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VTAP
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LP295x-N Series of Adjustable Micropower Voltage Regulators
1 Features 3 Description
The LP2950-N and LP2951-N are micropower
1• Input Voltage Range: 2.3 V to 30 V voltage regulators with very low quiescent current (75
• 5-V, 3-V, and 3.3-V Output Voltage Versions μA typical) and very low dropout voltage (typical 40
Available mV at light loads and 380 mV at 100 mA). They are
• High Accuracy Output Voltage ideally suited for use in battery-powered systems.
Furthermore, the quiescent current of the LP2950-
• Ensured 100-mA Output Current N/LP2951-N increases only slightly in dropout,
• Extremely Low Quiescent Current prolonging battery life.
• Low Dropout Voltage Careful design of the LP2950-N/LP2951-N has
• Extremely Tight Load and Line Regulation minimized all contributions to the error budget. This
• Very Low Temperature Coefficient includes a tight initial tolerance (0.5% typ.), extremely
good load and line regulation (.05% typ.) and a very
• Use as Regulator or Reference low output voltage temperature coefficient, making
• Needs Minimum Capacitance for Stability the part useful as a low-power voltage reference.
• Current and Thermal Limiting One such feature is an error flag output which warns
• Stable With Low-ESR Output Capacitors (10 mΩof a low output voltage, often due to falling batteries
to 6 Ω)on the input. It may be used for a power-on reset. A
• LP2951-N Versions Only: second feature is the logic-compatible shutdown input
which enables the regulator to be switched on and
– Error Flag Warns of Output Dropout off. Also, the part may be pin-strapped for a 5-V, 3-V,
– Logic-Controlled Electronic Shutdown or 3.3-V output (depending on the version), or
– Output Programmable From 1.24 V to 29 V programmed from 1.24 V to 29 V with an external
pair of resistors.
2 Applications The LP2950-N is available in the surface-mount TO-
• High-Efficiency Linear Regulator 252 package and in the popular 3-pin TO-92 package
for pin-compatibility with older 5-V regulators. The 8-
• Regulator with Undervoltage Shutdown lead LP2951-N is available in plastic, ceramic dual-in-
• Low dropout Battery-powered Regulator line, WSON, or metal can packages and offers
• Snap-ON/Snap-OFF Regulator additional system functions.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TO-92 (3) 4.30 mm x 4.30 mm
LP2950-N TO-252 (3) 9.91 mm x 6.58 mm
SOIC (8) 4.90 mm x 3.91 mm
VSSOP (8) 3.00 mm x 3.00 mm
LP2951-N WSON (8) 4.00 mm x 4.00 mm
PDIP (8) 9.81 mm x 6.35 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
LP2951 Simplified Schematic LP2950-N Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
8.3 Feature Description................................................. 16
1 Features.................................................................. 18.4 Device Functional Modes........................................ 17
2 Applications ........................................................... 19 Application and Implementation ........................ 18
3 Description............................................................. 19.1 Application Information............................................ 18
4 Revision History..................................................... 29.2 Typical Applications ................................................ 19
5 Voltage Options ..................................................... 310 Power Supply Recommendations ..................... 31
6 Pin Configuration and Functions......................... 311 Layout................................................................... 31
7 Specifications......................................................... 411.1 Layout Guidelines ................................................. 31
7.1 Absolute Maximum Ratings ...................................... 411.2 Layout Example .................................................... 31
7.2 ESD Ratings.............................................................. 411.3 WSON Mounting................................................... 31
7.3 Recommended Operating Conditions....................... 512 Device and Documentation Support ................. 33
7.4 Thermal Information: LP2950-N................................ 512.1 Documentation Support ....................................... 33
7.5 Thermal Information: LP2951-N................................ 512.2 Related Links ........................................................ 33
7.6 Electrical Characteristics........................................... 612.3 Trademarks........................................................... 33
7.7 Typical Characteristics.............................................. 912.4 Electrostatic Discharge Caution............................ 33
8 Detailed Description............................................ 15 12.5 Glossary................................................................ 33
8.1 Overview................................................................. 15 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagrams ..................................... 15 Information ........................................................... 33
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (May 2013) to Revision O Page
• Added Device Information and ESD Rating tables, Feature Description,Device Functional Modes,Application and
Implementation,Power Supply Recommendations,Layout,Device and Documentation Support, and Mechanical,
Packaging, and Orderable Information sections; moved some curves to Application Curves section; update pin
names; change package nomenclature from National to TI .................................................................................................. 1
Changes from Revision M (April 2013) to Revision N Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 1
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OUT
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SHUTDOWN
GND
VTAP
IN
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ERROR
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2
3
4 5
6
7
8
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5 Voltage Options
DEVICE NUMBER PACKAGE VOLTAGE OPTION (V)
3 (±0.5%, ±1 %)
TO-92 (LP) 3.3 (±0.5%, ±1 %)
5 (±0.5%, ±1 %)
LP2950-N 3 (±1 %)
TO-252 (NDP) 3.3 (±1%)
5 (±1%)
3 (±0.5%, ±1%)
SOIC (D) 3.3 (±0.5%, ±1%)
5 (±0.5%, ±1%)
3 (±0.5%, ±1%)
VSSOP (DGK) 3.3 (±0.5%, ±1%)
LP2951-N 5 (±0.5%, ±1%)
3 (±0.5%, ±1%)
WSON (NGT) 3.3 (±0.5%, ±1%)
5 (±0.5%, ±1%)
PDIP (P) 5 (±0.5%, ±1%)
6 Pin Configuration and Functions
TO-92 Package (LP) TO-252 Package (NDP)
3 Pins 3 Pins
Bottom View Front View
PDIP, SOIC, VSSOP Packages (P, D, DGK)
8 Pins
Top View
WSON Package (NGT)
8 Pins
Top View
Connect DAP to GND at device pin 4.
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Pin Functions: LP2950-N
PIN
LP2950 I/O DESCRIPTION
NAME LP NDP
GND 2 2 - Ground
INPUT 3 1 I Input supply voltage
OUTPUT 1 3 O Regulated output voltage
Pin Functions: LP2951-N
PIN
LP2951 I/O DESCRIPTION
NAME D, DGK, P NGT
ERROR 5 5 O Error output.
FEEDBACK 7 7 I Voltage feedback input
GROUND 4 4 - Ground
INPUT 8 8 I Input supply voltage
OUTPUT 1 1 O Regulated output voltage
SENSE 2 2 I Output voltage sense
SHUTDOWN 3 3 I Disable device
VTAP 6 6 O Internal resistor divider
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input supply voltage - SHUTDOWN input voltage error comparator output voltage(3) –0.3 30 V
FEEDBACK input voltage(3)(4) –1.5 30 V
Power dissipation Internally Limited
Junction temperature (TJ) 150
Soldering dwell time, temperature Wave 4 seconds, 260
Infrared 10 seconds, 240 °C
Vapor phase 75 seconds, 219
Storage temperature range, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) May exceed input supply voltage.
(4) When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be
diode-clamped to ground.
7.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Maximum input supply voltage 30 V
LP2950AC-XX, LP2950C-XX –40 125 °C
Junction temperature (TJ)(2) LP2951 –55 150 °C
LP2951AC-XX, LP2951C-XX –40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The junction-to-ambient thermal resistances are as follows: 157.4°C/W for the TO-92(LP) package, 51.3°C/W for the TO-252 (NDP)
package, 56.3°C/W for the molded PDIP (P), 117.7°C/W for the molded plastic SOIC (D), 171°C/W for the molded plastic VSSOP
(DGK). The above thermal resistances for the P, D, and DGK packages apply when the package is soldered directly to the PCB. The
value of RθJA for the WSON (NGT) package is typically 43.3°C/W but is dependent on the PCB trace area, trace material, and the
number of layers and thermal vias. For details of thermal resistance and power dissipation for the WSON package, refer to Texas
Instruments Application Note AN-1187 Leadless Leadframe Package (LLP) (SNOA401).
7.4 Thermal Information: LP2950-N LP2950-N
THERMAL METRIC(1) LP NDP UNIT
3 PINS
RθJA Junction-to-ambient thermal resistance 157.4 51.3
RθJC(top) Junction-to-case (top) thermal resistance 81.2 53.5
RθJB Junction-to-board thermal resistance 153.6 30.4 °C/W
ψJT Junction-to-top characterization parameter 25.2 5.5
ψJB Junction-to-board characterization parameter n/a 30
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 2.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Thermal Information: LP2951-N LP2951-N
THERMAL METRIC(1) P D DGK NGT UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 56.3 117.7 171.0 43.3
RθJC(top) Junction-to-case (top) thermal resistance 45.7 63.7 62.3 35.0
RθJB Junction-to-board thermal resistance 33.5 57.9 91.4 23.3 °C/W
ψJT Junction-to-top characterization parameter 22.9 15.9 8.9 0.5
ψJB Junction-to-board characterization parameter 33.3 57.5 90.1 20.5
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a 9.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)(1)
LP2950AC-XX LP2950C-XX
LP2951(2) LP2951AC-XX LP2951C-XX
PARAMETER TEST CONDITIONS(1) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
3-V VERSIONS(3)
TJ= 25°C 2.985 3 3.015 2.985 3 3.015 2.970 3 3.030 V(4)
−25°C ≤TJ≤85°C 2.970 3 3.030 2.955 3 3.045 V(5)
Output voltage 2.964 3 3.036 V(4)
Full operating
temperature range 2.964 3 3.036 2.940 3 3.060 V(5)
100 μA≤IL≤100 mA, 2.955 3 3.045 V(4)
Output voltage 100 μA≤IL≤100 mA, 2.958 3 3.042 2.928 3 3.072 V(5)
TJ≤TJMAX
3.3-V VERSIONS(3)
TJ= 25°C 3.284 3.3 3.317 3.284 3.3 3.317 3.267 3.3 3.333 V(4)
−25°C ≤TJ≤85°C 3.3 3.267 3.3 3.333 3.251 3.3 3.350 V(5)
Output voltage 3.260 3.3 3.340 V(4)
Full operating
temperature range 3.260 3.3 3.340 3.234 3.3 3.366 V(5)
3.251 3.3 3.350 V(4)
100 μA≤IL≤100 mA, TJ
Output voltage ≤TJMAX 3.254 3.3 3.346 3.221 3.3 3.379 V(5)
5-V VERSIONS(3)
TJ= 25°C 4.975 5 5.025 4.975 5 5.025 4.95 5 5.05 V(4)
−25°C ≤TJ≤85°C 5 4.95 5 5.05 4.925 5 5.075 V(5)
Output voltage 4.94 5 5.06 V(4)
Full operating
temperature range 4.94 5 5.06 4.9 5 5.1 V(5)
4.925 5 5.075 V(4)
100 μA≤IL≤100 mA, TJ
Output voltage ≤TJMAX 4.925 5 5.075 4.88 5 5.12 V(5)
ALL VOLTAGE OPTIONS
Output voltage 20 120 ppm/°C(4)
See(6), –40°C ≤TJ≤
temperature 125°C 20 100 50 150 ppm/°C(5)
coefficient (VONOM + 1)V ≤Vin ≤30 0.03 0.1 0.03 0.11 0.04 0.2 % (4)
V(8)
Line regulation(7) 0.03 0.5 % (4)
(VONOM + 1)V ≤Vin ≤30
V(8), –40°C ≤TJ≤125°C 0.03 0.2 0.04 0.4 % (5)
100 μA≤IL≤100 mA 0.04 0.1 0.04 0.1 0.1 0.2 % (4)
Load regulation(7) 0.04 0.3 % (4)
100 μA≤IL≤100 mA,
–40°C ≤TJ≤125°C 0.04 0.2 0.1 0.3 % (5)
(1) Unless otherwise noted, all limits apply for TA= TJ= 25°C as well as specified for VIN = (VONOM + 1)V, IL= 100 μA and CL= 1 μF for 5-
V versions and 2.2 μF for 3-V and 3.3-V versions. Additional conditions for the 8-pin versions are FEEDBACK tied to VTAP, OUTPUT
tied to SENSE, and VSHUTDOWN ≤0.8 V.
(2) A Military RETS specification is available on request.
(3) All LP2950 devices have the nominal output voltage coded as the last two digits of the part number. In the LP2951 products, the 3-V
and 3.3-V versions are designated by the last two digits, but the 5-V version is denoted with no code at this location of the part number
(refer to Mechanical, Packaging, and Orderable Information).
(4) Ensured and 100% production tested.
(5) Ensured but not 100% production tested. These limits are not used to calculate outgoing AQL levels.
(6) Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
(7) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation.
(8) Line regulation for the LP2951-N is tested at 150°C for IL= 1 mA. For IL= 100 μA and TJ= 125°C, line regulation is specified by design
to 0.2%. See Typical Characteristics for line regulation versus temperature and load current.
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)(1)
LP2950AC-XX LP2950C-XX
LP2951(2) LP2951AC-XX LP2951C-XX
PARAMETER TEST CONDITIONS(1) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
IL= 100 μA 50 80 50 80 50 80 mV(4)
150 mV(4)
IL= 100 μA, –40°C ≤TJ≤
125°C 150 150 mV(5)
Dropout voltage(9) IL= 100 mA 380 450 380 450 380 450 mV(4)
600 600 600 mV(4)
IL= 100 mA, –40°C ≤TJ≤
125°C 600 600 mV(5)
IL= 100 μA 75 120 75 120 75 120 μA(4)
140 μA(4)
IL= 100 μA, –40°C ≤TJ≤
125°C 140 140 μA(5)
Ground current IL= 100 mA 8 12 8 12 8 12 mA(4)
14 mA(4)
IL= 100 mA, –40°C ≤TJ≤
125°C 14 14 mA(5)
Vin = (VONOM −0.5)V, IL110 170 110 170 110 170 μA(4)
= 100 μA
Dropout ground Vin = (VONOM −0.5)V, IL200 200 200 μA(4)
current = 100 μA, –40°C ≤TJ≤200 200 μA(5)
125°C
Vout = 0 160 200 160 200 160 200 mA(4)
Current limit 220 mA(4)
Vout = 0, –40°C ≤TJ≤
125°C 220 220 mA(5)
Thermal 4egulation See(10) 0.05 0.2 0.05 0.2 0.05 0.2 %/W (4)
CL= 1μF (5 V Only) 430 430 430 μV rms
CL= 200 μF 160 160 160 μV rms
Output noise CL= 3.3 μF
10 Hz to 100 kHz (Bypass = 0.01 μF 100 100 100 μV rms
Pins 7 to 1 (LP2951-N)
8-PIN VERSIONS ONLY LP2951 LP2951AC-XX LP2951C-XX
1.22 1.235 1.25 1.22 1.235 1.25 1.21 1.235 1.26 V (4)
Reference voltage 1.2 1.26 V(4)
–40°C ≤TJ≤125°C 1.2 1.26 1 1.2 1.27 V(5)
1.19 1.27 V(4)
See(11), –40°C ≤TJ≤
Reference voltage 125°C 1.19 1.27 1.185 1.285 V(5)
20 40 20 40 20 40 nA(4)
Feedback pin bias 60 nA (4)
current –40°C ≤TJ≤125°C 60 60 nA(5)
Reference voltage
temperature See(6) 20 20 50 ppm/°C
coefficient
Feedback pin bias
current 0.1 0.1 0.1 nA/°C
temperature
coefficient
(9) Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value
measured at 1-V differential. At very low values of programmed output voltage, the minimum input supply voltage of 2 V (2.3 V
overtemperature) must be taken into account.
(10) Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a 50 mA load pulse at VIN = 30 V (1.25-W pulse) for T = 10 ms.
(11) VREF ≤VOUT ≤(VIN −1 V), 2.3 V ≤VIN ≤30 V, 100 μA≤IL≤100 mA, TJ≤TJMAX.
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)(1)
LP2950AC-XX LP2950C-XX
LP2951(2) LP2951AC-XX LP2951C-XX
PARAMETER TEST CONDITIONS(1) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
ERROR COMPARATOR
VOH = 30 V 0.01 1 0.01 1 0.01 1 μA(4)
Output leakage 2μA(4)
VOH = 30 V, –40°C ≤TJ≤
current 125°C 2 2 μA(5)
Vin = (VONOM −0.5)V, 150 250 150 250 150 250 mV(4)
IOL = 400 μA
Output low voltage Vin = (VONOM −0.5)V, 400 400 400 mV(4)
IOL = 400 μA, 400 400 mV(5)
–40°C ≤TJ≤125°C
See(12) 40 60 40 60 40 60 mV(4)
Upper threshold 25 mV(4)
See(12), –40°C ≤TJ≤
voltage 125°C 25 25 mV(5)
See(12) 75 95 75 95 75 95 mV(4)
Lower threshold 140 mV(4)
See(12), –40°C ≤TJ≤
voltage 125°C 140 140 mV(5)
Hysteresis See(12) 15 15 15 mV
SHUTDOWN INPUT
Input 1.3 1.3 1.3 V
0.6 V(4)
Low (Regulator ON),
Logic voltage –40°C ≤TJ≤125°C 0.7 0.7 V(5)
2 V(4)
High (Regulator OFF),
Logic voltage –40°C ≤TJ≤125°C 2 2 V(5)
Vshutdown = 2.4 V 30 50 30 50 30 50 μA(4)
100 μA(4)
Vshutdown = 2.4 V
–40°C ≤TJ≤125°C 100 100 μA(5)
Shutdown pin input
current Vshutdown = 30 V 450 600 450 600 450 600 μA(4)
750 μA(4)
Vshutdown = 30 V,
–40°C ≤TJ≤125°C 750 750 μA(5)
See(13) 3 10 3 10 3 10 μA(4)
Regulator output
current in 20 μA(4)
–40°C ≤TJ≤125°C
shutdown 20 20 μA(5)
(12) Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal reference voltage
measured at Vin = (VONOM + 1)V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain =
VOUT/VREF = (R1 + R2)/R2.For example, at a programmed output voltage of 5 V, the Error output is specified to go low when the output
drops by 95 mV × 5 V/1.235 V = 384 mV. Thresholds remain constant as a percent of Vout as Vout is varied, with the dropout warning
occurring at typically 5% below nominal, 7.5% ensured.
(13) VSHUTDOWN ≥2 V, VIN ≤30 V, VOUT = 0, Feedback pin tied to VTAP.
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7.7 Typical Characteristics
Figure 2. Dropout Characteristics
Figure 1. Quiescent Current
Figure 3. Input Current Figure 4. Input Current
Figure 6. Quiescent Current
Figure 5. Output Voltage vs. Temperature of 3
Representative Units
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Typical Characteristics (continued)
Figure 7. Quiescent Current Figure 8. Quiescent Current
Figure 9. Quiescent Current Figure 10. Short Circuit Current
Figure 12. Dropout Voltage
Figure 11. Dropout Voltage
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Typical Characteristics (continued)
Figure 13. LP2951-N Minimum Operating Voltage Figure 14. LP2951-N Feedback Bias Current
Figure 16. LP2951-N Error Comparator Output
Figure 15. LP2951-N Feedback Pin Current
Figure 17. LP2951-N Comparator Sink Current Figure 18. LP2951-N Enable Transient
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Typical Characteristics (continued)
Figure 19. Output Impedance Figure 20. Ripple Rejection
Figure 21. Ripple Rejection Figure 22. Ripple Rejection
Figure 24. LP2951-N Divider Resistance
Figure 23. LP2951-N Output Noise
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Typical Characteristics (continued)
Figure 25. Shutdown Threshold Voltage Figure 26. Line Regulation
Figure 27. LP2951-N Maximum Rated Output Current Figure 28. LP2950-N Maximum Rated Output Current
Figure 29. Thermal Response Figure 30. Output Capacitor ESR Range
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0 5 10 15 20 25 30
0
20
40
60
80
100
120
INPUT PIN CURRENT, IIN(A)
INPUT PIN VOLTAGE, VIN(V)
VSD= 2.0V
Output Load = Open
Ta= -50°C
Ta= -40°C
Ta= +25°C
Ta= +125°C
0 5 10 15 20 25 30
0
20
40
60
80
100
120
INPUT PIN CURRENT, IIN(A)
INPUT PIN VOLTAGE, VIN(V)
VSD= 2.0V
Output Load = Short to Ground
Ta= -50°C
Ta= -40°C
Ta= +25°C
Ta= +125°C
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Typical Characteristics (continued)
Figure 31. LP2951-N Input Pin Current vs Input Voltage Figure 32. LP2951-N Input Pin Current vs Input Voltage
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