2004 Microchip Technology Inc. DS51194K
MPLAB® ICE 2000/4000
TRANSITION SOCKET
SPECIFICATION
DS51194K-page ii 2004 Microchip Technology Inc.
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Printed on recycled paper. 11/12/04
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2004 Microchip Technology Inc. DS51194K-page iii
PDIP Transition Socket
XLT28XP
28-lead DIP 0.300-inch Male to 0.600-inch Female Adapter Socket ............................................................................. 2
SOIC Transition Socket
XLT08SO
8-lead DIP to 0.050-inch Adapter Socket ....................................................................................................................... 3
8-lead SOIC Header ...................................................................................................................................................... 3
XLT14SO
14-lead DIP to 0.050-inch Adapter Socket ..................................................................................................................... 4
14-lead SOIC Header .................................................................................................................................................... 4
XLT18SO
18-lead DIP to 0.050-inch Adapter Socket ..................................................................................................................... 4
18-lead SOIC Header ................................................................................................................................................... 4
XLT20SO1
20-lead DIP to 0.050-inch Adapter Socket ..................................................................................................................... 5
20-lead SOIC Header ................................................................................................................................................... 5
XLT28SO
28-lead DIP to 0.050-inch Adapter Socket ..................................................................................................................... 5
28-lead SOIC Header .................................................................................................................................................... 5
SSOP Transition Socket
XLT14SS
14-lead DIP to 0.8 mm Adapter Socket .......................................................................................................................... 6
14-lead SSOP Header ................................................................................................................................................... 6
XLT20SS
18-lead DIP to 0.8 mm Adapter Socket .......................................................................................................................... 7
20-lead SSOP Header ................................................................................................................................................... 7
XLT20SS1
20-lead DIP to 0.8 mm Adapter Socket .......................................................................................................................... 7
20-lead SSOP Header ................................................................................................................................................... 7
XLT28SS, XLT28SS2
28-lead DIP to 0.8 mm Adapter Socket .......................................................................................................................... 8
28-lead SSOP Header ................................................................................................................................................... 8
PLCC Transition Socket
XLT44L2, XLT68L1, XLT84L1
44/68/84-lead Transition Socket Top ........................................................................................................................... 10
44/68/84-lead Transition Socket Side .......................................................................................................................... 10
MQFP/TQFP Transition Socket
XLT44PT
44-lead QFP to 0.8 mm Adapter Socket Top ............................................................................................................... 12
44-lead QFP to 0.8 mm Adapter Socket Side .............................................................................................................. 12
XLT64PT1, XLT64PT2, XLT80PT
64/80-lead QFP to 0.5 mm Adapter Socket Top .......................................................................................................... 12
64/80-lead QFP to 0.5 mm Adapter Socket Side ......................................................................................................... 12
TRANSITION SOCKET
SPECIFICATION
Table of Contents
MPLAB® ICE 2000/4000
DS51194K-page iv 2004 Microchip Technology Inc.
XLT64PT3
64-lead QFP to 0.8mm Adapter Socket Top ................................................................................................................ 13
64-lead QFP to 0.8mm Adapter Socket Side ............................................................................................................... 13
XLT44PT3, XLT64PT4
44/64-lead QFP to 0.8 mm Adapter Socket Top .......................................................................................................... 13
44/64-lead QFP to 0.8 mm Adapter Socket Side ......................................................................................................... 13
XLT64PT5, XLT80PT3
64/80-lead QFP to 0.5 mm Adapter Socket Top .......................................................................................................... 14
64/80-lead QFP to 0.5 mm Adapter Socket Side ......................................................................................................... 14
XLT80PT2
80-lead QFP to 0.65 mm Adapter Socket Top ............................................................................................................. 14
80-lead QFP to 0.65 mm Adapter Socket Side ............................................................................................................ 14
SOT/DFN/QFN Transition Sockets
XLT06SOT
6-lead SOT-23 to 0.80-inch Adapter Socket ................................................................................................................ 17
XLT08DFN2
8/14-lead DIP to 0.025-inch Adapter Socket ................................................................................................................ 17
XLT28QFN3, XLT28QFN4, XLT44QFN2, XLT44QFN3
28/44-lead DIP to 0.025-inch Adapter Socket Top ....................................................................................................... 18
28/44-lead DIP to 0.025-inch Adapter Socket Side and Cables ................................................................................... 18
XLT08DFN (Discontinued - see XLT08DFN2)
8-lead DIP to 0.025-inch Adapter Socket ..................................................................................................................... 19
XLT28QFN (Discontinued - see XLT28QFN4)
28-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 19
XLT28QFN (Discontinued - see XLT28QFN4)
28-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 20
XLT28QFN2 (Discontinued - see XLT28QFN3)
18-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 20
XLT44QFN (Discontinued - see XLT44QFN2)
40-lead DIP to 0.025-inch Adapter Socket ................................................................................................................... 21
44-lead QFN Header .................................................................................................................................................... 21
2004 Microchip Technology Inc. DS51194K-page 1
INTRODUCTION
Transition sockets are devices that allow MPLAB® ICE
2000 and MPLAB ICE 4000 device adapters to inter-
face to sockets on customer products that differ from
the standard emulator adapter connection.
Embedded microcontrollers/microprocessors come in
many different types of IC packages, (i.e., DIP, PLCC,
SOIC, SSOP, MQFP, etc.). Typically, development
cycle components are EPROM based and, as a result,
are provided in larger windowed package formats such
as DIP or PLCC. Production components are primarily
preprogrammed ROM, OTP or Flash-based and are
often in very compact SOIC, SSOP, MQFP or PQFP
package formats.
The MPLAB ICE solution is transition sockets. A
transition socket is specifically designed to provide
compatibility between two differing types of IC package
formats.
Transition sockets are typically composed of two parts:
the DIP adapter socket and the SOIC/SSOP header.
The DIP adapter socket is designed to plug into the
emulator system’s DIP device adapter on one side and
the header on the other. The header is then soldered
down to the target application.
The QFP Adapter is a single part soldered directly to
the target application and fits into the QFP device
adapter.
WHY SHOULD I USE TRANSITION
SOCKETS IN MY PRODUCT DESIGN?
There are two very significant advantages to using
transition sockets:
1. Shorter product development cycle.
2. Reduced expense in the design, layout and
prototype testing.
A typical product design cycle has two important
phases: the prototype design phase and the production
design phase. Traditionally, these phases were differ-
ent simply because the prototype used a microcontrol-
ler with a different package type. However, with the
availability of the transition sockets, the prototype
design can be identical to the production design
because a transition socket can be used to bridge the
microcontroller package differences.
WHAT TRANSITION SOCKETS ARE
CURRENTLY AVAILABLE?
Microchip Technology currently offers the transition
sockets listed in the Table of Contents following this
introductory section.
The Product Line Card (DS00148) lists the transition
sockets available for each device adapter of the
MPLAB ICE 2000 or 4000 System. For more on
MPLAB ICE 2000 device adapters, see the MPLAB
ICE 2000 Processor Module and Device Adapter
Specification (DS51140). For more on MPLAB ICE
4000 device adapters, see the MPLAB ICE 4000
Processor Module and Device Adapter Specification
(DS51298).
Please check the Microchip web site
(www.microchip.com) for the most current version of all
documents.
HOW CAN I OBTAIN MAXIMUM
BENEFIT FROM THE USE OF
TRANSITION SOCKETS?
Attention to component placement should be
considered to provide adequate clearance for the
transition socket interface to the PCB footprint. This is
especially true for any tall components such as connec-
tor headers, radial components or voltage regulators.
Refer to the transition socket mechanical drawings for
dimensions.
Transition Socket Specification
MPLAB® ICE 2000/4000
MPLAB® ICE 2000/4000
DS51194K-page 2 2004 Microchip Technology Inc.
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
Attention to component placement should be consid-
ered in mating the adapter sockets to the SOIC/SSOP
headers. If visual alignment is difficult in your applica-
tion, C-shaped end brackets have been included to aid
in header-to-adapter socket alignment. Clip the
brackets onto the SOIC/SSOP header.
The placement of via’s around the Surface Mount
Technology (SMT) layout area should be examined.
Via’s immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Via’s should be placed along the centerline of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
The SOIC header is designed for SOIC body width of
0.300-inch, the adapter leads should be cut to fit the
0.150-inch and 0.208-inch SOIC body widths.
For information on packaging dimensions, please refer
to DS00049.
PDIP TRANSITION SOCKET
A PDIP transition socket and associated hardware is
shown in Figure 1.
FIGURE 1: PDIP TRANSITION SOCKET
The PDIP transition socket is a 0.300-inch Male to
0.600-inch Female adapter socket.
Microchip offers the following PDIP transition socket:
• XLT28XP: One 28-lead PDIP adapter socket and
two 28-lead gold stand-offs
See the drawings in this section for layout dimensions.
XLT28XP
28-lead DIP 0.300-inch Male to 0.600-inch Female
Adapter Socket
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/Adapters
0.300-inch Male to 0.600-inch Female Adapter Socket
Target/Application Board
(PDIP Transition Socket)
0.300"
0.100"
0.600"
1.400"
0.700"
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
2004 Microchip Technology Inc. DS51194K-page 3
Transition Socket Specification
SOIC TRANSITION SOCKET
An SOIC transition socket and associated hardware is
shown in Figure 2.
FIGURE 2: SOIC TRANSITION SOCKET
There are two components of the SOIC transition
socket.
1. Adapter socket that connects to the PDIP device
adapter.
2. SOIC header that is to be soldered down to the
target application.
Microchip offers the following SOIC transition sockets:
• XLT08SO: One adapter socket and three 8-lead
SOIC headers
• XLT14SO: One adapter socket and three 14-lead
SOIC headers
• XLT18SO: One adapter socket and three 18-lead
SOIC headers
• XLT20SO1: One adapter socket and three
20-lead SOIC headers
• XLT28SO: One adapter socket and three 28-lead
SOIC headers
See the drawings in this section for layout dimensions.
XLT08SO
8-lead DIP to 0.050-inch Adapter Socket
8-lead SOIC Header
Note: The SOIC header is designed for SOIC
body width of 0.300 inch. The adapter
leads should be cut to fit the 0.150-inch
and 0.208-inch SOIC body widths.
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapter Socket
SOIC Header Target/Application Board
SOIC Transition Socket
Adapters
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inch.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
TOP
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
ABCDEFG
0.060 0.410 0.050 0.075 0.178 0.050 0.050
MPLAB® ICE 2000/4000
DS51194K-page 4 2004 Microchip Technology Inc.
XLT14SO
14-lead DIP to 0.050-inch Adapter Socket
14-lead SOIC Header
XLT18SO
18-lead DIP to 0.050-inch Adapter Socket
18-lead SOIC Header
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
TOP
VIEW
SIDE
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inch.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
FRONT/
REAR
VIEW
ABCDEFG
0.060 0.410 0.050 0.075 0.178 0.050 0.050
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
TOP
VIEW
SIDE
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inches.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
FRONT/
REAR
VIEW
ABCDEFG
0.060 0.410 0.050 0.075 0.178 0.050 0.050
2004 Microchip Technology Inc. DS51194K-page 5
Transition Socket Specification
XLT20SO1
20-lead DIP to 0.050-inch Adapter Socket
20-lead SOIC Header
XLT28SO
28-lead DIP to 0.050-inch Adapter Socket
28-lead SOIC Header
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
TOP
VIEW
SIDE
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inches.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
FRONT/
REAR
VIEW
ABCDEFG
0.060 0.410 0.050 0.075 0.178 0.050 0.050
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
TOP
VIEW
SIDE
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
The SOIC header is designed for an SOIC body width of
0.300 inches.
The adapter leads should be cut to fit the 0.150-inch and
0.208-inch SOIC body widths.
FRONT/
REAR
VIEW
ABCDEFG
0.060 0.410 0.050 0.075 0.178 0.050 0.050
MPLAB® ICE 2000/4000
DS51194K-page 6 2004 Microchip Technology Inc.
SSOP TRANSITION SOCKET
An SSOP transition socket and associated hardware is
shown in Figure 3.
FIGURE 3: SSOP TRANSITION SOCKET
The SSOP transition sockets are similar to the SOIC
transition sockets. There are two parts to the SSOP
transition socket:
1. Adapter socket that connects to the PDIP device
adapter.
2. SSOP header that gets soldered down to the
target application.
Microchip offers the following SSOP transition sockets:
• XLT14SS: One adapter socket and three 14-lead
SSOP headers
• XLT20SS: One adapter socket and three 20-lead
SSOP headers
• XLT20SS1: One adapter socket and three 20-lead
SSOP headers
• XLT28SS: One adapter socket and three 28-lead
SSOP headers
• XLT28SS2: One adapter socket and three 28-lead
SSOP headers for PIC16C55/57
See the drawings in this section for layout dimensions
and clearances for tall components.
XLT14SS
14-lead DIP to 0.8 mm Adapter Socket
14-lead SSOP Header
Note: To keep the leads straight during assembly
and shipping, the SSOP headers are
shipped with break-away tabs attached to
the leads. Please remove the break-away
tabs before applying power to the target
system. Be careful not to bend the leads
prior to soldering to the target application.
Cable to Processor Module
PDIP Device Adapter
Adapter Socket
SSOP Header Target/Application Board
SSOP Transition Socket
Gold Standoffs/
Adapters
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
Shipped with
break-away tabs
attached to leads
Remove prior to
providing power
* Top drawing shown
with clip-on shrouds
installed
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
Break away tabs are to be removed prior to providing power.
TOP
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
ABCDEFG
0.035 0.300 0.023 0.080 0.186 0.043 0.025
2004 Microchip Technology Inc. DS51194K-page 7
Transition Socket Specification
XLT20SS
18-lead DIP to 0.8 mm Adapter Socket
20-lead SSOP Header
XLT20SS1
20-lead DIP to 0.8 mm Adapter Socket
20-lead SSOP Header
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
Shipped with
break-away tabs
attached to leads
Remove prior to
providing power
* Top drawing shown
with clip-on shrouds
installed
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
Break away tabs are to be removed prior to providing power.
TOP
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
ABCDEF G
0.040 0.295 0.026 0.075 0.190 0.047 0.0315
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
Shipped with
break-away tabs
attached to leads
Remove prior to
providing power
* Top drawing shown
with clip-on shrouds
installed
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN
INCHES.
Break away tabs are to be removed prior to providing power.
TOP
VIEW
SIDE
VIEW
FRONT/
REAR
VIEW
ABCDEF G
0.040 0.295 0.026 0.075 0.190 0.047 0.0315
MPLAB® ICE 2000/4000
DS51194K-page 8 2004 Microchip Technology Inc.
XLT28SS, XLT28SS2
28-lead DIP to 0.8 mm Adapter Socket
28-lead SSOP Header
TOP
VIEW
SIDE
VIEW
REAR
VIEW
FRONT/
BOTTOM
VIEW
A
B
C
D
E
F
G
Shipped with
break-away tabs
attached to leads
Remove prior to
applying power.
* Top drawing
shown with clip-on
shrouds installed
TOP
VIEW
FRONT/
REAR
SIDE
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Break away tabs are to be removed prior to applying
power.
VIEW
ABCDEF G
0.040 0.295 0.026 0.075 0.190 0.047 0.0315
2004 Microchip Technology Inc. DS51194K-page 9
Transition Socket Specification
PLCC TRANSITION SOCKET
A PLCC transition socket and associated hardware is
shown in Figure 4.
FIGURE 4: PLCC TRANSITION SOCKET
The PLCC transition socket is required for use along
with the PLCC device adapters. The DAF18-1 device
adapter is equipped with eight socket strips that inter-
face with one of two transition sockets. The DAF18-3
device adapter is equipped with four socket strips that
interface with one transition socket.
The PLCC transition sockets are designed with a
threaded insert in the center of the footprint so that a
4/40 screw can securely fasten the transition socket to
the device adapter.
The PLCC transition sockets are designed to be sol-
dered to the target PCB PLCC surface mount pattern or
inserted into a PLCC socket on the target PCB.
Microchip offers the following PLCC transition sockets:
• XLT44L2: One 44-lead PLCC transition socket
• XLT68L1: One 68-lead PLCC transition socket
• XLT84L1: One 84-lead PLCC transition socket
RECOMMENDED PCB LAYOUT
Note: To avoid solder bridging, do not place via’s
within 0.025-inch of the PLCC footprint.
Also, any via’s near the PLCC should be
directly on the centerline of the pad.
Cable to Processor Module
PLCC Device Adapter
PLCC Transition Socket
Target/Application Board
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 68-lead.
D1
D2
D3 D4
D1 D2 D3 D4
44-lead 0.865 0.024 0.050 0.074
68-lead 1.025 0.024 0.050 0.074
84-lead 1.225 0.024 0.050 0.074
MPLAB® ICE 2000/4000
DS51194K-page 10 2004 Microchip Technology Inc.
XLT44L2, XLT68L1, XLT84L1
44/68/84-lead Transition Socket Top
44/68/84-lead Transition Socket Side
Tooling hole with
#4-40 threaded insert.
A
BA
TOP VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 68-lead.
AB
44-lead* 1.100 0.800
68-lead 1.300 0.960
84-lead 1.400 1.160
*Caution: Pin 1 on the device adapter side (top of socket)
is 180 degrees from pin 1 on the target side (bottom of
socket.)
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 68-lead.
SIDE
VIEW
CD
EF
GH
CDEFGH
44-lead 0.050 0.018 0.050 0.017 0.850 0.588
68-lead 0.050 0.018 0.050 0.017 0.849 0.580
84-lead 0.050 0.018 0.050 0.017 0.849 0.580
2004 Microchip Technology Inc. DS51194K-page 11
Transition Socket Specification
MQFP/TQFP TRANSITION SOCKET
MQFP/TQFP transition sockets and associated hard-
ware is shown below.
FIGURE 5: MQFP/TQFP TRANSITION
SOCKET
FIGURE 6: MQFP/TQFP TWO-PART
TRANSITION SOCKET
The MQFP/TQFP transition socket is required for use
along with the MQFP/TQFP device adapters. The
device adapter is equipped with four socket strips that
interface with the transition socket.
Microchip offers the following MQFP/TQFP transition
sockets:
• XLT44PT: One 44-lead MQFP/TQFP transition
socket, 0.80 mm
• XLT44PT3: One 44-lead two-part MQFP/TQFP
transition socket, 0.80 mm
• XLT64PT1: One 64-lead MQFP/TQFP transition
socket, 0.5 mm (PIC16C92X)
• XLT64PT2: One 64-lead MQFP/TQFP transition
socket, 0.5 mm (PIC17CXXX)
• XLT64PT3: One 64-lead MQFP/TQFP transition
socket, 0.8 mm (dsPIC30F)
• XLT64PT4: One 64-lead MQFP/TQFP two-part
transition socket, 0.8 mm
• XLT64PT5: One 64-lead MQFP/TQFP two-part
transition socket, 0.5 mm
• XLT80PT: One 80-lead MQFP/TQFP transition
socket, 0.5 mm
• XLT80PT2: One 80-lead MQFP/TQFP two-part
transition socket, 0.65 mm
• XLT80PT3: One 80-lead MQFP/TQFP two-part
transition socket, 0.5 mm
See the drawings in this section for layout dimensions
and clearances for tall components.
TQFP TRANSITION SOCKET
SOLDERING TIPS
• Before soldering, consider keeping the break
away tabs in place during soldering.
• Use controlled soldering iron tip temperatures
between 300°C and 325°C (570°F to 615°F)
• If possible, use a PACE mini wave soldering iron
tip or an equivalent tip design.
• Plan to solder one (1 of 4) side first, then the
opposite side, then remaining two sides.
• Soldering iron tip movement should be in direction
of the leads (backward and forward), not across
the leads; dragging the tip across the leads may
cause lead damage.
• Use generous amounts of soldering flux to aid in
the solder flow action.
• If the breakaway tabs are removed after soldering
(using a dental pick or equivalent), any solder
bridging between leads can be repaired by simply
gently touching the soldering tip to the lead tip.
Note: To avoid solder bridging, do not place via’s
within 0.025-inch of the MQFP/TQFP foot-
print. Also, any via’s near the MQFP/TQFP
should be directly on the centerline of the
pad.
Cable to Processor Module
MQFP/TQFP Device Adapter
MQFP/TQFP Transition Socket
Target/Application Board
Cable to Processor Module
MQFP/TQFP Device Adapter
MQFP/TQFP Transition Socket
Target/Application Board
Note: The XLT64PT1 for the PIC16C92X is not
symmetrical. Please note Pin 1 orientation
prior to soldering to the target system.
CAUTION
The 64- and 80-pin TQFP headers are very
delicate and can be easily damaged!
TOP
VIEW
1
ST92X
Pin 1
MPLAB® ICE 2000/4000
DS51194K-page 12 2004 Microchip Technology Inc.
XLT44PT
44-lead QFP to 0.8 mm Adapter Socket Top
44-lead QFP to 0.8 mm Adapter Socket Side
XLT64PT1, XLT64PT2, XLT80PT
64/80-lead QFP to 0.5 mm Adapter Socket Top
64/80-lead QFP to 0.5 mm Adapter Socket Side
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
A
A
0.90
TOP
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
H
J
B
C
D
E
F
G
SIDE
VIEW
BCDEF G H J
0.80 0.65 0.55 0.365 0.05 0.80 mm 0.275 0.130
A
A
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
Drawing shown is for 64-lead.
This drawing shown with break away tabs attached to
the leads.
Break away tabs are to be removed prior to applying
power.
TOP
VIEW
A’
AA’
XLT64PT1 1.25 1.050 +/- 0.005
XLT64PT2 1.25 1.050 +/- 0.005
XLT80PT 1.45 N/A
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 64-lead.
Break away tabs are to be removed prior to applying
power.
B
C
E
F
G
H
J
SIDE
VIEW
BCEF G HJ
XLT64PT1 0.95 0.500 0.400 0.05 0.5 mm 0.275 0.095
XLT64PT2 0.95 0.500 0.400 0.05 0.5 mm 0.275 0.095
XLT80PT 1.15 0.575 0.475 0.05 0.5 mm 0.275 0.095
2004 Microchip Technology Inc. DS51194K-page 13
Transition Socket Specification
XLT64PT3
64-lead QFP to 0.8mm Adapter Socket Top
64-lead QFP to 0.8mm Adapter Socket Side
XLT44PT3, XLT64PT4
44/64-lead QFP to 0.8 mm Adapter Socket Top
44/64-lead QFP to 0.8 mm Adapter Socket
Side
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
A
1.05
A
TOP
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
H
J
B
C
D
E
F
G
SIDE
VIEW
BCDEF G H J
0.95 0.80 0.70 0.51 0.05 0.80 mm 0.275 0.140
A
A
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
Drawing shown is for 64-lead.
TOP
VIEW
B
ABC
XLT44PT3 1.100 0.300 0.050
XLT64PT4 1.250 0.225 0.050
1
17
68 52
18 34
51
35
QFP
PIN 1
C
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 64-lead.
E
F
SIDE
VIEW
DEFG
XLT44PT3 0.018 0.352 0.225 0.80 mm
XLT64PT4 0.018 0.352 0.227 0.80 mm
G
D
MPLAB® ICE 2000/4000
DS51194K-page 14 2004 Microchip Technology Inc.
XLT64PT5, XLT80PT3
64/80-lead QFP to 0.5 mm Adapter Socket Top
64/80-lead QFP to 0.5 mm Adapter Socket
Side
XLT80PT2
80-lead QFP to 0.65 mm Adapter Socket Top
80-lead QFP to 0.65 mm Adapter Socket
Side
A
A
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
Drawing shown is for 64-lead.
TOP
VIEW
B
ABC
XLT64PT5 1.250 0.225 0.050
XLT80PT3 1.450 0.225 0.050
1
17
68 52
18 34
51
35
QFP
PIN 1
C
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 64-lead.
E
F
SIDE
VIEW
DEFG
XLT64PT5 0.018 0.352 0.227 0.50 mm
XLT80PT3 0.018 0.352 0.227 0.50 mm
G
D
A
A
UNLESS OTHERWISE SPECIFIED, DIMENSIONS
ARE IN INCHES.
Drawing shown is for 64-lead.
TOP
VIEW
B
ABC
1.450 0.225 0.050
1
21
84 64
22 42
63
43
QFP
PIN 1
C
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 64-lead.
SIDE
VIEW
DEFG
0.018 0.352 0.227 0.65 mm
G
D
E
F
2004 Microchip Technology Inc. DS51194K-page 15
Transition Socket Specification
SOT/DFN/QFN TRANSITION
SOCKETS
SOT/DFN/QFN transition sockets and associated
hardware are shown below.
FIGURE 7: SOT TRANSITION SOCKET WITH
CABLE
FIGURE 8: DFN/QFN TWO-PART
TRANSITION SOCKET
FIGURE 9: QFN TRANSITION SOCKET
FIGURE 10:DFN TRANSITION SOCKET WITH
CABLE
FIGURE 11:QFN Transition Socket with Cable
Microchip offers the following SOT/DFN/QFN transition
sockets:
• XLT06SOT: One 6-lead SOT transition socket
with cable
• XLT08DFN: One 8-lead DFN two-part transition
socket
• XLT08DFN2: One 8-lead DFN transition socket
with cable
• XLT28QFN3: One 28-lead QFN transition socket
with cable
• XLT28QFN4: One 28-lead QFN transition socket
with cable
• XLT44QFN2: One 44-lead QFN transition socket
with cable
• XLT44QFN3: One 44-lead QFN transition socket
with cable
The following sockets have been discontinued:
• XLT28QFN: One 28-lead QFN transition socket.
(Replaced by XLT28QFN4.)
• XLT28QFN2: One 28-lead QFN transition socket.
(Replaced by XLT28QFN3.)
• XLT44QFN: One 44-lead QFN two-part transition
socket. (Replaced by XLT44QFN2.)
See the drawings in this section for layout dimensions.
SOT Transition Socket
Target/Application Board
Cables
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapters
DFN/QFN Transition Socket
Target/Application Board
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapters
QFN Transition Socket
Target/Application Board
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapters
DFN Transition Socket
Target/Application Board
Cables
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapters
QFN Transition Socket
Target/Application Board
Cables
Cable to Processor Module
PDIP Device Adapter
Gold Standoffs/
Adapters
MPLAB® ICE 2000/4000
DS51194K-page 16 2004 Microchip Technology Inc.
RECOMMENDED INSTALLATION OF
TRANSITION SOCKETS WITH
CABLES
For transition sockets that use a cable, follow these
instructions for installing your transition socket on the
target board.
PCB Layout Considerations:
Make sure you leave enough room on the PCB to acco-
modate the cable, i.e., space your target pads for each
device far enough apart so that the cable from one pad
group will not interfere with another pad group.
6-Pin SOT Solder Instructions:
1. Remove protective cable covering from end of
cable.
2. Position cables on target board (see below.)
Tape down to prevent movement.
3. Solder each lead to target pad.
4. Remove tape and clean.
8-Pin DFN Solder Instructions:
1. Prepare leads by trimming narrowest portion to
0.10 inches maximum in length (see below.)
2. Position cables on target board (see below.)
Tape down to prevent movement.
3. Solder each lead to target pad.
4. Remove tape and clean.
8-Pin DFN Assembly Instructions:
1. Start with cable associated with pin 1.
2. Fold cable up and over, forming a radius.
3. Mate with the header on the side of the transition
socket assembly, making sure pin 1 mates with
the pin labeled “DFN Pin 1”.
4. Fold over and mate the other cable.
28/44-Pin QFN Solder Instructions:
1. Remove protective cable jacket from stripped
end of cable.
2. Lay out with long cables opposing each other
and short cables opposing each other (see
below.)
3. Place center lead (6th lead for 44-pin, 4th lead
for 28-pin) on center target pad to center each
cable on the footprint (see below.) Tape down
each cable to prevent movement.
4. Solder each lead to target pad.
5. Remove tape and clean
28/44-Pin QFN Assembly Instructions:
1. Start with cable associated with pin 1.
2. Fold cable up and over, forming a radius.
Header pins will now be facing upwards.
3. Mate with the socket on the underside of the
transition socket assembly, making sure pin 1
mates with the pin labeled “QFN Pin 1”.
4. Fold over and mate the other cables.
pin 1
trim leads
pin 1
pin 1
use center lead
to center cable
on target footprint
short short
long long
header pins
facing down
2004 Microchip Technology Inc. DS51194K-page 17
Transition Socket Specification
RECOMMENDED PCB LAYOUT
XLT06SOT
6-lead SOT-23 to 0.80-inch Adapter Socket
XLT08DFN2
8/14-lead DIP to 0.025-inch Adapter Socket
16 mils
24 mils
50 mils
6-Pin SOT, 8-Pin DFN
28-Pin QFN
24 mils
11 mils
26 mils
44-Pin QFN
16 mils
13 mils
26 mils
DVA Pin 1
0.90
0.80
0.30
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
TOP
VIEW
SIDE
VIEW
DVA Pin 1
DFN Pin 1
0.90
1.35
0.30
0.30
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
TOP
VIEW
SIDE
VIEW
0.24
2.37
0.09
DVA Pin 1: Location of 8- or 14-lead DIP pin 1
MPLAB® ICE 2000/4000
DS51194K-page 18 2004 Microchip Technology Inc.
XLT28QFN3, XLT28QFN4, XLT44QFN2,
XLT44QFN3
28/44-lead DIP to 0.025-inch Adapter Socket Top
28/44-lead DIP to 0.025-inch Adapter Socket Side
and Cables
DVA Pin 1
QFN Pin 1
A
B
AB
1.15 2.45
DVA Pin 1
QFN Pin 1
A
B
XLT28QFN3 - 18-lead DIP (shown here)
XLT44QFN2 - 40-lead DIP (shown here)
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
XLT28QFN4 - 28-lead DIP
XLT44QFN3 - 44-lead DIP
DIP 1
CDEF
0.56 0.85 0.40 0.40
TOP
VIEW E
D
SIDE
VIEW
C
F
SIDE
VIEW
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
Drawing shown is for 28-lead DIP.
2004 Microchip Technology Inc. DS51194K-page 19
Transition Socket Specification
XLT08DFN (Discontinued - see XLT08DFN2)
8-lead DIP to 0.025-inch Adapter Socket
XLT28QFN (Discontinued - see XLT28QFN4)
28-lead DIP to 0.025-inch Adapter Socket
400 mils
DIP socket
Solder
PCB pads
400 mils
250 mils
170 mils
62 mils
160 mils
TOP
VIEW
SIDE
VIEW
1400 mils
600 mils
DIP socket
Solder
PCB pads
480 mils 425 mils
TOP
VIEW
SIDE
VIEW
MPLAB® ICE 2000/4000
DS51194K-page 20 2004 Microchip Technology Inc.
XLT28QFN (Discontinued - see XLT28QFN4)
28-lead DIP to 0.025-inch Adapter Socket
XLT28QFN2 (Discontinued - see XLT28QFN3)
18-lead DIP to 0.025-inch Adapter Socket
1400 mils
600 mils
DIP socket
Solder
PCB pads
480 mils 425 mils
TOP
VIEW
SIDE
VIEW
TOP
VIEW
W
D
SIDE
VIEW
E
p
H2
H1
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
BOTTOM
VIEW
DH1H2W E p
0.600 0.875 0.480 0.900 0.236 0.026
2004 Microchip Technology Inc. DS51194K-page 21
Transition Socket Specification
XLT44QFN (Discontinued - see XLT44QFN2)
40-lead DIP to 0.025-inch Adapter Socket
44-lead QFN Header
TOP
VIEW
W
D
SIDE
VIEW
H2
H1
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
BOTTOM
VIEW
DH1H2W
0.695 0.730 0.50 2.058
DIP 1
DIP 1
Pin 1 of QFN
TOP
VIEW
SIDE
VIEW
p
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE
IN INCHES.
BOTTOM
VIEW
DEH3p
0.315 0.315 0.195 0.026
H3
D
E
Solder
PCB pads
MPLAB® ICE 2000/4000
DS51194K-page 22 2004 Microchip Technology Inc.
NOTES:
2004 Microchip Technology Inc. DS51194K-page 23
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS51194K-page 24 2004 Microchip Technology Inc.
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10/20/04
