1. Product profile
1.1 General description
PNP transistor in a SOT416 (SC-75) plastic package. The NPN complement is 2PC4617.
1.2 Features
Low current (max. 150 mA)
Low voltage (max. 50 V)
1.3 Applications
General-purpose switching and amplification in communication, Electronic Data
Processing (EDP) and consumer applicatio ns.
2. Pinning information
3. Ordering information
2PA1774
PNP general-purpose transistor
Rev. 05 — 17 November 2009 Product data sheet
Table 1. Pinning
Pin Description Simplified outline Symbol
1base
2emitter
3 collector
12
3
sym01
3
3
2
1
Table 2. Ordering information
Type number Package
Name Description Version
2PA1774Q SC-75 plastic surface mounted package; 3 leads SOT416
2PA1774R
2PA1774S
2PA1774_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 2 of 7
NXP Semiconductors 2PA1774
PNP general-purpose transistor
4. Marking
5. Limiting values
[1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
6. Thermal characteristics
[1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
Table 3. Marking codes
Type number Marking code
2PA1774Q YQ
2PA1774R YR
2PA1774S YS
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 60 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 6V
ICcollector current (DC) - 150 mA
ICM peak collector current - 200 mA
IBM peak base current - 100 mA
Ptot total power dissipation Tamb 25 °C[1] -150mW
Tstg storage temperature 65 +150 °C
Tjjunction temperature - 150 °C
Tamb ambient temperature 65 +150 °C
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient [1] --833K/W
2PA1774_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 3 of 7
NXP Semiconductors 2PA1774
PNP general-purpose transistor
7. Characteristics
[1] Pulse test: tp300 μs; δ≤0.02.
Table 6. Characteristics
Tamb = 25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base
cut-off current IE=0 A; V
CB =30 V - - 100 nA
IE=0 A; V
CB =30 V;
Tj= 150 °C--5μA
IEBO emitter-base
cut-off current IC=0 A; V
EB =4V - - 100 nA
hFE DC current gain IC=1mA; V
CE =6V [1]
2PA1774Q 120 - 270
2PA1774R 180 - 390
2PA1774S 270 - 560
VCEsat collector-emitter
saturation
voltage
IC=50 mA;
IB=5mA [1] --200 mV
Cccollector
capacitance IE=i
e=0 A;
VCB =12 V; f = 1 MHz --2.2pF
fTtransition
frequency IE=2mA;
VCE =12 V;
f = 100 MHz
[1] 100--MHz
2PA1774_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 4 of 7
NXP Semiconductors 2PA1774
PNP general-purpose transistor
8. Package outline
Fig 1. Package outline SOT416 (SC-75)
UNIT A1
max bpcDEe1HELpQw
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.1 0.30
0.15
0.25
0.10
1.8
1.4
0.9
0.7 0.5
e
11.75
1.45 0.2
v
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
0.23
0.13
SOT416 SC-75
wM
bp
D
e1
e
A
A1
Lp
Q
detail X
HE
EAB
B
vMA
0 0.5 1 mm
scale
A
0.95
0.60
c
X
12
3
Plastic surface-mounted package; 3 leads SOT41
6
04-11-04
06-03-16
2PA1774_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 5 of 7
NXP Semiconductors 2PA1774
PNP general-purpose transistor
9. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
2PA1774_5 20091117 Product data sheet - 2PA1774_4
Modifications: This data sheet was changed to reflec t the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technica l
content.
Figure 1 “Package outline SOT416 (SC-75): updated
2PA1774_4 20041124 Product data sheet - 2PA1774_3
2PA1774_3 20001212 Product specification - 2PA1774_2
2PA1774_2 19990601 Preliminary specification - 2PA1774_1
2PA1774_1 19970709 Preliminary specification - -
2PA1774_5 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 05 — 17 November 2009 6 of 7
NXP Semiconductors 2PA1774
PNP general-purpose transistor
10. Legal information
10.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warrant ies as to t he accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full dat a
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre va il.
10.3 Disclaimers
General — In formation in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give an y represent ations or
warranties, expressed or impli ed, as to the accuracy or completeness of such
information and shall have no liability for th e co nsequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are no t designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ra tings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other co nditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may af fect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between inf ormation in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Not hing in this document may be interpret ed or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
10.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respective ow ners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors 2PA1774
PNP general-purpose transistor
© NXP B.V. 2009. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of rele ase: 17 Novem ber 2009
Document identifier: 2PA1774_5
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
12. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 2
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5
10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Contact information. . . . . . . . . . . . . . . . . . . . . . 6
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7