HSME-C190 - Avago Technologies

Avago reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product(s) at anytime.

Features

•Small size

•Industry standard footprint

•Operating temperature range of –30˚C to +85˚C

•Compatible with IR soldering

•Available in 8 mm tape on 7" diameter reel

•Reel sealed in zip-locked moisture barrier bags

Applications

•Membrane switch indicator

•LCD backlighting

•Pushbutton backlighting

•Front panel indicator

•Symbol backlighting

•Keypad backlighting

Description

This chip-type LED utilizes Aluminum Indium Gallium

Phosphide (AlInGaP) material technology. The AlInGaP

material has a very high luminous efficiency, capable

of producing high light output.

These chipLEDs come in top mounting, top emitting

packages (HSMx-C150/170/177/190/191/197), top

mounting, side emitting packages (HSMx-C110/120)

or reverse mounting, top emitting package (HSMx-

C265).

All packages are binned by both color and intensity.

In order to facilitate pick and place operation, these

chipLEDs are shipped in Tape & Reel, with 4000 units

per reel for HSMx-C120/170/ 177/190/191/197 and

3000 units per reel for HSMx-C110/C150/265.

These packages are compatible with reflow soldering

process.

HSME-Cxxx

AlInGaP Gr een ChipLED

Data Sheet

HSME-C110/C120/C150/C170/

C177/C190/C191/C197/C265

CAUTION: HSME-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions

during handling and processing. Refer to Application Note AN-1142 for additional details.

Package Dimensions

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.

3.2 (0.126 )

0.5 (0.020)

0.8 (0.031)

POLARITY

CATHODE

LINE

1.5 (0.059)

LED DIE

CLEAR

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.0 (0.039)

2.6 (0.102 )

1.6 (0.063 )

CATHODE LINE

HSMx-C110

3.2 (0.126 )

2.00 (0.079 )

0.30 (0.012)

0.40 ± 0.15

(0.016 ± 0.006)

0.30 (0.012)

POLARITY

0.80 (0.031)

0.40 ± 0.15

(0.016 ± 0.006)

1.40

(0.055)

DIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.25 (0.049)

CATHODE LINE

HSMx-C170

CATHODE

MARK

1.6

(0.063 )

0.3 (0.012)

0.3 ± 0.15

(0.012 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.8 (0.031)

0.3 ± 0.15

(0.012 ± 0.006)

1.0

(0.039)

DIFFUSED EPOXY

PC BOARD

SOLDERING

TERMINAL

0.8 (0.031)

CATHODE LINE

0.7 (0.028) MIN.

HSMx-C190

HSMx-C191

1.6

(0.063 )

0.3 (0.012)

0.3 ± 0.15

(0.012 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.6 (0.023)

0.3 ± 0.15

(0.012 ± 0.006)

1.0

(0.039)

DIFFUSED EPOXY

PC BOARD

SOLDERING

TERMINAL

0.8 (0.031)

CATHODE LINE

0.7 (0.028) MIN.

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.

3.40 (0.134)

0.30 (0.012)

2– 1.10 (0.043)

POLARITY

CATHODE

MARK (ETCHED)

1.10 (0.043)

2– 0.50 ± 0.15

(0.020 ± 0.006)

1.20

(0.047)

LED DIE

UNDIFFUSED

EPOXY

PC BOARD

1.25 (0.049)

CATHODE LINE

HSMx-C265

HSMx-C120

1.6

(0.063)

0.5 (0.020)

POLARITY

CATHODE MARK

1.0 (0.039)

3 – 0.3 (0.012)

1.2

(0.047)

0.3

(0.012)

LED DIE

CLEAR

EPOXY

PC BOARD

SOLDERING

TERMINAL

0.6

(0.024)

CATHODE LINE

3.2 (0.126 )

0.5 (0.020)

0.5 ± 0.2

(0.020 ± 0.008)

0.6 (0.024)

POLARITY

CATHODE

MARK

1.1 (0.043)

0.5 ± 0.2

(0.020 ± 0.008)

2.0 (0.079)

DIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.6 (0.063)

CATHODE LINE

HSMx-C150

0.80 (0.031)

1.60

(0.063)

DIFFUSED

EPOXY

PC BOARD 0.40 (0.016)

0.16 (0.006)

0.70

(0.028) MIN.

0.30 ± 0.15

(0.012 ± 0.006)

CATHODE LINE

CATHODE MARK

HSMx-C197

POLARITY

SOLDERING

TERMINAL

Package Dimensions, continued

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.

CATHODE MARK

1.25

(0.049)

2.00

(0.079)

DIFFUSED EPOXY

PC BOARD

0.40 (0.016)

0.16

(0.006)

0.40 ± 0.15

(0.016 ± 0.006)

SOLDERING

TERMINAL

HSMx-C177

1.10 (0.043)

POLARITY

CATHODE LINE

Device Selection Guide

Package Dimension (mm)[1,2] AlInGaP Green Package Description

1.6 (L) x 0.8 (W) x 0.6 (H) HSME-C191 Untinted, Diffused

1.6 (L) x 0.8 (W) x 0.4 (H) HSME-C197 Untinted, Diffused

1.6 (L) x 0.8 (W) x 0.8 (H) HSME-C190 Untinted, Diffused

2.0 (L) x 1.25 (W) x 0.8 (H) HSME-C170 Untinted, Diffused

2.0 (L) x 1.25 (W) x 0.4 (H) HSME-C177 Untinted, Diffused

1.6 (L) x 1.0 (W) x 0.6 (H) HSME-C120 Untinted, Non-diffused

3.2 (L) x 1.5 (W) x 1.0 (H) HSME-C110 Untinted, Non-diffused

3.2 (L) x 1.6 (W) x 1.1 (H) HSME-C150 Untinted, Diffused

3.4 (L) x 1.25 (W) x 1.1 (H) HSME-C265 Untinted, Non-diffused

Notes:

1. Dimensions in mm.

2. Tolerance ± 0.1 mm unless otherwise noted.

Absolute Maximum Ratings at TA = 25°C

HSME-C110/120/170/177/

Parameter 190/191/197/150/265 Units

DC Forward Current[1,2] 20 mA

Power Dissipation 52 mW

Reverse Voltage (IR = 100 µA) 5 V

LED Junction Temperature 95 °C

Operating Temperature Range –30 to +85 °C

Storage Temperature Range –40 to +85 °C

Soldering Temperature See reflow soldering profile (Figures 6 & 7)

Electrical Characteristics at TA = 25°C

Forward Voltage Reverse Breakdown Capacitance C Thermal

VF (Volts) VR (Volts) (pF), VF = 0, Resistance

@ IF = 20 mA @ IR = 100 µAf = 1 MHz RθJ–PIN (°C/W)

Part Number Typ. Max. Min. Typ. Typ.

HSME-C110/120 2.1 2.6 5 18 550

HSME-C150/170/177/190/191/197 2.1 2.6 5 15 450

HSME-C265 2.1 2.6 5 16 450

Notes:

1. Derate linearly as shown in Figure 4.

2. Drive current above 5 mA is recommended for best long term performance.

Optical Characteristics at TA = 25°C

Color, Dominant

Luminous Intensity Peak Wavelength Wavelength Viewing Angle Luminous Efficacy

IV (mcd) @ 20 mA[1] λpeak (nm) λd[2] (nm) 2 θ1/2 Degrees[3] ηV (lm/w)

Part Number Min. Typ. Typ. Typ. Typ. Typ.

HSME-C110 18 52 570 572 130 570

HSME-C120 18 52 570 572 155 570

HSME-150/170/ 18 50 570 572 170 570

190/191

HSME-C177/197 18 50 570 572 130 570

HSME-C265 18 50 570 572 150 570

Notes:

1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp

package.

2. The dominant wavelength, λd, is derived from the CIE Chromatically Diagram and represents the perceived color of the device.

3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.

Light Intensity (IV) Bin Limits[1]

Intensity (mcd)

Bin ID Min. Max.

A0.110.18

B0.180.29

C0.290.45

D0.450.72

E0.721.10

F1.101.80

G1.802.80

H2.804.50

J4.507.20

K7.2011.20

L11.20 18.00

M18.00 28.50

N28.50 45.00

P45.00 71.50

Q71.50 112.50

R112.50 180.00

S180.00 285.00

T285.00 450.00

U450.00 715.00

Green Color Bin Limits[1]

Dom. Wavelength (nm)

Bin ID Min. Max.

A561.5 564.5

B564.5 567.5

C567.5 570.5

D570.5 573.5

E573.5 576.5

Tolerance: ± 1 nm

Tolerance: ± 15%

Notes:

1. Bin categories are established for classification of products. Products may not be available in all

categories. Please contact your Avago representative for information on currently available bins.

2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv

bin limits.

Figure 5a. Relative intensity vs. angle for HSMx-C170, HSMx-C190, HSMx-C191, and HSMx-C150.Figure 4. Maximum forward current vs.

ambient temperature.

Figure 3. Luminous intensity vs. forward

current.

Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.

Figure 5b. Relative intensity vs. angle for HSMx-C177 and HSMx-C197.

100

400 450 550 600 650 700

RELATIVE INTENSITY – %

WAVELENGTH - nm

500

100

0.11.5 1.9 2.2

VF – FORWARD VOLTAGE – V

IF – FORWARD CURRENT – mA

1.7 2.01.6 1.8 2.1

05 15

– FORWARD CURRENT – mA

0.4

1.0

1.2

LUMINOUS INTENSITY

(NORMALIZED @ 20 mA)

0.6

0.2

0.8

10 20 25

020 60 80 100

F MAX.

– MAXIMUM FORWARD CURRENT – mA

– AMBIENT TEMPERATURE – °C

10 30 50 70 90

RELATIVE INTENSITY – %

100

ANGLE

-70 -50 -30 0 20 30 507090-90 -20-80 -60 -40 -10 10 40 60 80

RELATIVE INTENSITY – %

100

ANGLE

-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80

Figure 5c. Relative intensity vs. angle for HSMx-C110.

Figure 5d. Relative intensity vs. angle for HSMx-C120.

RELATIVE INTENSITY – %

100

ANGLE

020 100-100 -20-80 -60 -40 40 60 80

RELATIVE INTENSITY – %

100

ANGLE

020 100-100 -20-80 -60 -40 40 60 80

RELATIVE INTENSITY – %

100

ANGLE

-70 -50 -30 0 20 30 507090-90 -20-80 -60 -40 -10 10 40 60 80

100

RELATIVE INTENSITY

-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90

ANGLE

Figure 6. Recommended reflow soldering profile.Figure 5e. Relative intensity vs. angle for HSMx-C265.

Figure 8. Recommended soldering pattern for HSMx-C265.

Figure 9. Recommended soldering pattern for HSMx-C120. Figure 10. Recommended soldering pattern for HSMx-C110.

Figure 11. Recommended soldering pattern

for HSMx-C170 and HSMx-C177. Figure 12. Recommended soldering pattern

for HSMx-C190, HSMx-C191 and HSMx-C197. Figure 13. Recommended soldering pattern

for HSMx-C150.

RELATIVE INTENSITY – %

100

ANGLE

-70 -50 -30 0 20 30 507090-90 -20-80 -60 -40 -10 10 40 60 80

1.25 (0.049)

1.4

(0.055) 1.4

(0.055)

2.3

(0.091)

2.2 (0.087) DIA. PCB HOLE

0.7 (0.028)

0.8

(0.031) 0.8

(0.031)

1.2

(0.047)

0.4 (0.016)

0.15 (0.006)

0.4 (0.016)

CENTERING

BOARD

5.0 (0.200)

1.0 (0.039)

1.5

(0.059) 1.5

(0.059)

2.0

(0.079)

0.9 (0.035)

0.2 (0.008)

0.9 (0.035)

CENTERING

BOARD

1.2 (0.047)

1.2

(0.047)

0.9

(0.035)

1.2

(0.047)

0.8 (0.031)

0.8

(0.031) 0.7

(0.028)

0.8

(0.031)

1.5 (0.059)

1.5

(0.059) 1.5

(0.059)

2.0

(0.079)

NOTE:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

Figure 7. Recommended Pb-free reflow soldering profile.

230°C MAX.

10 SEC. MAX.

4°C/SEC.

MAX.

OVER 2 MIN.

TIME

TEMPERATURE

4°C/SEC. MAX.

140-160°C

–3°C/SEC.

217 °C

200 °C

60 - 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

150 °C

255 - 260 °C

100 SEC. MAX.

(Acc. to J-STD-020C)

10 - 30 SEC.

TIME

TEMPERATURE

Figure 15. Reel dimensions.

Figure 14. Reeling orientation.

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

NOTE:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

10.50 ± 1.0 (0.413 ± 0.039)

59.60 ± 1.00

(2.346 ± 0.039)

Ø 20.20 MIN.

(Ø 0.795 MIN.)

;;

;;;

;;

;

178.40 ± 1.00

(7.024 ± 0.039)

3.0 ± 0.5

(0.118 ± 0.020)

4.0 ± 0.5

(0.157 ± 0.020) 5.0 ± 0.5

(0.197 ± 0.020)

Ø 13.1 ± 0.5

(Ø 0.516 ± 0.020)

8.0 ± 1.0 (0.315 ± 0.039)

Figure 16. Tape dimensions.

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.

;;

;;;;;

;;;;;;

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

DIM. A

(SEE TABLE 1)

3.50 ± 0.05

(0.138 ± 0.002)

1.75 (0.069)

DIM. C

(SEE TABLE 1) 0.20 ± 0.05

(0.008 ± 0.002)

CARRIER TAPE

COVER TAPE

DIM. B

(SEE TABLE 1)

4.00 (0.157)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157) 1.50 (0.059)

HSMx-C265 SERIES 3.70 (0.146) 1.45 (0.057) 1.30 (0.051)

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

CATHODE

DIM. A

± 0.10 (0.004) DIM. B

± 0.10 (0.004)PART NUMBER DIM. C

± 0.10 (0.004)

;;

;;;

;;

;;;;;;

;;;;;;;

;;;;;;

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

DIM. A

(SEE TABLE 1)

3.50 ± 0.05

(0.138 ± 0.002)

1.75 (0.069)

DIM. C

(SEE TABLE 1) 0.20 ± 0.05

(0.008 ± 0.002)

CARRIER TAPE

COVER TAPE

DIM. B

(SEE TABLE 1)

4.00 (0.157)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157) 1.50 (0.059)

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

CATHODE

DIM. A

± 0.10 (± 0.004) DIM. B

± 0.10 (± 0.004)PART NUMBER DIM. C

± 0.10 (± 0.004)

HSMx-C170 SERIES 2.30 (0.091) 1.45 (0.057) 0.95 (0.037)

HSMx-C190 SERIES 1.75 (0.069) 0.90 (0.035) 0.90 (0.035)

HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)

HSMx-C191 SERIES 1.86 (0.073) 0.89 (0.035) 0.87 (0.034)

HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050)

;;;

HSMx-C110/C120

POSITION IN

CARRIER TAPE

DIM. B

(SEE TABLE 1)

DIM. A

(SEE TABLE 1)

HSMx-C110

R 1.0 ± 0.05

(0.039 ± 0.002)

HSMx-C120

R 0.5 ± 0.05

(0.020 ± 0.002)

HSMx-C120 SERIES 1.90 (0.075) 1.15 (0.045) 0.80 (0.031)

HSMx-C197 SERIES 1.75 (0.069) 0.95 (0.037) 0.60 (0.024)

HSMx-C177 SERIES 2.30 (0.091) 1.40 (0.055) 0.60 (0.024)

Convective IR Reflow Soldering

For more information on solder-

ing, refer to Application Note

1060, Surface Mounting SMT

LED Indicator Components.

Storage Condition: 5 to 30˚ C @ 60%

RH max.

Baking is required under the con-

dition:

a) Humidity Indicator Card is

>10% when read at 23 ± 5°C

b) Device exposed to factory

conditions <30°C/60% RH

more than 672 hours.

Baking recommended condition:

60 ± 5°C for 20 hours.

Figure 17. Tape leader and trailer dimensions.

END START

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MOUNTED WITH

COMPONENTS THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MINIMUM OF

230 mm

(9.05 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.

For product information and a complete list of distributors, please go to our website: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.

AV02-0976EN January 8, 2008