R08DS0014EJ0001 Rev.0.01 Page 1 of 15
May 09, 2011
PS9402 Preliminary Data Sheet
2.5 A OUTPUT CURRENT, HIGH CMR, IGBT,
POWER MOS FET GATE DRIVE, 16-PIN SSOP PHOTOCOUPLER
DESCRIPTION
The PS9402 is an optically coupled isolator containing a GaAlAs LED on the input side and a photo diode, a signal
processing circuit and a power output transistor on the output side on one chip.
The PS9402 is designed specifically for high common mode transient immunity (CMR), high output current and high
switching speed.
The PS9402 includes desaturation detection and active miller clamping functions.
The PS9402 is suitable for driving IGBTs and Power MOS FETs.
The PS9402 is in a 16-pin plastic SSOP (Shrink Small Outline Package). And the PS9402 is able to high-density
(surface) mounting.
FEATURES
Long creepage distance (8 mm MIN.)
Large peak output current (2.5 A MAX., 2.0 A MIN.)
High speed switching (tPLHtPHL = 200 ns MAX.)
UVLO (Under Voltage Lock Out) protection with hysteresis
Desaturation detection
Miller clamping
High common mode transient immunity (CMH, CML = 25 kV/
s MIN.)
Embossed tape product: PS9402-E3: 850 pcs/reel
Pb-Free product
Safety standards
UL awaiting approval
CSA awaiting approval
DIN EN60747-5-2 (VDE0884 Part2) awaiting approval
APPLICATIONS
IGBT, Power MOS FET Gate Driver
Industrial inverter
Uninterruptible Power Supply (UPS)
R08DS0014EJ0001
Rev.0.01
May 09, 2011
Specifications in this document are tentative and subject to change.
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 2 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
PACKAGE DIMENSIONS (UNIT: mm)
PHOTOCOUPLER CONSTRUCTION
Parameter
Unit (MIN.)
Air Distance
8 mm
Outer Creepage Distance
8 mm
Isolation Distance
0.4 mm
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 3 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
BLOCK DIAGRAM(UNIT: mm)
IF
UVLO (VCC2VEE)
DESAT
Don’t care
Active (<VUVLO-)
Don’t care
Don’t care
Don’t care
High (>VDESAT)
OFF
Don’t care
Don’t care
ON
Not Active (>VUVLO+)
Low (<VDESAT)
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 4 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
MARKING EXAMPLE
ORDERING INFORMATION
Part Number
Order Number
Solder Plating
Specification
Packing Style
Safety Standard
Approval
Application
Part Number*1
PS9402
PS9402-AX
Pb-Free
10 pcs (Tape 10 pcs cut)
Standard products
PS9402
PS9402-E3
PS9402-E3-AX
(Ni/Pd/Au)
Embossed Tape 850
(UL and CSA
pcs/reel
awaiting approval)
PS9402-V
PS9402-V-AX
10 pcs (Tape 10 pcs cut)
DIN EN60747-5-2
PS9402-V-E3
PS9402-V-E3-AX
Embossed Tape 850
(VDE0884 Part2)
pcs/reel
awaiting approval
(Option)
Note: *1. For the application of the Safety Standard, following part number should be used.
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 5 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Forward Current
IF
25
mA
Peak Transient Forward Current
(Pulse Width < 1
s)
IF (TRAN)
1.0
A
Reverse Voltage
VR
5
V
Input Supply Voltage
VCC1
0 to 5.5
V
Input IC Power Dissipation *1
PI
80
mW
High Level Peak Output Current *2
IOH (PEAK)
2.5
A
Low Level Peak Output Current *2
IOL (PEAK)
2.5
A
FAULT Output Current
IFAULT
8
mA
FAULT Pin Voltage
VFAULT
0 to VCC1
V
Total Output Supply Voltage
(VCC2VEE)
0 to 33
V
Negative Output Supply Voltage
(VEVEE)
0 to 15
V
Output Voltage
VO
0 to VCC2
V
Peak Clamping Sinking Current
IClamp
1.7
A
Miller Clamping Pin Voltage
VClamp
0 to VCC2
V
DESAT Voltage
VDESAT
VE to VE+10
V
Output IC Power Dissipation *3
PO
300
mW
Isolation Voltage *4
BV
5 000
Vr.m.s.
Operating Ambient Temperature
TA
40 to +110
C
Storage Temperature
Tstg
55 to +125
C
Notes: *1. Reduced to 1.6 mW/C at TA = 75C or more.
*2. Maximum pulse width = 10
s, Maximum duty cycle = 0.5%
*3. Reduced to 5.5 mW/C at TA = 70C or more.
*4. AC voltage for 1 minute at TA = 25C, RH = 60% between input and output.
Pins 1-8 shorted together, 9-16 shorted together.
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
MAX.
Unit
Total Output Supply Voltage
(VCC2VEE)
15
30
V
Negative Output Supply Voltage
(VEVEE)
0
15
V
Positive Output Supply Voltage
(VCC2VE)
15
30 (VE VEE)
V
Forward Current (ON)
IF (ON)
8
12
mA
Forward Voltage (OFF)
VF (OFF)
2
0.8
V
Operating Ambient Temperature
TA
40
110
C
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 6 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
ELECTRICAL CHARACTERISTICS (DC) (at RECOMMENDED OPERATING CONDITIONS,
VEE = VE = GND, unless otherwise specified)
Parameter
Symbol
Conditions
MIN.
TYP.*1
MAX.
Unit
FAULT Logic Low Output
Voltage
VFAULTL
IFAULT = 1.1 mA
0.1
V
FAULT Logic High Output
Current
IFAULTH
VFAULT = 5.5 V, VCC1 = 5.5 V,
TA = 25C
0.5
A
High Level Output Current
IOH
VO = (VCC4 V) *2
0.5
1.5
A
VO = (VCC15 V) *3
2.0
Low Level Output Current
IOL
VO = (VEE+2.5 V) *2
0.5
1.5
A
VO = (VEE+15 V) *3
2.0
Low Level Output Current
During Fault Condition
IOLF
VO–VEE = 14 V
90
140
230
mA
High Level Output Voltage
VOH
IO = 100 mA *4
VCC 2.0
VCC 1.3
V
IO = 650
A *4
VCC 1.5
VCC 0.8
Low Level Output Voltage
VOL
IO = 100 mA
0.15
0.5
V
Clamp Pin Threshold Voltage
VtClamp
2.0
V
Clamp Low Level Sinking
Current
ICL
VtClamp = VEE + 2.5V
0.35
1.5
A
High Level Supply Current
ICC2H
IO = 0 mA
2
3
mA
Low Level Supply Current
ICC2L
IO = 0 mA
2
3
mA
Blanking Capacitor Charging
Current
ICHG
VDESAT = 2 V
0.13
0.24
0.33
mA
Blanking Capacitor Discharging
Current
IDSCHG
VDESAT = 7 V
10
30
mA
DESAT Threshold
VDESAT
VCC1VE > VUVLO, VO < 5V
6.0
6.9
7.5
V
UVLO Threshold *5
VUVLO+
VO > 5 V
11.0
12.3
13.5
V
VUVLO
VO < 5 V
9.8
11.0
12.3
UVLO Hysteresis
VUVLO+
VUVLO
0.4
1.3
V
Threshold Input Current
(L H)
IFLH
IO = 0 mA, VO > 5 V
1.5
5
mA
Threshold Input Voltage
(H L)
VFHL
IO = 0 mA, VO < 5 V
0.8
V
Input Forward Voltage
VF
IF = 10 mA, TA = 25C
1.2
1.56
1.8
V
Input Reverse Current
IR
VR = 3V, TA = 25C
10
A
Input Capacitance
CIN
f = 1 MHz, VF = 0 V
30
pF
Notes: *1. Typical values at TA = 25C.
*2. Maximum pulse width = 50
s, Maximum duty cycle = 0.2%
*3. Maximum pulse width = 10
s, Maximum duty cycle = 0.5%
*4. VOH is measured with the DC load current in this testing (Maximum pulse width = 1 ms, Maximum duty cycle =
20%).
*5. For High Level Output Voltage testing, VOH is measured with the DC load current. When driving capacitive
loads, VOH will approach VCC as IOH approaches zero units.
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 7 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
SWITCHING CHARACTERISTICS (AC) (at RECOMMENDED OPERATING
CONDITIONS, VEE = VE = GND, unless otherwise specified)
Parameter
Symbol
Conditions
MIN.
TYP.*1
MAX.
Unit
Propagation Delay Time (L H)
tPLH
Rg = 10 , Cg = 10 nF,
50
100
200
ns
Propagation Delay Time (H L)
tPHL
f = 10 kHz,
50
100
200
ns
Pulse Width Distortion (PWD)
|tPHLtPLH|
Duty Cycle = 50%*2,
20
100
ns
Rise Time
tr
IF = 10 mA,
50
ns
Fall Time
tf
VCC2 = 30 V
50
ns
Common Mode Transient
Immunity at High Level Output*3
CMH1
TA = 25C, IF = 10 mA,
VCC2 = 30 V, VCM = 1.5 kV,
CDESAT = 100 pF,
RF = 2.1 kΩ, VCC1 = 5 V
25
kV/
s
Common Mode Transient
Immunity at Low Level Output*4
CML1
TA = 25C, VF = 0 V,
VCC2 = 30 V,
VCM = 1.5 kV, RF = 2.1 kΩ,
VCC1 = 5 V
25
kV/
s
DESAT Sense to 90% VO
Delay*5
tDESAT
(90%)
CDESAT = 100 pF,
RF = 2.1 kΩ,
250
500
ns
DESAT Sense to 10% VO Delay
tDESAT
(10%)
Rg = 10 Ω, Cg = 10 nF
VCC2 = 30 V
2
3
s
DESAT Sense to Low Level
FAULT Signal Delay*6
tDESAT
(FAULT)
400
800
ns
DESAT Sense to DESAT Low
Propagation Delay*5
tDESAT
(LOW)
250
ns
DESAT Input Mute*7
tDESAT
(MUTE)
5
s
RESET to High Level FAULT
tRESET
(FAULT)
VCC1 = 5.5 V
0.3
1.2
3.0
s
Signal Delay
VCC1 = 3.3 V
0.5
1.5
4.0
s
Notes: *1. Typical values at TA = 25C.
*2. This load condition is equivalent to the IGBT load at 1 200 V/150 A.
*3. Common mode transient immunity in the high state is the maximum tolerable dVCM/dt of the common mode
pulse, VCM, to assure that the output will remain in the high state (i.e., VO > 15 V or FAULT > 2 V). A 100 pF
and a 2.1kΩ pull-up resistor is needed in fault detection mode.
*4. Common mode transient immunity in the low state is the maximum tolerable dVCM/dt of the common mode
pulse, VCM, to assure that the output will remain in a low state (i.e., VO < 1.0 V or FAULT < 0.8 V).
*5. This is the amount of time the DESAT threshold must be exceeded before VOUT begins to go low, and the
FAULT output to go low. This is supply voltage dependent.
*6. This is the amount of time from when the DESAT threshold is exceeded, until the FAULT output goes low.
*7. Auto Reset: This is the amount of time when VOUT will be asserted low after DESAT threshold is exceeded.
See the Description of Operation (Auto Reset) topic in the application information section.
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 8 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
TEST CIRCUIT
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 9 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
TEST CIRCUIT 2
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 10 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
TEST CIRCUIT 3
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 11 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
TEST CIRCUIT 4
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 12 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
TAPING SPECIFICATIONS (UNIT: mm)
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 13 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
• Peak reflow temperature 260C or below (package surface temperature)
• Time of peak reflow temperature 10 seconds or less
• Time of temperature higher than 220C 60 seconds or less
• Time to preheat temperature from 120 to 180C 12030 s
• Number of reflows Three
• Flux Rosin flux containing small amount of chlorine (The flux
with a maximum chlorine content of 0.2 Wt% is
recommended.)
(2) Wave soldering
• Temperature 260C or below (molten solder temperature)
• Time 10 seconds or less
• Preheating conditions 120C or below (package surface temperature)
• Number of times One (Allowed to be dipped in solder including plastic mold portion.)
• Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron
• Peak Temperature (lead part temperature) 350C or below
• Time (each pins) 3 seconds or less
• Flux Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead
(4) Cautions
• Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 14 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
2. Cautions regarding noise
Be aware that when voltage is applied suddenly between the photocoupler’s input and output at startup, the output
transistor may enter the on state, even if the voltage is within the absolute maximum ratings.
USAGE CAUTIONS
1. This product is weak for static electricity by designed with high-speed integrated circuit so protect against static
electricity when handling.
2. Board designing
(1) By-pass capacitor of more than 0.1
F is used between VCC and GND near device. Also, ensure that the distance
between the leads of the photocoupler and capacitor is no more than 10 mm.
(2) In older to avoid malfunctions and characteristics degradation, IGBT collector or emitter traces should not be
closed to the LED input.
3. Make sure the rise/fall time of the forward current is 0.5
s or less.
4. In order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 V/
s or less.
5. Avoid storage at a high temperature and high humidity.
PS9402 Chapter Title
R08DS0014EJ0001 Rev.0.01 Page 15 of 15
May 09, 2011
Preliminary Document
Specifications in this document are tentative and subject to change.
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
All trademarks and registered trademarks are the property of their respective owners.
C - 1
Revision History
PS9402 Preliminary Data Sheet
Rev.
Date
Description
Page
Summary
0.01
May 09, 2011
First edition issued