LM4864
LM4864 725mW Audio Power Amplifier with Shutdown Mode
Literature Number: SNAS109E
LM4864
725mW Audio Power Amplifier with Shutdown Mode
General Description
The LM4864 is a bridged audio power amplifier capable of
delivering 725mW of continuous average power into an 8Ω
load with 1% THD+N from a 5V power supply.
Boomer®audio power amplifiers were designed specifically
to provide high quality output power from a low supply volt-
age while requiring a minimal amount of external compo-
nents. Since the LM4864 does not require output coupling
capacitors, bootstrap capacitors or snubber networks, it is
optimally suited for low-power portable applications.
The LM4864 features an externally controlled, low power
consumption shutdown mode, and thermal shutdown protec-
tion.
The closed loop response of the unity-gain stable LM4864
can be configured by external gain-setting resistors. The
device is available in multiple package types to suit various
applications.
Key Specifications
jP
O
at 1% THD+N with V
DD
= 5V, 1kHz
LM4864LD, 4Ωload 625mW (typ)
LM4864LD, 8Ωload 725mW (typ)
LM4864M & LM4864N
*
,8Ωload 675mW (typ)
LM4864MM, 8Ωload (Note 10) 300mW (typ)
LM4864, 16Ωload 550mW (typ)
jShutdown current 0.7µA (typ)
* Not recommended for new designs. Contact NSC Audio
Marketing.
Features
nMSOP, SOP, DIP
*
, and LD packaging
nNo output coupling capacitors, bootstrap capacitors, or
snubber circuits are necessary
nThermal shutdown protection circuitry
nUnity-gain stable
nExternal gain configuration capability
* Not recommended for new designs. Contact NSC Audio
Marketing.
Applications
nCellular phones
nPersonal computers
nGeneral purpose audio
Typical Application
Boomer®is a registered trademark of National Semiconductor Corporation.
01260701
FIGURE 1. Typical Audio Amplifier Application Circuit
September 2004
LM4864 725mW Audio Power Amplifier with Shutdown Mode
© 2004 National Semiconductor Corporation DS012607 www.national.com
Connection Diagrams
MSOP, SOP, and DIP Package
01260702
Top View
Order Number LM4864MM,
LM4864M or LM4864N
*
See NS Package Number MUA08A,
M08A or N08E
*
* Not recommended for new designs. Contact NSC Audio Marketing
LD Package
01260730
Top View
Order Number LM4864LD,
See NS Package Number LDA10A
DIE LAYOUT (B-STEP)
01260740
LM4864 MDC MWC
725MW AUDIO POWER AMPLIFIER WITH SHUTDOWN MODE
LM4864
www.national.com 2
Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage 6.0V
Storage Temperature −65˚C to +150˚C
Input Voltage −0.3V to V
DD
+
0.3V
Power Dissipation (Note 3) Internally limited
ESD Susceptibility (Note 4) 2000V
ESD Susceptibility (Note 5) 200V
Junction Temperature 150˚C
Soldering Information
Small Outline Package
Vapor Phase (60 sec.) 215˚C
Infrared (15 sec.) 220˚C
See AN-450 “Surface Mounting and their Effects on
Product Reliability” for other methods of soldering surface
mount devices.
Thermal Resistance
θ
JC
(MSOP) 56˚ C/W
θ
JA
(MSOP) 210˚C/W
θ
JC
(SOP) 35˚C/W
θ
JA
(SOP) 170˚C/W
θ
JC
(DIP)
*
37˚C/W
θ
JA
(DIP)
*
107˚C/W
θ
JA
(LD) (Note 11) 63˚C/W
θ
JC
(LD) (Note 11) 12˚C/W
* Not recommended for new designs. Contact NSC Audio
Marketing.
Operating Ratings
Temperature Range
T
MIN
≤T
A
≤T
MAX
−40˚C ≤T
A
≤
+85˚C
Supply Voltage 2.7V ≤V
DD
≤5.5V
Electrical Characteristics V
DD
=5V(Note 1) (Note 2)
The following specifications apply for V
DD
= 5V, for all available packages, unless otherwise specified. Limits apply for T
A
=
25˚C
Symbol Parameter Conditions
LM4864
Units
(Limits)
Typical
(Note 6)
Limit
(Notes 7,
8)
I
DD
Quiescent Power Supply Current V
IN
= 0V, I
O
= 0A (Note 9) 3.6 6.0 mA (max)
I
SD
Shutdown Current V
PIN1
=V
DD
0.7 5 µA (max)
V
OS
Output Offset Voltage V
IN
= 0V 5 50 mV (max)
P
O
Output Power THD = 1% (max);f=1kHz; R
L
=4Ω;
LM4864LD (Note 11)
625 mW (min)
THD = 1% (max);f=1kHz; R
L
=8Ω;
LM4864LD (Note 11)
725 mW (min)
THD = 1% (max);f=1kHz; R
L
=8Ω;
LM4864MM (Note 10)
300 mW (min)
THD = 1% (max);f=1kHz; R
L
=8Ω;
LM4864M and LM4864N
*
675 300 mW (min)
THD+N = 1%;f=1kHz; R
L
=16Ω; 550 mW
THD+N Total Harmonic Distortion+Noise P
O
= 300 mWrms; A
VD
=2;R
L
=8Ω;
20 Hz ≤f≤20 kHz, BW <80kHz 0.7 %
PSRR Power Supply Rejection Ratio V
DD
= 4.9V–5.1V 50 dB
* Not recommended for new designs. Contact NSC Audio Marketing.
Electrical Characteristics V
DD
=3V(Note 1) (Note 2)
The following specifications apply for V
DD
= 3V, for all available packages, unless otherwise specified. Limits apply for T
A
=
25˚C
Symbol Parameter Conditions
LM4864
Units
(Limits)
Typical
(Note 6)
Limit
(Notes 7,
8)
I
DD
Quiescent Power Supply Current V
IN
= 0V, I
O
= 0A (Note 9) 1.0 3.0 mA (max)
I
SD
Shutdown Current V
PIN1
=V
DD
0.3 2.0 µA (max)
LM4864
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Electrical Characteristics V
DD
=3V(Note 1) (Note 2) (Continued)
The following specifications apply for V
DD
= 3V, for all available packages, unless otherwise specified. Limits apply for T
A
=
25˚C
Symbol Parameter Conditions
LM4864
Units
(Limits)
Typical
(Note 6)
Limit
(Notes 7,
8)
V
OS
Output Offset Voltage V
IN
=0V 5 mV
P
O
Output Power THD = 1% (max);f=1kHz; R
L
=8Ω200 mW
THD = 1% (max);f=1kHz; R
L
=16Ω175 mW
THD+N Total Harmonic Distortion+Noise P
O
= 100 mWrms; A
VD
=2;R
L
=8Ω;
20 Hz ≤f≤20 kHz, BW <80 kHz 1.5 %
PSRR Power Supply Rejection Ratio V
DD
= 2.9V–3.1V 50 dB
Note 1: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature TA. The maximum
allowable power dissipation is PDMAX =(T
JMAX −T
A)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4864, TJMAX = 150˚C.
The typical junction-to-ambient thermal resistance, when board mounted, is 230˚C/W for package number MUA08A, 170˚C/W for package number M08A and is
107˚C/W for package number N08E*.
Note 4: Human body model, 100pF discharged through a 1.5kΩresistor.
Note 5: Machine Model, 220pF – 240pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 9: The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.
Note 10: The MUA08BA package is thermally limited to 595 mW of power dissipation at room temperature. Refering to the Power Dissipation vs Output Power
graph in the Typical Performance Characteristics section, the power dissipation limitation for the package occurs at 300 mW of output power. This package
limitation is based on 25˚C ambient temperature and θJA = 210˚C. For higher output power possibilities refer to the Power Dissipation Section.
Note 11: The LDA10A package has its exposed-DAP soldered to an exposed 1.2in2area of 1oz printed circuit board copper.
* Not recommended for new designs. Contact NSC Audio Marketing.
LM4864
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External Components Description (Figure 1)
Components Functional Description
1. R
i
Inverting input resistance which sets the closed-loop gain in conjunction with R
F
. This resistor also forms a
high pass filter with C
i
at f
c
= 1/(2πR
i
C
I
).
2. C
i
Input coupling capacitor which blocks the DC voltage at the amplifier’s input terminals. Also creates a
highpass filter with R
i
at f
c
= 1/(2πR
i
C
i
). Refer to the section, Proper Selection of External Components,
for an explanation of how to determine the value of C
i
.
3. R
F
Feedback resistance which sets the closed-loop gain in conjunction with R
i
.
4. C
S
Supply bypass capacitor which provides power supply filtering. Refer to the Power Supply Bypassing
section for information concerning proper placement and selection of the supply bypass capacitor.
5. C
B
Bypass pin capacitor which provides half-supply filtering. Refer to the Proper Selection of External
Components for information concerning proper placement and selection of C
B
.
Typical Performance Characteristics
THD+N vs Frequency THD+N vs Frequency
01260703 01260704
THD+N vs Frequency THD+N vs Frequency
01260705 01260706
LM4864
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Typical Performance Characteristics (Continued)
THD+N vs Frequency THD+N vs Frequency
01260707 01260708
THD+N vs Output Power THD+N vs Output Power
01260709 01260710
THD+N vs Output Power THD+N vs Output Power
01260711 01260712
LM4864
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Typical Performance Characteristics (Continued)
THD+N vs Output Power THD+N vs Output Power
01260713 01260714
Output Power vs
Supply Voltage
Output Power vs
Supply Voltage
01260715 01260716
Output Power vs
Supply Voltage
Output Power vs
Load Resistance
01260717 01260718
LM4864
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Typical Performance Characteristics (Continued)
Power Dissipation vs
Output Power Power Derating Curve
01260719 01260720
Dropout Voltage vs
Supply Voltage Noise Floor
01260721 01260722
Frequency Response vs
Input Capacitor Size
Power Supply
Rejection Ratio
01260723 01260724
LM4864
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Typical Performance Characteristics (Continued)
Open Loop
Frequency Response
Supply Current vs
Supply Voltage
01260725 01260726
Typical Performance Characteristics for the LM4864LD (Note 11)
THD+N vs Frequency THD+N vs Frequency
01260731 01260732
THD+N vs Power Out THD+N vs Power Out
01260733 01260734
LM4864
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Application Information
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4864 has two operational
amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier’s gain is externally config-
urable, while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-loop gain of
the first amplifier is set by selecting the ratio of R
F
to R
i
while
the second amplifier’s gain is fixed by the two internal 10kΩ
resistors. Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results in both
amplifiers producing signals identical in magnitude, but out
of phase 180˚. Consequently, the differential gain for the IC
is
A
VD
= 2*(R
F
/R
i
)
By driving the load differentially through outputs V
o1
and V
o2
,
an amplifier configuration commonly referred to as “bridged
mode” is established. Bridged mode operation is different
from the classical single-ended amplifier configuration where
one side of its load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same con-
ditions. This increase in attainable output power assumes
that the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing ex-
cessive clipping, please refer to the Audio Power Amplifier
Design section.
A bridge configuration, such as the one used in LM4864,
also creates a second advantage over single-ended amplifi-
ers. Since the differential outputs, V
o1
and V
o2
, are biased at
half-supply, no net DC voltage exists across the load. This
eliminates the need for an output coupling capacitor which is
required in a single supply, single-ended amplifier configura-
tion. If an output coupling capacitor is not used in a single-
ended configuration, the half-supply bias across the load
would result in both increased internal lC power dissipation
as well as permanent loudspeaker damage.
POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. Equation 1 states the maximum power dissi-
pation point for a bridge amplifier operating at a given supply
voltage and driving a specified output load.
P
DMAX
=(V
DD
)
2
/(2π
2
R
L
) Single-Ended (1)
However, a direct consequence of the increased power de-
livered to the load by a bridge amplifier is an increase in
internal power dissipation point for a bridge amplifier oper-
ating at the same conditions.
P
DMAX
= 4(V
DD
)
2
/(2π
2
R
L
) Bridge Mode (2)
Since the LM4864 has two operational amplifiers in one
package, the maximum internal power dissipation is 4 times
that of a single-ended amplifier. Even with this substantial
increase in power dissipation, the LM4864 does not require
heatsinking. From Equation 1, assuming a 5V power supply
and an 8Ωload, the maximum power dissipation point is
633 mW. The maximum power dissipation point obtained
from Equation 2 must not be greater than the power dissi-
pation that results from Equation 3:
P
DMAX
=(T
JMAX
−T
A
)/θ
JA
(3)
For package MUA08A, θ
JA
= 210˚C/W, for package M08A,
θ
JA
= 170˚C/W, for package N08E, θ
JA
= 107˚C/W, and for
package LDA10A, θ
JA
= 63˚C/W. T
JMAX
= 150˚C for the
LM4864. Depending on the ambient temperature, T
A
,ofthe
system surroundings, Equation 3 can be used to find the
maximum internal power dissipation supported by the IC
packaging. If the result of Equation 2 is greater than that of
Equation 3, then either the supply voltage must be de-
creased, the load impedance increased, the ambient tem-
perature reduced, or the θ
JA
reduced with heatsinking. In
many cases larger traces near the output, V
DD
, and GND
pins can be used to lower the θ
JA
. The larger areas of copper
provide a form of heatsinking allowing a higher power dissi-
pation. For the typical application of a 5V power supply, with
an 8Ωload, the maximum ambient temperature possible
without violating the maximum junction temperature is ap-
proximately 44˚C provided that device operation is around
the maximum power dissipation point and assuming surface
mount packaging. Internal power dissipation is a function of
output power. If typical operation is not around the maximum
power dissipation point, the ambient temperature can be
increased. Refer to the Typical Performance Characteris-
tics curves for power dissipation information for lower output
powers.
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATION
The LM4864’s exposed-dap (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air.
The LD package should have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad may be con-
nected to a large plane of continuous unbroken copper. This
plane forms a thermal mass, heat sink, and radiation area.
Further detailed and specific information concerning PCB
layout, fabrication, and mounting an LD (LLP) package is
available from National Semiconductor’s Package Engineer-
ing Group under application note AN1187.
POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is
critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and
power supply pins should be as close to the device as
possible. The effect of a larger half supply bypass capacitor
is improved PSRR due to increased half-supply stability.
Typical applications employ a 5V regulator with 10 µF and a
0.1 µF bypass capacitors which aid in supply stability, but do
not eliminate the need for bypassing the supply nodes of the
LM4864. The selection of bypass capacitors, especially C
B
,
is thus dependent upon desired PSRR requirements, click
and pop performance as explained in the section, Proper
Selection of External Components, system cost, and size
constraints.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the
LM4864 contains a shutdown pin to externally turn off the
amplifier’s bias circuitry. This shutdown feature turns the
amplifier off when a logic high is placed on the shutdown pin.
The trigger point between a logic low and logic high level is
typically half supply. It is best to switch between ground and
supply to provide maximum device performance. By switch-
ing the shutdown pin to V
DD
, the LM4864 supply current
LM4864
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Application Information (Continued)
draw will be minimized in idle mode. While the device will be
disabled with shutdown pin voltages less than V
DD
, the idle
current may be greater than the typical value of 0.7 µA. In
either case, the shutdown pin should be tied to a definite
voltage to avoid unwanted state changes.
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry which pro-
vides a quick, smooth transition into shutdown. Another so-
lution is to use a single-pole, single-throw switch in conjunc-
tion with an external pull-up resistor. When the switch is
closed, the shutdown pin is connected to ground and en-
ables the amplifier. If the switch is open, then the external
pull-up resistor will disable the LM4864. This scheme guar-
antees that the shutdown pin will not float, thus preventing
unwanted state changes.
PROPER SELECTION OF EXTERNAL COMPONENTS
Proper selection of external components in applications us-
ing integrated power amplifiers is critical to optimize device
and system performance. While the LM4864 is tolerant to a
variety of external component combinations, consideration
to component values must be used to maximize overall
system quality.
The LM4864 is unity-gain stable, giving a designer maximum
system flexibility. The LM4864 should be used in low gain
configurations to minimize THD+N values, and maximize the
signal to noise ratio. Low gain configurations require large
input signals to obtain a given output power. Input signals
equal to or greater than 1 Vrms are available from sources
such as audio codecs. Please refer to the section, Audio
Power Amplifier Design, for a more complete explanation
of proper gain selection.
Besides gain, one of the major considerations is the closed-
loop bandwidth of the amplifier. To a large extent, the band-
width is dictated by the choice of external components
shown in Figure 1. The input coupling capacitor, C
i
, forms a
first order high pass filter which limits low frequency re-
sponse. This value should be chosen based on needed
frequency response for a few distinct reasons.
Selection of Input Capacitor Size
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenu-
ation. But in many cases the speakers used in portable
systems, whether internal or external, have little ability to
reproduce signals below 150 Hz. In this case using a large
input capacitor may not increase system performance.
In addition to system cost and size, click and pop perfor-
mance is effected by the size of the input coupling capacitor,
C
i
. A larger input coupling capacitor requires more charge to
reach its quiescent DC voltage (nominally
1
⁄
2
V
DD
). This
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
Besides minimizing the input capacitor size, careful consid-
eration should be paid to the bypass capacitor value. Bypass
capacitor, C
B
, is the most critical component to minimize
turn-on pops since it determines how fast the LM4864 turns
on. The slower the LM4864’s outputs ramp to their quiescent
DC voltage (nominally
1
⁄
2
V
DD
), the smaller the turn-on pop.
Choosing C
B
equal to 1.0 µF along with a small value of C
i
(in the range of 0.1 µF to 0.39 µF), should produce a click-
less and popless shutdown function. While the device will
function properly, (no oscillations or motorboating), with C
B
equal to 0.1 µF, the device will be much more susceptible to
turn-on clicks and pops. Thus, a value of C
B
equal to 1.0 µF
or larger is recommended in all but the most cost sensitive
designs.
AUDIO POWER AMPLIFIER DESIGN
Design a 300 mW/8ΩAudio Amplifier
Given:
Power Output 300 mWrms
Load Impedance 8Ω
Input Level 1 Vrms
Input Impedance 20 kΩ
Bandwidth 100 Hz–20 kHz ±0.25 dB
A designer must first determine the minimum supply rail to
obtain the specified output power. By extrapolating from the
Output Power vs Supply Voltage graphs in the Typical Per-
formance Characteristics section, the supply rail can be
easily found. A second way to determine the minimum sup-
ply rail is to calculate the required V
opeak
using Equation 4
and add the dropout voltage. Using this method, the mini-
mum supply voltage would be (V
opeak
+ (2*V
OD
)), where V
OD
is extrapolated from the Dropout Voltage vs Supply Voltage
curve in the Typical Performance Characteristics section.
(4)
Using the Output Power vs Supply Voltage graph for an 8Ω
load, the minimum supply rail is 3.5V. But since 5V is a
standard supply voltage in most applications, it is chosen for
the supply rail. Extra supply voltage creates headroom that
allows the LM4864 to reproduce peaks in excess of 500 mW
without producing audible distortion. At this time, the de-
signer must make sure that the power supply choice along
with the output impedance does not violate the conditions
explained in the Power Dissipation section.
Once the power dissipation equations have been addressed,
the required differential gain can be determined from Equa-
tion 5.
(5)
R
F
/R
i
=A
VD
/2 (6)
From Equation 5, the minimum A
VD
is 1.55; use A
VD
=2.
Since the desired input impedance was 20 kΩ, and with a
A
VD
of 2, a ratio of 1:1 of R
F
to R
i
results in an allocation of
R
i
=R
F
=20kΩ. The final design step is to address the
bandwidth requirements which must be stated as a pair of
−3 dB frequency points. Five times away from a pole gives
0.17 dB down from passband response which is better than
the required ±0.25 dB specified.
f
L
= 100 Hz/5 = 20 Hz
f
H
=20kHzx5=100kHz
As stated in the External Components section, R
i
in con-
junction with C
i
create a highpass filter.
C
i
≥1/(2π*20 kΩ*20 Hz) = 0.397 µF; use 0.39 µF
LM4864
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Application Information (Continued)
The high frequency pole is determined by the product of the
desired high frequency pole, f
H
, and the differential gain,
A
VD
. With a A
VD
= 2 and f
H
= 100 kHz, the resulting GBWP
= 100 kHz which is much smaller than the LM4864 GBWP of
18 MHz. This figure displays that if a designer has a need to
design an amplifier with a higher differential gain, the
LM4864 can still be used without running into bandwidth
problems.
LM4864LD DEMO BOARD ARTWORK
01260737
Silk Screen View of LM4864LD 01260738
Top Layer of LM4864LD
01260739
Bottom Layer of LM4864LD
LM4864
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LM4864 MDC MWC
725MW Audio Power Amplifier With Shutdown Mode
01260740
Die Layout (B - Step)
DIE/WAFER CHARACTERISTICS
Fabrication Attributes General Die Information
Physical Die Identification LM4862B Bond Pad Opening Size (min) 86µm x 86µm
Die Step B Bond Pad Metalization ALUMINUM
Physical Attributes Passivation NITRIDE
Wafer Diameter 150mm Back Side Metal Bare Back
Dise Size (Drawn) 1283µm x 952µm
51mils x 37mils
Back Side Connection GND
Thickness 406µm Nominal
Min Pitch 117µm Nominal
Special Assembly Requirements:
Note: Actual die size is rounded to the nearest micron.
Die Bond Pad Coordinate Locations (B - Step)
(Referenced to die center, coordinates in µm) NC = No Connection
SIGNAL NAME PAD# NUMBER X/Y COORDINATES PAD SIZE
XYX Y
BYPASS 1 -322 523 86 x 86
GND 2 -359 259 86 x 188
INPUT + 3 -359 5 86 x 86
GND 4 -359 -259 86 x 188
NC 5 -323 -523 86 x 86
INPUT - 6 -109 -523 86 x 86
VOUT 1 7 8 -523 86 x 86
VDD 8 358 -78 86 x 188
GND 9 358 141 86 x 188
NC 10 359 406 86 x 86
NC 11 323 523 86 x 86
VOUT 2 12 8 523 86 x 86
SHUTDOWN 13 -109 523 86 x 86
LM4864
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LM4864 MDC MWC
725MW Audio Power Amplifier With Shutdown Mode (Continued)
IN U.S.A
Tel #: 1 877 Dial Die 1 877 342 5343
Fax: 1 207 541 6140
IN EUROPE
Tel: 49 (0) 8141 351492 / 1495
Fax: 49 (0) 8141 351470
IN ASIA PACIFIC
Tel: (852) 27371701
IN JAPAN
Tel: 81 043 299 2308
LM4864
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Physical Dimensions inches (millimeters) unless otherwise noted
8-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number LM4864M
NS Package Number M08A
LM4864
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
8-Lead (0.300" Wide) Molded Dual-In-Line Package
Order Number LM4864N
*
NS Package Number N08E
*
* Not recommended for new designs. Contact NSC Audio Marketing.
8-Lead (0.118" Wide) Molded Mini Small Outline Package
Order Number LM4864MM
NS Package Number MUA08A
LM4864
www.national.com17
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
Order Number LM4864LD
NS Package Number LDA10A
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www.national.com
LM4864 725mW Audio Power Amplifier with Shutdown Mode
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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