Data Sheet HSMx-A10x-xxxxx PLCC-2, Surface Mount LED Indicator Description Features This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. The super wide viewing angle at 120 makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs. Industry standard PLCC-2 package High reliability LED package High brightness using AlInGaP and InGaN dice technologies Available in full selection of colors Super wide viewing angle at 120 Available in 8 mm carrier tape on 7 inch reel (2000 pieces) Compatible with both IR and TTW soldering process Applications Interior automotive - Instrument panel backlighting - Central console backlighting - Switch/push button backlighting Electronic signs and signals - Interior full color sign - Variable message sign Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting - Display backlighting CAUTION! HSMN, M, and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Broadcom Application Note AN-1142 for additional details. Broadcom AV02-0198EN February 16, 2018 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Package Dimensions 2.8 0.2 2.2 0.2 3.2 0.2 1.9 0.2 0.1 TYP. 0.8 0.1 3.5 0.2 0.8 0.3 0.5 0.1 CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES) TOP MOUNT 2.8 0.2 2.2 0.2 1.9 0.2 5.2 0.2 3.2 0.2 0.1 TYP. CATHODE MARKING 0.5 0.1 REVERSE MOUNT Broadcom NOTE: ALL DIMENSIONS IN MILLIMETERS. AV02-0198EN 2 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Device Selection Guide Red Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMS-A100-J00J1 4.50 15.00 -- 20 GaP HSMS-A100-L00J1 11.20 15.00 -- 20 GaP HSMS-A100-J80J2 5.60 -- 14.00 10 GaP HSMH-A100-L00J1 11.20 15.00 -- 20 AlGaAs HSMH-A100-N00J1 28.50 50.00 -- 20 AlGaAs HSMC-A100-Q00J1 71.50 100.00 -- 20 AlInGaP HSMC-A100-R00J1 112.50 140.00 -- 20 AlInGaP HSMC-A101-S00J1 180.00 220.00 -- 20 AlInGaP HSMZ-A100-T00J1 285.00 350.00 -- 20 AlInGaP HSMC-A100-N00H1 28.50 -- -- 20 AlInGaP HSMC-A100-Q70J1 90.00 -- 180.0 20 AlInGaP HSMC-A101-S30J1 180.00 -- 355.0 20 AlInGaP HSMC-A101-S40J1 180.00 -- 450.0 20 AlInGaP HSMZ-A100-R00J1 112.50 -- -- 20 AlInGaP HSMZ-A100-T70J1 355.00 -- 715.0 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology 71.50 100.00 -- 20 AlInGaP HSMJ-A101-S00J1 180.00 200.00 -- 20 AlInGaP HSMJ-A100-T40J1 285.00 -- 715.00 20 AlInGaP HSMV-A100-T00J1 285.00 350.00 -- 20 AlInGaP HSMJ-A100-R40J1 112.50 -- 285.00 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMD-A100-J00J1 4.50 15.00 -- 20 GaP HSMD-A100-L00J1 11.20 15.00 -- 20 GaP HSMD-A100-K4PJ2 7.20 -- 18.00 10 GaP Red Orange Part Number HSMJ-A100-Q00J1 Orange Part Number HSML-A100-Q00J1 71.50 100.00 -- 20 AlInGaP HSML-A101-S00J1 180.00 220.00 -- 20 AlInGaP Broadcom AV02-0198EN 3 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Yellow/Amber Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMY-A100-J00J1 4.50 12.00 -- 20 GaP HSMY-A100-L00J1 11.20 12.00 -- 20 GaP HSMA-A100-Q00J1 71.50 100.00 -- 20 AlInGaP HSMA-A101-S00J1 180.00 220.00 -- 20 AlInGaP HSMU-A100-S00J1 180.00 320.00 -- 20 AlInGaP HSMA-A101-R8WJ1 140.00 -- 355.00 20 AlInGaP HSMA-A100-Q00H1 71.50 -- -- 20 AlInGaP HSMA-A100-R40J1 112.50 -- 285.00 20 AlInGaP HSMA-A100-R45J1 12.50 -- 285.00 20 AlInGaP HSMA-A101-S3WJ1 180.00 -- 355.00 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMG-A100-J02J1 4.50 18.00 -- 20 GaP HSMG-A100-K72J2 9.00 -- 18.00 10 GaP HSME-A100-M02J1 18.00 70.00 -- 20 AlInGaP HSME-A100-N82J1 35.50 -- 90.00 20 AlInGaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology 2.80 8.00 -- 20 GaP HSME-A100-L01J1 11.20 40.00 -- 20 AlInGaP HSME-A100-M3PJ1 18.00 -- 35.50 20 AlInGaP HSMG-A100-K42J2 7.20 -- 18 20 GaP HSMG-A100-L02J1 11.20 -- -- 20 GaP Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology 112.50 200.00 -- 20 InGaN HSMM-A100-S00J1 180.00 350.00 -- 20 InGaN HSMM-A100-U4PJ1 450.00 -- 1125.00 20 InGaN HSMM-A101-R00H1 112.50 -- -- 20 InGaN Yellow Green Part Number Emerald Green Part Number HSMG-A100-H01J1 Green Part Number HSMM-A101-R00J1 Broadcom AV02-0198EN 4 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Blue Part Number Min IV (mcd) Typ. IV (mcd) Max. IV (mcd) Test Current (mA) Dice Technology HSMN-A101-N00J1 28.50 50.00 -- 20 InGaN HSMN-A100-P00J1 45.00 70.00 -- 20 InGaN HSMN-A100-S4YJ1 180.00 -- 450.00 20 InGaN HSMN-A100-R8YJ1 140.00 -- 355.00 20 InGaN HSMN-A100-R00J1 112.50 -- -- 20 InGaN Part Numbering System HSM x 1 - A x 2 x 3 x 4 - x 5 x 6 x 7 x 8 x 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color Absolute Maximum Ratings (TA = 25C) Parameters HSMS/D/Y/G HSMH HSMC/J/L/A HSME HSMZ/V/U HSMM/N DC Forward Currenta 30 mA 30 mA 30 mAb, c 20 mAc 30 mAb, c 30 mA Peak Forward Currentd 100 mA 100 mA 100 mA 100 mA 100 mA 100 mA Power Dissipation 63 mW 60 mW 63 mW 48 mW 63 mW 114 mA Reverse Voltage Junction Temperature 5V 110C Operating Temperature -55C to +100C Storage Temperature -55C to +100C a. Derate linearly as shown in Figure 4. b. Drive current between 10 mA and 30 mA is recommended for best long term performance. c. Operation at current below 5 mA is not recommended. d. Duty factor = 10%, Frequency = 1 kHz. Broadcom AV02-0198EN 5 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Optical Characteristics (TA = 25C) Color Red Part Number Dice Technology Peak Wavelength PEAK (nm) Typ. Wavelengtha D (nm) Typ. Viewing Angle 2 1/2b (Degrees) Typ. Luminous Efficacy vc (lm/W) Typ. Luminous Intensity/Total Flux Iv(mcd)/ v(mlm) Typ. Dominant HSMS-A100 GaP 635 626 120 120 0.45 HSMH-A100 AlGaAs 645 637 120 63 0.45 HSMC-A10x AlInGaP 635 626 120 150 0.45 HSMZ-A100 AlInGaP 635 626 120 155 0.45 Red HSMJ-A10x AlInGaP 621 615 120 240 0.45 Orange HSMV-A100 AlInGaP 623 617 120 263 0.45 Orange HSMD-A100 GaP 600 602 120 380 0.45 HSML-A10x AlInGaP 609 605 120 320 0.45 HSMY-A100 GaP 583 585 120 520 0.45 HSMA-A10x AlInGaP 592 590 120 480 0.45 Amber HSMU-A100 AlInGaP 594 592 120 500 0.45 Yellow Green HSMG-A100 GaP 565 569 120 590 0.45 HSME-A100 AlInGaP 575 570 120 560 0.45 Emerald Green HSMG-A100 GaP 558 560 120 650 0.45 HSME-A100 AlInGaP 566 560 120 610 0.45 Green HSMM-A10x InGaN 523 525 120 500 0.45 Blue HSMN-A10x InGaN 468 470 120 75 0.45 a. The dominant wavelength, D, is derived from the CIE Chromaticity Diagram and represents the color of the device. b. 1/2 is the off -axis angle where the luminous intensity is 1/2 the peak intensity. c. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. Electrical Characteristics (TA = 25C) Forward Voltage VF (Volts) at IF = 20 mA Part Number Typ. Max. Reverse Voltage VR Reverse Voltage VR Thermal Resistance RJP (CW) at 100 A Min. at 10 A Min. HSMS/D/Y/G 2.2 2.6 5 180 HSMH 1.9 2.6 5 180 HSMC/J/L/A/E 1.9 2.4 5 280 HSMZ/V/U 1.9 2.4 5 280 HSMM/N 3.4 4.05 Broadcom 5 280 AV02-0198EN 6 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 1: Relative Intensity vs. Wavelength 1.0 0.8 RELATIVE INTENSITY EMERALD GREEN YELLOW GREEN BLUE 0.9 GREEN 0.7 AMBER 0.6 0.5 ORANGE 0.4 RED ORANGE RED 0.3 0.2 0.1 0 380 430 1.0 530 580 630 WAVELENGTH - nm 680 730 780 GaP EMERALD GREEN 0.8 RELATIVE INTENSITY 480 GaP YELLOW GREEN 0.6 GaP YELLOW GaP ORANGE 0.4 GaP RED 0.2 0 380 Broadcom 430 480 530 580 630 WAVELENGTH - nm 680 730 780 AV02-0198EN 7 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 2: Forward Current vs. Forward Voltage Figure 3: Relative Intensity vs. Forward Current 35 1.8 1.6 HSMS/D/Y/G RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT - mA 30 25 20 HSMH 15 HSMC/J/L/A/E/Z/V/U HSMM/N 10 5 0 InGaN 1.0 0.8 0.6 0.4 2 3 FORWARD VOLTAGE - V 4 5 0 5 10 25 20 15 DC FORWARD CURRENT - mA 35 30 Figure 5: Maximum Forward Current vs. Solder Point Temperature, Derated Based on TJMAX = 110C, RJA = 180 C/W or 280 C/W 35 30 HSMS/D/G/ Y/H/Z/V/U 25 30 20 HSME 15 HSMS/D/G/Y/H HSMC/J/L/A HSMZ/V/U 25 HSMC/J/L/A CURRENT - mA CURRENT - mA 1.2 0 1 0 35 HSMM/N 10 20 HSME HSMM/N 15 10 5 5 0 20 40 60 80 TEMPERATURE (C) 100 120 0 Figure 6: Dominant Wavelength vs. Forward Current (InGaN Devices) 20 40 60 80 TEMPERATURE (C) 100 120 0.5 DELTA VF (NORMALIZED AT 25C) 530 GREEN 520 510 500 490 480 BLUE 470 460 0 Figure 7: Forward Voltage Shift vs. Temperature 540 DOMINANT WAVELENGTH - nm 1.4 0.2 Figure 4: Maximum Forward Current vs. Ambient Temperature, Derated Based on TJMAX = 110C, RJA = 500 C/W 0 Gap AlInGaP AlGaAs 0 Broadcom 5 10 15 20 CURRENT - mA 25 30 35 0.4 0.3 0.2 0.1 0 GaP/AlGaAs/ AlInGaP -0.1 -0.2 -0.3 -100 InGaN/GaN -50 0 50 TEMPERATURE - C 100 150 AV02-0198EN 8 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 8: Radiation Pattern 1.0 NORMALIZED INTENSITY 0.8 0.6 0.4 0.2 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT - DEGREES NOTE: For detailed information on reflow soldering of Broadcom surface mount LEDs, refer to Broadcom Application Note AN 1060, Surface Mounting SMT LED Indicator Components. Reflow soldering must not be done more than twice. Observe necessary precautions of handling moisture sensitive device as stated in the following section. Figure 9: Recommended Soldering Pad Pattern 4.50 1.50 2.60 SOLDER RESIST Broadcom AV02-0198EN 9 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 10: Tape Leader and Trailer Dimensions TRAILER COMPONENT LEADER 480 mm MIN. FOR O180 REEL. 960 mm MIN. FOR O330 REEL. 200 mm MIN. FOR O180 REEL. 200 mm MIN. FOR O330 REEL. C A USER FEED DIRECTION Figure 11: Tape Dimensions 4 0.1 4 0.1 2 0.05 2.29 0.1 1.75 0.1 +0.1 O 1.5 -0 C 3.5 0.05 +0.3 8 -0.1 3.81 0.1 A 3.05 0.1 +0.1 O1 -0 8 0.229 0.01 Broadcom AV02-0198EN 10 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Figure 12: Reel Dimensions O 20.5 0.3 2 +0.5 -0 62.5 180 +0 -2.5 O 13 0.2 +1.50 8.4 -0.00 (MEASURED AT OUTER EDGE) 14.4 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (0.25 mm) 7.9 (MIN.) 10.9 (MAX.) Figure 13: Reeling Orientation USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Broadcom AV02-0198EN 11 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Intensity Bin Select (X5X6) Intensity Bin Limits Individual reel will contain parts from one half bin only. X5 Min. IV Bin X6 Bin ID Min. (mcd) Max. (mcd) G1 1.80 2.24 G2 2.24 2.80 H1 2.80 3.55 H2 3.55 4.50 J1 4.50 5.60 J2 5.60 7.20 K1 7.20 9.00 K2 9.00 11.20 L1 11.20 14.00 0 Full Distribution 2 2 half bins starting from X51 3 3 half bins starting from X51 4 4 half bins starting from X51 5 5 half bins starting from X51 L2 14.00 18.00 6 2 half bins starting from X52 M1 18.00 22.40 7 3 half bins starting from X52 M2 22.40 28.50 8 4 half bins starting from X52 N1 28.50 35.50 9 5 half bins starting from X52 N2 35.50 45.00 P1 45.00 56.00 P2 56.00 71.50 Q1 71.50 90.00 Q2 90.00 112.50 R1 112.50 140.00 R2 140.00 180.00 S1 180.00 224.00 S2 224.00 285.00 T1 285.00 355.00 T2 355.00 450.00 U1 450.00 560.00 U2 560.00 715.00 V1 715.00 900.00 V2 900.00 1125.00 W1 1125.00 1400.00 W2 1400.00 1800.00 X1 1800.00 2240.00 X2 2240.00 2850.00 Tolerance of each bin limit = 12% Broadcom AV02-0198EN 12 HSMx-A10x-xxxxx Data Sheet Color Bin Select (X7) PLCC-2, Surface Mount LED Indicator Color Bin Limits Individual reel will contain parts from one full bin only. Color Min. (nm) Max. (nm) A 460.0 465.0 Blue X7 0 Full distribution Z A and B only Y B and C only W C and D only V D and E only U T B 465.0 470.0 C 470.0 475.0 D 475.0 480.0 E and F only A 515.0 520.0 F and G only B 520.0 525.0 S G and H only C 525.0 530.0 Q A, B, and C only D 530.0 535.0 Green P B, C, and D only N C, D, and E only A 552.5 555.5 M D, E, and F only B 555.5 558.5 L E, F, and G only C 558.5 561.5 K F, G, and H only D 561.5 564.5 1 A, B, C, and D only 2 E, F, G, and H only 3 B, C, D, and E only E 564.5 567.5 4 C, D, E, and F only 5 A, B, C, D, and E only 6 B, C, D, E, and F only Emerald Green Yellow Green F 567.5 570.5 G 570.5 573.5 H 573.5 576.5 A 582.0 584.5 B 584.5 587.0 C 587.0 589.5 D 589.5 592.0 E 592.0 594.5 F 594.5 597.0 A 597.0 600.0 B 600.0 603.0 C 603.0 606.0 D 606.0 609.0 E 609.0 612.0 A 611.0 616.0 B 616.0 620.0 Amber Orange Red Orange Red Full distribution Broadcom AV02-0198EN 13 HSMx-A10x-xxxxx Data Sheet PLCC-2, Surface Mount LED Indicator Packaging Option (X8X9) Figure 14: Recommended Pb-Free Reflow Soldering Profile Test Current Package Type Reel Size J1 20 mA Top Mount 7 inches J4 20 mA Top Mount 13 inches H1 20 mA Reverse Mount 7 inches H4 20 mA Reverse Mount 13 inches J2 10 mA Top Mount 7 inches J5 10 mA Top Mount 13 inches H2 10 mA Reverse Mount 7 inches H5 10 mA Reverse Mount 13 inches L2 2 mA Top Mount 7 inches Precautionary Notes 10 to 30 SEC. TEMPERATURE Option 217 C 200 C 255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 150 C 3 C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Soldering Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: - Soldering iron tip temperature = 315C max. - Soldering duration = 3s max. - Number of cycles = 1 only - Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Broadcom Figure 15: Recommended Board Reflow Direction Handling Precautions For automated pick and place, Broadcom has tested a nozzle size with OD 1.5 mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. AV02-0198EN 14 HSMx-A10x-xxxxx Data Sheet Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures. Before use: - An unopened moisture barrier bag (MBB) can be stored at <40C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the Humidity Indicator Card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - Do not open the MBB prior to assembly (for example, for IQC). If unavoidable, MBB must be properly resealed with fresh desiccant and HIC. The exposed duration must be taken in as floor life. Control after opening the MBB: - Read the HIC immediately upon opening of MBB. - Keep the LEDs at <30/60% RH at all times, and complete all high temperature-related processes, including soldering, curing or rework within 672 hours. Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or a desiccator at <5% RH. Application Precautions Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at <5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours. PLCC-2, Surface Mount LED Indicator Baking is required if: - The HIC indicator indicates a change in color for 10% and 5%, as stated on the HIC. - The LEDs are exposed to conditions of >30C/60% RH at any time. - The LED's floor life exceeded 168 hours. The recommended baking condition is: 605C for 20 hours. Baking can only be done once. Storage: The soldering terminals of these Broadcom LEDs are silver plated. If the LEDs are exposed in ambient environment for too long, the silver plating might be oxidized, thus affecting its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in a desiccator at <5% RH. Broadcom The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved. The LED exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (meaning: intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. The LED is not intended for reverse bias. Use other appropriate components for such purposes. When driving the LED in matrix form, ensure that the reverse bias voltage does not exceed the allowable limit of the LED. Do not use the LED in the vicinity of material with sulfur content or in environments of high gaseous sulfur compounds and corrosive elements. Examples of material that might contain sulfur are rubber gaskets, room- temperature vulcanizing (RTV) silicone rubber, rubber gloves, and so on. Prolonged exposure to such environments may affect the optical characteristics and product life. White LEDs must not be exposed to acidic environments and must not be used in the vicinity of any compound that may have acidic outgas, such as, but not limited to, acrylate adhesive. These environments have an adverse effect on LED performance. This LED is designed to have enhanced gas corrosion resistance. Its performance has been tested according to the conditions below: - IEC 60068-2-43: 25C/75% RH, H2S 15 ppm, 21 days - IEC 60068-2-42: 25C/75% RH, SO2 25 ppm, 21 days - IEC 60068-2-60: 25C/75% RH, SO2 200 ppb, NO2 200 ppb, H2S 10 ppb, Cl2 10 ppb, 21 days. As actual application might not be exactly similar to the test conditions, do verify that the LED will not be damaged by prolonged exposure in the intended environment. Avoid rapid change in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED. AV02-0198EN 15 HSMx-A10x-xxxxx Data Sheet If the LED is intended to be used in harsh or outdoor environment, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. Thermal Management The optical, electrical, and reliability characteristics of the LED are affected by temperature. Keep the junction temperature (TJ) of the LED below the allowable limit at all times. TJ can be calculated as follows: TJ = TA + RJ-A x IF x VFmax PLCC-2, Surface Mount LED Indicator TS can be easily measured by mounting a thermocouple on the soldering joint as shown in preceding figure, while RJ-S is provided in the data sheet. Verify the TS of the LED in the final product to ensure that the LEDs are operating within all maximum ratings stated in the data sheet. Eye Safety Precautions LEDs may pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment. where; TA = ambient temperature (C) RJ-A = thermal resistance from LED junction to ambient (C/W) IF = forward current (A) VFmax = maximum forward voltage (V) The complication of using this formula lies in TA and RJ-A. Actual TA is sometimes subjective and hard to determine. RJ-A varies from system to system depending on design and is usually not known. Another way of calculating TJ is by using the solder point temperature, TS as follows: TJ = TS + RJ-S x IF x VFmax where; TS = LED solder point temperature as shown in the following figure (C) RJ-S = thermal resistance from junction to solder point (C/W) IF = forward current (A) VFmax = maximum forward voltage (V) Figure 16: Solder Point Temperatures on PCB Package mark Ts point Broadcom AV02-0198EN 16 Disclaimer Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components, or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its suppliers, for all loss, damage, expense, or liability in connection with such use. Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU. Copyright (c) 2017-2018 Broadcom. All Rights Reserved. The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.