STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-90649
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
C SHEET 3
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and han dbooks. The following specification, standards, an d handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-385 35 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Stand ard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircu it Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents ar e available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue , Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item r equirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified h erein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified man ufacturer or a manufacturer who has been granted transitional certification to
MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and
qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management
(QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the
device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with
MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and ph ysical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3 Electrical performance characteristics . Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall app ly over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in tabl e I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appe ndix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all no n-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indic ator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flo w option is used.