL
0.5 BSC
BALL
PITCH
11.00 BSC SQ
TOP VIEW
A1 BALL
PAD CORNER
12.00 BSC SQ
SIDE VIEW
DETAIL A
DETAIL A
SEATING PLANE
0.35
0.30
0.25
BALL DIAMETER
0.08 MAX
COPLANARITY
0.20 MIN
BOTTOM VIEW
A1 BALL
PAD CORNER
M
B
C
D
E
F
G
H
J
K
L
N
R
T
A
345678910111213141516 12
289-BALL MINI BGA
(BC-289-2)
1.40
1.26
1.11
17181920212223
U
V
W
Y
AA
AB
AC
P
Table 6. BGA Data for Use with Surface Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
289-Ball Chip Scale Package Ball Grid Array (Mini-BGA) Solder Mask Defined 0.26 mm diameter 0.35 mm diameter
Rev. PrB | Page 12 of 12 | June 2007
ADSP-BF522C/ADSP-BF525C/ADSP-BF527C Preliminary Technical Data
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
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PR06876-0-6/07(PrB)
ORDERING GUIDE
Model
Temperature
Range
1
1
Referenced temperature is ambient temperature.
Package Description
Package
Option
Instruction
Rate (Max)
Operating Voltage
(Nom)
ADSPBF527KBCZENGC1 0ºC to +70ºC 289-Ball Chip Scale Package Ball Grid Array
(Mini-BGA)
BC-289 600 MHz tbd V internal, 1.8 V or 3.3 V I/O