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REV:A
SMD Diodes Specialist
GBJ1502-G Thru. GBJ1508-G
Dimensions in millimeter
QW-BBR10
Features
-Plastic package has underwriters laboratory
Flammability classification 94V-0.
-Glass passivated chip junction.
-High case dielectric with standing voltage of
2500 VRMS.
-High surge current capability.
-Ideal for printed circuit boards.
-High temperautre soldering guaranteed:
O
260 C/10sec, 0.375"(9.5mm) lead length,
5lbs.(2.3kg) tension.
Mechanical Data
-Case: 5S Molded Plastic body
-Terminal: Plated leads solderable per MIL-STD-
750, method 2026.
-Mounting position : Any (Note 3).
-Mounting torque: 8 in-lbs max.
-Weight: 0.26 ounce, 7.0 grams.
Reverse Voltage: 200 to 800V
RoHS Device
Maximum ratings and electrical characteristics
O
Rating at 25 C ambient temperature unless otherwise specified.
GBJ
Note:
1. Unit case mounted on Al plate heatsink.
2. Unit mounted on P.C.B. with 0.5×0.5" ( 12×12mm) copper pads and 0.375"(9.5mm) lead length.
3. Recommended mounting position is to bolt down on heatsink with silicon thermal compound for maximum heat transfer with #6 screws.
COMCHIP
2.5 0.2
2.2 0.2
1 0.1
10 0.2
7.5
0.2
4 0.2 5
20 0.3
17
.
5 0.5
11 0.2
2.7 0.2
3.5 0.2
3.2 0.2
0.7 0.1
4.6 0.2
3.6 0.2
++
7.5
0.2
30 0.3
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
±
Parameter Symbol Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward
output current
Peak forward surge current, 8.3ms single
half sine-wave superimposed on rated load
(JEDEC method)
Rating for fusing (t<8.3ms)
Maximum instantaneous forward voltage
drop per element at 7.5A DC
Maximum reverse current at
rated DC blocking voltage TA=125
Typical thermal resistance per leg
Operating and storage temperature range
O
@TC=107 C
O
@TA=25 C
O
TA=25 C
OC
VRRM
VRMS
VDC
IF(AV)
IFSM
2
I t
VF
IR
RθJA
TJ,TSTG
GBJ1502-G
200
140
200
GBJ1504-G
400
280
400
GBJ1506-G
600
420
600
GBJ1508-G
800
560
800
15
3.5
240
60
1.05
10
250
22
-55 ~ +150
V
V
V
A
A
2
A sec
V
A
OC/W
OC
μ
Glass Passivated Single Phase Bridge Rectifiers