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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. 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FSA8049 Audio Jack Detection and Configuration, MIC / GND Cross Point Switch Features Description Detection Audio Plug GND & MIC Polarity VDD 2.5 to 4.4 V THD (MIC) 0.002% Typical ESD (IEC 61000-4-2) (Air Gap) 15 kV Operating Temperature -40C to 85C 9-Ball WLCSP 3x3 Array, 0.4 mm Terminal Pitch, 250 m Ball Package Top Mark M3 Ordering Information FSA8049UCX Detects 3- or 4-pole audio accessories Detects polarity of GND and MIC on 4-pole plugs Automatically routes GND and MIC to audio jack terminals Related Resources For evaluation boards and questions, please contact: Applications The FSA8049 is an audio jack detection switch for 3- or 4-pole accessories. The FSA8049 detects the locations of ground (GND) and microphone (MIC) poles on the audio plug and automatically routes them to the appropriate connections. This allows the end user to plug accessories, such as headsets with different audio pole configurations, into the mobile device and have them operate correctly. Analog.Switch@fairchildsemi.com. Cellular Phones, Smart Phones MP3 and Portable Multimedia Player Typical Application To Audio Plug Detection Circuit VDD Baseband Processor GPIO EN Audio Jack Oscillator & Logic Detection LSPKR CEXT Audio Sub System RSPKR Switch Enable Timing 3Pole 4Pole MIC Bias RMIC MIC CMIC GND/MIC1 MIC GND/MIC2 5 tOn/Off Capacitor 100m GND GNDA Figure 1. Mobile Phone Example (c) 2011 Fairchild Semiconductor Corporation FSA8049 * Rev. 1.0.2 www.fairchildsemi.com FSA8049 -- Audio Jack Detection and Configuration, MIC/GND Cross point Switch August 2012 1 2 3 A VDD GNDA GND / MIC1 B MIC GNDA GND / MIC 2 C EN CEXT GND 3 2 1 GNDA VDD A GND/ MIC2 GNDA MIC B GND CEXT EN C GND// MIC1 M3 KK XYZ Pin Assignments , Top Through View Top Mark Side Pin Assignments Bottom View Bump Side 2 3 GND/ MIC1 GND/ MIC2 GND Top View 1 VDD GNDA GNDA CEXT MIC EN M3 KK X Y Z A B C = = = = = = FSA8049UCX Product Identifier Lot Run Trace Code Year Work Week Assembly Site (P= Penang, Malaysia) Pin 1 Indicator Bottom View Figure 2. Pin Assignments Figure 3. Top Mark Pin Descriptions Name Ball Type Description VDD A1 Power GNDA A2 GND Supply voltage GND/MIC1 A3 I/O Switch connects to audio jack MIC B1 I/O Switch connects to audio subsystem microphone pre-amplifier GNDA B2 GND GND/MIC2 B3 I/O EN C1 Input Enable (0=VIL, 1=VIH) CEXT C2 Input External capacitor for switch slow tON/OFF timing GND C3 GND Device Ground(1) Switch Ground(1) Switch Ground(1) Switch connects to audio jack 0 Disabled 1 Enabled Note: 1. GND and GNDA can be shorted together if the system does not utilize an FM antenna on the handset ground. If the system utilizes an FM antenna on the handset ground; separate GND and GNDA, place the FM-decoupling inductor and capacitor on GNDA only, and connect GND to a low-impedance path to battery ground. States of Pins after Audio Jack Detection State of pins GND/MIC1, GND/MIC2, and MIC after detection time (tDET) is complete. GND/MIC1 GND/MIC2 0 (GND) 0 (GND) 0 (GND) 1 (MIC Attached) GND/MIC1=GND, GND/MIC2=MIC 4-Pole Headset with Microphone 1 (MIC Attached) 0 (GND) GND/MIC1=MIC, GND/MIC2=GND 4-Pole Headset with Microphone (c) 2011 Fairchild Semiconductor Corporation FSA8049 * Rev. 1.0.2 Switch Configuration Accessory Connected GND/MIC1=GND, GND/MIC2=GND, MIC=GND 3-Pole Headphones www.fairchildsemi.com 2 FSA8049 -- Audio Jack Detection and Configuration, MIC/GND Cross point Switch Pin Configuration Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol v VSW Parameter Min. Max. Unit Supply Voltage from Battery -0.5 6.0 V VCC+0.5 Switch I/O Voltage -0.5 IIK Input Clamp Diode Current -50 ISW Switch I/O Current (Continuous)(2) TSTG Storage Temperature Range -65 TJ Maximum Junction Temperature TL Lead Temperature (Soldering, 10 Seconds) IEC 61000-4-2 System ESD ESD Human Body Model, JEDEC JESD22-A114 Air Gap 15 Contact 8 GND/MICn vs. GND 11 VDD vs. GND 16 All Pins 7 Charged Device Model, JEDEC JESD22-C101 All Pins V mA 50 mA +150 C +150 C +260 C kV 1.5 Note: 2. The input and output negative ratings may be exceeded if the input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol Parameter VDD Supply Voltage VEN Enable Input Voltage TA Operating Temperature (c) 2011 Fairchild Semiconductor Corporation FSA8049 * Rev. 1.0.2 Min. Max. Unit 2.5 4.4 V 0 VDD V -40 +85 C www.fairchildsemi.com 3 FSA8049 -- Audio Jack Detection and Configuration, MIC/GND Cross point Switch Absolute Maximum Ratings All typical values are at TA=25C unless otherwise specified. Symbol Parameter VDD (V) Condition TA=-40 to +85C Min. Typ. Max. 3.00 2.50 0.25 0.20 5.00 4.00 0.50 0.40 Unit MIC Switch (MIC to (GND/MIC1 or GND/MIC2)) RON(MIC) MIC Switch On Resistance RFLAT(ON) On Resistance Flatness VIN(MIC) CON(MIC) COFF(MIC) 2.8 3.8 2.8 3.8 IOUT=24 mA, VIN=1.8 V IOUT=24 mA, VIN=1 V to VDD 2.7 to 4.4 Switch Input Voltage Range 0 VDD V (3) 3.8 f=1 MHz 90 pF (3) 3.8 f=1 MHz 21 pF 2.8 3.8 IOUT=24 mA 90 80 MIC Switch On Capacitance MIC Switch Off Capacitance GND Switch (GND to (GND/MIC1 or GND/MIC2)) RON(GNDA) GND Switch On Resistance VIN(GNDA) Switch Input Voltage Range XC(GNDA) GND Switch On Reactance (4) 2.7 to 4.4 3.8 0 f=88 MHz to 108 MHz, VIN=50 mV 170 100 m 1 V 100 m Parallel I/O VIH Input High Voltage 2.7 to 4.4 1.1 VDD V VIL Input Low Voltage 2.7 to 4.4 0 0.55 V ICCT Increase in Quiescent Supply Current 4.4 EN=1.3 V 3 A IOZ Switch Leakage Current 4.4 GND/MICn=1 V, 4.3 V; MIC=4.3V, 1V; EN=LOW 75 nA IIN Input Leakage Current 0.1 A Current 0 to 4.4 -75 EN Input 0 to 4.3 V ICC-DIS Disabled Current 2.7 to 4.4 EN=0 100 nA ICC-EN Enabled Current After Detection 2.7 to 4.4 EN=1 100 nA ICC-DET Current During Detection Mode 2.7 to 4.4 EN=01, 3-Pole Mode, GND/MIC1=GND/MIC2 0.5 2.0 mA Notes: 3. Guaranteed by characterization. 4. Guaranteed by design. (c) 2011 Fairchild Semiconductor Corporation FSA8049 * Rev. 1.0.2 www.fairchildsemi.com 4 FSA8049 -- Audio Jack Detection and Configuration, MIC/GND Cross point Switch DC Electrical Characteristics All typical values are at TA=25C unless otherwise specified. Symbol Parameter VDD (V) Condition TA = -40 to +85C Min. Typ. Max. Unit MIC Switch THD OIRR (5) Total Harmonic Distortion Off Isolation 3.8 (5) 3.8 RT=600 , VSW=0.5 VPP, f=20 Hz to 20 kHz, VIN=1.8 V and 2.2 V (Figure 4) 0.002 f=20 kHz, RS=32 , CL=0 pF, RT=32 (Figure 5) -108 f=20 KHz, RS=600 , CL=0 pF, RT=600 (Figure 5) -85 CEXT=Float RL=10 k, CL=10 pF 200 s CEXT=0.1 F RL=10 k, CL=10 pF 140 ms CEXT=Float RL=10 k, CL=10 pF 20 s CEXT=0.1 F RL=10 k, CL=1 0pF 6 ms RL=10 k, CL=10 pF 100 ns % dB Parallel I/O tON-GNDA Switch Turn-On Time (MIC & GND Switch), Measure 10/90 3.8 Switch Turn-Off Time (MIC & GND Switch), Measure 10/90 3.8 tOFF-MIC Switch Turn-Off Time (MIC Switch), Measure 10/90 3.8 tON-DET Detection Circuit NMOS On time 2.7 to 4.4 20 s 20 s tOFF-GNDA tOFF-DET Detection Circuit NMOS OFF time 2.7 to 4.4 tDET Detection Time of Audio Jack GND and MIC Terminals(6) 2.7 to 4.4 EN=1 50 ms tEN Enable / Disable Time 2.7 to 4.4 EN=01, EN=10 15 s Power Supply Noise 300mVPP, Measured 10/90%, f=217 Hz Square Wave -89 dB Power PSRR Power Supply Rejection Ratio (5) 3.8 Notes: 5. Guaranteed by characterization. 6. Detection time may be longer if there is noise in the system or a poor audio jack connection. (c) 2011 Fairchild Semiconductor Corporation FSA8049 * Rev. 1.0.2 www.fairchildsemi.com 5 FSA8049 -- Audio Jack Detection and Configuration, MIC/GND Cross point Switch AC Electrical Characteristics FSA8049 -- Audio Jack Detection and Configuration, MIC/GND Cross point Switch Typical Performance Characteristics Figure 4. THD Test Setup Figure 5. (c) 2011 Fairchild Semiconductor Corporation FSA8049 * Rev. 1.0.2 Off Isolation www.fairchildsemi.com 6 FSA8049 -- Audio Jack Detection and Configuration, MIC/GND Cross point Switch Physical Dimensions F 0.03 C A E 2X 0.40 B O0.20 Cu Pad A1 PIN A1 INDEX AREA 0.40 D O0.30 Solder Mask 0.03 C 2X LAND PATTERN RECOMMENDATION (NSMD PAD TYPE) TOP VIEW 0.06 C 0.05 C 0.625 0.547 C SEATING PLANE D 0.3780.018 E 0.2080.021 SIDE VIEWS NOTES: A. NO JEDEC REGISTRATION APPLIES. O0.2600.020 9X 0.40 C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. C B A 0.40 B. DIMENSIONS ARE IN MILLIMETERS. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. (Y)0.018 E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS 39 MICRONS (547-625 MICRONS). F 1 2 3 (X)0.018 F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. BOTTOM VIEW G. DRAWING FILNAME: MKT-UC009ABrev2 Figure 6. 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4 mm Pitch, 250 m Ball Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Ordering Information Part Number FSA8049UCX Operating Top Temperature Mark Range -40 to +85C (c) 2011 Fairchild Semiconductor Corporation FSA8049 * Rev. 1.0.2 M3 Package 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4 mm Pitch, 250 m Ball D E X Y 1.16 mm 1.16 mm 0.018 mm 0.018 mm www.fairchildsemi.com 7 FSA8049 -- Audio Jack Detection and Configuration, MIC/GND Cross point Switch (c) 2011 Fairchild Semiconductor Corporation FSA8049 * Rev. 1.0.2 www.fairchildsemi.com 8 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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