SFH 4059
1Version 1.5 | 2018-04-16
Produktdatenblatt | Version 1.1
www.osram-os.com
SFH 4059
CHIPLED® Lens
High Power Infrared Emitter (850 nm)
Applications
—Industrial Automation (Machine controls, Light
barriers, Vision controls)
—Smoke Detectors
Features:
—Package: black epoxy
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—High optical power
—Very small package: (LxWxH) 3.2 mm x 1.6 mm x 1.85 mm
—UL version available (ordering code & test conditions on request)
Ordering Information
Type Irradiance 1) Irradiance 1) Ordering Code
typ.
IF = 70 mA; tp = 20 ms IF = 70 mA; tp = 20 ms
EeEe
SFH 4059 6.3 ... 32.0 mW/cm² 15 mW/cm² Q65111A2991
SFH 4059-RS 10.0 ... 32.0 mW/cm² 15 mW/cm² Q65111A7272
Ee measured in the near 󰘰eld with a detector (7.2 mm diameter) in 20 mm distance (Ω = 0.1 sr) to the device surface
SFH 4059
2Version 1.5 | 2018-04-16
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating temperature Top min.
max.
-40 °C
85 °C
Storage temperature Tstg min.
max.
-40 °C
85 °C
Reverse voltage 2) VRmax. 12 V
Forward current IFmax. 70 mA
Surge current
tp ≤ 300 µs; D = 0
IFSM max. 0.7 A
Power consumption Ptot max. 140 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
SFH 4059
3Version 1.5 | 2018-04-16
Characteristics
IF = 70 mA; tp = 20 ms; TA = 25 °C
Parameter Symbol Values
Peak wavelength
λ
peak typ. 860 nm
Centroid wavelength
λ
centroid typ. 850 nm
Spectral bandwidth at 50% Irel,max
∆λ
typ. 30 nm
Half angle
φ
typ. 10 °
Dimensions of active chip area L x W typ. 0.2 x 0.2
mm x mm
Rise time (10% / 90%)
IF = 70 mA; RL = 50 Ω
trtyp. 12 ns
Fall time (10% / 90%)
IF = 70 mA; RL = 50 Ω
tftyp. 12 ns
Forward voltage VFtyp.
max.
1.6 V
2 V
Forward voltage
IF = 500 mA; tp = 100 µs
VFtyp. 2.4 V
Reverse current 2)
VR = 5 V
IRmax.
typ.
10 µA
0.01 µA
Total radiant 󰘱ux 3)
Φ
etyp. 40 mW
Radiant intensity Ietyp. 100 mW/sr
Temperature coe󰘲cient of brightness TCItyp. -0.5 % / K
Temperature coe󰘲cient of voltage TCVtyp. -0.7 mV / K
Temperature coe󰘲cient of wavelength TC
λ
typ. 0.3 nm / K
Thermal resistance junction ambient real 4) RthJA max. 540 K / W
Thermal resistance junction solder point real 5) RthJS max. 360 K / W
Radiant Intensity measured with a detector (11.3 mm diameter) in 100 mm
distance (Ω = 0.01 sr) to the device surface
SFH 4059
4Version 1.5 | 2018-04-16
Brightness Groups
TA = 25 °C
Group Irradiance 1) Irradiance 1)
IF = 70 mA; tp = 20 ms IF = 70 mA; tp = 20 ms
min. max.
EeEe
Q 6.3 mW/cm² 12.5 mW/cm²
R 10.0 mW/cm² 20.0 mW/cm²
S 16.0 mW/cm² 32.0 mW/cm²
Only one group in one packing unit (variation lower 2:1).
Ee measured in the near 󰘰eld with a detector (7.2 mm diameter) in 20 mm distance (Ω = 0.1 sr) to the device
surface
700
0nm
%
OHF04132
20
40
60
80
100
950
750 800 850
I
rel
λ
Relative Spectral Emission 6), 7)
Irel = f (
λ
); IF = 70 mA; tp = 20 ms
SFH 4059
5Version 1.5 | 2018-04-16
OHF04384
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
Radiation Characteristics 6), 7)
Irel = f (
φ
)
OHF05563
I
F
mA
10 510510 10 3
1
10
-2
10
-3
10
5
10
10
5
-1
5
0
e(70 mA)
E
E
012
e
Irradiance 6), 7)
Ee/Ee(70mA) = f (IF); single pulse ; tp = 25 µs
OHF03826
F
I
10
-4
0.5 1 1.5 2 2.5 V3
10
0
A
0
F
V
-1
10
5
5
10
-2
-3
5
10
Forward current 6), 7)
IF = f (VF); single pulse; tp = 100 µs
SFH 4059
6Version 1.5 | 2018-04-16
1010
0
-2-3-4-5
1010 10
F
I
AP
t
=
DT
210-1
10
t
p
10 s10
OHF04265
T
t
P
I
F
0.1
0.2
0.3
0.4
0.5
0.6
0.8
0.7
0.03
0.2
0.1
0.05
0.02
0.01
0.005
=
D
1
0.5
Permissible Pulse Handling Capability
IF = f (tp); duty cycle D = parameter; TA = 25°C
0
0˚C
T
I
F
mA
OHF04264
A
20 40 60 80 100
10
20
30
40
50
60
70
80
Max. Permissible Forward Current
IF,max = f (TA); RthJA = 540 K / W
1010
0
-2-3-4-5
1010 10
F
I
A
P
t
=
DT
210-1
10
t
p
10 s10
OHF04266
T
t
P
I
F
0.1
0.2
0.3
0.4
0.5
0.6
0.8
0.7
0.03
0.2
0.1
0.05
0.02
0.01
0.005
=
D
1
0.5
Permissible Pulse Handling Capability
IF = f (tp); duty cycle D = parameter; TA = 85°C
SFH 4059
7Version 1.5 | 2018-04-16
Dimensional Drawing 8)
Approximate Weight: 8.0 mg
Package marking: Anode
Pin Description
1 Cathode
2 Anode
SFH 4059
8Version 1.5 | 2018-04-16
Recommended Solder Pad 8)
Reflow Soldering Profile
Product complies to MSL Level 3 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
SFH 4059
9Version 1.5 | 2018-04-16
Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the speci󰘰ed peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range
Taping 8)
SFH 4059
10 Version 1.5 | 2018-04-16
Tape and Reel 9)
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel dimensions [mm]
A W Nmin W1W2 max Pieces per PU
180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 2000
SFH 4059
11 Version 1.5 | 2018-04-16
Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 8)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
SFH 4059
12 Version 1.5 | 2018-04-16
Transportation Packing and Materials 8)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of transportation box in mm
Width Length Height
200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
SFH 4059
13 Version 1.5 | 2018-04-16
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED speci󰘰ed in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from
these devices. As a matter of principle, however, it should be mentioned that intense light sources have a
high secondary exposure potential due to their blinding e󰘯ect. As is also true when viewing other bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
For further application related informations please visit www.osram-os.com/appnotes
SFH 4059
14 Version 1.5 | 2018-04-16
Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version in the OSRAM OS Webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.
SFH 4059
15 Version 1.5 | 2018-04-16
Glossary
1) Irradiance: Measured at a solid angle of Ω = 0.1 sr
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3) Total radiant 󰘱ux: Measured with integrating sphere.
4) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 5 mm² each
5) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)
6) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data
or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures. These do not nec-
essarily correspond to the actual parameters of each single product, which could di󰘯er from the typical
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical
improvements, these typ. data will be changed without any further notice.
7) Testing temperature: TA = 25°C
8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
9) Tape and Reel: All dimensions and tolerances are speci󰘰ed acc. IEC 60286-3 and speci󰘰ed in mm.
SFH 4059
16 Version 1.5 | 2018-04-16
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.