OUT
IN
GND
LP38513-ADJ
VIN VOUT
EN
VEN
CIN
10 PF
Ceramic COUT
10 PF
Ceramic
GND GND
ON
OFF CFF
ADJ
R1
R2
LP38513-ADJ
www.ti.com
SNVS514C –JANUARY 2009–REVISED APRIL 2013
LP38513-ADJ 3A Fast-Transient Response Adjustable Low-Dropout Linear Voltage
Regulator
Check for Samples: LP38513-ADJ
1FEATURES APPLICATIONS
2• 2.25V to 5.5V Input Voltage Range • Digital Core ASICs, FPGAs, and DSPs
• Adjustable Output Voltage Range of 0.5V to • Servers
4.5V • Routers and Switches
• 3.0A Output Load Current • Base Stations
• ±2.0% Accuracy over Line, Load, and Full- • Storage Area Networks
Temperature Range from -40°C to +125°C • DDR2 Memory
• Stable with tiny 10 µF ceramic capacitors
• Enable pin DESCRIPTION
The LP38513-ADJ Fast-Transient Response Low-
• Typically less than 1 µA of Ground pin current Dropout Voltage Regulator offers the highest-
when Enable pin is low performance in meeting AC and DC accuracy
• 25dB of PSRR at 100 kHz requirements for powering Digital Cores. The
• Over-Temperature and Over-Current LP38513-ADJ uses a proprietary control loop that
Protection enables extremely fast response to change in line
conditions and load demands. Output Voltage DC
• TO-263 THIN 5-Pin Surface Mount Package accuracy at 2.5% over line, load and full temperature
range from -40°C to +125°C. The LP38513-ADJ is
designed for inputs from the 2.5V, 3.3V, and 5.0V rail,
is stable with 10 μF ceramic capacitors, and has an
adjustable output voltage. The LP38513-ADJ
provides excellent transient performance to meet the
demand of high performance digital core ASICs,
DSPs, and FPGAs found in highly-intensive
applications such as servers, routers/switches, and
base stations.
Typical Application Circuit
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2009–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Exposed
DAP
OUT
GND
EN 1
2
3
4
5
IN
LP38513TJ-ADJ
ADJ
LP38513-ADJ
SNVS514C –JANUARY 2009–REVISED APRIL 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Connection Diagram
Top View
See Package Number NDQ0005A
Pin Descriptions for TO-263 THIN Package
Pin # Pin Name Function
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
1 EN must be tied to the input voltage, or actively driven.
2 IN Input Supply Pin
3 GND Ground
4 OUT Regulated Output Voltage Pin
5 ADJ The feedback to the internal Error Amplifier to set the output voltage
The TO-263 THIN DAP connection is used as a thermal connection to remove heat from the device
to an external heat-sink in the form of the copper area on the printed circuit board. The DAP is
DAP DAP physically connected to backside of the die, but is not internally connected to device ground. The
DAP should be soldered to the Ground Plane copper..
2Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LP38513-ADJ
LP38513-ADJ
www.ti.com
SNVS514C –JANUARY 2009–REVISED APRIL 2013
ABSOLUTE MAXIMUM RATINGS (1)
Storage Temperature Range −65°C to +150°C
Soldering Temperature (2)
Thin TO-263 260°C, 10s
ESD Rating (3) ±2 kV
Power Dissipation (4) Internally Limited
Input Pin Voltage (Survival) -0.3V to +6.0V
Enable Pin Voltage (Survival) -0.3V to +6.0V
Output Pin Voltage (Survival) -0.3V to +6.0V
ADJ Pin Voltage (Survival) -0.3V to +6.0V
IOUT (Survival) Internally Limited
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not specific performance limits. For specifications and conditions, see the
Electrical Characteristics.
(2) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the
temperatures and times are for Sn-Pb (STD) only.
(3) The human body model (HBM) is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin. Test method is per JESD22-
A114.
(4) Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum
allowable operating junction temperature (TJ(MAX)), and package thermal resistance (θJA). The typical θJA rating given is worst case
based on minimum land area on two-layer PCB (EIA/JESD51-3). See POWER DISSIPATION/HEAT-SINKING for details.
OPERATING RATINGS (1)
Input Supply Voltage, VIN 2.25V to 5.5V
Output Voltage, VOUT VADJ to 5V
Enable Input Voltage, VEN 0.0V to 5.5V
Output Current (DC) 1 mA to 3A
Junction Temperature (2) −40°C to +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not specific performance limits. For specifications and conditions, see the
Electrical Characteristics.
(2) Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum
allowable operating junction temperature (TJ(MAX)), and package thermal resistance (θJA). The typical θJA rating given is worst case
based on minimum land area on two-layer PCB (EIA/JESD51-3). See POWER DISSIPATION/HEAT-SINKING for details.
Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LP38513-ADJ
LP38513-ADJ
SNVS514C –JANUARY 2009–REVISED APRIL 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
Unless otherwise specified: VIN= 2.50V, VOUT = VADJ, IOUT= 10 mA, CIN= 10 µF, COUT= 10 µF, VEN= 2.0V. Limits in standard
type are for TJ= 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C.
Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at TJ= 25°C, and are provided for reference purposes only.
Symbol Parameter Conditions Min Typ Max Units
2.25V ≤VIN ≤5.5V 495.0 505.0
VADJ VADJ Accuracy (1) 500. mV
10 mA ≤IOUT ≤3A 490.0 510.0
IADJ ADJ Pin Bias Current 2.25V ≤VIN ≤5.5V - 1 - nA
0.03
ΔVADJ/ΔVIN VADJ Line Regulation (2) (1) 2.25V ≤VIN ≤5.5V - - %/V
0.06
0.15
ΔVADJ/ΔIOUT VADJ Load Regulation (3) (1) 10 mA ≤IOUT ≤3A - - %/A
0.20
VDO Dropout Voltage (4) IOUT = 3A - - 470 mV
10
IOUT = 10 mA - 8 12
Ground Pin Current, Output mA
Enabled 14
IGND IOUT = 3A - 12 16
Ground Pin Current, Output 5
VEN = 0.50V - 1 µA
Disabled 10
ISC Short Circuit Current VOUT = 0V - 5.2 - A
Enable Input
VEN rising from <0.5V until 0.90 1.50
VEN(ON) Enable ON Voltage Threshold 1.20
VOUT = ON 0.80 1.60 V
VEN falling from 1.6V until 0.70 1.30
VEN(OFF) Enable OFF Voltage Threshold 1.00
VOUT = OFF 0.60 1.40
VEN(HYS) Enable Voltage Hysteresis VEN(ON) - VEN(OFF) - 200 - mV
VEN = VIN - 1 -
IEN Enable Pin Current nA
VEN = 0V - -1 -
Time from VEN < VEN(TH) to
td(OFF) Turn-off delay - 5 -
VOUT = OFF, ILOAD = 3A µs
Time from VEN >VEN(TH) to
td(ON) Turn-on delay - 5 -
VOUT = ON, ILOAD = 3A
AC Parameters
VIN = 2.5V - 73 -
f = 120Hz
PSRR Ripple Rejection dB
VIN = 2.5V - 70 -
f = 1 kHz
ρn(l/f) Output Noise Density f = 120Hz - 0.4 - µV/√Hz
enOutput Noise Voltage BW = 10Hz - 100kHz - 25 - µVRMS
Thermal Characteristics
TSD Thermal Shutdown TJrising - 165 - °C
ΔTSD Thermal Shutdown Hysteresis TJfalling from TSD - 10 -
Thermal Resistance
θJ-A TO-263 THIN - 67 - °C/W
Junction to Ambient (5)
Thermal Resistance
θJ-C TO-263 THIN - 2 - °C/W
Junction to Case
(1) The line and load regulation specification contains only the typical number. However, the limits for line and load regulation are included
in the output voltage tolerance specification.
(2) Line regulation is defined as the change in VADJ from the nominal value due to change in the voltage at the input.
(3) Load regulation is defined as the change in VADJ from the nominal value due to change in the load current at the output.
(4) Dropout voltage (VDO) is typically defined as the input to output voltage differential (VIN - VOUT) where the input voltage is low enough to
cause the output voltage to drop 2%. For the LP38513-ADJ, the minimum operating voltage of 2.25V is the limiting factor when the
programed output voltage is less than typically 1.80V.
(5) Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum
allowable operating junction temperature (TJ(MAX)), and package thermal resistance (θJA). The typical θJA rating given is worst case
based on minimum land area on two-layer PCB (EIA/JESD51-3). See POWER DISSIPATION/HEAT-SINKING for details.
4Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LP38513-ADJ
LP38513-ADJ
www.ti.com
SNVS514C –JANUARY 2009–REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified: TJ= 25°C, VIN = 2.50V, VOUT = VADJ, VEN = 2.0V, CIN = 10 µF, COUT = 10 µF, IOUT = 10 mA.
VADJ VOUT
vs vs
Temperature VIN
Figure 1. Figure 2.
Ground Pin Current (IGND) Ground Pin Current (IGND)
vs vs
VIN Temperature
Figure 3. Figure 4.
Ground Pin Current (IGND) Enable Threshold
vs vs
Temperature Temperature
Figure 5. Figure 6.
Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LP38513-ADJ
LP38513-ADJ
SNVS514C –JANUARY 2009–REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ= 25°C, VIN = 2.50V, VOUT = VADJ, VEN = 2.0V, CIN = 10 µF, COUT = 10 µF, IOUT = 10 mA.
VOUT Load regulation
vs vs
VEN Temperature
Figure 7. Figure 8.
Line Regulation Current Limit
vs vs
Temperature Temperature
Figure 9. Figure 10.
Load Transient, 10mA to 3A Load Transient, 10 mA to 3A
VOUT = VADJ, COUT = 10 μF Ceramic VOUT = 1.20V, COUT = 10 μF Ceramic
Figure 11. Figure 12.
6Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LP38513-ADJ
LP38513-ADJ
www.ti.com
SNVS514C –JANUARY 2009–REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TJ= 25°C, VIN = 2.50V, VOUT = VADJ, VEN = 2.0V, CIN = 10 µF, COUT = 10 µF, IOUT = 10 mA.
Load Transient, 1A to 3A Line Transient
VOUT = 1.20V, COUT = 10 μF Ceramic VOUT = VADJ, COUT = 10 μF Ceramic
Figure 13. Figure 14.
Line Transient PSRR, IOUT = 100 mA
VOUT = 1.20V, COUT = 10 μF Ceramic VOUT = VADJ, COUT = 10 μF Ceramic
Figure 15. Figure 16.
PSRR, IOUT = 3.0A Output Noise Density
VOUT = VADJ, COUT = 10 μF Ceramic VOUT = VADJ, COUT = 10 μF Ceramic
Figure 17. Figure 18.
Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LP38513-ADJ
LP38513-ADJ
www.ti.com
SNVS514C –JANUARY 2009–REVISED APRIL 2013
APPLICATION INFORMATION
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are required to assure stability. These capacitors must be
correctly selected for proper performance.
Input Capacitor
A ceramic input capacitor of at least 10 µF is required. For general usage across all load currents and operating
conditions, a 10 µF ceramic input capacitor will provide satisfactory performance.
Output Capacitor
A ceramic capacitor with a minimum value of 10 µF is required at the output pin for loop stability. It must be
located less than 1 cm from the device and connected directly to the output and ground pin using traces which
have no other currents flowing through them. As long as the minimum of 10 µF ceramic is met, there is no
limitation on any additional capacitance.
X7R and X5R dielectric ceramic capacitors are strongly recommended, as they typically maintain a capacitance
range within ±20% of nominal over full operating ratings of temperature and voltage. Of course, they are typically
larger and more costly than Z5U/Y5U types for a given voltage and capacitance.
Z5U and Y5V dielectric ceramics are not recommended as the capacitance will drop severely with applied
voltage. A typical Z5U or Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage
applied to it. The Z5U and Y5V also exhibit a severe temperature effect, losing more than 50% of nominal
capacitance at high and low limits of the temperature range.
Application Information
REVERSE VOLTAGE
A reverse voltage condition will exist when the voltage at the output pin is higher than the voltage at the input pin.
Typically this will happen when VIN is abruptly taken low and COUT continues to hold a sufficient charge such that
the input to output voltage becomes reversed. A less common condition is when an alternate voltage source is
connected to the output.
There are two possible paths for current to flow from the output pin back to the input during a reverse voltage
condition.
While VIN is high enough to keep the control circuity alive, and the Enable pin is above the VEN(ON) threshold, the
control circuitry will attempt to regulate the output voltage. Since the input voltage is less than the programmed
output voltage, the control circuit will drive the gate of the pass element to the full on condition when the output
voltage begins to fall. In this condition, reverse current will flow from the output pin to the input pin, limited only
by the RDS(ON) of the pass element and the output to input voltage differential. Discharging an output capacitor up
to 1000 µF in this manner will not damage the device as the current will rapidly decay. However, continuous
reverse current should be avoided. When the Enable is low this condition will be prevented.
The internal PFET pass element in the LP38513-ADJ has an inherent parasitic diode. During normal operation,
the input voltage is higher than the output voltage and the parasitic diode is reverse biased. However, if the
output voltage to input voltage differential is more than 500 mV (typical) the parasitic diode becomes forward
biased and current flows from the output pin to the input pin through the diode. The current in the parasitic diode
should be limited to less than 1A continuous and 5A peak.
If used in a dual-supply system where the regulator output load is returned to a negative supply, the output pin
must be diode clamped to ground. A Schottky diode is recommended for this protective clamp.
SHORT-CIRCUIT PROTECTION
The LP38513-ADJ is short circuit protected, and in the event of a peak over-current condition the short-circuit
control loop will rapidly drive the output PMOS pass element off. Once the power pass element shuts down, the
control loop will rapidly cycle the output on and off until the average power dissipation causes the thermal
shutdown circuit to respond to servo the on/off cycling to a lower frequency. Please refer to the POWER
DISSIPATION/HEAT-SINKING section for power dissipation calculations.
Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LP38513-ADJ
LP38513-ADJ
SNVS514C –JANUARY 2009–REVISED APRIL 2013
www.ti.com
SETTING THE OUTPUT VOLTAGE
The output voltage is set using the external resistive divider R1 and R2. The output voltage is given by the
formula:
VOUT = VADJ x (1 + (R1/R2)) (1)
The resistors used for R1 and R2 should be high quality, tight tolerance, and with matching temperature
coefficients. It is important to remember that, although the value of VADJ is specified, the final value of VOUT is
not. The use of low quality resistors for R1 and R2 can easily produce a VOUT value that is unacceptable.
It is recommended that the values selected for R1 and R2 are such that the parallel value is less than 1.00 kΩ.
This is to reduce the possibility of any internal parasitic capacitances on the ADJ pin from creating an
undesirable phase shift that may interfere with device stability.
( (R1 x R2) / (R1 + R2) ) ≤1.00 kΩ(2)
FEED FORWARD CAPACITOR, CFF
When using a ceramic capacitor for COUT, the typical ESR value will be too small to provide any meaningful
positive phase compensation, FZ, to offset the internal negative phase shifts in the gain loop.
FZ= 1 / (2 x πx COUT x ESR) (3)
A capacitor placed across the gain resistor R1 will provide additional phase margin to improve load transient
response of the device. This capacitor, CFF, in parallel with R1, will form a zero in the loop response given by the
formula:
FZ= 1 / (2 x πx CFF x R1) (4)
For optimum load transient response select CFF so the zero frequency, FZ, falls between 20 kHz and 40 kHz.
CFF = 1 / (2 x πx R1 x FZ) (5)
The phase lead provided by CFF diminishes as the DC gain approaches unity, or VOUT approaches VADJ. This is
because CFF also forms a pole with a frequency of:
FP= 1 / (2 x πx CFF x (R1 || R2) ) (6)
It's important to note that at higher output voltages, where R1 is much larger than R2, the pole and zero are far
apart in frequency. At lower output voltages the frequency of the pole and the zero mover closer together. The
phase lead provided from CFF diminishes quickly as the output voltage is reduced, and has no effect when VOUT
= VADJ. For this reason, relying on this compensation technique alone is adequate only for higher output
voltages.
Table 1 lists some suggested, best fit, standard ±1% resistor values for R1 and R2, and a standard ±10%
capacitor values for CFF, for a range of VOUT values. Other values of R1, R2, and CFF are available that will give
similar results.
10 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LP38513-ADJ
LP38513-ADJ
www.ti.com
SNVS514C –JANUARY 2009–REVISED APRIL 2013
Table 1.
VOUT R1 R2 CFF FZ
0.80V 1.07 kΩ1.78 kΩ4700 pF 31.6 kHz
1.00V 1.00 kΩ1.00 kΩ4700 pF 33.8 kHz
1.20V 1.40 kΩ1.00 kΩ3300 pF 34.4 kHz
1.50V 2.00 kΩ1.00 kΩ2700 pF 29.5 kHz
1.80V 2.94 kΩ1.13 kΩ1500 pF 36.1 kHz
2.00V 1.02 kΩ340Ω4700 pF 33.2 kHz
2.50V 1.02 kΩ255Ω4700 pF 33.2 kHz
3.00V 1.00 kΩ200Ω4700 pF 33.8 kHz
3.30V 2.00 kΩ357Ω2700 pF 29.5 kHz
Please refer to Application Note AN-1378 Method For Calculating Output Voltage Tolerances in Adjustable
Regulators SNVA112 for additional information on how resistor tolerances affect the calculated VOUT value.
ENABLE OPERATION
The Enable ON threshold is typically 1.2V, and the OFF threshold is typically 1.0V. To ensure reliable operation
the Enable pin voltage must rise above the maximum VEN(ON) threshold and must fall below the minimum VEN(OFF)
threshold. The Enable threshold has typically 200mV of hysteresis to improve noise immunity.
The Enable pin (EN) has no internal pull-up or pull-down to establish a default condition and, as a result, this pin
must be terminated either actively or passively.
If the Enable pin is driven from a single ended device (such as the collector of a discrete transistor) a pull-up
resistor to VIN, or a pull-down resistor to ground, will be required for proper operation. A 1 kΩto 100 kΩresistor
can be used as the pull-up or pull-down resistor to establish default condition for the EN pin. The resistor value
selected should be appropriate to swamp out any leakage in the external single ended device, as well as any
stray capacitance.
If the Enable pin is driven from a source that actively pulls high and low (such as a CMOS rail to rail comparator
output), the pull-up, or pull-down, resistor is not required.
If the application does not require the Enable function, the pin should be connected directly to the adjacent VIN
pin.
POWER DISSIPATION/HEAT-SINKING
A heat-sink may be required depending on the maximum power dissipation (PD(MAX)), maximum ambient
temperature (TA(MAX))of the application, and the thermal resistance (θJA) of the package. Under all possible
conditions, the junction temperature (TJ) must be within the range specified in the Operating Ratings. The total
power dissipation of the device is given by:
PD= ( (VIN−VOUT) x IOUT) + ((VIN) x IGND) (7)
where IGND is the operating ground current of the device (specified under Electrical Characteristics).
The maximum allowable junction temperature rise (ΔTJ) depends on the maximum expected ambient
temperature (TA(MAX)) of the application, and the maximum allowable junction temperature (TJ(MAX)):
ΔTJ= TJ(MAX) −TA(MAX) (8)
The maximum allowable value for junction to ambient Thermal Resistance, θJA, can be calculated using the
formula:
θJA =ΔTJ/ PD(MAX) (9)
Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LP38513-ADJ
LP38513-ADJ
SNVS514C –JANUARY 2009–REVISED APRIL 2013
www.ti.com
LP38513-ADJ is available in the TO-263 THIN surface mount package. For a comparison of the TO-263 THIN
package to the standard TO-263 package see Application Note AN-1797 TO-263 THIN Package SNVA328. The
thermal resistance depends on amount of copper area, or heat sink, and on air flow. See Application Note AN-
1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages SNVA183 for guidelines.
Heat-Sinking the TO-263 THIN Package
The DAP of the TO-263 THIN package is soldered to the copper plane for heat sinking. The TO-263 THIN
package has a θJA rating of 67°C/W, and a θJC rating of 2°C/W. The θJA rating of 67°C/W includes the device
DAP soldered to an area of 0.055 square inches (0.22 in x 0.25 in) of 1 ounce copper on a two sided PCB, with
no airflow. See JEDEC standard EIA/JESD51-3 for more information.
Figure 19 shows a curve for the θJA of TO-263 THIN package for different thermal via counts under the exposed
DAP, using a four layer PCB for heat sinking. The thermal vias connect the copper area directly under the
exposed DAP to the first internal copper plane only. See JEDEC standards EIA/JESD51-5 and EIA/JESD51-7 for
more information.
Figure 19. θJA vs Thermal Via Count for the TO-263 THIN Package on 4–Layer PCB
Figure 20 shows the thermal performance when the Thin TO-263 is mounted to a two layer PCB where the
copper area is predominately directly under the exposed DAP. .As shown in the figure, increasing the copper
area beyond 1 square inch produces very little improvement.
Figure 20. θJA vs Copper Area for the TO-263 THIN Package
12 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LP38513-ADJ
LP38513-ADJ
www.ti.com
SNVS514C –JANUARY 2009–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 12
Copyright © 2009–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LP38513-ADJ
PACKAGE OPTION ADDENDUM
www.ti.com 21-May-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP38513TJ-ADJ/NOPB ACTIVE TO-263 NDQ 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LP38513
TJ-ADJ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP38513TJ-ADJ/NOPB TO-263 NDQ 5 1000 330.0 24.4 10.6 15.4 2.45 12.0 24.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 29-May-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP38513TJ-ADJ/NOPB TO-263 NDQ 5 1000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-May-2013
Pack Materials-Page 2
MECHANICAL DATA
NDQ0005A
www.ti.com
TJ5A (Rev F)
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
