1-2058703-3 - Tyco Electronics

Application Specification

Hermaphroditic Blade 114--13225

LOC B

1of 10

E2010 Tyco Electronics Corporation, Berwyn, PA

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TOOLING ASSISTANCE CENTER 1--800--722--1111

PRODUCT INFORMATION 1--800--522--6752

This controlled document is subject to change.

For latest revision and Regional Customer Service,

visit our website at www.tycoelectronics.com

and Receptacle Connector 15 MAR 10 Rev E

All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters [and

inches]. Unless otherwise specified, dimensions have a tolerance of +0.13 [+.005] and angles have a tolerance of +2_.

Figures and illustrations are for identification only and are not drawn to scale.

1. INTRODUCTION

This specification covers the requirements for application of Hermaphroditic Blade and Receptacle Connectors

for use on modular printed circuit (pc) board--to--board Surface Mount Technology (SMT) applications. The

connector allows installers to top mount LED lighting pc boards end--to--end as they are fastened to the

mounting surface. The connector is available in 2, 4, or 6 positions. See Figure 1.

The connector can mate or unmate horizontally or vertically allowing replacement of center pc boards in a

series of pc board strips. The connector can mate around corners, allowing the series of pc board strips to

continue around edges. It is hermaphroditic, so the customer only needs to stock a single part number.

A dust cap is also available to protect the last connector in a series of printed circuit (pc) board strips. The dust

cap is available in 2, 4, and 6 positions in natural color. The dust cap is intended to be put on after the

connector has been soldered on the pc board.

When corresponding with Tyco Electronics Personnel, use the terminology provided in this specification to

facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1.

Figure 1

SMT Contact Tine

Hermaphroditic Blade

and Receptacle Connector

Hermaphroditic Blade

and Receptacle with

Latching Tab

2--Position

Dust Cap

Mating End

2. REFERENCE MATERIAL

2.1. Revision Summary

SUpdated document to corporate requirements

SAdded new text to Paragraph 3.8 and new Figure 10 and renumbered

NOTE

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E2 of 10 Tyco Electronics Corporation

2.2. Customer Assistance

Reference Product Base Part Numbers 1954289 and 2058703, and Product Code L012 are representative of

the Hermaphroditic Blade and Receptacle Connector. Use of these numbers will identify the product line and

expedite your inquiries through a service network established to help you obtain product and tooling

information. Such information can be obtained through a local Tyco Electronics Representative or, after

purchase, by calling Product Information at the number at the bottom of this page.

2.3. Drawings

Customer Drawings for product part numbers are available from the service network. If there is a conflict

between the information contained in the Customer Drawings and this specification or with any other technical

documentation supplied, call the Product Information number at the bottom of this page.

2.4. Manuals

Manual 402--40 is available from the service network. This manual provides information on various flux types

and characteristics along with the commercial designation and flux removal procedures. A checklist is included

in the manual as required for information on soldering problems.

3. REQUIREMENTS

3.1. Safety

Do not stack product shipping containers so high that the containers buckle or deform.

3.2. Limitations

The connectors are designed to operate in a temperature range of --40_to 105_C[--40_to 221_F].

3.3. Material

The contacts are made of tin--plated phosphor bronze, and the housing is made from UL 94V--0 rated LCP.

The dust cap is made from 94V--0, glass fiber reinforced PBT.

3.4. Storage

A. Ultraviolet Light

Prolonged exposure to ultraviolet light may deteriorate the chemical composition used in the connector

material.

B. Shelf Life

The connectors should remain in the shipping containers until ready for use to prevent deformation. The

connectors should be used on a first in, first out basis to avoid storage contamination that could adversely

affect performance.

C. Chemical Exposure

Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in

the contacts.

Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds

Amines Carbonates Nitrites Sulfur Nitrites Tartrates

3.5. PC Board

A. Material and Thickness

Common pc board materials may be used such as glass epoxy (FR--4 or G--10), Aluminum--clad pc

boards and flex circuits. The pc board thickness may vary to suit the end use thickness.

B. Tolerance

Maximum allowable bow of the pc board shall be 0.10 mm [.004 in.] over the length of the connector.

Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space

between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and

would not provide long--term performance for the connector.

CAUTION

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E 3 of 10Tyco Electronics Corporation

C. Pads

The pc board circuit pads must be solderable in accordance with Test Specification 109--11

(Test Method A, non--activated rosin flux).

D. Layout

The pc board layout must be designed using the dimensions provided on the customer drawing for the

specific connector. The recommended pc board layout is shown in Figure 2.

Figure 2

Typical PC Board Layout

7.10 [.280] Typ

2.00 [.079] Typ

1.00 [.039] Typ

4.00 [.157] Typ

3.6. Connector Placement

This product is packaged in SMT tape and reel packaging per ANSI/EIA Std 481--B. Robotic/gripper placement

requires total equipment accuracy of 0.25 mm [.010 in.] to locate the connector for insertion. This includes

gripper and fixture tolerances, as well as equipment repeatability. Insertion location will be programmed by a

simple pantograph/template system or software package. Optimally, the contact solder tines should be

centered on the pc board pads. However, slight misalignment is permissible for the performance classifications

specified in Association of Connecting Electronics Industries (IPC)--S--815, “General Requirements for

Soldering Electronic Interconnection.” See Figure 3.

Figure 3B shows the permissible misalignment between the connector face and pc board edge. This alignment

is important to ensure that the latch in the wire--to--board connector engages with the latching tab in the

hermaphroditic blade and receptacle connector.

PC Board

Optimum Placement of

Contact Solder Tine

Centered on Circuit Pad Contact Solder Tine

Overhang Permissible

Per IPC--S--815

Figure 3

Permissible

Misalignment

Between PC

Board Edge

and Connector

Face: 0.13 mm

[.005 in.] Max

3A 3B

3.7. Soldering

Observe guidelines and procedures when soldering contacts. Solder, clean, and dry all leads to contacts

according to the following. The connectors should be soldered using vapor phase reflow (VPR), double--sided,

non--focused infrared (IR), forced air convection, or equivalent soldering techniques. All solder joints should

conform to the Workmanship Specification 101--21 and IPC--S--815.

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E4 of 10 Tyco Electronics Corporation

A. Flux Selection

Contacts must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will

depend on the type of pc board and other components mounted on the board. Additionally, the flux must

be compatible with the wave solder line, manufacturing, health, and safety requirements. Flux that is

compatible with the connectors is provided in Figure 4.

COMMERCIAL DESIGNATION

KESTER ALPHA

Type RMA (Mildly Activated) Mild Noncorrosive 185/197 611

Figure 4

B. Connectors with SMT Contacts

1. Solderability

The pc board pads must be solderable in accordance with Test Specification 109--11 (Test Method A,

non--activated rosin flux) and all other requirements for surface mount contacts specified in this

document.

2. Solder Paste Characteristics

a. Alloy type shall be SAC 305; Sn 96.5/Ag 3.0/Cu 0.5

b. Flux incorporated in the paste shall be rosin, mildly active (RMA) type.

c. Paste will be at least 80% solids by volume.

d. Mesh designation --200 to +325 (74 to 44 square micron openings, respectively).

e. Minimum viscosity of screen print shall be 5¢10% cp (centipoise).

f. Minimum viscosity of stencil print shall be 7.5¢10% cp (centipoise).

3. Solder Volume

Solder paste volumes are required as follows (calculated per 50% solids content). Paste volume may vary depending

on the composition.

Solder volume for each Hermaphroditic Blade and Receptacle Connector must be according to the

following:

1.75 mm3[.0001068 in3] per contact solder tine

4. Stencil

The stencil aperture shall be determined by the circuit pad size and stencil thickness. It may be any

shape as long as it prevents solder bridging from one pad to another. Generally, the thinner stencil will

need a larger aperture to maintain the given volume of solder paste. See Figure 5.

The recommended stencil thickness is 0.13 mm [.005 in.] minimum.

The stencil layouts illustrated apply to the top (connector) side (unless otherwise noted) of the pc board. For any other

variations, refer to the pc board mounting configurations on the appropriate customer drawing to determine

modifications necessary to the solder stencils in Figure 5.

NOTE

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E 5 of 10Tyco Electronics Corporation

All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create

a short, or wick solder away from the solder tines, producing a weak solder joint.

If a hold--down aperture is required other than that specified, the design must ensure that the connector housing will

not sit on the solder deposit.

Figure 5

Typical Stencil Layout

2.00 [.079] (Typ)

4.00 [.157] (Typ)

5.75 [.226] (Typ)

5. Solder Mask

Solder mask is recommended between all pads when soldering connectors with surface mount contacts

to minimize solder bridging between pads. The mask must not exceed the height of the pad by more

than 0.05 mm [.002 in.]. If a trace is run between adjacent pads on the solder side of the pc board, a

solder mask must be applied over the trace to prevent bridging and wicking of solder away from the

contact solder tines. Those most suitable are Liquid Photo Imageable and Dry Film.

Since the connector may rest on top of the solder mask, an excessively high mask will allow too much space between

the lead and pad for a good solder joint. A solder joint under these conditions would be weak and would not provide

long--term performance for the connector.

6. Process

Connectors with surface mount contacts should be soldered using vapor phase (VPR), double--sided,

non--focused infrared reflow (IR) or equivalent soldering techniques. Due to many variables involved with

the reflow process (i.e., component density, orientation, etc.), it is recommended that trial runs be

conducted under actual manufacturing conditions to ensure product and process compatibility. These

connectors will withstand the temperature and exposure time specified in Figure 6.

SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature)

IR 260_C [468_F] 10 Seconds

Figure 6

The lead--free reflow profile is shown in Figure 7.

CAUTION

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E6 of 10 Tyco Electronics Corporation

Figure 7

Reflow Zone

Time Above 217C

(90 Seconds Max)

40--70 Seconds Typ

Peak Temperature

235--255C

Soaking Zone

(2.0 Minutes Max)

60--90 Seconds Typ

Pre--Heating Zone

(2.0 --4.0 Minutes Max)

<2.5 C/Second

30 60 90 120 150 180 210 240 270 3000

Time (Seconds)

300C

250C

200C

150C

100C

50C

0C

Kester Lead- Free Reflow Profile

Alloys: Sn96.5/Ag3.0/Cu0.5 and Sn96.5/Ag3.5

C. Cleaning

After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the

solder and flux for recommended cleaning solvents. Common cleaning solvents that will not affect the

connectors or assemblies for the times and temperatures provided without any adverse effects on the

connector assembly are listed in Figure 8.

Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.

Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however, Tyco

Electronics does not recommend them because of the harmful occupational and environmental effects. Both are

carcinogenic (cancer--causing) and Trichloroethylene is harmful to the earth’s ozone layer.

If you have a particular solvent that is not listed, contact Tyco Electronics Tooling Assistance Center or Product

Information at the number on the bottom of page 1.

DANGER

NOTE

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E 7 of 10Tyco Electronics Corporation

CLEANER TIME

(

)

TEMPERATURES (Maximum)

NAME TYPE (Minutes) CELSIUS FAHRENHEIT

ALPHA 2110 Aqueous 1132 270

BIOACT EC--7 Solvent 5100 212

BUTYL CARBITOL Solvent 1Room Ambient

Isopropyl Alcohol Solvent 5100 212

KESTER 5778 Aqueous 5100 212

KESTER 5779 Aqueous 5100 212

LONCOTERGE 520 Aqueous 5100 212

LONCOTERGE 530 Aqueous 5100 212

Terpene Solvent Solvent 5100 212

Figure 8

D. Drying

Excessive temperatures may cause housing and plating degradation.

When drying cleaned assemblies and pc boards, temperatures to which the connectors are subject should

not exceed 220_C [492_F] for more than 3 minutes.

3.8. Alignment

Proper alignment is essential to ensure full engagement of mating connectors and also to ensure the contacts

are not bent or otherwise damaged during mating and unmating. For alignment tolerances, see Figure 9.

Figure 9

Horizontal Alignment 1.27 [.050] Max.

Vertical Alignment 0.73 [.029] Max.

Angular Alignment 3Max.

CAUTION

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E8 of 10 Tyco Electronics Corporation

Figure 10 provides the maximum distance between the connector faces.

Figure 10

Permissible Gap Between

Connector Faces is 5.75 mm

[.226 in.] Max.

3.9. Checking Installed Connector

All solder joints should comply with Tyco Electronics Workmanship Specification 101--21. For typical fillets

for surface mount tine requirements, refer to Figure 11.

Figure 11

Solder

Fillet

Pad Width

Pad

Length

PC Board (Ref)

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E 9 of 10Tyco Electronics Corporation

3.10. Aligning and Applying the Dust Cap

Figure 12 shows the alignment of placing the dust cap on the blade and receptacle connector.

Figure 12

Marking to Help

Orient the Dust Cap

Plastic Fin in the Hermaphroditic

Connector is Contained in this

Opening to Prevent Sideways

Movement of the Dust Cap Thicker Wall to Prevent

Dust Cap from Mating in

the Wrong Orientation

Plastic “Blade” in Dust Cap

Mates with Socket in the

Hermaphroditic Connector

3.11. Removal and Repair

Damaged product should not be used. If a damaged product is evident, it should be removed from the pc board and

replaced with a new one. Removal of the Hermaphroditic Blade and Receptacle Connector from the pc board may be

done by standard de--soldering methods.

4. QUALIFICATIONS

Hermaphroditic Blade and Receptacle Connectors are Underwriters Laboratories, Inc. (UL) / CSA International

Component Recognized in File E28476 and Volume 67.

5. TOOLING

5.1. Robotic Equipment

The robotic equipment must have a true position accuracy tolerance of 0.25 mm [.010 in.] to properly locate

the connectors. This includes gripper and fixture tolerances as well as equipment repeatability.

Automatic machine placement is recommended for connectors instead of manual placement with surface mount

contacts.

5.2. PC Board Support

For automatic machine placement, a pc board support must be used to prevent bowing of the pc board during

the placement of connectors. It should have flat surfaces with holes or a channel large enough and deep

enough to receive any protruding components. The pc board support must be customer made.

CAUTION

NOTE

Hermaphroditic Blade and Receptacle Connector 114- 13225

Rev E10 of 10 Tyco Electronics Corporation

6. VISUAL AID

Figure 13 shows a typical application of a Hermaphroditic Blade and Receptacle Connector. This illustration

should be used by production personnel to ensure a correctly applied product. Applications which DO NOT

appear correct should be inspected using the information in the preceding pages of this specification and in the

instructional material shipped with the product or tooling.

FIGURE 13. VISUAL AID

SOLDER FILLET MUST BE

FORMED EVENLY

AROUND SOLDER TINE

CONTACT TINE SHOULD

BE VISUALLY CENTERED

ON PAD