P2160A-08SR - Alliance Semiconductor

October 2003 P2160

rev E

Alliance Semiconductor

2575, Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com

Notice: The information in this document is subject to change without notice.

High Frequency LCD Panel EMI Reduction IC

Features

 FCC approved method of EMI attenuation

 Provides up to 20 dB of EMI suppression

 Generates a low EMI spread spectrum clock of

the input frequency

 40 MHz to 166 MHz input frequency range

 Optimized for SVGA, XGA and high resolution

SXGA and UXGA LCD panels

 Internal loop filter minimizes external

components and board space

 2 selectable spreading options

 SSON# control pin for spread spectrum enable

and disable options

 2 selectable modulation rates

 Low cycle-to-cycle jitter

 3.3V operating range 16 mA output drives

 16 mA output drives

 TTL or CMOS compatible outputs

 Low power CMOS design

 Supports most mobile graphic accelerator

specifications

 Available in 8 pin SOIC and TSSOP

Product Description

The P2160 is a selectable spread spectrum

frequency modulator designed compared to the

typical narrow band signal produced by oscillators

and most frequency generators. Lowering EMI by

increasing a signal’s bandwidth is called “spread

spectrum clock generation” reducing the number of

circuit board layers and shielding that are traditionally

required to pass EMI regulations.

The P2160 uses the most efficient and optimized

modulation profile approved by the FCC and is

implemented in a proprietary all-digital method.

The P2160 modulates the output of a single PLL in

order to “spread” the bandwidth of a synthesized

clock and, more importantly, decreases the peak

amplitudes of its harmonics. This results in

significantly lower system EMI compared to the

typical narrow band signal produced by oscillators

and most frequency generators. Lowering EMI by

increasing a signal’s bandwidth is called “spread

spectrum clock generation”.

Applications

The P2160 is targeted towards digital flat panel

applications for Notebook PCs, Palm-size PCs, Office

Automation Equipments, and LCD Monitors, Digital

Still Cameras and GPS Devices.

Block Diagram

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Pin Configuration

Pin Description

Pin# Pin Name Type Description

1 CLKIN I

External reference frequency input. Connect to externally generated

reference signal. Select appropriate frequency range for the intended input

frequency (see Table ‘Modulation Selection’)

2 FSO I

Digital logic input used to select Frequency Range (see Table 1). This pin

has an internal pull-up resistor.

3 MRA I

Digital logic input used to select Modulation Rate (see Table 1). This pin

has an internal pull-up resistor.

4 VSS P Ground Connection. Connect to system ground.

5 SSON# I

Digital logic input used to enable Spread Spectrum function (Active Low).

Spread Spectrum function enable when low. This pin has an internal pull-

low resistor.

6 ModOUT O Spread Spectrum Clock Output.

7 SRO I

Digital logic input used to select Spreading Range (see Table 1). This pin

has an internal pull-up resistor.

8 VDD P Connect to +3.3V

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Table-1 Modulation Selection

FS0 MRA SR0 Frequency Range Spread Range Modulation Rate

0 0 0 40-80MHz +/- 0.5% (Fin/40) * 34.72 KHz

0 0 1 40-80MHz +/- 1.0% (Fin/40) * 34.72 KHz

0 1 0 40-80MHz +/- 0.5% (Fin/40) * 20.83 KHz

0 1 1 40-80MHz +/- 1.0% (Fin/40) * 20.83 KHz

1 0 0 80-166MHz +/- 0.5% (Fin/80) * 34.72 KHz

1 0 1 80-166MHz +/- 1.00% (Fin/80) * 34.72 KHz

1 1 0 80-166MHz +/- 0.5% (Fin/80) * 20.83 KHz

1 1 1 80-166MHz +/- 1.00% (Fin/80) * 20.83 KHz

Spread Spectrum Selection

Table 1 illustrates the possible spread spectrum options. The optimal setting should minimize system EMI to the

fullest without affecting system performance. The spreading is described as a percentage deviation of the center

frequency (Note: the center frequency is the frequency of the external reference input on CLKIN, Pin 1).

Example: P2160 is designed for high-resolution flat panel applications and is able to support UXGA (1600 X

1200) flat panel that operates on 162 MHz (Fin) clock speed. A spreading selection of FS0=1, SR0=1 and

modulation rate selection MRA=1, enables input frequency range from 80 ~ 166 MHz and provides a

percentage deviation of +/-1.00% (see Table 1) of the input frequency (Fin). This results in frequency on

ModOUT being swept from 160.38 MHz to 163.62 MHz at a modulation rate of 42.18 KHz (162 MHz/80 MHz X

20.83KHz). This particular example (see below figure) given here is a common EMI reduction method for

notebook and LCD monitor manufacturers and has already been implemented by most of the leading OEM and

mobile graphic accelerator manufacturers.

Application Schematic for Mobile LCD Graphics Controllers

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EMC Software Simulation

By using Alliance Semiconductor’s proprietary EMC simulation software – EMI-lator®, radiated system level EMI

analysis can be made easier to allow a quantitative assessment on Alliance’s EMI reduction products. The

simulation engine of this EMC software has already been characterized to correlate with the electrical

characteristics of Alliance EMI reduction IC’s. The figure below is an example of the simulation result. Please

visit our web site at www.alsc.comfor information on how to obtain a free copy and demonstration of EMI-lator®.

Simulation Result from EMI-lator®

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Absolute Maximum Ratings

Symbol Parameter Rating Unit

VDD, VIN Voltage on any pin with respect to GND -0.5 to + 7.0 V

TSTG Storage temperature -65 to +125 °C

TA Operating temperature 0 to +70 °C

DC Electrical Characteristics

Symbol Parameter Min Typ Max Unit

VIL Input Low Voltage GND – 0.3 - 0.8 V

VIH Input High Voltage 2.0 - VDD + 0.3 V

IIL Input Low Current (pull-up resistor on inputs FS0, SR0

and MRA) - - -35

µA

IIH Input High Current (pull-down resistor on input SSON#) - - 35 µA

VOL Output Low Voltage (VDD=3.3V, IOL = 20 mA) - - 0.4 V

VOH Output High Voltage (VDD=3.3V, IOH = 20 mA) 2.5 - - V

IDD Static Supply Current, measured @ FS0=0

@ FS0=1 - 3.27

0.67 - mA

ICC Dynamic Supply Current FS0=0 (see fIN )

(3.3V and 15 pF loading) FS0=1 (see fIN )

7.92

10.9

12.9

22.1 mA

VDD Operating Voltage 2.7 3.3 3.8 V

tON Power Up Time (First locked clock cycle after power up) 0.18 ms

ZOUT Clock Output Impedance 50 Ω

AC Electrical Characteristics

Symbol Parameter Min Typ Max Unit

fIN

Input Frequency when FS0=0

FS0=1

120

166

MHz

tLH* Output rise time

(Measured at 0.8V to 2.0V) 0.7 0.9 1.1 ns

tHL* Output fall time

(Measured at 0.8V to 2.0V) 0.6 0.8 1.0 ns

tJC Jitter (cycle to cycle) - - 360 ps

tD Output duty cycle 45 50 55 %

*tLH and tHL are measured into a capacitive load of 15pF

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Package Information

Mechanical Package Outline 8-Pin SOIC

Dimensions in inches Dimensions in millimeters

Symbol Min Nor Max Min Nor Max

A 0.057 0.064 0.071 1.45 1.63 1.80

A1 0.004 0.007 0.010 0.10 0.18 0.25

A2 0.053 0.061 0.069 1.35 1.55 1.75

B 0.012 0.016 0.020 0.31 0.41 0.51

C 0.004 0.006 0.01 0.10 0.15 0.25

D 0.186 0.194 0.202 4.72 4.92 5.12

E 0.148 0.156 0.164 3.75 3.95 4.15

e 0.050 BSC 1.27 BSC

H 0.224 0.236 0.248 5.70 6.00 6.30

L 0.012 0.020 0.028 0.30 0.50 0.70

a 0° 5° 8° 0° 5° 8°

Note: Controlling dimensions are millimeters

SOIC – 0.074 grams unit weight

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Mechanical Package Outline 8-Pin TSSOP

Dimensions in inches Dimensions in millimeters

Symbol Min Nor Max Min Nor Max

0.047

1.10

A1 0.002 0.006 0.05 0.15

A2 0.031 0.039 0.041 0.80 1.00 1.05

B 0.007 0.012 0.19 0.30

C 0.004 0.008 0.09 0.20

D 0.114 0.118 0.122 2.90 3.00 3.10

E 0.169 0.173 0.177 4.30 4.40 4.50

e 0.026 BSC 0.65 BSC

H 0.244 0.252 0.260 6.20 6.40 6.60

L 0.018 0.024 0.030 0.45 0.60 0.75

a 0°

5° 8° 0°

5° 8°

Note: Controlling dimensions are millimeters

TSSOP – 0.034 grams unit weight

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Notice: The information in this document is subject to change without notice.

Ordering Codes

Part Number Marking Package Type Qty per reel Temperature

(°C)

P2160A-08ST P2160A 8-pin SOIC, tube 0 to 70

P2160A-08SR P2160A 8-pin SOIC, tape & reel 2500 0 to 70

P2160A-08TT P2160A 8-pin TSSOP, tube 0 to 70

P2160A-08TR P2160A 8-pin TSSOP, tape & reel 2500 0 to 70

Licensed under US patent Nos 5,488,627 and 5,631,920.

Preliminary datasheet. Specification subject to change without notice.

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trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their

respective companies. Alliance reserves the right to make changes to this document and its products at any time without

notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein

represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this

data at any time, without notice. If the product described herein is under development, significant changes to these

specifications are possible. The information in this product data sheet is intended to be general descriptive information for

potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or

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including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual

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components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant

injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer

assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.

Alliance Semiconductor Corporation

2595, Augustine Drive,

Santa Clara, CA 95054

Tel# 408-855-4900

Fax: 408-855-4999

www.alsc.com

Part Number: P2160A

Document Version: E