QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 1 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
Applications
Repeaters / DAS
Mobile Infrastructure
Defense Communications
General Purpose Wireless
16-Pin 3 x 3 mm Leadless QFN Package
Functional Block Diagram
Top View
Product Features
400-4200 MHz
+27.2 dBm P1dB
+44 dBm Output IP3
17 dB Gain at 2140 MHz
+5 V Single Supply, 130 mA ICQ
Internal RF overdrive protection
Internal DC overvoltage protection
On chip ESD protection
3x3 mm QFN Package
Pin Configuration
Pin No.
Label
1, 4, 5, 6, 7, 8, 9, 12, 13, 14, 16
No Connection
2, 3
RF In
10, 11
RF Out
15
I Ref
Backside Paddle
GND
General Description
The QPA9119 is a high linearity driver amplifier in a low-
cost, RoHS compliant, surface mount package. This
InGaP/GaAs HBT delivers high performance across a
broad range of frequencies with +44 dBm OIP3 and
+27.2 dBm P1dB while only consuming 130 mA quiescent
current. All devices are 100% RF and DC tested.
The QPA9119 incorporates on-chip features that
differentiate it from other products in the market. The
amplifier integrates an on-chip DC over-voltage and RF
over-drive protection. This protects the amplifier from
electrical DC voltage surges and high input RF input
power levels that may occur in a system. On-chip ESD
protection allows the amplifier to have a very robust Class
1C HBM ESD rating.
The QPA9119 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity, medium
power, and high efficiency are required. The device an
excellent candidate for transceiver line cards in current
and next generation multi-carrier 3G / 4G base stations.
Ordering Information
Part No.
Description
QPA9119
0.5 W High Linearity Amplifier
QPA9119−PCB900
869−960 MHz Evaluation Board
QPA9119−PCB2140
2.11–2.17 GHz Evaluation Board
Standard T/R size = 2,500 pieces on a 7” reel
7 865
14 131516
12
11
10
9
1
2
3
4
RF In
RF In
NC
NC
RF Out
RF Out
NC
NC
NC I Ref NC NC
NC NC NC NC
Backside Paddle - RF/DC GND
Pin 1 Reference Mark
Bias
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 2 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
Recommended Operating Conditions
Parameter
Min
Typ
Max
Units
Device Voltage (VCC)
+4.75
+5
+5.25
V
TCASE
−40
+105
°C
Tj for >106 hours MTTF
+175
°C
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Absolute Maximum Ratings
Parameter
Rating
Storage Temperature
−65 to +150 °C
RF Input Power, CW, 50 Ω, T=25 °C
+27 dBm
Device Voltage (VCC)
+8 V
Dissipated Power (PDISS)
1.7 W
Operation of this device outside the parameter ranges
given above may cause permanent damage.
Electrical Specifications
Test conditions unless otherwise noted: VCC = VPD = +5.0 V, Temp = +25 °C, 50 Ω system.
Parameter
Conditions
Min
Typ
Max
Units
Operational Frequency Range
400
4200
MHz
Test Frequency
2140
MHz
Gain
17.1
dB
Input Return Loss
14
dB
Output Return Loss
11
dB
Output P1dB
+27.2
dBm
Output IP3
Pout = +13 dBm/tone, ∆f = 1 MHz
+43.8
dBm
LTE Channel Power(1)
−50 dBc ACLR See Note 1
+18.1
dBm
Noise Figure
4.8
dB
Reference Bias current
Pin 15
7
mA
Quiescent Current, ICQ
Pins 10, 11
130
mA
Total Current
137
mA
Thermal Resistance, θjc
Junction to case
50.3
°C/W
Notes:
1. ACLR test set-up: LTE, 20 MHz E-UTRA, +20 MHz offset, PAR = 9.5 dB at 0.01% Probability
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 3 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
S-Parameters
Test Conditions: VCC=+5 V, ICQ=135 mA (typ.), Temp.=+25 °C, unmatched 50 Ohm system, reference plane at device leads
Freq (GHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
0.05
-6.62
-174.41
27.28
124.83
-24.82
87.65
-4.37
-172.48
0.10
-6.11
-174.19
23.31
125.16
-36.26
0.46
-2.80
-159.87
0.20
-7.34
-152.53
17.32
131.27
-40.20
9.27
-2.05
-177.15
0.40
-0.95
-162.11
20.48
144.17
-33.75
33.77
-4.17
166.09
0.60
-0.67
-177.80
19.46
120.55
-32.49
22.94
-4.88
167.74
0.80
-0.81
174.16
17.80
105.64
-32.11
18.72
-4.89
167.06
1.00
-0.92
168.52
16.25
94.63
-31.86
16.69
-4.81
164.86
1.20
-1.00
163.75
14.88
85.61
-31.62
15.38
-4.73
162.09
1.40
-1.06
159.42
13.67
77.74
-31.39
14.42
-4.66
158.97
1.60
-1.10
155.28
12.59
70.57
-31.16
13.48
-4.57
155.65
1.80
-1.12
151.20
11.59
63.86
-30.95
12.50
-4.48
152.21
2.00
-1.13
147.13
10.68
57.49
-30.74
11.44
-4.38
148.80
2.20
-1.13
142.97
9.83
51.35
-30.56
10.16
-4.26
145.35
2.40
-1.13
138.79
9.03
45.42
-30.40
8.87
-4.15
142.00
2.60
-1.12
134.61
8.25
39.65
-30.26
7.52
-4.03
138.91
2.80
-1.09
130.44
7.50
34.07
-30.15
5.99
-3.89
136.04
3.00
-1.05
126.28
6.77
28.70
-30.06
4.49
-3.75
133.19
3.20
-1.03
122.34
6.07
23.53
-30.00
3.00
-3.63
130.49
3.40
-1.00
118.66
5.38
18.51
-29.95
1.37
-3.52
128.09
3.60
-0.95
115.17
4.72
13.69
-29.93
-0.17
-3.38
125.84
3.80
-0.91
111.69
4.09
9.01
-29.91
-1.72
-3.25
123.58
4.00
-0.89
109.84
3.55
4.09
-29.84
-3.69
-3.09
118.66
4.20
-0.86
107.48
2.95
-0.05
-29.86
-5.00
-2.99
116.78
4.40
-0.82
105.44
2.38
-3.91
-29.88
-6.15
-2.88
115.15
4.60
-0.79
103.60
1.84
-7.62
-29.91
-7.26
-2.76
113.43
4.80
-0.77
102.20
1.34
-11.12
-29.93
-8.27
-2.68
111.71
5.00
-0.76
100.98
0.87
-14.54
-29.95
-9.25
-2.61
110.10
5.20
-0.75
100.03
0.44
-17.85
-29.97
-10.10
-2.54
108.53
5.40
-0.74
99.00
0.04
-21.17
-29.98
-11.00
-2.47
106.94
5.60
-0.74
98.11
-0.33
-24.43
-29.98
-11.73
-2.41
105.20
5.80
-0.75
97.20
-0.67
-27.76
-29.96
-12.52
-2.36
103.39
6.00
-0.76
96.42
-0.99
-31.12
-29.92
-13.30
-2.32
101.42
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 4 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
869 – 960 MHz Evaluation Board (QPA9119−PCB900)
Notes:
1. See Evaluation Board PCB Information for material and stack up.
2. The recommended component values are dependent upon the frequency of operation.
3. All components are of 0603 size unless stated on the schematic.
4. Critical component placement locations:
Distance from U1 (left edge) to R4 (right edge): 25 mils (1.2 deg. at 920 MHz)
Distance from U1 (left edge) to C5 (right edge): 360 mils (17 deg. at 920 MHz)
Distance from U1 (right edge) to L2 (left edge): 120 mils (5.7 deg. at 920 MHz)
Distance from U1 (right edge) to C6 (left edge): 347 mils (16.5 deg. at 920 MHz)
Typical Performance QPA9119−PCB900
Test conditions unless otherwise noted: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7 mA , Temp.=+25 °C
Parameter
Conditions
Typical Value
Units
Frequency
869
920
960
MHz
Gain
21.1
21.2
21.1
dB
Input Return Loss
10
13
17
dB
Output Return Loss
13
12
11
dB
Output P1dB
+28.0
+28.2
+28.3
dBm
OIP3
Pout= +21 dBm/tone, Δf=1 MHz
+43.5
+43.8
+43.5
dBm
LTE Channel Power(1)
−50 dBc ACLR
+18.3
+18.7
+18.7
dBm
Noise Figure
6.8
6.7
6.7
dB
Notes:
1. ACLR Test set-up: LTE, 20 MHz E-UTRA, +20 MHz offset, PAR = 9.5 dB at 0.01% Probability
Bill of Material QPA9119−PCB900
Reference Des.
Value
Description
Manuf.
Part Number
n/a
n/a
Printed Circuit Board
Qorvo
U1
n/a
QPA9119 Amplifier, QFN pkg.
Qorvo
QPA9119
R2
0 Ω
Resistor, Chip, 0603
various
R4
2.7 Ω
Resistor, Chip, 0402, 1%, 1/16W
various
R1
380 Ω
Resistor, Chip, 0603, 1%, 1/16W
various
L2
2.2 nH
Inductor, 0603, +/-0.3 nH
Toko
LL1608-FSL2N2S
L1
33 nH
Inductor, 0805, 5%, Coilcraft CS Series
Coilcraft
0805CS-330XJLB
C7
10 pF
Cap., Chip, 0603, 5%, 50V. NPO/COG
various
C6
2.7 pF
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
NPO/COG
various
C2, C8
100 pF
Cap., Chip, 0603, 5%, 50V, NPO/COG
various
C4
1.0 uF
Cap., Chip, 0603, 10%, 10V, X5R
various
C5
5.6 pF
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
various
L1
J4
J3
R4 U1
J5
R1
C7 L2 C8
R2
C5
C6
C3
C4
Q1 J2
RF
Output
J4 GND
2,3
1,4,5,6,7,8,9,
12,13,14,16
10,11
J1
RF
Input
L1
33 nH C8
100 pF
C7
10 pF
C3
100 pF
C4
1 uF
R1
380
15
R2
0
C8
DNI
J3 Vcc
J5 Vpd
C2
DNI
C5
5.6 pF
C6
2.7 pF
R4
2.7
0402 L2
2.2 nH
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 5 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
Performance Plots QPA9119−PCB900
Test conditions unless otherwise noted: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7 mA , Temp.=+25 °C
15
17
19
21
23
25
860 880 900 920 940 960
Gain (dB)
Frequency (MHz)
Gain vs. Frequency
+105°C
+25°C
−40°C
-20
-15
-10
-5
0
860 880 900 920 940 960
|S11| (dB)
Frequency (MHz)
Input Return Loss vs. Frequency
+105°C
+25°C
−40°C
-20
-15
-10
-5
0
860 880 900 920 940 960
|S22| (dB)
Frequency (MHz)
Output Return Loss vs. Frequency
+105°C
+25°C
−40°C
30
35
40
45
50
55
10 12 14 16 18 20 22 24
OIP3 (dBm)
Pout/tone (dBm)
OIP3 vs Pout/tone
869 MHz
920 MHz
960 MHz
Temp.=+25°C
30
35
40
45
50
55
10 12 14 16 18 20 22 24
OIP3 (dBm)
Pout/tone (dBm)
OIP3 vs Pout/tone
+105°C
+25°C
−40°C
F = 920 MHz
25
26
27
28
29
30
870 880 890 900 910 920 930 940 950 960
P1dB (dBm)
Frequency (MHz)
P1dB vs Frequency
+105°C
+25°C
−40°C
-65
-60
-55
-50
-45
-40
810 12 14 16 18 20
ACLR (dBm)
Pout (dBm)
ACLR vs Pout
869 MHz
920 MHz
960 MHz
Temp.=+25°C
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW
-65
-60
-55
-50
-45
-40
810 12 14 16 18 20
ACLR (dBm)
Pout (dBm)
ACLR vs Pout
+105°C
+25°C
−40°C
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW F = 920 MHz
25
26
27
28
29
30
870 880 890 900 910 920 930 940 950 960
P1dB (dBm)
Frequency (MHz)
P1dB vs Frequency
+105°C
+25°C
−40°C
F = 920 MHz
-65
-60
-55
-50
-45
-40
810 12 14 16 18 20
ACLR (dBc)
Pout (dBm)
ACLR vs Pout
869 MHz
920 MHz
960 MHz
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
Temp.=+25°C
-65
-60
-55
-50
-45
-40
810 12 14 16 18 20
ACLR (dBc)
Pout (dBm)
ACLR vs Pout
+105°C
+25°C
−40°C
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
F = 920 MHz
0
50
100
150
200
250
300
350
400
12 14 16 18 20 22 24 26 28 30
Icc, Total (mA)
Pout (dBm)
Icc vs. Pout
+105°C
+25°C
−40°C
F = 920 MHz
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 6 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
2110 – 2140 MHz Evaluation Board (QPA9119−PCB2140)
Notes:
1. See Evaluation Board PCB Information for material and stack up.
2. The recommended component values are dependent upon the frequency of operation.
3. All components are of 0603 size unless stated on the schematic.
4. Critical component placement locations:
Distance from U1 (left edge) to R4 (right edge): 32 mils (3.6 deg. at 2140 MHz)
Distance from U1 (left edge) to C5 (right edge): 70 mils (7.8 deg. at 2140 MHz)
Distance from U1 (left edge) to C7 (right edge): 152 mils (16.8 deg. at 2140 MHz)
Distance from U1 (right edge) to C8 (left edge): 380 mils (42.0 deg. at 2140 MHz)
Distance from U1 (right edge) to C6 (left edge): 305 mils (33.7 deg. at 2140 MHz)
Bill of Material QPA9119−PCB2140
Reference Des.
Value
Description
Manuf.
Part Number
n/a
n/a
Printed Circuit Board
Qorvo
U1
n/a
QPA9119 Amplifier, QFN pkg.
Qorvo
QPA9119
R2
0 Ω
Resistor, Chip, 0603
various
R4
1.5 Ω
Resistor, Chip, 0402, 1%, 1/16W
various
R1
380 Ω
Resistor, Chip, 0603, 1%, 1/16W
various
C3
100 pF
Cap., Chip, 0603, 5%, 50V, NPO/COG
various
L1
18 nH
Inductor, 0805, 5%, Coilcraft CS Series
Coilcraft
0805CS-180XJLB
C7
1.5 pF
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
5%, 50V. NPO/COG
various
C6
0.8 pF
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
NPO/COG
various
C8
3.3 pF
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
various
C4
1.0 uF
Cap., Chip, 0603, 10%, 10V, X5R
various
C5
1.8 pF
Cap., Chip, 0603, +/-0.1pF. 200V. NPO/COG
various
Typical Performance QPA9119−PCB2140
Test conditions unless otherwise noted: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7 mA , Temp.=+25 °C
Parameter
Conditions
Typical Value
Units
Frequency
2110
2140
2170
MHz
Gain
17.1
17.1
17.0
dB
Input Return Loss
13
14
14
dB
Output Return Loss
12
11
11
dB
Output P1dB
+27.4
+27.2
+27.1
dBm
OIP3
Pout= +13 dBm/tone, Δf=1 MHz
+43.5
+43.8
+43.6
dBm
LTE Channel Power(1)
−50 dBc ACLR
+18.2
+18.1
+18.4
dBm
Noise Figure
4.8
4.8
4.8
dB
Notes:
1. ACLR Test set-up: LTE, 1-CH E-UTRA, +20 MHz offset, PAR = 9.5 dB at 0.01% Probability
L1
J4
J3
R4 U1
J5
R1
C7R3 C8
R2
C5
C6
C3
C4
Q1 J2
RF
Output
J4 GND
2,3
1,4,5,6,7,8,9,
12,13,14,16
10,11
J1
RF
Input
L1
18 nH C8
3.3 pF
C7
1.5 pF
C3
100 pF
C4
1 uF
R1
380
15
R2
0
C8
DNI
J3 Vcc
J5 Vpd
C2
DNI
C5
1.8 pF
C6
0.8 pF
R4
1.5
0402
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 7 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
Performance Plots QPA9119−PCB2140
Test conditions unless otherwise noted: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7 mA , Temp.=+25 °C
14
15
16
17
18
19
2110 2120 2130 2140 2150 2160 2170
Gain (dB)
Frequency (MHz)
Gain vs. Frequency
+105°C
+25°C
−40°C
-20
-15
-10
-5
0
2110 2120 2130 2140 2150 2160 2170
|S11| (dB)
Frequency (MHz)
Input Return Loss vs. Frequency
+105°C
+25°C
−40°C
-20
-15
-10
-5
0
2110 2120 2130 2140 2150 2160 2170
|S22| (dB)
Frequency (MHz)
Output Return Loss vs. Frequency
+105°C
+25°C
−40°C
25
30
35
40
45
50
10 13 16 19 22
OIP3 (dBm)
Pout/tone (dBm)
OIP3 vs Pout/tone
2110 MHz
2140 MHz
2170 MHz
Temp.=+25°C
25
30
35
40
45
50
10 13 16 19 22
OIP3 (dBm)
Pout/tone (dBm)
OIP3 vs Pout/tone
+105°C
+25°C
−40°C
F = 2140 MHz
25
26
27
28
29
30
2110 2120 2130 2140 2150 2160 2170
P1dB (dBm)
Frequency (MHz)
P1dB vs Frequency
+105°C
+25°C
−40°C
-65
-60
-55
-50
-45
-40
810 12 14 16 18 20
ACLR (dBc)
Pout (dBm)
ACLR vs Pout
2110 MHz
2140 MHz
2170 MHz
Temp.=+25°C
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW
-65
-60
-55
-50
-45
-40
810 12 14 16 18 20
ACLR (dBc)
Pout (dBm)
ACLR vs Pout
+105°C
+25°C
−40°C
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW F = 2140 MHz
10
12
14
16
18
20
22
24
26
28
30
-5 -3 -1 1357911 13 15
Pout (dBm)
Pin (dBm)
Pout vs. Pin
+105°C
+25°C
−40°C
F = 2140 MHz
-65
-60
-55
-50
-45
-40
810 12 14 16 18 20
ACLR (dBc)
Pout (dBm)
ACLR vs Pout
2110 MHz
2140 MHz
2170 MHz
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
Temp.=+25°C
-65
-60
-55
-50
-45
-40
810 12 14 16 18 20
ACLR (dBc)
Pout (dBm)
ACLR vs Pout
+105°C
+25°C
−40°C
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
F = 2140 MHz
0
50
100
150
200
250
300
350
400
12 14 16 18 20 22 24 26 28 30
Icc, Total (mA)
Pout (dBm)
Icc vs. Pout
+105°C
+25°C
−40°C
F = 2140 MHz
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 8 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
2300 – 2700 MHz Reference Design
Notes:
1. All components are of 0603 size unless stated on the schematic.
2. The recommended component values are dependent upon the frequency of operation.
3. Critical component placement locations:
Distance between U1 (left edge) to R4 (right edge): 15 mil
Distance between U1 (left edge) to C5 (right edge): 80 mil
Distance between U1 (left edge) to C7 (right edge): 130 mil
Distance between U1 (right edge) to C6 (left edge): 130 mil
Bill of Material 2300 – 2700 MHz Reference Design
Reference Des.
Value
Description
Manuf.
Part Number
n/a
n/a
Printed Circuit Board
Qorvo
U1
n/a
0.5 W High Linearity Amplifier
Qorvo
QPA9119
R1
380 Ω
Res., Chip, 0603, +/-1%, 1/10W
various
R2, R3
0 Ω
Res., Chip, 0603
various
C5, C7
1.2 pF
CAP, 0603, +/-0.1pF. 200V. NPO/COG
various
C6
0.8 pF
CAP, 0603, +/-0.1pF. 200V. NPO/COG
various
C8
39 pF
Cap., Chip, 0603, +/-5%. 50V NPO/COG
various
C3
22 pF
Cap., Chip, 0603, +/-5%. 50V NPO/COG
various
R4
2.2 Ω
Res., Chip, 0603, +/-1%, 1/10W
various
C4
1.0 uF
CAP, 0603, 10%, X5R , 10V
various
L1
18 nH
Inductor, 0805, 5%, Coilcraft CS series
Coilcraft
0805CS-180XJLB
L1
J4
J3
J1 J2
R4 U1
J5
R1
C7R3 C8
R2
C5
C6
C3
C4
Q1 J2
RF
Output
J4 GND
2,3
1,4,5,6,7,8,9,
12,13,14,16
10,11
J1
RF
Input
L1
18 nH C8
39 pF
C7
1.2 pF
C3
22 pF
C4
1 uF
R1
380
15
R2
0
C8
DNI
J3 Vcc
J5 Vpd
C2
DNI
C5
1.2 pF
C6
0.8 pF
R4
2.2
0402
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 9 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
Typical Performance 2300 – 2700 MHz Reference Design
Test Conditions: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7 mA , Temp.=+25 °C
Parameter
Conditions
Typical Value
Units
Frequency
2300
2400
2500
2600
2700
MHz
Gain
14.1
14.3
14.3
14.1
13.7
dB
Input Return Loss
7.6
10
13
13
11
dB
Output Return Loss
9.1
8.8
8.6
8.3
8.2
dB
Output P1dB
+27.3
+27.6
+27.6
+27.3
+27.1
dBm
Output IP3
Pout= +15 dBm/tone, f= 1 MHz
+46.1
+44.5
+44.1
+44.5
+44.9
dBm
Quiescent Collector Current, ICQ
130
mA
Performance Plots 2300 – 2700 MHz Reference Design
Test Conditions: VCC = VPD = +5V, ICQ = 130 mA , IREF = 7 mA , Temp.=+25 °C
11
12
13
14
15
16
2300 2400 2500 2600 2700
Gain (dB)
Frequency (MHz)
Gain vs. Frequency
Temp.=+25°C
-15
-10
-5
0
2300 2400 2500 2600 2700
|S11| (dB)
Frequency (MHz)
Input Return Loss vs. Frequency
Temp.=+25°C
-15
-10
-5
0
2300 2400 2500 2600 2700
|S22| (dB)
Frequency (MHz)
Output Return Loss vs. Frequency
Temp.=+25°C
35
40
45
50
910 11 12 13 14 15 16 17 18 19
OIP3 (dBm)
Pout/Tone (dBm)
OIP3 vs. Pout/tone
F = 2.3 GHz
F = 2.4 GHz
F = 2.5 GHz
F = 2.6 GHz
F = 2.7 GHz
TQP7M9102
Temp.=+25°C
24
25
26
27
28
29
2.3 2.4 2.5 2.6 2.7
P1dB (dBm)
Frequency (GHz)
P1dB vs. Frequency
Temp.=+25°C
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 10 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
Pin Configuration and Description
Top View
Pin No.
Label
Description
1, 4, 5, 6, 7, 8, 9,
12, 13, 14, 16
NC
No electrical connection. Land pads should be provided for PCB mounting
integrity.
2, 3
RF IN
RF input. External DC Block required. Requires conjugate match for optimal
performance.
10, 11
RF OUT / VCC
RF output. External DC Block and bias voltage required. Requires matching.
15
I REF
Sets the bias current for the amp. Also can be used to power down device.
Backside Paddle
GND
RF/DC ground. Use recommended via pattern to minimize inductance and
thermal resistance. See PCB Mounting Pattern for suggested footprint.
Evaluation Board PCB Information
PC Board Layout
PCB Material (stackup):
1 oz. Cu top layer
0.014 inch Nelco N-4000-13, εr=3.7
1 oz. Cu MIDDLE layer 1
Core Nelco N-4000-13
1 oz. Cu middle layer 2
0.014 inch Nelco N-4000-13
1 oz. Cu bottom layer
Finished board thickness is 0.062±.006
50 ohm line dimensions: width = .029”, spacing = .029”.
The pad pattern shown has been developed and tested for
optimized assembly at Qorvo Semiconductor. The PCB
land pattern has been developed to accommodate lead
and package tolerances. Since surface mount processes
vary from supplier to supplier, careful process
development is recommended.
7 865
14 131516
12
11
10
9
1
2
3
4
RF In
RF In
NC
NC
RF Out
RF Out
NC
NC
NC I Ref NC NC
NC NC NC NC
Backside Paddle - RF/DC GND
Pin 1 Reference Mark
Bias
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 11 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
Package Marking and Dimensions
Marking: Part number – 9119
Date - YYWW
Lot code – AaXXXX
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
3. Contact plating: NiPdAu
PCB Mounting Pattern
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We
recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Pin 1 Locator
COMPONENT SIDE
7X 3
16X 0.32 0.50 Pitch 16X
16X 0.52 1.50
1.50
Package Outline
0.31
0.09
0.55
0.32
0.64
9119
YYWW
AaXXXX
QPA9119
½ W High Linearity Amplifier
Advanced Data Sheet: Rev. D 08-20-15
- 12 of 12 -
Disclaimer: Subject to change without notice
© 2015 TriQuint Semiconductor, Inc
www.Qorvo.com / www.qorvo.com
Product Compliance Information
ESD Sensitivity Ratings
Caution! ESD-Sensitive Device
ESD Class: Class 1C
Volt. Range: >1000V to <2000V
Test: Human Body Model (HBM)
Standard: ESAD/JEDEC Standard JS-001-2012
ESD Class: Class C3
Volt. Range: ≥ 1000 V
Test: Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101F
Solderability
Compatible with both lead-free (260 °C max. reflow
temperature) and tin/lead (245 °C max. reflow
temperature) soldering processes.
Contact plating: NiPdAu
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
MSL Rating
MSL Rating: Level 1
Test: 260°C convection reflow
Standard: JEDEC Standard IPC/JEDEC J-STD-020
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Web: www.triquint.com Tel: 1-844-890-8163
Email: customer.support@qorvo.com
For information about the merger of RFMD and Qorvo as Qorvo:
Web: www.qorvo.com
Important Notice
The information contained herein is believed to be reliable. Qorvo makes no warranties regarding the information
contained herein. Qorvo assumes no responsibility or liability whatsoever for any of the information contained herein.
Qorvo assumes no responsibility or liability whatsoever for the use of the information contained herein. The information
contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information
is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain
and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or
any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other
intellectual property rights, whether with regard to such information itself or anything described by such information.
Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining
applications, or other applications where a failure would reasonably be expected to cause severe personal injury or
death.
Printed copy of this document is considered an uncontrolled copy; unless control copy designator is identified.
Qorvo, Inc. – Confidential & Proprietary Information Template: FOR-QPA9119 Rev B
QPA9119 Product Data Sheet
DAT.QPA9119 Rev. D
Page 1 of 1
Revision History
Rev.
Date
ECN#
(Hillsboro
Only)
Description of Change
WEBMASTER POSTING
INSTRUCTIONS TO
PUBLIC WEBSITE
Email*
Info
Link
Only
1st page
only
Full
Data
Sheet
Answer YES in one
column only OR NO**
all 3 columns
A
05-08-15
92909
Initial Release (S. Paniccia)
No
No
No
B
05-12-15
92970
Added application circuit (S. Paniccia)
No
No
No
C
08-12-15
95204
Added reference designs, plots, thermal,
ESD info (S. Paniccia)
No
No
Yes
D
08-20-15
95446
Added de-embedded data (S. Paniccia)
No
No
Yes
CONTROLLED DISTRIBUTION: 03
(Hillsboro Only)
