Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC45 –
t1
P1P2P0Tape running direction
t2Chip component
Feeding hole Chip pocket
φD0
A
B
F
W
E
t2
φD0
P1P2P0
EF
W
B
A
t1
Tape running direction
Chip component
Feeding hole Chip pocket
t
K0P1P2P0
φD0
A
B
F
W
E
Tape running direction
Chip component
Feeding hole Chip pocket t
K0P1P2P0
φD0
A
B
F
W
E
Tape running direction
Chip component
Feeding hole Chip pocket
■Packaging Specifi cations
● Standard Packing Quantities
Style
Size
Paper Taping Embossed Taping
Tape Width
(mm) Pitch (mm) Quantity
(pcs./reel)
Tape Width
(mm) Pitch (mm) Quantity
(pcs./reel)
0201 0.3 8 2 15,000 — — —
04020.5 82 10,000 — — —
0603 0.45 8 4 4,000 — — —
0.8 8 4 4,000 — — —
0805
0.6 8 4 5,000 — — —
0.85 8 4 4,000 — — —
1.25 — — — 8 43,000
1206
0.85 8 4 4,000 — — —
1.15 — — — 8 43,000
1.6 — — — 8 4 2,000
1210 2.0 — — — 8 4 2,000
2.5 — — — 84 1,000
0504 0.6 8 4 4,000 — — —
0.8 8 4 4,000 — — —
0508 0.85 8 4 4,000 — — —
0612 0.85 8 4 4,000 — — —
Thickness
(mm)
φ330 reel and Bulk case Type: Please contact us.
● Paper Taping
2 mm (Pressed Carrier Taping): Size 0201
4 mm (Punched Carrier Taping):
Size 0603, 0805, 1206, 0504, 0508, 0612
2 mm (Punched Carrier Taping): Size 0402
ABWFEP
1P2P0φD0t1t2
0.62
±0.05 1.12
±0.05 8.0
±0.2 3.50
±0.05 1.75
±0.10 2.00
±0.05 2.00
±0.05 4.0
±0.1
1.5+0.1
0
0.7
max.
1.0
max.
Unit:mm Unit:mm
Size t
ABWFEP
1P2P0φD0t1t2
0603
0.45
0.8 1.05
±0.10 1.85
±0.10
8.0
±0.2 3.50
±0.05 1.75
±0.10 4.0
±0.1 2.00
±0.05 4.0
±0.1
1.5+0.1
0
1.1
max. 1.4
max.
0504
0.6
0.8 1.18
±0.10 1.63
±0.10
0805
0.6
0.85 1.65
±0.20 2.4
±0.2
0508
0.85
1206
0.85 2.0
±0.2 3.6
±0.2
0612
0.85
ABWFEP
1P2P0φD0tK
0
0.36
±0.03 0.66
±0.03 8.0
±0.2 3.50
±0.05 1.75
±0.10 2.00
±0.05 2.00
±0.05 4.0
±0.1
1.5+0.1
0
0.55
max. 0.36
±0.03
Unit:mm
2 mm (Pressed Carrier Taping): Size 0402✽
1
ABWFEP
1P2P0φD0tK
0
0.36
±0.03 0.66
±0.03 8.0
±0.2 3.50
±0.05 1.75
±0.10 2.00
±0.05 2.00
±0.05 4.0
±0.1
1.5+0.1
0
0.55
max. 0.36
±0.03
Unit:mmSize 0402
✽
1 The following value is applied as a dimensional tolerance :
+0.15/-0.05 mm (L, W and T).
Size 0201
Size 0402
01 Dec. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC46 –
E
C
D
A
B
W2
W1
100 min.
Vacant position
400 min.
Top cover tape
160 min.
Vacant position
t1
t2P1P2P0
F
B
W
E
A
φD0
Tape running direction
Chip component
Feeding hole Chip pocket
● Reel for Taping
Tape Width
ABCDEW
1W2
8
φ
180–3
φ60.0+1.0
13.0
±0.5
21.0
±0.8
2.0
±0.5 9.0+1.0 11.4
±1.0
Unit:mm
0
● Leader Part and Taped End
Leader part
Tape end
unit:mm
Unit:mm
Size t
ABWFEP
1P2P0φD0t1t2
0805
1.25 1.55
±0.20 2.35
±0.20
8.0
±0.2 3.50
±0.05 1.75
±0.10 4.0
±0.1 2.00
±0.05 4.0
±0.1
1.5+0.1
0
0.6
max.
2.5
max.
1206
1.15
1.6 1.9
±0.2 3.5
±0.2
1210
2.0
2.5 2.8
±0.2 3.5
max.
● Embossed Taping
00
01 Dec. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC47 –
0.1 1 10 100 1000 10000
0.01
0.1
1
10
100
1000
10000
100000
Frequency (MHz)
Impedance (액)
100 pF
10 pF 1pF
0.1 1 10 100 1000 10000
Frequency (MHz)
Impedance (액)
1
0.1
0.01
0.001
10
100
1000
10000
0.1 µF
0.01 µF
1000 pF
0.1 1 10 100 1000 10000 100000
1
0.1
0.01
0.001
10
100
1000
10000
Frequency (kHz)
Impedance (액)
Size 0402
1µF
Size 0603
10 µF
6
4
2
0
–2
–4
–6
–8
–30 –20 –10 0 10 20 30 405060708090
Capacitance Change (%)
Temp. (˚C)
CH(0±60 ppm/˚C)
SL(+350 to –1000 ppm/˚C)
–100
–80
–60
–40
–20
0
20
051015 20 25 30 35 40 45 50
Temp. Char. C∆(DC 50 V)
Temp. Char. B (DC 50 V)
Temp. Char. F (DC 50 V)
Capacitance Change (%)
DC Voltage (V)
20
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-60 -40 -20 0 20 40 60 80 100 120
Temp. Char. B
Temp. Char. F
Capacitance Change (%)
Temp. (˚C)
Temp. Char. F (DC 50 V)
Temp. Char. B (DC 50 V)
Temp. Char. C∆(DC 50 V)
–5
0
5
10
012345
Capacitance Change (%)
AC Voltage (V)
–40
–30
–20
–10
0
10
10 100 1000 10000 100000
Temp. Char. C∆
Temp. Char. B
Temp. Char. F
Capacitance Change (%)
Time (h)
■Temperature Characteristics [Ex.]
Class 1 (T.C. Type)
■Temperature Characteristics [Ex.]
Class 2 (Hi-K Type)
■Capacitance - DC bias Voltage [Ex.] ■Capacitance - AC Voltage [Ex.]
■Capacitance aging [Ex.] ■Impedance - Frequency [Ex.]
Class 1, Temp. Char. CH, Size 0402
■Impedance - Frequency [Ex.]
Class 2, Temp. Char. X5R, Size 0402 and 0603
■Impedance - Frequency [Ex.]
Class 2, Temp. Char. B, Size 0603
01 Dec. 2008
