LCB717STR - IXYS Integrated Circuits Division

INTEGRATED CIRCUITS DIVISION

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DS-LCB717-R02 1

LCB717

Single-Pole, Normally Closed

OptoMOS® Relay

Part # Description

LCB717 6-Lead DIP (50/Tube)

LCB717S 6-Lead Surface Mount (50/Tube)

LCB717STR 6-Lead Surface Mount (1000/Reel)

Parameter Rating Units

Load Voltage 30 VP

Load Current 1.5 Arms / ADC

On-Resistance (max) 0.3 

LED Current to Operate 2 mA

Applications

Features

Description

Approvals

Ordering Information

Pin Configuration

Switching Characteristics

of Normally Closed Devices

LCB717 is a single-pole normally closed

(1-Form-B) solid state relay that uses optically

coupled technology to provide an enhanced 3750Vrms

isolation barrier between the input and the output of

the relay. The efficient MOSFET switches use IXYS

Integrated Circuits' patented OptoMOS architecture.

The optically coupled output is controlled by a highly

efficient infrared LED.

• Sensor Circuitry

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Medical Equipment-Patient/Equipment Isolation

• Security

• Aerospace

• Industrial Controls

• 1.5A Load Current

• 0.3 Max On-Resistance

• 2mA Control Current

• 3750Vrms Input/Output Isolation

• Low Drive Power Requirements

• High Reliability

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Flammability Rating UL 94 V-0

• Small 6-Pin Package

• Tape & Reel, Surface Mount Version Available

Form-B

10% 90%

ILOAD

toff ton

• UL Recognized Component: File E76270

• CSA Certified Component: Certificate 1175739

• EN/IEC 60950-1 Certified Component:

Certificate available on our website

+ Control

– Control

Do Not Use

Load

Do Not Use

Load

AC/DC Configuration

+ Control

– Control

Do Not Use

+ Load

– Load

DC Only Configuration

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LCB717

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Typical values are characteristic of the device at +25°C,

and are the result of engineering evaluations. They are

provided for information purposes only, and are not part of

the manufacturing testing requirements.

Parameter Conditions Symbol Min Typ Max Units

Output Characteristics

Load Current

AC/DC Configuration, Continuous IF=0mA IL

- - 1.5 Arms / ADC

DC Configuration, Continuous - - 3 ADC

Peak IF=0mA , t < 10ms ILPK --5 A

On-Resistance 1

IF=0mA, IL=1.5A - - 0.3 AC/DC Configuration RON 

DC Configuration IF=0mA, IL=3A - - 0.08

Switching Speeds

Turn-On ton --2

IF=5mA, VL=10V ms

Turn-Off toff --5

Off-State Leakage Current IF=2mA, VL=30V ILEAK --1 A

Output Capacitance IF=2mA, VL=25V, f=1MHz COUT

- 160 - pF

IF=2mA, VL=1V, f=1MHz - 459 -

Input Characteristics

Input Control Current to Activate 2IL=1A IF--2 mA

Input Control Current to Deactivate - IF0.1 - - mA

Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V

Reverse Input Current VR=5V IR--10 A

Common Characteristics

Capacitance, Input to Output VIO=0V, f=1MHz CIO -3- pF

1 Measurement taken within 1 second of on-time.

2 For high temperature operation (>60ºC) a minimum LED drive current of 4mA is recommended.

Parameter Ratings Units

Blocking Voltage 30 VP

Reverse Input Voltage 5 V

Input Control Current

Peak (10ms)

50 mA

Input Power Dissipation 1100 mW

Total Power Dissipation 2800 mW

Isolation Voltage, Input to Output 3750 Vrms

ESD Rating, Human Body Model 8 kV

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

1 Derate linearly 1.33 mW / ºC

2 Derate linearly 6.67 mW / ºC

Absolute Maximum Ratings @ 25ºC

Electrical Characteristics @ 25ºC

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LED Forward Voltage (V)

1.215 1.230 1.245 1.260 1.275 1.290

Device Count (N)

Typical LED Forward Voltage Drop

(N=50, IF=5mA)

Turn-On Time (ms)

0.45 0.50 0.55 0.60 0.65 0.70

Device Count (N)

Typical Turn-On Time

(N=50, IF=5mA, IL=100mA)

Turn-Off Time (ms)

2.0 2.3 2.6 2.9 3.2 3.5 3.8 4.1

Device Count (N)

Typical Turn-Off Time

(N=50, IF=5mA, IL=100mA)

LED Forward Current (mA)

0.275 0.300 0.325 0.350 0.375 0.400 0.425

Device Count (N)

Typical LED Current to Operate

(N=50, IL=100mA)

Blocking Voltage (VP)

34 35 36 37 38 39 40

Device Count (N)

Typical Blocking Voltage Distribution

(N=50, IF=2mA)

On-Resistance (:)

0.1700 0.1725 0.1750 0.1775 0.1800 0.1825 0.1850

Device Count (N)

Typical On-Resistance Distribution

(N=50, IF=0mA, IL=1A)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Current (mA)

0.20

0.25

0.30

0.35

0.40

0.45

0.50

Typical LED Current to Operate

vs. Temperature

(IL=750mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-On Time (Ps)

350

400

450

500

550

600

Typical Turn-On Time

vs. Temperature

(VL=10V, IL=100mA)

IF=5mA

IF=2mA

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-Off Time (ms)

Typical Turn-Off Time

vs. Temperature

(IL=100mA)

IF=2mA

IF=5mA

IF=10mA

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Voltage (V)

1.0

1.1

1.2

1.3

1.4

1.5

1.6

Typical LED Forward Voltage Drop

vs. Temperature

IF=10mA

IF=5mA

IF=2mA

IF=50mA

IF=20mA

LED Current (mA)

0 1020304050

Turn-On Time (Ps)

500

510

520

530

540

550

Typical Turn-On Time

vs. LED Forward Current

(IL=100mA)

LED Forward Current (mA)

0 1020304050

Turn-Off Time (ms)

Typical Turn-Off Time

vs. LED Forward Current

(IL=100mA)

PERFORMANCE DATA*

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

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LCB717

Temperature (ºC)

-40 -20 0 20 40 60 80 100

On-Resistance (:)

0.15

0.16

0.17

0.18

0.19

0.20

0.21

0.22

Typical On-Resistance vs. Temperature

AC/DC Configuration

(IF=0mA, IL=750mA)

Load Voltage (V)

-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3

Load Current (A)

-2.0

-1.5

-1.0

-0.5

0.0

0.5

1.0

1.5

2.0

Typical Load Current vs. Load Voltage

AC/DC Configuration

(IF=0mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Load Current (A)

0.6

0.8

1.0

1.2

1.4

1.6

Maximum Load Current vs. Temperature

AC/DC Configuration

(IF=0mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

On-Resistance (:)

0.030

0.035

0.040

0.045

0.050

0.055

0.060

0.065

Typical On-Resistance vs. Temperature

DC-Only Configuration

(IF=0mA, IL=1.5A)

Load Voltage (V)

0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14

Load Current (A)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

Typical Load Current vs. Load Voltage

DC-Only Configuration

(IF=0mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Load Current (A)

1.0

1.5

2.0

2.5

3.0

3.5

Maximum Load Current vs. Temperature

DC-Only Configuration

(IF=0mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Blocking Voltage (VP)

Typical Blocking Voltage

vs. Temperature

(IF=4mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Leakage Current (nA)

Leakage Current vs. Temperature

Measured Across Pins 4 & 6

(IF=4mA, VL=30V)

Load Voltage (V)

0 5 10 15 20 25

Output Capacitance (pF)

100

200

300

400

500

600

700

800

Output Capacitance vs. Load Voltage

(IF=2mA, f=1MHz)

Time

10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s

Load Current (A)

Energy Rating Curve

PERFORMANCE DATA*

*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.

For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION

LCB717

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Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of

the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of

our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices

when handled according to the limitations and information in that standard as well as to any limitations set forth in the

information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Classiﬁ cation

LCB717 / LCB717S MSL 1

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Soldering Profile

Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the

body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum

Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other

processes, the guidelines of J-STD-020 must be observed.

Device Classiﬁ cation Temperature (Tc) Dwell Time (tp) Max Reﬂ ow Cycles

LCB717 250ºC 30 seconds 1

LCB717S 250ºC 30 seconds 3

Board Wash

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux

residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage

to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow

up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the

variability of the wash parameters used to clean the board, determination of the bake temperature and duration

necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning

or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the

device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

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LCB717

Mechanical Dimensions

Dimensions

(inches)

PCB Hole Pattern

6.350 ± 0.127

(0.250 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

5.080 ± 0.127

(0.200 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

0.254 ± 0.0127

(0.010 ± 0.0005)

9.144 ± 0.508

(0.360 ± 0.020)

7.239 TYP

(0.285 TYP)

7.620 ± 0.254

(0.300 ± 0.010)

3.302 ± 0.051

(0.130 ± 0.002) 4.064 TYP

(0.160 TYP)

0.457 ± 0.076

(0.018 ± 0.003)

8.382 ± 0.381

(0.330 ± 0.015) 2.54 ± 0.127

(0.100 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

1.651 ± 0.254

(0.065 ± 0.010)

Pin 1

Dimensions

(inches)

PCB Land Pattern

0.254 ± 0.0127

(0.010 ± 0.0005)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.127

(0.025 ± 0.005)

3.302 ± 0.051

(0.130 ± 0.002)

4.445 ± 0.254

(0.175 ± 0.010)

2.54

(0.10)

8.90

(0.3503)

1.65

(0.0649)

0.65

(0.0255)

8.382 ± 0.381

(0.330 ± 0.015) 2.54 ± 0.127

(0.100 ± 0.005)

9.524 ± 0.508

(0.375 ± 0.020) 6.350 ± 0.127

(0.250 ± 0.005)

0.457 ± 0.076

(0.018 ± 0.003)

1.651 ± 0.254

(0.065 ± 0.010)

1.651 ± 0.254

(0.065 ± 0.010)

Pin 1

LCB717

LCB717S

INTEGRATED CIRCUITS DIVISION

Specification: DS-LCB717-R02

OptoMOS® is a registered trademark of IXYS Integrated Circuits

6/26/2018

For additional information please visit our website at: www.ixysic.com

LCB717

IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes

to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'

Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but

not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property

or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.

NOTES:

1. All dimensions carry tolerances of EIA Standard 481-2

2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2

Dimensions

(inches)

Embossment

Embossed

Carrier

330.2 Dia

(13.00 Dia)

Top Cover

Tape Thickness

0.102 Max

(0.004 Max)

W=16.00

(0.63)

B0 = 10.10

(0.398)

A0 = 10.10

(0.398)

P1 = 12.00

(0.472)

K1 = 3.80

(0.15)

K0 = 4.90

(0.19)

User Direction of Feed

LCB717S Tape & Reel