PS9402 Specifications in this document are tentative and subject to change. 2.5 A OUTPUT CURRENT, HIGH CMR, IGBT, POWER MOS FET GATE DRIVE, 16-PIN SSOP PHOTOCOUPLER Preliminary Data Sheet R08DS0014EJ0001 Rev.0.01 May 09, 2011 DESCRIPTION The PS9402 is an optically coupled isolator containing a GaAlAs LED on the input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip. The PS9402 is designed specifically for high common mode transient immunity (CMR), high output current and high switching speed. The PS9402 includes desaturation detection and active miller clamping functions. The PS9402 is suitable for driving IGBTs and Power MOS FETs. The PS9402 is in a 16-pin plastic SSOP (Shrink Small Outline Package). And the PS9402 is able to high-density (surface) mounting. FEATURES Long creepage distance (8 mm MIN.) Large peak output current (2.5 A MAX., 2.0 A MIN.) High speed switching (tPLHtPHL = 200 ns MAX.) UVLO (Under Voltage Lock Out) protection with hysteresis Desaturation detection Miller clamping High common mode transient immunity (CM H, CML = 25 kV/s MIN.) Embossed tape product: PS9402-E3: 850 pcs/reel Pb-Free product Safety standards UL awaiting approval CSA awaiting approval DIN EN60747-5-2 (VDE0884 Part2) awaiting approval APPLICATIONS IGBT, Power MOS FET Gate Driver Industrial inverter Uninterruptible Power Supply (UPS) R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 1 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title PACKAGE DIMENSIONS (UNIT: mm) PHOTOCOUPLER CONSTRUCTION Parameter Air Distance Outer Creepage Distance Isolation Distance R08DS0014EJ0001 Rev.0.01 May 09, 2011 Unit (MIN.) 8 mm 8 mm 0.4 mm Page 2 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title BLOCK DIAGRAM(UNIT: mm) IF Don't care UVLO (VCC2VEE) Active (<VUVLO-) DESAT Don't care FAULT Undefined VO Low Don't care OFF Don't care Don't care High (>VDESAT) Don't care Low Undefined Low Low ON Not Active (>VUVLO+) Low (<VDESAT) High High R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 3 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title MARKING EXAMPLE ORDERING INFORMATION Part Number PS9402 PS9402-AX Solder Plating Specification Pb-Free PS9402-E3 PS9402-E3-AX (Ni/Pd/Au) PS9402-V PS9402-V-E3 PS9402-V-AX PS9402-V-E3-AX Note: Order Number Packing Style 10 pcs (Tape 10 pcs cut) Safety Standard Approval Standard products Embossed Tape 850 pcs/reel (UL and CSA awaiting approval) 10 pcs (Tape 10 pcs cut) Embossed Tape 850 pcs/reel DIN EN60747-5-2 (VDE0884 Part2) awaiting approval (Option) Application *1 Part Number PS9402 *1. For the application of the Safety Standard, following part number should be used. R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 4 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified) Parameter Symbol Ratings Unit Forward Current Peak Transient Forward Current (Pulse Width < 1 s) IF IF (TRAN) 25 1.0 mA A VR VCC1 5 0 to 5.5 V V PI IOH (PEAK) 80 2.5 mW A IOL (PEAK) IFAULT 2.5 8 A mA VFAULT (VCC2VEE) 0 to VCC1 0 to 33 V V Negative Output Supply Voltage Output Voltage (VEVEE) VO 0 to 15 0 to VCC2 V V Peak Clamping Sinking Current Miller Clamping Pin Voltage IClamp VClamp 1.7 0 to VCC2 A V DESAT Voltage *3 Output IC Power Dissipation VDESAT PO VE to VE+10 300 V mW Isolation Voltage Operating Ambient Temperature BV TA 5 000 40 to +110 Vr.m.s. C Storage Temperature Tstg 55 to +125 C Reverse Voltage Input Supply Voltage *1 Input IC Power Dissipation *2 High Level Peak Output Current Low Level Peak Output Current FAULT Output Current *2 FAULT Pin Voltage Total Output Supply Voltage *4 Notes: *1. *2. *3. *4. Reduced to 1.6 mW/C at TA = 75C or more. Maximum pulse width = 10 s, Maximum duty cycle = 0.5% Reduced to 5.5 mW/C at TA = 70C or more. AC voltage for 1 minute at TA = 25C, RH = 60% between input and output. Pins 1-8 shorted together, 9-16 shorted together. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. MAX. Unit Total Output Supply Voltage Negative Output Supply Voltage (VCC2VEE) (VEVEE) 15 0 30 15 V V Positive Output Supply Voltage Forward Current (ON) (VCC2VE) IF (ON) 15 8 30 (VE VEE) 12 V mA Forward Voltage (OFF) Operating Ambient Temperature VF (OFF) TA 2 40 0.8 110 V C R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 5 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title ELECTRICAL CHARACTERISTICS (DC) (at RECOMMENDED OPERATING CONDITIONS, VEE = VE = GND, unless otherwise specified) Parameter Symbol Conditions FAULT Logic Low Output Voltage FAULT Logic High Output Current VFAULTL IFAULT = 1.1 mA IFAULTH VFAULT = 5.5 V, VCC1 = 5.5 V, TA = 25C High Level Output Current IOH VO = (VCC4 V) *3 VO = (VCC15 V) Low Level Output Current IOL Low Level Output Current During Fault Condition High Level Output Voltage Low Level Output Voltage TYP. *1 MAX. 0.1 *2 Unit V 0.5 A 0.5 2.0 1.5 A VO = (VEE+2.5 V) *3 VO = (VEE+15 V) 0.5 2.0 1.5 A IOLF VO-VEE = 14 V 90 140 VOH IO = 100 mA VOL IO = 650 A IO = 100 mA *2 *4 *4 Clamp Pin Threshold Voltage Clamp Low Level Sinking Current VtClamp ICL VtClamp = VEE + 2.5V High Level Supply Current Low Level Supply Current ICC2H ICC2L IO = 0 mA IO = 0 mA Blanking Capacitor Charging Current Blanking Capacitor Discharging Current ICHG VDESAT = 2 V IDSCHG VDESAT = 7 V DESAT Threshold *5 UVLO Threshold VDESAT VUVLO+ UVLO Hysteresis VUVLO VUVLO+ VUVLO Threshold Input Current (L H) Threshold Input Voltage (H L) MIN. 230 VCC 2.0 VCC 1.3 VCC 1.5 VCC 0.8 0.15 0.35 mA V 0.5 2.0 1.5 V V A 2 2 3 3 mA mA 0.13 0.24 0.33 mA 10 30 VCC1VE > VUVLO, VO < 5V VO > 5 V 6.0 11.0 6.9 12.3 7.5 13.5 VO < 5 V 9.8 0.4 11.0 1.3 12.3 1.5 5 IFLH IO = 0 mA, VO > 5 V VFHL IO = 0 mA, VO < 5 V 0.8 1.2 Input Forward Voltage Input Reverse Current VF IR IF = 10 mA, TA = 25C VR = 3V, TA = 25C Input Capacitance CIN f = 1 MHz, VF = 0 V mA V V V mA V 1.56 30 1.8 10 V A pF Notes: *1. Typical values at TA = 25C. *2. Maximum pulse width = 50 s, Maximum duty cycle = 0.2% *3. Maximum pulse width = 10 s, Maximum duty cycle = 0.5% *4. VOH is measured with the DC load current in this testing (Maximum pulse width = 1 ms, Maximum duty cycle = 20%). *5. For High Level Output Voltage testing, VOH is measured with the DC load current. When driving capacitive loads, VOH will approach VCC as IOH approaches zero units. R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 6 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title SWITCHING CHARACTERISTICS (AC) (at RECOMMENDED OPERATING CONDITIONS, VEE = VE = GND, unless otherwise specified) Parameter Symbol Propagation Delay Time (L H) Propagation Delay Time (H L) tPLH tPHL Pulse Width Distortion (PWD) Rise Time |tPHLtPLH| tr Conditions Rg = 10 , Cg = 10 nF, f = 10 kHz, *2 tf CMH1 VCC2 = 30 V TA = 25C, IF = 10 mA, VCC2 = 30 V, VCM = 1.5 kV, CDESAT = 100 pF, RF = 2.1 k, VCC1 = 5 V Common Mode Transient *4 Immunity at Low Level Output CML1 DESAT Sense to 90% VO *5 Delay tDESAT TA = 25C, VF = 0 V, VCC2 = 30 V, VCM = 1.5 kV, RF = 2.1 k, VCC1 = 5 V CDESAT = 100 pF, RF = 2.1 k, DESAT Sense to 10% VO Delay tDESAT (10%) DESAT Sense to Low Level *6 FAULT Signal Delay 50 50 Duty Cycle = 50% , IF = 10 mA, Fall Time Common Mode Transient *3 Immunity at High Level Output (90%) MIN. TYP. *1 MAX. Unit 100 100 200 200 ns ns 20 50 100 ns ns 50 ns kV/s 25 Rg = 10 , Cg = 10 nF VCC2 = 30 V tDESAT 25 kV/s 250 500 ns 2 3 s 400 800 ns (FAULT) DESAT Sense to DESAT Low *5 Propagation Delay *7 DESAT Input Mute tDESAT RESET to High Level FAULT Signal Delay tRESET 250 ns (LOW) tDESAT s 5 (MUTE) (FAULT) VCC1 = 5.5 V VCC1 = 3.3 V 0.3 0.5 1.2 1.5 3.0 4.0 s s Notes: *1. Typical values at TA = 25C. *2. This load condition is equivalent to the IGBT load at 1 200 V/150 A. *3. Common mode transient immunity in the high state is the maximum tolerable dV CM/dt of the common mode pulse, VCM, to assure that the output will remain in the high state (i.e., V O > 15 V or FAULT > 2 V). A 100 pF and a 2.1k pull-up resistor is needed in fault detection mode. *4. Common mode transient immunity in the low state is the maximum tolerable dV CM/dt of the common mode pulse, VCM, to assure that the output will remain in a low state (i.e., VO < 1.0 V or FAULT < 0.8 V). *5. This is the amount of time the DESAT threshold must be exceeded before V OUT begins to go low, and the FAULT output to go low. This is supply voltage dependent. *6. This is the amount of time from when the DESAT threshold is exceeded, until the FAULT output goes low. *7. Auto Reset: This is the amount of time when VOUT will be asserted low after DESAT threshold is exceeded. See the Description of Operation (Auto Reset) topic in the application information section. R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 7 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title TEST CIRCUIT R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 8 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title TEST CIRCUIT 2 R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 9 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title TEST CIRCUIT 3 R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 10 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title TEST CIRCUIT 4 R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 11 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title TAPING SPECIFICATIONS (UNIT: mm) R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 12 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title NOTES ON HANDLING 1. Recommended soldering conditions (1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux (2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One (Allowed to be dipped in solder including plastic mold portion.) Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) 350C or below * Time (each pins) 3 seconds or less * Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 13 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Chapter Title 2. Cautions regarding noise Be aware that when voltage is applied suddenly between the photocoupler's input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. USAGE CAUTIONS 1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static electricity when handling. 2. Board designing (1) By-pass capacitor of more than 0.1 F is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) In older to avoid malfunctions and characteristics degradation, IGBT collector or emitter traces should not be closed to the LED input. 3. Make sure the rise/fall time of the forward current is 0.5 s or less. 4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/s or less. 5. Avoid storage at a high temperature and high humidity. R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 14 of 15 Preliminary Document Specifications in this document are tentative and subject to change. PS9402 Caution Chapter Title GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth. R08DS0014EJ0001 Rev.0.01 May 09, 2011 Page 15 of 15 Revision History PS9402 Preliminary Data Sheet Description Rev. 0.01 Date May 09, 2011 Page Summary First edition issued All trademarks and registered trademarks are the property of their respective owners. C-1