LCMXO3LF-9400E-6BG256I - LATTICE SEMICONDUCTOR

MachXO3 Family

Data Sheet

FPGA-DS-02032-2.4

February 2019

MachXO3 Family   
Data Sheet 
 
© 2014-2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.  
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
  FPGA-DS-02032-2.4 
Contents 
Acronyms in This Document ................................................................................................................................................. 6 
Introduction .................................................................................................................................................................. 7 
1. Features ............................................................................................................................................................... 8 
1.1. Solutions ......................................................................................................................................................... 8 
1.2. Flexible Architecture ....................................................................................................................................... 8 
1.3. Advanced Packaging ....................................................................................................................................... 8 
1.4. Pre-Engineered Source Synchronous I/O ........................................................................................................ 8 
1.5. High Performance, Flexible I/O Buffer ............................................................................................................ 8 
1.6. Flexible On-Chip Clocking ................................................................................................................................ 8 
1.7. Non-volatile, Multi-time Programmable ......................................................................................................... 8 
1.8. TransFR Reconfiguration ................................................................................................................................. 8 
1.9. Enhanced System Level Support ..................................................................................................................... 8 
1.10. Applications ................................................................................................................................................ 8 
1.11. Low Cost Migration Path ............................................................................................................................ 8 
Architecture ................................................................................................................................................................ 10 
1. Architecture Overview ...................................................................................................................................... 10 
2. PFU Blocks ......................................................................................................................................................... 12 
2.1. Slices ............................................................................................................................................................. 12 
2.2. Modes of Operation ...................................................................................................................................... 14 
2.3. RAM Mode .................................................................................................................................................... 14 
2.4. ROM Mode .................................................................................................................................................... 14 
3. Routing .............................................................................................................................................................. 15 
4. Clock/Control Distribution Network................................................................................................................... 15 
4.1. sysCLOCK Phase Locked Loops (PLLs) ........................................................................................................... 17 
5. sysMEM Embedded Block RAM Memory .......................................................................................................... 20 
5.1. sysMEM Memory Block ................................................................................................................................ 20 
5.2. Bus Size Matching ......................................................................................................................................... 20 
5.3. RAM Initialization and ROM Operation ........................................................................................................ 20 
5.4. Memory Cascading ....................................................................................................................................... 20 
5.5. Single, Dual, Pseudo-Dual Port and FIFO Modes .......................................................................................... 21 
5.6. FIFO Configuration ........................................................................................................................................ 22 
5.7. Memory Core Reset ...................................................................................................................................... 22 
5.8. EBR Asynchronous Reset .............................................................................................................................. 23 
6. Programmable I/O Cells (PIC) ............................................................................................................................ 24 
7. PIO ..................................................................................................................................................................... 26 
7.1. Input Register Block ...................................................................................................................................... 26 
7.2. Output Register Block ................................................................................................................................... 26 
7.3. Tri-state Register Block ................................................................................................................................. 27 
8. Input Gearbox ................................................................................................................................................... 27 
9. Output Gearbox ................................................................................................................................................. 29 
10. sysI/O Buffer ...................................................................................................................................................... 31 
10.1. Typical I/O Behavior during Power-up ..................................................................................................... 31 
10.2. Supported Standards ................................................................................................................................ 31 
10.3. sysI/O Buffer Banks ................................................................................................................................... 33 
11. Hot Socketing .................................................................................................................................................... 34 
12. On-chip Oscillator .............................................................................................................................................. 34 
13. Embedded Hardened IP Functions .................................................................................................................... 35 
13.1. Hardened I2C IP Core ................................................................................................................................ 35 
13.2. Hardened SPI IP Core ................................................................................................................................ 36 
13.3. Hardened Timer/Counter ......................................................................................................................... 38 
14. User Flash Memory (UFM) ................................................................................................................................ 39 
15. Standby Mode and Power Saving Options ........................................................................................................ 39 

  MachXO3 Family 
   Data Sheet 
© 2014-2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.  
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
FPGA-DS-02032-2.4    3 
16. Power On Reset ................................................................................................................................................. 40 
17. Configuration and Testing ................................................................................................................................. 41 
17.1. IEEE 1149.1-Compliant Boundary Scan Testability ................................................................................... 41 
17.2. Device Configuration ................................................................................................................................ 41 
18. TraceID .............................................................................................................................................................. 43 
19. Density Shifting ................................................................................................................................................. 43 
DC and Switching Characteristics ............................................................................................................................... 44 
1. Absolute Maximum Rating ................................................................................................................................ 44 
2. Recommended Operating Conditions ............................................................................................................... 44 
3. Power Supply Ramp Rates ................................................................................................................................ 44 
4. Power-On-Reset Voltage Levels ........................................................................................................................ 45 
5. Hot Socketing Specifications ............................................................................................................................. 45 
6. Programming/Erase Specifications ................................................................................................................... 45 
7. ESD Performance .............................................................................................................................................. 45 
8. DC Electrical Characteristics .............................................................................................................................. 46 
9. Static Supply Current – C/E Devices .................................................................................................................. 47 
10. Programming and Erase Supply Current – C/E Devices ..................................................................................... 48 
11. sysI/O Recommended Operating Conditions ..................................................................................................... 49 
12. sysI/O Single-Ended DC Electrical Characteristics .............................................................................................. 50 
13. sysI/O Differential Electrical Characteristics ..................................................................................................... 51 
13.1. LVDS .......................................................................................................................................................... 51 
13.2. LVDS Emulation ........................................................................................................................................ 51 
13.3. BLVDS ....................................................................................................................................................... 52 
13.4. LVPECL ....................................................................................................................................................... 53 
13.5. MIPI D-PHY Emulation .............................................................................................................................. 54 
14. Typical Building Block Function Performance – C/E Devices ............................................................................ 57 
14.1. Pin-to-Pin Performance (LVCMOS25 12 mA Drive) .................................................................................. 57 
14.2. Register-to-Register Performance ............................................................................................................ 57 
15. Derating Logic Timing ........................................................................................................................................ 57 
16. Maximum sysI/O Buffer Performance .............................................................................................................. 58 
17. MachXO3L/LF External Switching Characteristics – C/E Devices ...................................................................... 59 
18. sysCLOCK PLL Timing ......................................................................................................................................... 65 
19. NVCM/Flash Download Time ............................................................................................................................ 66 
20. JTAG Port Timing Specifications ........................................................................................................................ 66 
21. sysCONFIG Port Timing Specifications .............................................................................................................. 68 
22. I2C Port Timing Specifications ........................................................................................................................... 69 
23. SPI Port Timing Specifications ........................................................................................................................... 69 
24. Switching Test Conditions ................................................................................................................................. 69 
Signal Descriptions ...................................................................................................................................................... 70 
1. Pin Information Summary ................................................................................................................................. 72 
MachXO3 Part Number Description ........................................................................................................................... 77 
Ordering Information ................................................................................................................................................. 78 
1. MachXO3L Ultra Low Power Commercial and Industrial Grade Devices, Halogen Free (RoHS) Packaging ...... 78 
2. MachXO3LF Ultra Low Power Commercial and Industrial Grade Devices, Halogen Free (RoHS) Packaging .... 81 
References .......................................................................................................................................................................... 85 
Revision History .................................................................................................................................................................. 86 
 

MachXO3 Family   
Data Sheet 
 
© 2014-2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.  
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
4    FPGA-DS-02032-2.4 
Figures 
Figure 2.1. Top View of the MachXO3L/LF-1300 Device .................................................................................................... 10 
Figure 2.2. Top View of the MachXO3L/LF-4300 Device .................................................................................................... 11 
Figure 2.3. PFU Block Diagram ............................................................................................................................................ 12 
Figure 2.4. Slice Diagram .................................................................................................................................................... 13 
Figure 2.5. Primary Clocks for MachXO3L/F Devices .......................................................................................................... 16 
Figure 2.6. Secondary High Fanout Nets for MachXO3L/F Devices .................................................................................... 17 
Figure 2.7. PLL Diagram ...................................................................................................................................................... 18 
Figure 2.8. sysMEM Memory Primitives ............................................................................................................................. 21 
Figure 2.9. Memory Core Reset .......................................................................................................................................... 23 
Figure 2.10. EBR Asynchronous Reset (Including GSR) Timing Diagram ............................................................................. 23 
Figure 2.11. Group of Four Programmable I/O Cells .......................................................................................................... 25 
Figure 2.12. Output Register Block Diagram (PIO on the Left, Top and Bottom Edges) ..................................................... 27 
Figure 2.13. Input Gearbox ................................................................................................................................................. 28 
Figure 2.14. Output Gearbox .............................................................................................................................................. 30 
Figure 2.15. MachXO3L/LF-1300 in 256 Ball Packages, MachXO3L/LF-2100, MachXO3L/LF-4300, MachXO3L/LF-6900 and 
MachXO3L/LF-9400 Banks I/O Banks.................................................................................................................................. 33 
Figure 2.16. MachXO3L/LF-640 and MachXO3L/LF-1300 Banks ......................................................................................... 34 
Figure 2.17. Embedded Function Block Interface ............................................................................................................... 35 
Figure 2.18. I2C Core Block Diagram ................................................................................................................................... 36 
Figure 2.19. SPI Core Block Diagram ................................................................................................................................... 37 
Figure 2.20. Timer/Counter Block Diagram ........................................................................................................................ 38 
Figure 3.1. LVDS Using External Resistors (LVDS25E) ......................................................................................................... 51 
Figure 3.2. BLVDS Multi-point-Output Example ................................................................................................................. 52 
Figure 3.3. Differential LVPECL ........................................................................................................................................... 53 
Figure 3.4. MIPI D-PHY Input Using External Resistors ....................................................................................................... 54 
Figure 3.5. MIPI D-PHY Output Using External Resistors .................................................................................................... 55 
Figure 3.6.Receiver GDDR71_RX. Waveforms .................................................................................................................... 64 
Figure 3.7. Transmitter GDDR71_TX. Waveforms .............................................................................................................. 64 
Figure 3.8. JTAG Port Timing Waveforms ........................................................................................................................... 67 
Figure 3.9. Output Test Load, LVTTL and LVCMOS Standards ............................................................................................ 69 
 
Tables 
Table 1.1. MachXO3L/LF Family Selection Guide ................................................................................................................. 9 
Table 2.1. Resources and Modes Available per Slice .......................................................................................................... 12 
Table 2.2. Slice Signal Descriptions ..................................................................................................................................... 13 
Table 2.3. Number of Slices Required For Implementing Distributed RAM ....................................................................... 14 
Table 2.4. PLL Signal Descriptions ....................................................................................................................................... 19 
Table 2.5. sysMEM Block Configurations ............................................................................................................................ 20 
Table 2.6. EBR Signal Descriptions ...................................................................................................................................... 21 
Table 2.7. Programmable FIFO Flag Ranges ........................................................................................................................ 22 
Table 2.8. PIO Signal List ..................................................................................................................................................... 26 
Table 2.9. Input Gearbox Signal List .................................................................................................................................... 27 
Table 2.10. Output Gearbox Signal List ............................................................................................................................... 29 
Table 2.11. Supported Input Standards ............................................................................................................................... 32 
Table 2.12. Supported Output Standards ............................................................................................................................ 32 
Table 2.13. Available MCLK Frequencies ............................................................................................................................ 34 
Table 2.14. I2C Core Signal Description ............................................................................................................................... 36 
Table 2.15. SPI Core Signal Description .............................................................................................................................. 37 

  MachXO3 Family 
   Data Sheet 
© 2014-2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.  
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
FPGA-DS-02032-2.4    5 
Table 2.16. Timer/Counter Signal Description .................................................................................................................... 39 
Table 2.17. MachXO3L/LF Power Saving Features Description .......................................................................................... 40 
Table 3.1. Absolute Maximum Rating1, 2, 3 .......................................................................................................................... 44 
Table 3.2. Recommended Operating Conditions1 .............................................................................................................. 44 
Table 3.3. Power Supply Ramp Rates ................................................................................................................................. 44 
Table 3.4. Power-On Reset Voltage Levels ......................................................................................................................... 45 
Table 3.5. Hot Socketing Specifications .............................................................................................................................. 45 
Table 3.6. Programming/Erase Specifications .................................................................................................................... 45 
Table 3.7. DC Electrical Characteristics ............................................................................................................................... 46 
Table 3.8. Static Supply Current – C/E Devices1, 2, 3, 6 .......................................................................................................... 47 
Table 3.9. Programming and Erase Supply Current – C/E Devices1, 2, 3, 4 ............................................................................ 48 
Table 3.10. sysI/O Recommended Operating Conditions ................................................................................................... 49 
Table 3.11. sysI/O Single-Ended DC Electrical Charateristics1, 2 .......................................................................................... 50 
Table 3.12. LVDS ................................................................................................................................................................. 51 
Table 3.13. LVDS25E DC Conditions .................................................................................................................................... 52 
Table 3.14. BLVDS DC Condition ......................................................................................................................................... 53 
Table 3.15. LVPECL DC Conditions ...................................................................................................................................... 54 
Table 3.16. MIPI DC Conditions .......................................................................................................................................... 55 
Table 3.17. MIPI D-PHY Output DC Conditions ................................................................................................................... 56 
Table 3.18. Pin-to-Pin Performance (LVCMOS25 12 mA Drive) .......................................................................................... 57 
Table 3.19. Register-to-Register Performance ................................................................................................................... 57 
Table 3.20. Maximum sysI/O Buffer Performance ............................................................................................................. 58 
Table 3.21. MachXO3L/LF External Switching Characteristics – C/E Devices1, 2, 3, 4, 5, 6, 10 ................................................... 59 
Table 3.22. sysCLOCK PLL Timing ........................................................................................................................................ 65 
Table 3.23. NVCM/Flash Download Time ........................................................................................................................... 66 
Table 3.24. JTAG Port Timing Specifications ....................................................................................................................... 66 
Table 3.25. sysCONFIG Port Timing Specifications ............................................................................................................. 68 
Table 3.26. I2C Port Timing Specification ............................................................................................................................ 69 
Table 3.27. SPI Port Timing Specifications .......................................................................................................................... 69 
Table 3.28. Test Fixture Required Components, Non-Terminated Interfaces .................................................................... 69 
Table 4.1. Signal Descriptions ............................................................................................................................................. 70 
Table 4.2. MachXO3L/LF-640 and MachXO3L/LF-1300 ...................................................................................................... 72 
Table 4.3. MachXO3L/LF-2100 ............................................................................................................................................ 73 
Table 4.4. MachXO3L/LF-4300 ............................................................................................................................................ 74 
Table 4.5. MachXO3L/LF-6900 ............................................................................................................................................ 75 
Table 4.6. MachXO3L/LF-9400C.......................................................................................................................................... 76 
 

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

6 FPGA-DS-02032-2.4

Acronyms in This Document

A list of acronyms used in this document.

Acronym

Definition

AES

Advanced Encryption Standard

BGA

Ball Grid Array

CMOS

Complementary Metal Oxide Semiconductor

EBR

Embedded Block RAM

ECDSA

Elliptic Curve Digital Signature Algorithm

ECLK

Edge Clock

ESB

Embedded Security Block

I2C

Inter-Integrated Circuit

LUT

Look-Up Table

LVCMOS

Low-Voltage CMOS

PCLK

Primary Clock

PFU

Programmable Functional Unit

PLL

Phase Locked Loop

SHA

Secure Hash Algorithm

SPI

Serial Peripheral Interface

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 7

1. Introduction

MachXO3™ device family is an Ultra-Low Density

family that supports the most advanced programmable

bridging and I/O expansion. It has the breakthrough

I/O density and the lowest cost per I/O. The device I/O

features have the integrated support for latest industry

standard I/O.

The MachXO3L/LF family of low power, instant-on,

non-volatile PLDs has five devices with densities

ranging from 640 to 9400 Look-Up Tables (LUTs). In

addition to LUT-based, low-cost programmable logic

these devices feature Embedded Block RAM (EBR),

Distributed RAM, Phase Locked Loops (PLLs),

pre-engineered source synchronous I/O support,

advanced configuration support including dual-boot

capability and hardened versions of commonly used

functions such as SPI controller, I2C controller and

timer/counter. MachXO3LF devices also support User

Flash Memory (UFM). These features allow these

devices to be used in low cost, high volume consumer

and system applications.

The MachXO3L/LF devices are designed on a 65nm

non-volatile low power process. The device

architecture has several features such as

programmable low swing differential I/Os and the

ability to turn off I/O banks, on-chip PLLs and

oscillators dynamically. These features help manage

static and dynamic power consumption resulting in low

static power for all members of the family.

The MachXO3L/LF devices are available in two versions

C and E with two speed grades: -5 and -6, with -6 being

the fastest. C devices have an internal linear voltage

regulator which supports external VCC supply voltages

of 3.3 V or 2.5 V. E devices only accept 1.2 V as the

external VCC supply voltage. With the exception of

power supply voltage both C and E are functionally

compatible with each other.

The MachXO3L/LF PLDs are available in a broad range

of advanced halogen-free packages ranging from the

space saving 2.5 x 2.5 mm WLCSP to the 19 x 19 mm

caBGA. MachXO3L/LF devices support density

migration within the same package. Table 1.1 shows

the LUT densities, package and I/O options, along with

other key parameters.

The MachXO3L/LF devices offer enhanced I/O features

such as drive strength control, slew rate control, PCI

compatibility, bus-keeper latches, pull-up resistors,

pull-down resistors, open drain outputs and hot

socketing. Pull-up, pull-down and bus-keeper features

are controllable on a “per-pin” basis. A user-

programmable internal oscillator is included in

MachXO3L/LF devices. The clock output from this

oscillator may be divided by the timer/counter for use

as clock input in functions such as LED control,

keyboard scanner and similar state machines.

The MachXO3L/LF devices also provide flexible,

reliable and secure configuration from on-chip

NVCM/Flash. These devices can also configure

themselves from external SPI Flash or be configured by

an external master through the JTAG test access port

or through the I2C port. Additionally, MachXO3L/LF

devices support dual-boot capability (using external

Flash memory) and remote field upgrade (TransFR)

capability.

Lattice provides a variety of design tools that allow

complex designs to be efficiently implemented using

the MachXO3L/LF family of devices. Popular logic

synthesis tools provide synthesis library support for

MachXO3L/LF. Lattice design tools use the synthesis

tool output along with the user-specified preferences

and constraints to place and route the design in the

MachXO3L/LF device. These tools extract the timing

from the routing and back-annotate it into the design

for timing verification.

Lattice provides many pre-engineered IP (Intellectual

Property) LatticeCORE™ modules, including a number

of reference designs licensed free of charge, optimized

for the MachXO3L/LF PLD family. By using these

configurable soft core IP cores as standardized blocks,

users are free to concentrate on the unique aspects of

their design, increasing their productivity.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

8 FPGA-DS-02032-2.4

1.1. Features

1.1.1. Solutions

 Smallest footprint, lowest power, high data

throughput bridging solutions for mobile

applications

 Optimized footprint, logic density, I/O count, I/O

performance devices for I/O management and

logic applications

 High I/O logic, lowest cost I/O, high I/O devices

for I/O expansion applications

1.1.2. Flexible Architecture

 Logic Density ranging from 64 to 9.4K LUT4

 High I/O to LUT ratio with up to 384 I/O pins

1.1.3. Advanced Packaging

 0.4 mm pitch: 1K to 4K densities in very small

footprint WLCSP (2.5 mm × 2.5 mm to 3.8 mm ×

3.8 mm) with 28 to 63 I/Os

 0.5 mm pitch: 640 to 9.4K LUT densities in 6 mm x

6 mm to 10 mm x 10 mm BGA packages with up

to 281 I/Os

 0.8 mm pitch: 1K to 9.4K densities with up to 384

I/Os in BGA packages

1.1.4. Pre-Engineered Source Synchronous

I/O

 DDR registers in I/O cells

 Dedicated gearing logic

 7:1 Gearing for Display I/Os

 Generic DDR, DDRx2, DDRx4

1.1.5. High Performance, Flexible I/O Buffer

 Programmable sysI/O™ buffer supports wide

range of interfaces:

 LVCMOS 3.3/2.5/1.8/1.5/1.2

 LVTTL

 LVDS, Bus-LVDS, MLVDS, LVPECL

 MIPI D-PHY Emulated

 Schmitt trigger inputs, up to 0.5 V hysteresis

 Ideal for I/O bridging applications

 I/Os support hot socketing

 On-chip differential termination

 Programmable pull-up or pull-down mode

1.1.6. Flexible On-Chip Clocking

 Eight primary clocks

 Up to two edge clocks for high-speed I/O

interfaces (top and bottom sides only)

 Up to two analog PLLs per device with fractional-

n frequency synthesis

 Wide input frequency range (7 MHz to

400 MHz).

1.1.7. Non-volatile, Multi-time

Programmable

 Instant-on

 Powers up in microseconds

 Optional dual boot with external SPI memory

 Single-chip, secure solution

 Programmable through JTAG, SPI or I2C

 MachXO3L includes multi-time programmable

NVCM

 MachXO3LF reconfigurable Flash includes

100,000 write/erase cycle

 Supports background programming of

non-volatile memory

1.1.8. TransFR Reconfiguration

 In-field logic update while I/O holds the system

state

1.1.9. Enhanced System Level Support

 On-chip hardened functions: SPI, I2C,

timer/counter

 On-chip oscillator with 5.5% accuracy

 Unique TraceID for system tracking

 Single power supply with extended operating

range

 IEEE Standard 1149.1 boundary scan

 IEEE 1532 compliant in-system programming

1.1.10. Applications

 Consumer Electronics

 Compute and Storage

 Wireless Communications

 Industrial Control Systems

 Automotive System

1.1.11. Low Cost Migration Path

 Migration from the Flash based MachXO3LF to

the NVCM based MachXO3L

 Pin compatible and equivalent timing

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 9

Table 1.1. MachXO3L/LF Family Selection Guide

Features

MachXO3L-

640/

MachXO3LF-

640

MachXO3L-

1300/

MachXO3LF-

1300

MachXO3L-

2100/

MachXO3LF-

2100

MachXO3L-

4300/

MachXO3LF-

4300

MachXO3L-

6900/

MachXO3LF-

6900

MachXO3L-

9400/

MachXO3LF-

9400

LUTs

640

1300

2100

4300

69004

94004

Distributed RAM (kb)

EBR SRAM (kb)

240

432

UFM (kb, MachXO3LF

only)

256

448

Device

Options

—

Yes

Number of PLLs

Hardened

Functions

I2C

SPI

Timer/

Counter

Oscillator

MIPI D-PHY Support

Yes

Multi Time

Programmable NVCM

MachXO3L-640

MachXO3L-1300

MachXO3L-

2100

MachXO3L-

4300

MachXO3L-

6900

MachXO3L-

9400

Programmable Flash

MachXO3LF-640

MachXO3LF-

1300

MachXO3LF-

2100

MachXO3LF-

4300

MachXO3LF-

6900

MachXO3LF-

9400

Packages

I/O

36-ball WLCSP1

(2.5 mm x 2.5 mm, 0.4 mm)

49-ball WLCSP1

(3.2 mm x 3.2 mm, 0.4 mm)

81-ball WLCSP1

(3.8 mm x 3.8 mm, 0.4 mm)

121-ball csfBGA1

(6 mm x 6 mm, 0.5 mm)

100

256-ball csfBGA1

(9 mm x 9 mm, 0.5 mm)

206

324-ball csfBGA1

(10 mm x 10 mm, 0.5 mm)

268

281

256-ball caBGA

(14 mm x 14 mm, 0.8 mm)

2062

2063

324-ball caBGA2

(15 mm x 15 mm, 0.8 mm)

279

400-ball caBGA

(17 mm x 17 mm, 0.8 mm)

3352

3353

484-ball caBGA

(19 mm x 19 mm, 0.8 mm)

3843

Notes:

1. Package is only available for E=1.2 V devices.

2. Package is only available for C=2.5 V/3.3 V devices in 6900 LUT and smaller densities. (Both C and E variants are available for

9400 LUT devices).

3. Package is available for both E=1.2 V and C=2.5 V/3.3 V devices.

4. Refer to Power and Thermal Estimation and Management for MachXO3 Devices (TN1289) for determination of safe ambient

operating conditions.

5. High Performance with regulator – VCC = 2.5 V/3.3 V.

6. High Performance without regulator – VCC = 1.2 V.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

10 FPGA-DS-02032-2.4

2. Architecture

2.1. Architecture Overview

The MachXO3L/LF family architecture contains an array of logic blocks surrounded by Programmable I/O (PIO). All logic

density devices in this family have sysCLOCK™ PLLs and blocks of sysMEM Embedded Block RAM (EBRs). Figure 2.1 and

Figure 2.2 show the block diagrams of the various family members.

sysCLOCK PLL

Configuration

Flash 1/2

PIOs Arranged into

sysI/O Banks

Programmable Function Units

with Distributed RAM (PFUs)

sysMEM Embedded

Block RAM (EBR)

UFM/User Key

Embedded Function Block (EFB)

Embedded Security Block

Figure 2.1. Top View of the MachXO3L/LF-1300 Device

Notes:

 MachXO3L/LF-640 is similar to MachXO3L/LF-1300. MachXO3L/LF-640 has a lower LUT count.

 MachXO3L devices have NVCM, MachXO3LF devices have Flash.

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 11

Embedded

Function Block (EFB)

NVCM1/UFM

sysMEM Embedded

Block (EBR)

Programmable Function Units

with Distributed RAM (PFUs)

sysCLOCK PLL

Configuration

NVCM0/Flash

PIOs Arranged Into

sysIO Banks

Notes:

MachXO3L/LF-1300, MachXO3L/LF-2100, MachXO3L/LF-6900 and MachXO3L/LF-9400 are similar to MachXO3L/LF-4300. MachXO3L/LF-1300 has

a lower LUT count, one PLL, and seven EBR blocks. MachXO3L/LF-2100 has a lower LUT count, one PLL, and eight EBR blocks.

MachXO3L/LF-6900 has a higher LUT count, two PLLs, and 26 EBR blocks. MachXO3L/LF-9400 has a higher LUT count, two PLLs, and 48 E blocks.

MachXO3L devices have NVCM, MachXO3LF devices have Flash.

Figure 2.2. Top View of the MachXO3L/LF-4300 Device

The logic blocks, Programmable Functional Unit (PFU) and sysMEM EBR blocks, are arranged in a two-dimensional grid

with rows and columns. Each row has either the logic blocks or the EBR blocks. The PIO cells are located at the

periphery of the device, arranged in banks. The PFU contains the building blocks for logic, arithmetic, RAM, ROM, and

variety of interface standards. The blocks are connected with many vertical and horizontal routing channel resources.

The place and route software tool automatically allocates these routing resources.

In the MachXO3L/LF family, the number of sysI/O banks varies by device. There are different types of I/O buffers on the

different banks. Refer to the details in later sections of this document. The sysMEM EBRs are large, dedicated fast

memory blocks. These blocks can be configured as RAM, ROM or FIFO. FIFO support includes dedicated FIFO pointer

and flag “hard” control logic to minimize LUT usage.

The MachXO3L/LF registers in PFU and sysI/O can be configured to be SET or RESET. After power up and device is

configured, the device enters into user mode with these registers SET/RESET according to the configuration set-ting,

allowing device entering to a known state for predictable system function.

The MachXO3L/LF architecture also provides up to two sysCLOCK Phase Locked Loop (PLL) blocks. These blocks are

located at the ends of the on-chip NVCM/Flash block. The PLLs have multiply, divide, and phase shifting capabilities

that are used to manage the frequency and phase relationships of the clocks.

MachXO3L/LF devices provide commonly used hardened functions such as SPI controller, I2C controller and timer/

counter.

MachXO3LF devices also provide User Flash Memory (UFM). These hardened functions and the UFM interface to the

core logic and routing through a WISHBONE interface. The UFM can also be accessed through the SPI, I2C and JTAG

ports.

Every device in the family has a JTAG port that supports programming and configuration of the device as well as access

to the user logic. The MachXO3L/LF devices are available for operation from 3.3 V, 2.5 V and 1.2 V power supplies,

providing easy integration into the overall system.

MachXO3 Family

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12 FPGA-DS-02032-2.4

2.2. PFU Blocks

The core of the MachXO3L/LF device consists of PFU blocks, which can be programmed to perform logic, arithmetic,

distributed RAM and distributed ROM functions. Each PFU block consists of four interconnected slices numbered 0 to 3

as shown in Figure 2.3. Each slice contains two LUTs and two registers. There are 53 inputs and 25 outputs associated

with each PFU block.

FCO

FCIN

From

Routing

FF/

Latch

FF/

Latch

FF/

Latch

FF/

Latch

FF/

Latch

FF/

Latch

Slice 2

Slice 1

Slice 0 Slice 3

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

LUT4 &

CARRY

FF/

Latch

FF/

Latch

Figure 2.3. PFU Block Diagram

2.2.1. Slices

Slices 0-3 contain two LUT4s feeding two registers. Slices 0-2 can be configured as distributed memory. Table 2.1 shows

the capability of the slices in PFU blocks along with the operation modes they enable. In addition, each PFU contains

logic that allows the LUTs to be combined to perform functions such as LUT5, LUT6, LUT7 and LUT8. The control logic

performs set/reset functions (programmable as synchronous/ asynchronous), clock select, chip select and wider

RAM/ROM functions.

Table 2.1. Resources and Modes Available per Slice

Slice

PFU Block

Resources

Modes

Slice 0

2 LUT4s and 2 Registers

Logic, Ripple, RAM, ROM

Slice 1

2 LUT4s and 2 Registers

Logic, Ripple, RAM, ROM

Slice 2

2 LUT4s and 2 Registers

Logic, Ripple, RAM, ROM

Slice 3

2 LUT4s and 2 Registers

Logic, Ripple, ROM

Figure 2.4 shows an overview of the internal logic of the slice. The registers in the slice can be configured for positive/

negative and edge triggered or level sensitive clocks. All slices have 15 inputs from routing and one from the carry-

chain (from the adjacent slice or PFU). There are seven outputs: six for routing and one to carry-chain (to the adjacent

PFU). Table 2.2 lists the signals associated with Slices 0-3.

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FPGA-DS-02032-2.4 13

Figure 2.4. Slice Diagram

Table 2.2. Slice Signal Descriptions

Function

Type

Signal Names

Description

Input

Data signal

A0, B0, C0, D0

Inputs to LUT4

Input

Data signal

A1, B1, C1, D1

Inputs to LUT4

Input

Multi-purpose

M0/M1

Multi-purpose input

Input

Control signal

Clock enable

Input

Control signal

LSR

Local set/reset

Input

Control signal

CLK

System clock

Input

Inter-PFU signal

FCIN

Fast carry in1

Output

Data signals

F0, F1

LUT4 output register bypass signals

Output

Data signals

Q0, Q1

Output

Data signals

OFX0

Output of a LUT5 MUX

Output

Data signals

OFX1

Output of a LUT6, LUT7, LUT82 MUX depending on the slice

Output

Inter-PFU signal

FCO

Fast carry out1

Notes:

1. See Figure 2.3 for connection details.

2. Requires two PFUs.

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14 FPGA-DS-02032-2.4

2.2.2. Modes of Operation

Each slice has up to four potential modes of operation: Logic, Ripple, RAM and ROM.

2.2.2.1. Logic Mode

In this mode, the LUTs in each slice are configured as 4-input combinatorial lookup tables. A LUT4 can have 16 possible

input combinations. Any four input logic functions can be generated by programming this lookup table. Since there are

two LUT4s per slice, a LUT5 can be constructed within one slice. Larger look-up tables such as LUT6, LUT7 and LUT8 can

be constructed by concatenating other slices. Note LUT8 requires more than four slices.

2.2.2.2. Ripple Mode

Ripple mode supports the efficient implementation of small arithmetic functions. In Ripple mode, the following

functions can be implemented by each slice:

 Addition 2-bit

 Subtraction 2-bit

 Add/subtract 2-bit using dynamic control

 Up counter 2-bit

 Down counter 2-bit

 Up/down counter with asynchronous clear

 Up/down counter with preload (sync)

 Ripple mode multiplier building block

 Multiplier support

 Comparator functions of A and B inputs

 A greater-than-or-equal-to B

 A not-equal-to B

 A less-than-or-equal-to B

Ripple mode includes an optional configuration that performs arithmetic using fast carry chain methods. In this

configuration (also referred to as CCU2 mode) two additional signals, Carry Generate and Carry Propagate, are

generated on a per-slice basis to allow fast arithmetic functions to be constructed by concatenating slices.

2.2.3. RAM Mode

In this mode, a 16x4-bit distributed single port RAM (SPR) can be constructed by using each LUT block in Slice 0 and Slice

1 as a 16x1-bit memory. Slice 2 is used to provide memory address and control signals.

MachXO3L/LF devices support distributed memory initialization.

The Lattice design tools support the creation of a variety of different size memories. Where appropriate, the software

will construct these using distributed memory primitives that represent the capabilities of the PFU. Table 2.3 shows the

number of slices required to implement different distributed RAM primitives. For more information about using RAM in

MachXO3L/LF devices, please see Memory Usage Guide for MachXO3 Devices (TN1290).

Table 2.3. Number of Slices Required For Implementing Distributed RAM

SPR 16 x 4

PDPR 16 x 4

Number of slices

Note: SPR = Single Pot RAM, PDPR = Pseudo Dual Port RAM

2.2.4. ROM Mode

ROM mode uses the LUT logic; hence, slices 0-3 can be used in ROM mode. Preloading is accomplished through the

programming interface during PFU configuration.

For more information on the RAM and ROM modes, please refer to Memory Usage Guide for MachXO3 Devices

(TN1290).

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FPGA-DS-02032-2.4 15

2.3. Routing

There are many resources provided in the MachXO3L/LF devices to route signals individually or as buses with related

control signals. The routing resources consist of switching circuitry, buffers and metal interconnect (routing) segments.

The inter-PFU connections are made with three different types of routing resources: x1 (spans two PFUs), x2 (spans

three PFUs) and x6 (spans seven PFUs). The x1, x2, and x6 connections provide fast and efficient connections in the

horizontal and vertical directions.

The design tools take the output of the synthesis tool and places and routes the design. Generally, the place and route

tool is completely automatic, although an interactive routing editor is available to optimize the design.

2.4. Clock/Control Distribution Network

Each MachXO3L/LF device has eight clock inputs (PCLK [T, C] [Banknum]_[2..0]) – three pins on the left side, two pins

each on the bottom and top sides and one pin on the right side. These clock inputs drive the clock nets. These eight

inputs can be differential or single-ended and may be used as general purpose I/O if they are not used to drive the

clock nets. When using a single ended clock input, only the PCLKT input can drive the clock tree directly.

The MachXO3L/LF architecture has three types of clocking resources: edge clocks, primary clocks and secondary high

fanout nets. MachXO3L/LF devices have two edge clocks each on the top and bottom edges. Edge clocks are used to

clock I/O registers and have low injection time and skew. Edge clock inputs are from PLL outputs, primary clock pads,

edge clock bridge outputs and CIB sources.

The eight primary clock lines in the primary clock network drive throughout the entire device and can provide clocks for

all resources within the device including PFUs, EBRs and PICs. In addition to the primary clock signals, MachXO3L/LF

devices also have eight secondary high fanout signals which can be used for global control signals, such as clock

enables, synchronous or asynchronous clears, presets, output enables, etc. Internal logic can drive the global clock

network for internally-generated global clocks and control signals.

The maximum frequency for the primary clock network is shown in the MachXO3L/LF External Switching Characteristics

table.

Primary clock signals for the MachXO3L/LF-1300 and larger devices are generated from eight 27:1 muxes The available

clock sources include eight I/O sources, 11 routing inputs, eight clock divider inputs and up to eight sysCLOCK PLL

outputs.

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16 FPGA-DS-02032-2.4

Primary Clock 0

Primary Clock 1

Primary Clock 2

Primary Clock 3

Primary Clock 4

Primary Clock 5

Primary Clock 6

811 8

Dynamic

Clock

Enable

Dynamic

Clock

Enable

Dynamic

Clock

Enable

Dynamic

Clock

Enable

Dynamic

Clock

Enable

27:1

Up to 8

Dynamic

Clock

Enable

Dynamic

Clock

Enable

Dynamic

Clock

Enable

Clock

Switch

Figure 2.5. Primary Clocks for MachXO3L/F Devices

Eight secondary high fanout nets are generated from eight 8:1 muxes as shown in Figure 2.6. One of the eight inputs to

the secondary high fanout net input mux comes from dual function clock pins and the remaining seven come from

internal routing. The maximum frequency for the secondary clock network is shown in MachXO3L/LF External Switching

Characteristics table.

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FPGA-DS-02032-2.4 17

1 7

8:1

Clock Pads Routing

Fanout Net 0

Fanout Net 1

Fanout Net 2

Fanout Net 3

Fanout Net 4

Fanout Net 5

Fanout Net 6

Fanout Net 7

Secondary High

Figure 2.6. Secondary High Fanout Nets for MachXO3L/F Devices

2.4.1. sysCLOCK Phase Locked Loops (PLLs)

The sysCLOCK PLLs provide the ability to synthesize clock frequencies. All MachXO3L/LF devices have one or more

sysCLOCK PLL. CLKI is the reference frequency input to the PLL and its source can come from an external I/O pin or from

internal routing. CLKFB is the feedback signal to the PLL which can come from internal routing or an external I/O pin.

The feedback divider is used to multiply the reference frequency and thus synthesize a higher frequency clock output.

The MachXO3L/LF sysCLOCK PLLs support high resolution (16-bit) fractional-N synthesis. Fractional-N frequency

synthesis allows the user to generate an output clock which is a non-integer multiple of the input frequency. For more

information about using the PLL with Fractional-N synthesis, please see MachXO3 sysCLOCK PLL Design and Usage

Guide (TN1282).

Each output has its own output divider, thus allowing the PLL to generate different frequencies for each output. The

output dividers can have a value from 1 to 128. The output dividers may also be cascaded together to generate low

frequency clocks. The CLKOP, CLKOS, CLKOS2, and CLKOS3 outputs can all be used to drive the MachXO3L/LF clock

distribution network directly or general purpose routing resources can be used.

The LOCK signal is asserted when the PLL determines it has achieved lock and de-asserted if a loss of lock is detected. A

block diagram of the PLL is shown in Figure 2.7.

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18 FPGA-DS-02032-2.4

The setup and hold times of the device can be improved by programming a phase shift into the CLKOS, CLKOS2, and

CLKOS3 output clocks which will advance or delay the output clock with reference to the CLKOP output clock.

This phase shift can be either programmed during configuration or can be adjusted dynamically. In dynamic mode, the

PLL may lose lock after a phase adjustment on the output used as the feedback source and not relock until the tLOCK

parameter has been satisfied.

The MachXO3L/LF also has a feature that allows the user to select between two different reference clock sources

dynamically. This feature is implemented using the PLLREFCS primitive. The timing parameters for the PLL are shown in

the sysCLOCK PLL Timing table.

The MachXO3L/LF PLL contains a WISHBONE port feature that allows the PLL settings, including divider values, to be

dynamically changed from the user logic. When using this feature the EFB block must also be instantiated in the design

to allow access to the WISHBONE ports. Similar to the dynamic phase adjustment, when PLL settings are updated

through the WISHBONE port the PLL may lose lock and not relock until the tLOCK parameter has been satisfied. The

timing parameters for the PLL are shown in the sysCLOCK PLL Timing table.

For more details on the PLL and the WISHBONE interface, see MachXO3 sysCLOCK PLL Design and Usage Guide

(TN1282).

CLKOP, CLKOS, CLKOS2, CLKOS3

REFCLK

Internal Feedback

FBKSEL

CLKOP

CLKOS

CLKOS2

CLKOS3

REFCLK

Divider

M (1 - 40)

LOCK

ENCLKOP, ENCLKOS, ENCLKOS2, ENCLKOS3

RST, RESETM, RESETC, RESETD

CLKFB

CLKI

Dynamic

Phase

Adjust

PHASESEL[1:0]

PHASEDIR

PHASESTEP

FBKCLK

Divider

N (1 - 40)

Fractional-N

Synthesizer

Phase detector,

VCO, and

loop filter.

CLKOS3

Divider

(1 - 128)

CLKOS2

Divider

(1 - 128)

Phase

Adjust

Phase

Adjust

Phase

Adjust/

Edge Trim

CLKOS

Divider

(1 - 128)

CLKOP

Divider

(1 - 128)

Lock

Detect

ClkEn

Synch

ClkEn

Synch

ClkEn

Synch

ClkEn

Synch

PLLDATO[7:0] , PLLACK

PLLCLK, PLLRST, PLLSTB, PLLWE, PLLDATI[7:0], PLLADDR[4:0]

D0 D1

Mux

DPHSRC

Phase

Adjust/

Edge Trim

STDBY

Figure 2.7. PLL Diagram

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FPGA-DS-02032-2.4 19

Table 2.4 provides signal descriptions of the PLL block.

Table 2.4. PLL Signal Descriptions

Port Name

I/O

Description

CLKI

Input clock to PLL

CLKFB

Feedback clock

PHASESEL[1:0]

Select which output is affected by Dynamic Phase adjustment ports

PHASEDIR

Dynamic Phase adjustment direction

PHASESTEP

Dynamic Phase step – toggle shifts VCO phase adjust by one step.

CLKOP

Primary PLL output clock (with phase shift adjustment)

CLKOS

Secondary PLL output clock (with phase shift adjust)

CLKOS2

Secondary PLL output clock2 (with phase shift adjust)

CLKOS3

Secondary PLL output clock3 (with phrase shift adjust)

LOCK

PLL LOCK, asynchronous signal. Active high indicates PLL is locked to input and

feedback signals.

DPHSRC

Dynamic Phase source – ports or WISHBONE is active

STDBY

Standby signal to power down the PLL

RST

PLL reset without resetting the M-driver. Active high reset.

RESETM

PLL rest – includes resetting the M-divider. Active high reset.

RESETC

Reset for CLKOS2 output divider only. Active high reset.

RESETD

Reset for CLKOS3 output divider only. Active high reset.

ENCLKOP

Enable PLL output CLKOP

ENCLKOS

Enable PLL output CLKOS when port is active

ENCLKOS2

Enable PLL output CLKOS2 when port is active

ENCLKOS3

Enable PLL output CLKOS3 when port is active

PLLCLK

PLL data bus clock input signal

PLLRST

PLL data bus reset. This resets only the data bus not any register values.

PLLSTB

PLL data bus strobe signal

PLLWE

PLL data bus write enable signal

PLLADDR [4:0]

PLL data bus address

PLLDATI [7:0]

PLL data bus data input

PLLDATO [7:0]

PLL data bus data output

PLLACK

PLL data bus acknowledge signal

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20 FPGA-DS-02032-2.4

2.5. sysMEM Embedded Block RAM Memory

The MachXO3L/LF devices contain sysMEM Embedded Block RAMs (EBRs). The EBR consists of a 9-Kbit RAM, with

dedicated input and output registers. This memory can be used for a wide variety of purposes including data buffering,

PROM for the soft processor and FIFO.

2.5.1. sysMEM Memory Block

The sysMEM block can implement single port, dual port, pseudo dual port, or FIFO memories. Each block can be used in

a variety of depths and widths as shown in Table 2.5.

Table 2.5. sysMEM Block Configurations

Memory Mode

Configurations

Single Port

8,192 x 1

4,096 x 2

2,048 x 4

1,024 x 9

True Dual Port

8,192 x 1

4,096 x 2

2,048 x 4

1,024 x 9

Pseudo Dual Port

8,192 x 1

4,096 x 2

2,048 x 4

1,024 x 9

512 x 18

FIFO

8,192 x 1

4,096 x 2

2,048 x 4

1,024 x 9

512 x 18

2.5.2. Bus Size Matching

All of the multi-port memory modes support different widths on each of the ports. The RAM bits are mapped LSB word

0 to MSB word 0, LSB word 1 to MSB word 1, and so on. Although the word size and number of words for each port

varies, this mapping scheme applies to each port.

2.5.3. RAM Initialization and ROM Operation

If desired, the contents of the RAM can be pre-loaded during device configuration. EBR initialization data can be loaded

from the NVCM or Configuration Flash.

MachXO3LF EBR initialization data can also be loaded from the UFM. To maximize the number of UFM bits, initialize

the EBRs used in your design to an all-zero pattern. Initializing to an all-zero pattern does not use up UFM bits.

MachXO3LF devices have been designed such that multiple EBRs share the same initialization memory space if they are

initialized to the same pattern.

By preloading the RAM block during the chip configuration cycle and disabling the write controls, the sysMEM block

can also be utilized as a ROM.

2.5.4. Memory Cascading

Larger and deeper blocks of RAM can be created using EBR sysMEM Blocks. Typically, the Lattice design tools cascade

memory transparently, based on specific design inputs.

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FPGA-DS-02032-2.4 21

2.5.5. Single, Dual, Pseudo-Dual Port and FIFO Modes

Figure 2.8 shows the five basic memory configurations and their input/output names. In all the sysMEM RAM modes,

the input data and addresses for the ports are registered at the input of the memory array. The output data of the

memory is optionally registered at the memory array output.

DI[17:0]

CLKW

FIFO RAM

DO[17:0]

RST

FULLI

AFF

AEF

CLKR

CSR[1:0]

ORE

RPRST

CSW[1:0] EMPTYI

ROM

DO[17:0]

AD[12:0]

CLK

RST

CS[2:0]

OCE

EBR EBR

AD[12:0]

DI[8:0]

DO[8:0]

CLK

RST

CS[2:0]

OCE

Single-Port RAM

ADA[12:0]

DIA[8:0]

CLKA

CEA

RSTA

WEA

CSA[2:0]

DOA[8:0]

OCEA

ADB[12:0]

DI[8:0]

CLKB

CEB

RSTB

WEB

CSB[2:0]

DOB[8:0]

OCEB

True Dual Port RAM

ADW[8:0]

DI[17:0]

CLKW

CEW

RST

CSW[2:0]

ADR[12:0]

CLKR

CER

DO[17:0]

CSR[2:0]

OCER

BE[1:0]

Pseudo Dual Port RAM

EBREBREBR

Figure 2.8. sysMEM Memory Primitives

Table 2.6. EBR Signal Descriptions

Port Name

Description

Active State

CLK

Clock

Rising Clock Edge

Clock Enable

Active High

OCE1

Output Clock Enable

Active High

RST

Reset

Active High

BE1

Byte Enable

Active High

Write Enable

Active High

Address Bus

—

Data In

—

Data Out

—

Chip Select

Active High

AFF

FIFO RAM Almost Full Flag

—

FIFO RAM Full Flag

—

AEF

FIFO RAM Almost Empty Flag

—

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22 FPGA-DS-02032-2.4

Port Name

Description

Active State

FIFO RAM Empty Flag

—

RPRST

FIFO RAM Read Pointer Reset

—

Notes:

1. Optional signals.

2. For dual port EBR primitives a trailing ‘A’ or ‘B’ in the signal name specifies the EBR port A or port B respectively.

3. For FIFO RAM mode primitive, a trailing ‘R’ or ‘W’ in the signal name specifies the FIFO read port or write port respectively.

4. For FIFO RAM mode primitive FULLI has the same function as CSW(2) and EMPTYI has the same function as CSR(2).

5. In FIFO mode, CLKW is the write port clock, CSW is the write port chip select, CLKR is the read port clock, CSR is the read port

chip select, ORE is the output read enable.

The EBR memory supports three forms of write behavior for single or dual port operation:

 Normal – Data on the output appears only during the read cycle. During a write cycle, the data (at the current

address) does not appear on the output. This mode is supported for all data widths.

 Write Through – A copy of the input data appears at the output of the same port. This mode is supported for all

data widths.

 Read-Before-Write – When new data is being written, the old contents of the address appears at the output.

2.5.6. FIFO Configuration

The FIFO has a write port with data-in, CEW, WE and CLKW signals. There is a separate read port with data-out, RCE, RE

and CLKR signals. The FIFO internally generates Almost Full, Full, Almost Empty and Empty Flags. The Full and Almost

Full flags are registered with CLKW. The Empty and Almost Empty flags are registered with CLKR. Table 2.7 shows the

range of programming values for these flags.

Table 2.7. Programmable FIFO Flag Ranges

Flag Name

Programming Range

Full (FF)

1 to max (up to 2N-1)

Almost Full (AF)

1 to Full-1

Almost Empty (AE)

1 to Full-1

Empty (EF)

N = Address bit width.

The FIFO state machine supports two types of reset signals: RST and RPRST. The RST signal is a global reset that clears

the contents of the FIFO by resetting the read/write pointer and puts the FIFO flags in their initial reset state. The

RPRST signal is used to reset the read pointer. The purpose of this reset is to retransmit the data that is in the FIFO. In

these applications it is important to keep careful track of when a packet is written into or read from the FIFO.

2.5.7. Memory Core Reset

The memory core contains data output latches for ports A and B. These are simple latches that can be reset

synchronously or asynchronously. RSTA and RSTB are local signals, which reset the output latches associated with port

A and port B respectively. The Global Reset (GSRN) signal resets both ports. The output data latches and associated

resets for both ports are as shown in Figure 2.9.

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FPGA-DS-02032-2.4 23

Memory Core

Figure 2.9. Memory Core Reset

For further information on the sysMEM EBR block, please refer to Memory Usage Guide for MachXO3 Devices

(TN1290).

2.5.8. EBR Asynchronous Reset

EBR asynchronous reset or GSR (if used) can only be applied if all clock enables are low for a clock cycle before the

reset is applied and released a clock cycle after the reset is released, as shown in Figure 2.10. The GSR input to the EBR

is always asynchronous.

Reset

Clock

Enable

Figure 2.10. EBR Asynchronous Reset (Including GSR) Timing Diagram

If all clock enables remain enabled, the EBR asynchronous reset or GSR may only be applied and released after the EBR

read and write clock inputs are in a steady state condition for a minimum of 1/fMAX (EBR clock). The reset release must

adhere to the EBR synchronous reset setup time before the next active read or write clock edge.

If an EBR is pre-loaded during configuration, the GSR input must be disabled or the release of the GSR during device

wake up must occur before the release of the device I/Os becoming active.

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24 FPGA-DS-02032-2.4

These instructions apply to all EBR RAM, ROM and FIFO implementations. For the EBR FIFO mode, the GSR signal is

always enabled and the WE and RE signals act like the clock enable signals in Figure 2.10. The reset timing rules apply

to the RPReset input versus the RE input and the RST input versus the WE and RE inputs. Both RST and RPReset are

always asynchronous EBR inputs. For more details refer to Memory Usage Guide for MachXO3 Devices (TN1290).

Note that there are no reset restrictions if the EBR synchronous reset is used and the EBR GSR input is disabled.

2.6. Programmable I/O Cells (PIC)

The programmable logic associated with an I/O is called a PIO. The individual PIO are connected to their respective

sysI/O buffers and pads. On the MachXO3L/LF devices, the PIO cells are assembled into groups of four PIO cells called a

Programmable I/O Cell or PIC. The PICs are placed on all four sides of the device.

On all the MachXO3L/LF devices, two adjacent PIOs can be combined to provide a complementary output driver pair.

All PIO pairs can implement differential receivers. Half of the PIO pairs on the top edge of these devices can be

configured as true LVDS transmit pairs. The PIO pairs on the bottom edge of these devices have on-chip differential

termination and, in the MachXO3L/LF-9400 devices, also provide PCI support.

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 25

1 PIC

PIO A

Output Register

Block and

Tristate Register

Block

Input Register

Block

PIO B

PIO C

PIO D

Core Logic/

Routing Input

Gearbox

Output

Gearbox

Output Register

Block and

Tristate Register

Block

Input Register

Block

Output Register

Block and

Tristate Register

Block

Input Register

Block

Output Register

Block and

Tristate Register

Block

Input Register

Block

Figure 2.11. Group of Four Programmable I/O Cells

MachXO3 Family

Data Sheet

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26 FPGA-DS-02032-2.4

2.7. PIO

The PIO contains three blocks: an input register block, output register block and tri-state register block. These blocks contain

registers for operating in a variety of modes along with the necessary clock and selection logic.

Table 2.8. PIO Signal List

Pin Name

I/O Type

Description

Input

Clock Enable

Input

Pin input from sysI/O buffer

INDD

Output

INCK

Output

Clock input

Output

DDR positive edge input

Output

Registered input/DDR negative edge input

Input

Output signal from the core (SDR and DDR)

Input

Output signal from the core (DDR)

Input

Tri-state signal from the core

Output

Data output signals to sysI/O Buffer

Output

Tri-state output signals to sysI/O Buffer

SCLK

Input

System clock for input and output/tri-state blocks.

RST

Input

Local set reset signal

2.7.1. Input Register Block

The input register blocks for the PIOs on all edges contain delay elements and registers that can be used to condition

high-speed interface signals before they are passed to the device core.

2.7.1.1. Left, Top, Bottom Edges

Input signals are fed from the sysI/O buffer to the input register block (as signal D). If desired, the input signal can

bypass the register and delay elements and be used directly as a combinatorial signal (INDD), and a clock (INCK). If an

input delay is desired, users can select a fixed delay. I/Os on the bottom edge also have a dynamic delay, DEL[4:0]. The

delay, if selected, reduces input register hold time requirements when using a global clock. The input block allows two

modes of operation. In single data rate (SDR) the data is registered with the system clock (SCLK) by one of the registers

in the single data rate sync register block. In Generic DDR mode, two registers are used to sample the data on the

positive and negative edges of the system clock (SCLK) signal, creating two data streams.

2.7.2. Output Register Block

The output register block registers signals from the core of the device before they are passed to the sysI/O buffers.

2.7.2.1. Left, Top, Bottom Edges

In SDR mode, D0 feeds one of the flip-flops that then feeds the output. The flip-flop can be configured as a D-type

In DDR generic mode, D0 and D1 inputs are fed into registers on the positive edge of the clock. At the next falling edge

the registered D1 input is registered into the register Q1. A multiplexer running off the same clock is used to switch the

mux between the outputs of registers Q0 and Q1 that will then feed the output.

Figure 2.12 shows the output register block on the left, top and bottom edges.

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 27

Output path

Tri-state path

D1 DQ1

D/L Q

SCLK

D/L Q

Figure 2.12. Output Register Block Diagram (PIO on the Left, Top and Bottom Edges)

2.7.3. Tri-state Register Block

The tri-state register block registers tri-state control signals from the core of the device before they are passed to the

sysI/O buffers. The block contains a register for SDR operation. In SDR, TD input feeds one of the flip-flops that then

feeds the output.

2.8. Input Gearbox

Each PIC on the bottom edge has a built-in 1:8 input gearbox. Each of these input gearboxes may be programmed as a

1:7 de-serializer or as one IDDRX4 (1:8) gearbox or as two IDDRX2 (1:4) gearboxes. Table 2.9 shows the gearbox signals.

Table 2.9. Input Gearbox Signal List

Name

I/O Type

Description

Input

High-speed data input after programmable delay in PIO A input register block

ALIGNWD

Input

Data alignment signal from device core

SCLK

Input

Slow-speed system clock

ECLK[1:0]

Input

High-speed edge clock

RST

Input

Reset

Q[7:0]

Output

Low-speed data to device core:

Video RX(1:7): Q[6:0]

GDDRX4(1:8): Q[7:0]

GDDRX2(1:4)(IOL-A): Q4, Q5, Q6, Q7

GDDRX2(1:4)(IOL-C): Q0, Q1, Q2, Q3

These gearboxes have three stage pipeline registers. The first stage registers sample the high-speed input data by the high-speed

edge clock on its rising and falling edges. The second stage registers perform data alignment based on the control signals UPDATE

and SEL0 from the control block. The third stage pipeline registers pass the data to the device core synchronized to the low-speed

system clock. Figure 2.13 shows a block diagram of the input gearbox.

MachXO3 Family

Data Sheet

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28 FPGA-DS-02032-2.4

D Q

ECLK0/1 SCLK

Q21

Q0_

S0 D Q

D Q T2

T0 Q0

D Q

Q65

Q43

S4 D Q

D Q T6

D Q

cdn

D Q

cdn

D Q

Q54

Q_6

S5 D

DT3

D Q

Q10

Q32

S1 DT1

D Q

Q65

Q43

Q21

Q10

Q21

Q32

Q54

Q_6

Q54

Q32

SEL0

S7 D Q T7

D Q

UPDATE

Q_6

Figure 2.13. Input Gearbox

More information on the input gearbox is available in Implementing High-Speed Interfaces with MachXO3 Devices

(TN1281).

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 29

2.9. Output Gearbox

Each PIC on the top edge has a built-in 8:1 output gearbox. Each of these output gearboxes may be programmed as a

7:1 serializer or as one ODDRX4 (8:1) gearbox or as two ODDRX2 (4:1) gearboxes. Table 2.10 shows the gearbox signals.

Table 2.10. Output Gearbox Signal List

Name

I/O Type

Description

Output

High-speed data output

D[7:0]

Input

Low-speed data from device core

Video TX(7:1): D[6:0]

—

GDDRX4(8:1): D[7:0]

—

GDDRX2(4:1)(IOL-A): D[3:0]

—

GDDRX2(4:1)(IOL-C): D[7:4]

—

SCLK

Input

Slow-speed system clock

ECLK [1:0]

Input

High-speed edge clock

RST

Input

Reset

The gearboxes have three stage pipeline registers. The first stage registers sample the low-speed input data on the low-

speed system clock. The second stage registers transfer data from the low-speed clock registers to the high- speed

clock registers. The third stage pipeline registers controlled by high-speed edge clock shift and mux the high-speed data

out to the sysI/O buffer. Figure 2.14 shows the output gearbox block diagram.

MachXO3 Family

Data Sheet

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30 FPGA-DS-02032-2.4

GND

Figure 2.14. Output Gearbox

More information on the output gearbox is available in Implementing High-Speed Interfaces with MachXO3 Devices

(TN1281).

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 31

2.10. sysI/O Buffer

Each I/O is associated with a flexible buffer referred to as a sysI/O buffer. These buffers are arranged around the

periphery of the device in groups referred to as banks. The sysI/O buffers allow users to implement a wide variety of

standards that are found in today’s systems including LVCMOS, TTL, PCI (MachXO3L/LF-9400 devices only), LVDS, BLVDS,

MLVDS and LVPECL.

Each bank is capable of supporting multiple I/O standards. In the MachXO3L/LF devices, single-ended output buffers,

ratioed input buffers (LVTTL, LVCMOS and PCI), differential (LVDS) input buffers are powered using I/O supply voltage

(VCCIO). Each sysI/O bank has its own VCCIO.

MachXO3L/LF devices contain three types of sysI/O buffer pairs.

 Left and Right sysI/O Buffer Pairs

The sysI/O buffer pairs in the left and right banks of the device consist of two single-ended output drivers and two

single-ended input buffers (for ratioed inputs such as LVCMOS and LVTTL). The I/O pairs on the left and right of the

devices also have differential input buffers.

 Bottom sysI/O Buffer Pairs

The sysI/O buffer pairs in the bottom bank of the device consist of two single-ended output drivers and two single-

ended input buffers (for ratioed inputs such as LVCMOS and LVTTL). The I/O pairs on the bottom also have

differential input buffers. In the MachXO3L/LF-9400 devices, only the I/Os on the bottom banks have

programmable PCI clamps and differential input termination. The PCI clamp is enabled after VCC and VCCIO are at

valid operating levels and the device has been configured.

 Top sysI/O Buffer Pairs

The sysI/O buffer pairs in the top bank of the device consist of two single-ended output drivers and two

single-ended input buffers (for ratioed inputs such as LVCMOS and LVTTL). The I/O pairs on the top also have

differential I/O buffers. Half of the sysI/O buffer pairs on the top edge have true differential outputs. The sysI/O

buffer pair comprising of the A and B PIOs in every PIC on the top edge have a differential output driver.

2.10.1. Typical I/O Behavior during Power-up

The internal power-on-reset (POR) signal is deactivated when VCC and VCCIO0 have reached VPORUP level defined in the

Power-On-Reset Voltage table in the DC and Switching Characteristics section of this data sheet. After the POR signal is

deactivated, the FPGA core logic becomes active. It is the user’s responsibility to ensure that all VCCIO banks are active

with valid input logic levels to properly control the output logic states of all the I/O banks that are critical to the

application. The default configuration of the I/O pins in a blank device is tri-state with a weak pull-down to GND (some

pins such as PROGRAMN and the JTAG pins have weak pull-up to VCCIO as the default functionality). The I/O pins will

maintain the blank configuration until VCC and VCCIO (for I/O banks containing configuration I/Os) have reached VPORUP

levels at which time the I/Os will take on the user-configured settings only after a proper download/configuration.

There are various ways a user can ensure that there are no spurious signals on critical outputs as the device powers up.

These are discussed in more detail in MachXO3 sysIO Usage Guide (TN1280).

2.10.2. Supported Standards

The MachXO3L/LF sysI/O buffer supports both single-ended and differential standards. Single-ended standards can be

further subdivided into LVCMOS, LVTTL, and PCI. The buffer supports the LVTTL, PCI, LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V,

and 3.3 V standards. In the LVCMOS and LVTTL modes, the buffer has individually configurable options for drive

strength, bus maintenance (weak pull-up, weak pull-down, bus-keeper latch or none) and open drain. BLVDS, MLVDS

and LVPECL output emulation is supported on all devices. The MachXO3L/LF devices support on-chip LVDS output

buffers on approximately 50% of the I/Os on the top bank. Differential receivers for LVDS, BLVDS, MLVDS and LVPECL

are supported on all banks of MachXO3L/LF devices. PCI compatibility is supported in the bottom bank of the

MachXO3L/LF-9400 devices only. PCI support is provided by:

 Selecting the LVTTL33 buffer standard

 Enabling the clamp feature

 Setting 16 mA drive strength (PCI output only).

MachXO3 Family

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32 FPGA-DS-02032-2.4

Table 2.11 shows the I/O standards (together with their supply and reference voltages) supported by the MachXO3L/LF

devices. For further information on utilizing the sysI/O buffer to support a variety of standards please see MachXO3

sysIO Usage Guide (TN1280).

Table 2.11. Supported Input Standards

VCCIO (Typ.)

Input Standard

3.3 V

2.5 V

1.8 V

1.5 V

1.2 V

Single-Ended Interfaces

LVTTL

Yes

Yes2

—

LVCMOS33

Yes

Yes2

—

LVCMOS25

Yes2

Yes

Yes2

—

LVCMOS18

Yes2

Yes

Yes2

—

LVCMOS15

Yes2

Yes

Yes2

LVCMOS12

Yes2

Yes

PCI3

Yes

—

Differential Interfaces

LVDS

Yes

—

BLVDS, MLVDS, LVPECL, RSDS

Yes

—

MIPI1

Yes

—

LVTTLD

Yes

—

LVCMOS33D

Yes

—

LVCMOS25D

—

Yes

—

LVCMOS18D

—

Yes

—

Notes:

1. These interfaces can be emulated with external resistors in all devices.

2. Reduced functionality. Refer to MachXO3 sysIO Usage Guide (TN1280) for more details.

3. PCI input is supported for MachXO3L/LF-9400 devices, bottom bank 2 only. See the Supported Standards section.

Table 2.12. Supported Output Standards

Output Standard

VCCIO (Typ.)

Single-Ended Interfaces

LVTTL

3.3

LVCMOS33

3.3

LVCMOS25

2.5

LVCMOS18

1.8

LVCMOS15

1.5

LVCMOS12

1.2

LVCMOS33, Open Drain

—

LVCMOS25, Open Drain

—

LVCMOS18, Open Drain

—

LVCMOS15, Open Drain

—

LVCMOS12, Open Drain

—

PCI332

3.3

Differential Interfaces

LVDS1

2.5, 3.3

BLVDS, MLVDS, RSDS1

2.5

LVPECL1

3.3

MIPI1

2.5

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 33

Output Standard

VCCIO (Typ.)

LVTTLD

3.3

LVCMOS33D

3.3

LVCMOS25D

2.5

LVCMOS18D

1.8

Notes:

1. These interfaces can be emulated with external resistors in all devices.

2. PCI input is supported for MachXO3L/LF-9400 devices, bottom bank 2 only. See the Supported Standards section.

2.10.3. sysI/O Buffer Banks

The numbers of banks vary between the devices of this family. MachXO3L/LF-1300 in the 256 Ball packages and the

MachXO3L/LF-2100 and higher density devices have six I/O banks (one bank on the top, right and bottom side and

three banks on the left side). The MachXO3L/LF-1300 and lower density devices have four banks (one bank per side).

Figure 2.15 and Figure 2.16 show the sysI/O banks and their associated supplies for all devices.

Bank 0

Bank 2

VCCIO0

VCCIO2

VCCIO1

GND

VCCIO5

VCCIO4

VCCIO3

GND

Figure 2.15. MachXO3L/LF-1300 in 256 Ball Packages, MachXO3L/LF-2100, MachXO3L/LF-4300, MachXO3L/LF-6900

and MachXO3L/LF-9400 Banks I/O Banks

MachXO3 Family

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34 FPGA-DS-02032-2.4

Bank 0

Bank 2

VCCIO0

VCCIO2

GND

VCCIO1

GND

VCCIO3

GND

Figure 2.16. MachXO3L/LF-640 and MachXO3L/LF-1300 Banks

2.11. Hot Socketing

The MachXO3L/LF devices have been carefully designed to ensure predictable behavior during power-up and power-

down. Leakage into I/O pins is controlled to within specified limits. This allows for easy integration with the rest of the

system. These capabilities make the MachXO3L/LF ideal for many multiple power supply and hot-swap applications.

2.12. On-chip Oscillator

Every MachXO3L/LF device has an internal CMOS oscillator. The oscillator output can be routed as a clock to the clock

tree or as a reference clock to the sysCLOCK PLL using general routing resources. The oscillator frequency can be

divided by internal logic. There is a dedicated programming bit and a user input to enable/disable the oscillator. The

oscillator frequency ranges from 2.08 MHz to 133 MHz. The software default value of the Master Clock (MCLK) is

nominally 2.08 MHz. When a different MCLK is selected during the design process, the following sequence takes place:

Device powers up with a nominal MCLK frequency of 2.08 MHz.

During configuration, users select a different master clock frequency.

The MCLK frequency changes to the selected frequency once the clock configuration bits are received.

If the user does not select a master clock frequency, then the configuration bitstream defaults to the MCLK

frequency of 2.08 MHz.

Table 2.13 lists all the available MCLK frequencies.

Table 2.13. Available MCLK Frequencies

MCLK (MHz, Nominal)

2.08 (default)

9.17

33.25

2.46

10.23

3.17

13.3

44.33

4.29

14.78

53.2

5.54

20.46

66.5

26.6

88.67

8.31

29.56

133

MachXO3 Family

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FPGA-DS-02032-2.4 35

2.13. Embedded Hardened IP Functions

All MachXO3L/LF devices provide embedded hardened functions such as SPI, I2C and Timer/Counter. MachXO3LF

devices also provide User Flash Memory (UFM). These embedded blocks interface through the WISHBONE interface

with routing as shown in Figure 2.17.

Figure 2.17. Embedded Function Block Interface

2.13.1. Hardened I2C IP Core

Every MachXO3L/LF device contains two I2C IP cores. These are the primary and secondary I2C IP cores. Either of the

two cores can be configured either as an I2C master or as an I2C slave. The only difference between the two IP cores is

that the primary core has pre-assigned I/O pins whereas users can assign I/O pins for the secondary core.

When the IP core is configured as a master it will be able to control other devices on the I2C bus through the interface.

When the core is configured as the slave, the device will be able to provide I/O expansion to an I2C Master. The I2C

cores support the following functionality:

 Master and Slave operation

 7-bit and 10-bit addressing

 Multi-master arbitration support

 Up to 400 kHz data transfer speed

 General call support

 Interface to custom logic through 8-bit WISHBONE interface

MachXO3 Family

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36 FPGA-DS-02032-2.4

Figure 2.18. I2C Core Block Diagram

Table 2.14 describes the signals interfacing with the I2C cores.

Table 2.14. I2C Core Signal Description

Signal Name

I/O

Description

i2c_scl

Bi-directional

Bi-directional clock line of the I2C core. The signal is an output if the I2C core is in master

mode. The signal is an input if the I2C core is in slave mode. MUST be routed directly to the

pre-assigned I/O of the chip. Refer to the Pinout Information section of this document for

detailed pad and pin locations of I2C ports in each MachXO3L/LF device.

i2c_sda

Bi-directional

Bi-directional data line of the I2C core. The signal is an output when data is transmitted from

the I2C core. The signal is an input when data is received into the I2C core. MUST be routed

directly to the pre-assigned I/O of the chip. Refer to the Pinout Information section of this

document for detailed pad and pin locations of I2C ports in each MachXO3L/LF device.

i2c_irqo

Output

Interrupt request output signal of the I2C core. The intended usage of this signal is for it to be

connected to the WISHBONE master controller (i.e. a microcontroller or state machine) and

request an interrupt when a specific condition is met. These conditions are described with the

I2C register definitions.

cfg_wake

Output

Wake-up signal – To be connected only to the power module of the MachXO3L/LF device. The

signal is enabled only if the “Wakeup Enable” feature has been set within the EFB GUI, I2C

Tab.

cfg_stdby

Output

Stand-by signal – To be connected only to the power module of the MachXO3L/LF device. The

signal is enabled only if the “Wakeup Enable” feature has been set within the EFB GUI, I2C

Tab.

2.13.2. Hardened SPI IP Core

Every MachXO3L/LF device has a hard SPI IP core that can be configured as a SPI master or slave. When the IP core is

configured as a master it will be able to control other SPI enabled chips connected to the SPI bus. When the core is

configured as the slave, the device will be able to interface to an external SPI master. The SPI IP core on MachXO3L/LF

devices supports the following functions:

 Configurable Master and Slave modes

 Full-Duplex data transfer

 Mode fault error flag with CPU interrupt capability

 Double-buffered data register

 Serial clock with programmable polarity and phase

 LSB First or MSB First Data Transfer

 Interface to custom logic through 8-bit WISHBONE interface

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FPGA-DS-02032-2.4 37

There are some limitations on the use of the hardened user SPI. These are defined in the following technical notes:

 Minimizing System Interruption During Configuration Using TransFR Technology (TN1087) (Appendix B)

 Using Hardened Control Functions in MachXO3 Devices (TN1293)

EFB

SPI Function

Core

Logic/

Routing EFB

WISHBONE

Interface SPI

Registers Control

Logic

Configuration

Logic

MISO

MOSI

SCK

MCSN

SCSN

Figure 2.19. SPI Core Block Diagram

Table 2.15 describes the signals interfacing with the SPI cores.

Table 2.15. SPI Core Signal Description

Signal Name

I/O

Master/Slave

Description

spi_csn[0]

Master

SPI master chip-select output

spi_csn[1..7]

Master

Additional SPI chip-select outputs (total up to eight slaves)

spi_scsn

Slave

SPI slave chip-select input

spi_irq

Master/Slave

Interrupt request

spi_clk

I/O

Master/Slave

SPI clock. Output in master mode. Input in slave mode.

spi_miso

I/O

Master/Slave

SPI data. Input in master mode. Output in slave mode.

spi_mosi

I/O

Master/Slave

SPI data. Output in master mode. Input in slave mode.

Slave

Configuration Slave Chip Select (active low), dedicated for selecting the

Configuration Logic.

cfg_stdby

Master/Slave

Stand-by signal – To be connected only to the power module of the

MachXO3L/LF device. The signal is enabled only if the “Wakeup Enable” feature

has been set within the EFB GUI, SPI Tab.

cfg_wake

Master/Slave

Wake-up signal – To be connected only to the power module of the

MachXO3L/LF device. The signal is enabled only if the “Wakeup Enable” feature

has been set within the EFB GUI, SPI Tab.

MachXO3 Family

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38 FPGA-DS-02032-2.4

2.13.3. Hardened Timer/Counter

MachXO3L/LF devices provide a hard Timer/Counter IP core. This Timer/Counter is a general purpose, bidirectional,

16-bit timer/counter module with independent output compare units and PWM support. The Timer/Counter supports

the following functions:

 Supports the following modes of operation:

 Watchdog timer

 Clear timer on compare match

 Fast PWM

 Phase and Frequency Correct PWM

 Programmable clock input source

 Programmable input clock prescaler

 One static interrupt output to routing

 One wake-up interrupt to on-chip standby mode controller

 Three independent interrupt sources: overflow, output compare match, and input capture

 Auto reload

 Time-stamping support on the input capture unit

 Waveform generation on the output

 Glitch-free PWM waveform generation with variable PWM period

 Internal WISHBONE bus access to the control and status registers

 Stand-alone mode with preloaded control registers and direct reset input

Figure 2.20. Timer/Counter Block Diagram

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 39

Table 2.16. Timer/Counter Signal Description

Port

I/O

Description

tc_clki

Timer/Counter input clock signal

tc_rstn

tc_ic

Input capture trigger event, applicable for non-pwm modes with WISHBONE interface. If enabled,

a rising edge of this signal will be detected and synchronized to capture tc_cnt value into tc_icr

for time-stamping.

tc_int

Without WISHBONE – Can be used as overflow flag With WISHBONE – Controlled by three IRQ

registers

tc_oc

Timer counter output signal

For more details on these embedded functions, please refer to Using Hardened Control Functions in MachXO3 Devices

(TN1293).

2.14. User Flash Memory (UFM)

MachXO3LF devices provide a User Flash Memory block, which can be used for a variety of applications including

storing a portion of the configuration image, initializing EBRs, to store PROM data or, as a general purpose user Flash

memory. The UFM block connects to the device core through the embedded function block WISHBONE interface. Users

can also access the UFM block through the JTAG, I2C and SPI interfaces of the device. The UFM block offers the

following features:

 Non-volatile storage up to 448 kbits

 100K write/erase cycles

 Write access is performed page-wise; each page has 128 bits (16 bytes)

 Auto-increment addressing

 WISHBONE interface

For more information on the UFM, please refer to Using Hardened Control Functions in MachXO3 Devices (TN1293).

2.15. Standby Mode and Power Saving Options

MachXO3L/LF devices are available in two options, the C and E devices. The C devices have a built-in voltage regulator

to allow for 2.5 V VCC and 3.3 V VCC while the E devices operate at 1.2 V VCC.

MachXO3L/LF devices have been designed with features that allow users to meet the static and dynamic power

requirements of their applications by controlling various device subsystems such as the bandgap, power-on-reset

circuitry, I/O bank controllers, power guard, on-chip oscillator, PLLs, etc. In order to maximize power savings,

MachXO3L/LF devices support a low power Stand-by mode.

In the stand-by mode the MachXO3L/LF devices are powered on and configured. Internal logic, I/Os and memories are

switched on and remain operational, as the user logic waits for an external input. The device enters this mode when

the standby input of the standby controller is toggled or when an appropriate I2C or JTAG instruction is issued by an

external master. Various subsystems in the device such as the band gap, power-on-reset circuitry etc. can be

configured such that they are automatically turned “off” or go into a low power consumption state to save power when

the device enters this state. Note that the MachXO3L/LF devices are powered on when in standby mode and all power

supplies should remain in the Recommended Operating Conditions.

MachXO3 Family

Data Sheet

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40 FPGA-DS-02032-2.4

Table 2.17. MachXO3L/LF Power Saving Features Description

Device Subsystem

Feature Description

Bandgap

The bandgap can be turned off in standby mode. When the Bandgap is turned

off, analog circuitry such as the POR, PLLs, on-chip oscillator, and differential I/O

buffers are also turned off. Bandgap can only be turned off for 1.2 V devices.

Power-On-Reset (POR)

The POR can be turned off in standby mode. This monitors VCC levels. In the

event of unsafe VCC drops, this circuit reconfigures the device. When the POR

circuitry is turned off, limited power detector circuitry is still active. This option is

only recommended for applications in which the power supply rails are reliable.

On-Chip Oscillator

The on-chip oscillator has two power saving features. It may be switched off if it

is not needed in your design. It can also be turned off in Standby mode.

PLL

Similar to the on-chip oscillator, the PLL also has two power saving features. It

can be statically switched off if it is not needed in a design. It can also be turned

off in Standby mode. The PLL will wait until all output clocks from the PLL are

driven low before powering off.

I/O Bank Controller

Differential I/O buffers (used to implement standards such as LVDS) consume

more than ratioed single-ended I/Os such as LVCMOS and LVTTL. The I/O bank

controller allows the user to turn these I/Os off dynamically on a per bank

selection.

Dynamic Clock Enable for Primary Clock Nets

Each primary clock net can be dynamically disabled to save power.

Power Guard

Power Guard is a feature implemented in input buffers. This feature allows users

to switch off the input buffer when it is not needed. This feature can be used in

both clock and data paths. Its biggest impact is that in the standby mode it can

be used to switch off clock inputs that are distributed using general routing

resources.

For more details on the standby mode refer to Power and Thermal Estimation and Management for MachXO3 Devices

(TN1289).

2.16. Power On Reset

MachXO3L/LF devices have power-on reset circuitry to monitor VCCINT and VCCIO voltage levels during power-up and

operation. At power-up, the POR circuitry monitors VCCINT and VCCIO0 (controls configuration) voltage levels. It then

triggers download from the on-chip configuration NVCM/Flash memory after reaching the VPORUP level specified in

the Power-On-Reset Voltage table in the DC and Switching Characteristics section of this data sheet. For “E” devices

without voltage regulators, VCCINT is the same as the VCC supply voltage. For “C” devices with voltage regulators, VCCINT is

regulated from the VCC supply voltage. From this voltage reference, the time taken for configuration and entry into user

mode is specified as NVCM/Flash Download Time (tREFRESH) in the DC and Switching Characteristics section of this data

sheet. Before and during configuration, the I/Os are held in tri-state. I/Os are released to user functionality once the

device has finished configuration. Note that for “C” devices, a separate POR circuit monitors external VCC voltage in

addition to the POR circuit that monitors the internal post-regulated power supply voltage level.

Once the device enters into user mode, the POR circuitry can optionally continue to monitor VCCINT levels. If VCCINT drops

below VPORDNBG level (with the bandgap circuitry switched on) or below VPORDNSRAM level (with the bandgap circuitry

switched off to conserve power) device functionality cannot be guaranteed. In such a situation the POR issues a reset

and begins monitoring the VCCINT and VCCIO voltage levels. VPORDNBG and VPORDNSRAM are both specified in the

Power-On-Reset Voltage table in the DC and Switching Characteristics section of this data sheet.

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 41

Note that once an “E” device enters user mode, users can switch off the bandgap to conserve power. When the

bandgap circuitry is switched off, the POR circuitry also shuts down. The device is designed such that a minimal, low

power POR circuit is still operational (this corresponds to the VPORDNSRAM reset point described in the paragraph above).

However this circuit is not as accurate as the one that operates when the bandgap is switched on. The low power POR

circuit emulates an SRAM cell and is biased to trip before the vast majority of SRAM cells flip. If users are concerned

about the VCC supply dropping below VCC (min) they should not shut down the bandgap or POR circuit.

2.17. Configuration and Testing

This section describes the configuration and testing features of the MachXO3L/LF family.

2.17.1. IEEE 1149.1-Compliant Boundary Scan Testability

All MachXO3L/LF devices have boundary scan cells that are accessed through an IEEE 1149.1 compliant test access port

(TAP). This allows functional testing of the circuit board, on which the device is mounted, through a serial scan path

that can access all critical logic nodes. Internal registers are linked internally, allowing test data to be shifted in and

loaded directly onto test nodes, or test data to be captured and shifted out for verification. The test access port

consists of dedicated I/Os: TDI, TDO, TCK and TMS. The test access port shares its power supply with VCCIO Bank 0 and

can operate with LVCMOS3.3, 2.5, 1.8, 1.5, and 1.2 standards.

For more details on boundary scan test, see Boundary Scan Testability with Lattice sysIO Capability (AN8066) and

Minimizing System Interruption During Configuration Using TransFR Technology (TN1087).

2.17.2. Device Configuration

All MachXO3L/LF devices contain two ports that can be used for device configuration. The Test Access Port (TAP),

which supports bit-wide configuration and the sysCONFIG port which supports serial configuration through I2C or SPI.

The TAP supports both the IEEE Standard 1149.1 Boundary Scan specification and the IEEE Standard 1532 In-System

Configuration specification. There are various ways to configure a MachXO3L/LF device:

 Internal Flash Download

 JTAG

 Standard Serial Peripheral Interface (Master SPI mode) – interface to boot PROM memory

 System microprocessor to drive a serial slave SPI port (SSPI mode)

 Standard I2C Interface to system microprocessor

Upon power-up, the configuration SRAM is ready to be configured using the selected sysCONFIG port. Once a

configuration port is selected, it will remain active throughout that configuration cycle. The IEEE 1149.1 port can be

activated any time after power-up by sending the appropriate command through the TAP port. Optionally the de- vice

can run a CRC check upon entering the user mode. This will ensure that the device was configured correctly.

The sysCONFIG port has 10 dual-function pins which can be used as general purpose I/Os if they are not required for

configuration. See MachXO3 Programming and Configuration Usage Guide (TN1279) for more information about using

the dual-use pins as general purpose I/Os.

Lattice design software uses proprietary compression technology to compress bit-streams for use in MachXO3L/ LF

devices. Use of this technology allows Lattice to provide a lower cost solution. In the unlikely event that this technology

is unable to compress bitstreams to fit into the amount of on-chip NVCM/Flash, there are a variety of techniques that

can be utilized to allow the bitstream to fit in the on-chip NVCM/Flash. For more details, refer to MachXO3

Programming and Configuration Usage Guide (TN1279).

The Test Access Port (TAP) has five dual purpose pins (TDI, TDO, TMS, TCK and JTAGENB). These pins are dual function

pins - TDI, TDO, TMS and TCK can be used as general purpose I/O if desired. For more details, refer to MachXO3

Programming and Configuration Usage Guide (TN1279).

MachXO3 Family   
Data Sheet 
 
© 2014-2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.  
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
42    FPGA-DS-02032-2.4 
2.17.2.1. TransFR (Transparent Field Reconfiguration) 
TransFR is a unique Lattice technology that allows users to update their logic in the field without interrupting sys- tem 
operation using a simple push-button solution. For more details, refer to Minimizing System Interruption During 
Configuration Using TransFR Technology (TN1087) for details. 
2.17.2.2. Security and One-Time Programmable Mode (OTP) 
For applications where security is important, the lack of an external bitstream provides a solution that is inherently 
more secure than SRAM-based FPGAs. This is further enhanced by device locking. MachXO3L/LF devices contain 
security bits that, when set, prevent the readback of the SRAM configuration and NVCM/Flash spaces. The device can 
be in one of two modes: 
 Unlocked – Readback of the SRAM configuration and NVCM/Flash spaces is allowed. 
 Permanently Locked – The device is permanently locked. 
Once set, the only way to clear the security bits is to erase the device. To further complement the security of the 
device, a One Time Programmable (OTP) mode is available. Once the device is set in this mode it is not possible to 
erase or re-program the NVCM/Flash and SRAM OTP portions of the device. For more details, refer to MachXO3 
Programming and Configuration Usage Guide (TN1279). 
2.17.2.3. Password 
The MachXO3LF supports a password-based security access feature also known as Flash Protect Key. Optionally, the 
MachXO3L device can be ordered with a custom specification (c-spec) to support this feature. The Flash Protect Key 
feature provides a method of controlling access to the Configuration and Programming modes of the device. When 
enabled, the Configuration and Programming edit mode operations (including Write, Verify and Erase operations) are 
allowed only when coupled with a Flash Protect Key which matches that expected by the device. Without a valid Flash 
Protect Key, the user can perform only rudimentary non-configuration operations such as Read Device ID. For more 
details, refer to Using Password Security with MachXO3 Devices (TN1313).  
2.17.2.4. Dual Boot 
MachXO3L/LF devices can optionally boot from two patterns, a primary bitstream and a golden bitstream. If the 
primary bitstream is found to be corrupt while being downloaded into the SRAM, the device shall then automatically 
re-boot from the golden bitstream. Note that the primary bitstream must reside in the external SPI Flash. The golden 
image MUST reside in an on-chip NVCM/Flash. For more details, refer to MachXO3 Programming and Configuration 
Usage Guide (TN1279). 
2.17.2.5. Soft Error Detection 
The SED feature is a CRC check of the SRAM cells after the device is configured. This check ensures that the SRAM cells 
were configured successfully. This feature is enabled by a configuration bit option. The Soft Error Detection can also be 
initiated in user mode via an input to the fabric. The clock for the Soft Error Detection circuit is generated using a 
dedicated divider. The undivided clock from the on-chip oscillator is the input to this divider. For low power 
applications users can switch off the Soft Error Detection circuit. For more details, refer to MachXO3 Soft Error 
Detection Usage Guide (TN1292). 
2.17.2.6. Soft Error Correction 
The MachXO3LF device supports Soft Error Correction (SEC). Optionally, the MachXO3L device can be ordered with a 
custom specification (c-spec) to support this feature. When BACKGROUND_RECONFIG is enabled using the Lattice 
Diamond Software in a design, asserting the PROGRAMN pin or issuing the REFRESH sysConfig command refreshes the 
SRAM array from configuration memory. Only the detected error bit is corrected. No other SRAM cells are changed, 
allowing the user design to function uninterrupted. 

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 43

During the project design phase, if the overall system cannot guarantee containment of the error or its subsequent

effects on downstream data or control paths, Lattice recommends using SED only. The MachXO3 can be then be

soft-reset by asserting PROGRAMN or issuing the Refresh command over a sysConfig port in response to SED. Soft-reset

additionally erases the SRAM array prior to the SRAM refresh, and asserts internal Reset circuitry to guarantee a known

state. For more details, refer to MachXO3 Soft Error Detection (SED)/Correction (SEC) Usage Guide (TN1292).

2.18. TraceID

Each MachXO3L/LF device contains a unique (per device), TraceID that can be used for tracking purposes or for IP

security applications. The TraceID is 64 bits long. Eight out of 64 bits are user-programmable, the remaining 56 bits are

factory-programmed. The TraceID is accessible through the EFB WISHBONE interface and can also be accessed through

the SPI, I2C, or JTAG interfaces.

2.19. Density Shifting

The MachXO3L/LF family has been designed to enable density migration within the same package. Furthermore, the

architecture ensures a high success rate when performing design migration from lower density devices to higher

density devices. In many cases, it is also possible to shift a lower utilization design targeted for a high-density device to

a lower density device. However, the exact details of the final resource utilization will impact the likely success in each

case. When migrating from lower to higher density or higher to lower density, ensure to review all the power supplies

and NC pins of the chosen devices. For more details refer to the MachXO3 migration files.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

44 FPGA-DS-02032-2.4

3. DC and Switching Characteristics

3.1. Absolute Maximum Rating

Table 3.1. Absolute Maximum Rating1, 2, 3

MachXO3L/LF E (1.2 V)

MachXO3L/LF C (2.5 V/3.3 V)6

Supply Voltage VCC

–0.5 V to 1.32 V

–0.5 V to 3.75 V

Output Supply Voltage VCCIO

–0.5 V to 3.75 V

I/O Tri-state Voltage Applied4, 5

–0.5 V to 3.75 V

Dedicated Input Voltage Applied4

–0.5 V to 3.75 V

Storage Temperature (Ambient)

–55 °C to 125 °C

Junction Temperature (TJ)

–40 °C to 125 °C

Notes:

1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional

operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is

not implied.

2. Compliance with the Lattice Thermal Management document is required.

3. All voltages referenced to GND.

4. Overshoot and undershoot of –2 V to (VIHMAX + 2) volts is permitted for a duration of <20 ns.

5. The dual function I2C pins SCL and SDA are limited to –0.25 V to 3.75 V or to –0.3 V with a duration of <20 ns.

6. Refer to Power and Thermal Estimation and Management for MachXO3 Devices (TN1289) for determination of safe ambient

operating conditions.

3.2. Recommended Operating Conditions

Table 3.2. Recommended Operating Conditions1

Symbol

Parameter

Min.

Max.

Units

VCC1

Core Supply Voltage for 1.2 V Devices

1.14

1.26

Core Supply Voltage for 2.5 V/3.3 V Devices

2.375

3.465

VCCIO1, 2, 3

I/O Driver Supply Voltage

1.14

3.465

tJCOM

Junction Temperature Commercial Operation

°C

tJIND

Junction Temperature Industrial Operation

–40

100

°C

Notes:

1. Like power supplies must be tied together. For example, if VCCIO and VCC are both the same voltage, they must also be the same

supply.

2. See recommended voltages by I/O standard in subsequent table.

3. VCCIO pins of unused I/O banks should be connected to the VCC power supply on boards.

3.3. Power Supply Ramp Rates

Table 3.3. Power Supply Ramp Rates

Symbol

Parameter

Min.

Typ.

Max.

Units

tRAMP

Power supply ramp rates for all power supplies.

0.01

—

100

V/ms

Note: Assumes monotonic ramp rates.

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 45

3.4. Power-On-Reset Voltage Levels

Table 3.4. Power-On Reset Voltage Levels

Symbol

Parameter

Min.

Typ.

Max.

Units

VPORUP

Power-On-Reset ramp up trip point (band gap based circuit

monitoring VCCINT and VCCIO0)

0.9

—

1.06

VPORUPEXT

Power-On-Reset ramp up trip point (band gap based circuit

monitoring external VCC power supply)

1.5

—

2.1

VPORDNBG

Power-On-Reset ramp down trip point (band gap based circuit

monitoring VCCINT)

0.75

—

0.93

VPORDNBGEXT

Power-On-Reset ramp down trip point (band gap based circuit

monitoring VCC)

0.98

—

1.33

VPORDNSRAM

Power-On-Reset ramp down trip point (SRAM based circuit

monitoring VCCINT)

—

0.6

—

VPORDNSRAMEXT

Power-On-Reset ramp down trip point (SRAM based circuit

monitoring VCC)

—

0.96

—

Notes:

 These POR trip points are only provided for guidance. Device operation is only characterized for power supply voltages specified

under recommended operating conditions.

 For devices without voltage regulators VCCINT is the same as the VCC supply voltage. For devices with voltage regulators, VCCINT is

regulated from the VCC supply voltage.

 Note that VPORUP (min.) and VPORDNBG (max.) are in different process corners. For any given process corner VPORDNBG (max.) is

always 12.0 mV below VPORUP (min.).

 VPORUPEXT is for C devices only. In these devices, a separate POR circuit monitors the external VCC power supply.

 VCCIO0 does not have a Power-On-Reset ramp down trip point. VCCIO0 must remain within the Recommended Operating

Conditions to ensure proper operation.

3.5. Hot Socketing Specifications

Table 3.5. Hot Socketing Specifications

Symbol

Parameter

Condition

Max.

Units

IDK

Input or I/O leakage Current

0 < VIN < VIH (MAX)

± 1000

µA

Notes:

 Insensitive to sequence of VCC and VCCIO. However, assumes monotonic rise/fall rates for VCC and VCCIO.

 0 < VCC < VCC (MAX), 0 < VCCIO < VCCIO (MAX).

 IDK is additive to IPU, IPD or IBH.

3.6. Programming/Erase Specifications

Table 3.6. Programming/Erase Specifications

Symbol

Parameter

Min.

Max. 1

Units

NPROGCYC

Flash Programming cycles per tRETENTION

—

10,000

Cycles

Flash Write/Erase cycles2

—

100,000

tRETENTION

Data retention at 100 °C junction temperature

—

Years

Data retention at 85 °C junction temperature

—

Notes:

1. Maximum Flash memory reads are limited to 7.5E13 cycles over the lifetime of the product.

2. A Write/Erase cycle is defined as any number of writes over time followed by any erase cycle.

3.7. ESD Performance

Refer to the MachXO3/MachXO3LF Product Family Qualification Summary for complete qualification data, including

ESD performance.

MachXO3 Family

Data Sheet

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46 FPGA-DS-02032-2.4

3.8. DC Electrical Characteristics

Over recommended operating conditions.

Table 3.7. DC Electrical Characteristics

Symbol

Parameter

Condition

Min.

Typ.

Max.

Units

IIL, IIH1, 4

Input or I/O Leakage

Clamp OFF and VCCIO < VIN < VIH (MAX)

—

+175

µA

Clamp OFF and VIN = VCCIO

–10

—

µA

Clamp OFF and VCCIO - 0.97 V < VIN <

VCCIO

–175

—

µA

Clamp OFF and 0 V < VIN < VCCIO – 0.97 V

—

µA

Clamp OFF and VIN = GND

—

µA

Clamp ON and 0 V < VIN < VCCIO

—

µA

IPU

I/O Active Pull-up Current

0 < VIN < 0.7 VCCIO

–30

—

–309

µA

IPD

I/O Active Pull-down Current

VIL (MAX) < VIN < VCCIO

—

305

µA

IBHLS

Bus Hold Low sustaining current

VIN = VIL (MAX)

—

µA

IBHHS

Bus Hold High sustaining current

VIN = 0.7VCCIO

–30

—

µA

IBHLO

Bus Hold Low Overdrive current

0 ≤ VIN ≤ VCCIO

—

305

µA

IBHHO

Bus Hold High Overdrive current

0 ≤ VIN ≤ VCCIO

—

–309

µA

VBHT3

Bus Hold Trip Points

—

VIL (MAX)

—

VIH (MIN)

I/O Capacitance2

VCCIO = 3.3 V, 2.5 V, 1.8 V, 1.5 V, 1.2 V,

VCC = Typ., VIO = 0 to VIH (MAX)

VHYST

Hysteresis for Schmitt Trigger

Inputs5

VCCIO = 3.3 V, Hysteresis = Large

—

450

—

VCCIO = 2.5 V, Hysteresis = Large

—

250

—

VCCIO = 1.8 V, Hysteresis = Large

—

125

—

VCCIO = 1.5 V, Hysteresis = Large

—

100

—

VCCIO = 3.3 V, Hysteresis = Small

—

250

—

VCCIO = 2.5 V, Hysteresis = Small

—

150

—

VCCIO = 1.8 V, Hysteresis = Small

—

VCCIO = 1.5 V, Hysteresis = Small

—

Notes:

1. Input or I/O leakage current is measured with the pin configured as an input or as an I/O with the output driver tri-stated. It is

not measured with the output driver active. Bus maintenance circuits are disabled.

2. TA 25 °C, f = 1.0 MHz.

3. Refer to VIL and VIH in the sysI/O Single-Ended DC Electrical Characteristics table of this document.

4. When VIH is higher than VCCIO, a transient current typically of 30 ns in duration or less with a peak current of 6 mA can occur on

the high-to-low transition. For true LVDS output pins in MachXO3L/LF devices, VIH must be less than or equal to VCCIO.

5. With bus keeper circuit turned on. For more details, refer to MachXO3 sysIO Usage Guide (TN1280).

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 47

3.9. Static Supply Current – C/E Devices

Table 3.8. Static Supply Current – C/E Devices1, 2, 3, 6

Symbol

Parameter

Device

Typ.4

Units

ICC

Core Power Supply

LCMXO3/L/LF-1300C 256 Ball Package

4.8

LCMXO3L/LF-2100C

4.8

LCMXO3L/LF-2100C 324 Ball Package

8.45

LCMXO3L/LF-4300C

8.45

LCMXO3L/LF-4300C 400 Ball Package

12.87

LCMXO3L/LF-6900C

12.87

LCMXO3L/LF-9400C

17.86

LCMXO3L/LF-640E

1.00

LCMXO3L/LF-1300E

1.00

LCMXO3L/LF-1300E 256 Ball Package

1.39

LCMXO3L/LF-2100E

1.39

LCMXO3L/LF-2100E 324 Ball Package

2.55

LCMXO3L/LF-4300E

2.55

LCMXO3L/LF-6900E

4.06

LCMXO3L/LF-9400E

5.66

ICCIO

Bank Power Supply5 VCCIO = 2.5 V

All devices

Notes:

1. For further information on supply current, refer to Power and Thermal Estimation and Management for MachXO3 Devices

(TN1289).

2. Assumes blank pattern with the following characteristics: all outputs are tri-stated, all inputs are configured as LVCMOS and

held at VCCIO or GND, on-chip oscillator is off, on-chip PLL is off.

3. Frequency = 0 MHz.

4. TJ = 25 °C, power supplies at nominal voltage.

5. Does not include pull-up/pull-down.

6. To determine the MachXO3L/LF peak start-up current data, use the Power Calculator tool.

MachXO3 Family

Data Sheet

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48 FPGA-DS-02032-2.4

3.10. Programming and Erase Supply Current – C/E Devices

Table 3.9. Programming and Erase Supply Current – C/E Devices1, 2, 3, 4

Symbol

Parameter

Device

Typ.4

Units

ICC

Core Power Supply

LCMXO3L/LF-1300C 256 Ball Package

22.1

LCMXO3L/LF-2100C

22.1

LCMXO3L/LF-2100C 324 Ball Package

26.8

LCMXO3L/LF-4300C

26.8

LCMXO3L/LF-4300C 400 Ball Package

33.2

LCMXO3L/LF-6900C

33.2

LCMXO3L/LF-9400C

39.6

LCMXO3L/LF-640E

17.7

LCMXO3L/LF-1300E

17.7

LCMXO3L/LF-1300E 256 Ball Package

18.3

LCMXO3L/LF-2100E

18.3

LCMXO3L/LF-2100E 324 Ball Package

20.4

LCMXO3L/LF-4300E

20.4

LCMXO3L/LF-6900E

23.9

LCMXO3L/LF-9400E

28.5

ICCIO

Bank Power Supply5 VCCIO = 2.5 V

All devices

Notes:

1. For further information on supply current, refer to Power and Thermal Estimation and Management for MachXO3 Devices

(TN1289).

2. Assumes all inputs are held at VCCIO or GND and all outputs are tri-stated.

3. Typical user pattern.

4. JTAG programming is at 25 MHz.

5. TJ = 25 °C, power supplies at nominal voltage.

6. Per bank. VCCIO = 2.5 V. Does not include pull-up/pull-down.

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 49

3.11. sysI/O Recommended Operating Conditions

Table 3.10. sysI/O Recommended Operating Conditions

Standard

VCCIO (V)

VREF (V)

Min.

Typ.

Max.

Min.

Typ.

Max.

LVCMOS 3.3

3.135

3.3

3.465

—

LVCMOS 2.5

2.375

2.5

2.625

—

LVCMOS 1.8

1.71

1.8

1.89

—

LVCMOS 1.5

1.425

1.5

1.575

—

LVCMOS 1.2

1.14

1.2

1.26

—

LVTTL

3.135

3.3

3.465

—

LVDS251, 2

2.375

2.5

2.625

—

LVDS331, 2

3.135

3.3

3.465

—

LVPECL1

3.135

3.3

3.465

—

BLVDS1

2.375

2.5

2.625

—

MIPI3

2.375

2.5

2.625

—

MIPI_LP3

1.14

1.2

1.26

—

LVCMOS25R33

3.135

3.3

3.6

1.1

1.25

1.4

LVCMOS18R33

3.135

3.3

3.6

0.75

0.9

1.05

LVCMOS18R25

2.375

2.5

2.625

0.75

0.9

1.05

LVCMOS15R33

3.135

3.3

3.6

0.6

0.75

0.9

LVCMOS15R25

2.375

2.5

2.625

0.6

0.75

0.9

LVCMOS12R334

3.135

3.3

3.6

0.45

0.6

0.75

LVCMOS12R254

2.375

2.5

2.625

0.45

0.6

0.75

LVCMOS10R334

3.135

3.3

3.6

0.35

0.5

0.65

LVCMOS10R254

2.375

2.5

2.625

0.35

0.5

0.65

Notes:

1. Inputs on-chip. Outputs are implemented with the addition of external resistors.

2. For the dedicated LVDS buffers.

3. Requires the addition of external resistors.

4. Supported only for inputs and BIDIs for –6 speed grade devices.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

50 FPGA-DS-02032-2.4

3.12. sysI/O Single-Ended DC Electrical Characteristics

Table 3.11. sysI/O Single-Ended DC Electrical Charateristics1, 2

Standard

VIL

VIH

VOL Max.

(V)

VOH Min. (V)

IOL Max.4

(mA)

IOH Max.4

(mA)

Min. (V)3

Max. (V)

Min. (V)

Max. (V)

LVCMOS 3.3

LVTTL

–0.3

0.8

2.0

3.6

0.4

VCCIO – 0.4

–4

–8

–12

–16

0.2

VCCIO – 0.2

0.1

–0.1

LVCMOS 2.5

–0.3

0.7

1.7

3.6

0.4

VCCIO – 0.4

–4

–8

–12

–16

0.2

VCCIO – 0.2

0.1

–0.1

LVCMOS 1.8

–0.3

0.35 VCCIO

0.65 VCCIO

3.6

0.4

VCCIO – 0.4

–4

–8

–12

0.2

VCCIO – 0.2

0.1

–0.1

LVCMOS 1.5

–0.3

0.35 VCCIO

0.65 VCCIO

3.6

0.4

VCCIO – 0.4

–4

–8

0.2

VCCIO – 0.2

0.1

–0.1

LVCMOS 1.2

–0.3

0.35 VCCIO

0.65 VCCIO

3.6

0.4

VCCIO – 0.4

–2

–6

0.2

VCCIO – 0.2

0.1

–0.1

LVCMOS25R33

–0.3

VREF – 0.1

VREF+0.1

3.6

LVCMOS18R33

–0.3

VREF – 0.1

VREF+0.1

3.6

LVCMOS18R25

–0.3

VREF – 0.1

VREF+0.1

3.6

LVCMOS15R33

–0.3

VREF – 0.1

VREF+0.1

3.6

LVCMOS15R25

–0.3

VREF – 0.1

VREF+0.1

3.6

LVCMOS12R33

–0.3

VREF – 0.1

VREF+0.1

3.6

0.40

NA Open Drain

24, 16, 12,

8, 4

NA Open

Drain

LVCMOS12R25

–0.3

VREF – 0.1

VREF+0.1

3.6

0.40

NA Open Drain

16, 12, 8, 4

NA Open

Drain

LVCMOS10R33

–0.3

VREF – 0.1

VREF+0.1

3.6

0.40

NA Open Drain

24, 16, 12,

8, 4

NA Open

Drain

LVCMOS10R25

-0.3

VREF – 0.1

VREF+0.1

3.6

0.40

NA Open Drain

16, 12, 8, 4

NA Open

Drain

Notes:

1. MachXO3L/LF devices allow LVCMOS inputs to be placed in I/O banks where VCCIO is different from what is specified in the

applicable JEDEC specification. This is referred to as a ratioed input buffer. In a majority of cases this operation follows or

exceeds the applicable JEDEC specification. The cases where MachXO3L/LF devices do not meet the relevant JEDEC

specification are documented in the table below.

2. MachXO3L/LF devices allow for LVCMOS referenced I/Os which follow applicable JEDEC specifications. For more details about

mixed mode operation please refer to please refer to MachXO3 sysIO Usage Guide (TN1280).

3. The dual function I2C pins SCL and SDA are limited to a VIL min of –0.25 V or to –0.3 V with a duration of <10 ns.

4. For electromigration, the average DC current sourced or sinked by I/O pads between two consecutive VCCIO or GND pad

connections, or between the last VCCIO or GND in an I/O bank and the end of an I/O bank, shall not exceed a maximum of n * 8

mA. “n” is the number of I/O pads between the two consecutive bank VCCIO or GND connections or between the last VCCIO

and GND in a bank and the end of a bank. I/O Grouping can be found in the Data Sheet Pin Tables, which can also be generated

from the Lattice Diamond software.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 51

3.13. sysI/O Differential Electrical Characteristics

The LVDS differential output buffers are available on the top side of the MachXO3L/LF PLD family.

3.13.1. LVDS

Over recommended operating conditions.

Table 3.12. LVDS

Parameter

Symbol

Parameter Description

Test Conditions

Min.

Typ.

Max.

Units

VINP, VINM

Input Voltage

VCCIO = 3.3 V

—

2.605

VCCIO = 2.5 V

—

2.05

VTHD

Differential Input Threshold

—

±100

—

VCM

Input Common Mode Voltage

VCCIO = 3.3 V

0.05

—

2.6

VCCIO = 2.5 V

0.05

—

2.0

IIN

Input current

Power on

—

±10

µA

VOH

Output high voltage for VOP or VOM

RT = 100 Ω

—

1.375

—

VOL

Output low voltage for VOP or VOM

RT = 100 Ω

0.90

1.025

—

VOD

Output voltage differential

(VOP - VOM), RT = 100 Ω

250

350

450

VOD

Change in VOD between high and low

—

VOS

Output voltage offset

(VOP - VOM)/2, RT = 100 Ω

1.125

1.20

1.395

VOS

Change in VOS between H and L

—

IOSD

Output short circuit current

VOD = 0 V driver outputs shorted

—

3.13.2. LVDS Emulation

MachXO3L/LF devices can support LVDS outputs via emulation (LVDS25E). The output is emulated using

complementary LVCMOS outputs in conjunction with resistors across the driver outputs on all devices. The scheme

shown in Figure 3.1 is one possible solution for LVDS standard implementation. Resistor values in Figure 3.1 are

industry standard values for 1% resistors.

158

140 100

Off-chip Off-chip

VCCIO = 2.5

8mA

Note: All resistors are ±1%.

VCCIO = 2.5 –

Emulated

LVDS

Buffer

On-chip

Zo = 100

On-chip

Figure 3.1. LVDS Using External Resistors (LVDS25E)

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

52 FPGA-DS-02032-2.4

Over recommended operating conditions.

Table 3.13. LVDS25E DC Conditions

Parameter

Description

Typ.

Units

ZOUT

Output impedance

Ω

Driver series resistor

158

Ω

Driver parallel resistor

140

Ω

Receiver termination

100

Ω

VOH

Output high voltage

1.43

VOL

Output low voltage

1.07

VOD

Output differential voltage

0.35

VCM

Output common mode voltage

1.25

ZBACK

Back impedance

100.5

Ω

IDC

DC output current

6.03

3.13.3. BLVDS

The MachXO3L/LF family supports the BLVDS standard through emulation. The output is emulated using

complementary LVCMOS outputs in conjunction with resistors across the driver outputs. The input standard is

supported by the LVDS differential input buffer. BLVDS is intended for use when multi-drop and bi-directional multi-

point differential signaling is required. The scheme shown in Figure 3.2 is one possible solution for bi-directional

multi-point differential signals.

Heavily loaded backplane, effective Zo ~ 45 to 90 Ω differential

2.5 V80

80808080

45-90 Ω

2.5 V

–

. . . . . .

–

16 mA

–

16 mA16 mA 16 mA

2.5 V 2.5 V 2.5 V

45-90 Ω

–

Figure 3.2. BLVDS Multi-point-Output Example

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 53

Over recommended operating conditions.

Table 3.14. BLVDS DC Condition

Symbol

Description

Nominal

Units

Zo = 45

Zo = 90

ZOUT

Output impedance

Ω

Driver series resistance

Ω

RTLEFT

Left end termination

Ω

RTRIGHT

Right end termination

Ω

VOH

Output high voltage

1.376

1.480

VOL

Output low voltage

1.124

1.020

VOD

Output differential voltage

0.253

0.459

VCM

Output common mode voltage

1.250

IDC

DC output current

11.236

10.204

Note: For input buffer, see LVDS table.

3.13.4. LVPECL

The MachXO3L/LF family supports the differential LVPECL standard through emulation. This output standard is

emulated using complementary LVCMOS outputs in conjunction with resistors across the driver outputs on all the

devices. The LVPECL input standard is supported by the LVDS differential input buffer. The scheme shown in

Differential LVPECL is one possible solution for point-to-point signals.

Transmission line, Zo = 100 Ω differential

100 Ω

93 Ω

16 mA

93 Ω

Off-chip On-chip

VCCIO = 3.3 V

VCCIO = 3.3 V196 Ω

On-chipOff-chip

–

Figure 3.3. Differential LVPECL

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

54 FPGA-DS-02032-2.4

Over recommended operating conditions.

Table 3.15. LVPECL DC Conditions

Symbol

Description

Nominal

Units

ZOUT

Output impedance

Ω

Driver series resistor

Ω

Driver parallel resistor

196

Ω

Receiver termination

100

Ω

VOH

Output high voltage

2.05

VOL

Output low voltage

1.25

VOD

Output differential voltage

0.80

VCM

Output common mode voltage

1.65

ZBACK

Back impedance

100.5

Ω

IDC

DC output current

12.11

Note: For input buffer, see LVDS table.

For further information on LVPECL, BLVDS and other differential interfaces, see details of additional technical

documentation at the end of the data sheet.

3.13.5. MIPI D-PHY Emulation

MachXO3L/LF devices can support MIPI D-PHY unidirectional HS (High Speed) and bidirectional LP (Low Power) inputs

and outputs via emulation. In conjunction with external resistors High Speed I/Os use the LVDS25E buffer and Low

Power I/Os use the LVCMOS buffers. The scheme shown in Figure 3.4 is one possible solution for MIPI D-PHY Receiver

implementation. The scheme shown in Figure 3.5 is one possible solution for MIPI D-PHY Transmitter implementation.

LVDS

MIPI D-PHY Input

LVCMOS

Figure 3.4. MIPI D-PHY Input Using External Resistors

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 55

Over recommended operating conditions.

Table 3.16. MIPI DC Conditions

Description

Min.

Typ.

Max.

Units

Receiver

External Termination

1% external resistor with VCCIO=2.5 V

—

Ω

1% external resistor with VCCIO=3.3 V

—

Ω

High Speed

VCCIO

VCCIO of the Bank with LVDS Emulated input buffer

—

2.5

—

VCCIO of the Bank with LVDS Emulated input buffer

—

3.3

—

VCMRX

Common-mode voltage HS receive mode

150

200

250

VIDTH

Differential input high threshold

—

100

VIDTL

Differential input low threshold

–100

—

VIHHS

Single-ended input high voltage

—

300

VILHS

Single-ended input low voltage

100

—

ZID

Differential input impedance

100

120

Ω

Low Power

VCCIO

VCCIO of the Bank with LVCMOS12D 6 mA drive

bidirectional I/O buffer

—

1.2

—

VIH

Logic 1 input voltage

—

0.88

VIL

Logic 0 input voltage, not in ULP State

0.55

—

VHYST

Input hysteresis

—

LVCMOS

LVDS

MIPI D-PHY Output

LVCMOS

Figure 3.5. MIPI D-PHY Output Using External Resistors

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

56 FPGA-DS-02032-2.4

Over recommended operating conditions.

Table 3.17. MIPI D-PHY Output DC Conditions

Description

Min.

Typ.

Max.

Units

Transmitter

External Termination

1% external resistor with VCCIO = 2.5 V

—

Ω

1% external resistor with VCCIO = 3.3 V

—

1% external resistor with performance up to 800

Mbps or with performance up 900 Mbps when

VCCIO = 2.5 V

—

330

—

Ω

1% external resistor with performance between

800 Mbps to 900 Mbps when VCCIO = 3.3 V

—

464

—

Ω

High Speed

VCCIO

VCCIO of the Bank with LVDS Emulated output

buffer

—

2.5

—

VCCIO of the Bank with LVDS Emulated output

buffer

—

3.3

—

VCMTX

HS transmit static common mode voltage

150

200

250

VOD

HS transmit differential voltage

140

200

270

VOHHS

HS output high voltage

—

360

ZOS

Single ended output impedance

—

Ω

ZOS

Single ended output impedance mismatch

—

Low Power

VCCIO

VCCIO of the Bank with LVCMOS12D 6 mA drive

bidirectional I/O buffer

—

1.2

—

VOH

Output high level

1.1

1.2

1.3

VOL

Output low level

–50

ZOLP

Output impedance of LP transmitter

110

—

Ω

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 57

3.14. Typical Building Block Function Performance – C/E Devices

3.14.1. Pin-to-Pin Performance (LVCMOS25 12 mA Drive)

Table 3.18. Pin-to-Pin Performance (LVCMOS25 12 mA Drive)

Function

–6 Timing

Units

Basic Functions

16-bit decoder

8.9

4:1 MUX

7.5

16:1 MUX

8.3

3.14.2. Register-to-Register Performance

Table 3.19. Register-to-Register Performance

Function

–6 Timing

Units

Basic Functions

16:1 MUX

412

MHz

16-bit adder

297

MHz

16-bit counter

324

MHz

64-bit counter

161

MHz

Embedded Memory Functions

1024x9 True-Dual Port RAM

(Write Through or Normal, EBR output registers)

183

MHz

Distributed Memory Functions

16x4 Pseudo-Dual Port RAM (one PFU)

500

MHz

Note: The above timing numbers are generated using the Diamond design tool. Exact performance may vary with

device and tool version. The tool uses internal parameters that have been characterized but are not tested on every

device. Commercial timing numbers are shown at 85 °C and 1.14 V. Other operating conditions, including industrial, can

be extracted from the Diamond software.

3.15. Derating Logic Timing

Logic timing provided in the following sections of the data sheet and the Lattice design tools are worst case numbers in

the operating range. Actual delays may be much faster. Lattice design tools can provide logic timing numbers at a

particular temperature and voltage.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

58 FPGA-DS-02032-2.4

3.16. Maximum sysI/O Buffer Performance

Table 3.20. Maximum sysI/O Buffer Performance

I/O Standard

Max. Speed

Units

MIPI

450

MHz

LVDS25

400

MHz

LVDS25E

150

MHz

BLVDS25

150

MHz

BLVDS25E

150

MHz

MLVDS25

150

MHz

MLVDS25E

150

MHz

LVPECL33

150

MHz

LVPECL33E

150

MHz

LVTTL33

150

MHz

LVTTL33D

150

MHz

LVCMOS33

150

MHz

LVCMOS33D

150

MHz

LVCMOS25

150

MHz

LVCMOS25D

150

MHz

LVCMOS18

150

MHz

LVCMOS18D

150

MHz

LVCMOS15

150

MHz

LVCMOS15D

150

MHz

LVCMOS12

MHz

LVCMOS12D

MHz

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 59

3.17. MachXO3L/LF External Switching Characteristics – C/E Devices

Over recommended operating conditions.

Table 3.21. MachXO3L/LF External Switching Characteristics – C/E Devices1, 2, 3, 4, 5, 6, 10

Parameter

Description

Device

–6

–5

Units

Min.

Max.

Min.

Max.

Clocks

Primary Clocks

fMAX_PRI7

Frequency for Primary Clock

Tree

All MachXO3L/LF

devices

—

388

—

323

MHz

tW_PRI

Clock Pulse Width for Primary

Clock

All MachXO3L/LF

devices

0.5

—

0.6

—

tSKEW_PRI

Primary Clock Skew Within a

Device

MachXO3L/LF-1300

—

867

—

897

MachXO3L/LF-2100

—

867

—

897

MachXO3L/LF-4300

—

865

—

892

MachXO3L/LF-6900

—

902

—

942

MachXO3L/LF-9400

—

908

—

950

Edge Clock

fMAX_EDGE7

Frequency for Edge Clock

MachXO3L/LF

—

400

—

333

MHz

Pin-LUT-Pin Propagation Delay

tPD

Best case propagation delay

through one LUT-4

All MachXO3L/LF

devices

—

6.72

—

6.96

General I/O Pin Parameters (Using Primary Clock without PLL)

tCO

Clock to Output – PIO Output

MachXO3L/LF-1300

—

7.46

—

7.66

MachXO3L/LF-2100

—

7.46

—

7.66

MachXO3L/LF-4300

—

7.51

—

7.71

MachXO3L/LF-6900

—

7.54

—

7.75

MachXO3L/LF-9400

—

7.53

—

7.83

tSU

Clock to Data Setup – PIO Input

MachXO3L/LF-1300

–0.20

—

–0.20

—

MachXO3L/LF-2100

–0.20

—

–0.20

—

MachXO3L/LF-4300

–0.23

—

–0.23

—

MachXO3L/LF-6900

–0.23

—

–0.23

—

MachXO3L/LF-9400

–0.24

—

–0.24

—

Clock to Data Hold – PIO Input

MachXO3L/LF-1300

1.89

—

2.13

—

MachXO3L/LF-2100

1.89

—

2.13

—

MachXO3L/LF-4300

1.94

—

2.18

—

MachXO3L/LF-6900

1.98

—

2.23

—

MachXO3L/LF-9400

1.99

—

2.24

—

tSU_DEL

Clock to Data Setup – PIO Input

MachXO3L/LF-1300

1.61

—

1.76

—

MachXO3L/LF-2100

1.61

—

1.76

—

MachXO3L/LF-4300

1.66

—

1.81

—

MachXO3L/LF-6900

1.53

—

1.67

—

MachXO3L/LF-9400

1.65

—

1.80

—

tH_DEL

Clock to Data Hold – PIO Input

MachXO3L/LF-1300

–0.23

—

–0.23

—

MachXO3L/LF-2100

–0.23

—

–0.23

—

MachXO3L/LF-4300

–0.25

—

–0.25

—

MachXO3L/LF-6900

–0.21

—

–0.21

—

MachXO3L/LF-9400

–0.24

—

–0.24

—

fMAX_I/O

Clock Frequency of I/O and PFU

All MachXO3L/LF

devices

—

388

—

323

MHz

MachXO3 Family

Data Sheet

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60 FPGA-DS-02032-2.4

Parameter

Description

Device

–6

–5

Units

Min.

Max.

Min.

Max.

General I/O Pin Parameters (Using Edge Clock without PLL)

tCOE

Clock to Output – PIO Output

MachXO3L/LF-1300

—

7.53

—

7.76

MachXO3L/LF-2100

—

7.53

—

7.76

MachXO3L/LF-4300

—

7.45

—

7.68

MachXO3L/LF-6900

—

7.53

—

7.76

MachXO3L/LF-9400

—

8.93

—

9.35

tSUE

Clock to Data Setup – PIO Input

MachXO3L/LF-1300

–0.19

—

–0.19

—

MachXO3L/LF-2100

–0.19

—

–0.19

—

MachXO3L/LF-4300

–0.16

—

–0.16

—

MachXO3L/LF-6900

–0.19

—

–0.19

—

MachXO3L/LF-9400

–0.20

—

–0.20

—

tHE

Clock to Data Hold – PIO Input

MachXO3L/LF-1300

1.97

—

2.24

—

MachXO3L/LF-2100

1.97

—

2.24

—

MachXO3L/LF-4300

1.89

—

2.16

—

MachXO3L/LF-6900

1.97

—

2.24

—

MachXO3L/LF-9400

1.98

—

2.25

—

tSU_DELE

Clock to Data Setup – PIO Input

MachXO3L/LF-1300

1.56

—

1.69

—

MachXO3L/LF-2100

1.56

—

1.69

—

MachXO3L/LF-4300

1.74

—

1.88

—

MachXO3L/LF-6900

1.66

—

1.81

—

MachXO3L/LF-9400

1.71

—

1.85

—

tH_DELE

Clock to Data Hold – PIO Input

MachXO3L/LF-1300

–0.23

—

–0.23

—

MachXO3L/LF-2100

–0.23

—

–0.23

—

MachXO3L/LF-4300

–0.34

—

–0.34

—

MachXO3L/LF-6900

–0.29

—

–0.29

—

MachXO3L/LF-9400

–0.30

—

–0.30

—

General I/O Pin Parameters (Using Primary Clock with PLL)

tCOPLL

Clock to Output – PIO Output

MachXO3L/LF-1300

—

5.98

—

6.01

MachXO3L/LF-2100

—

5.98

—

6.01

MachXO3L/LF-4300

—

5.99

—

6.02

MachXO3L/LF-6900

—

6.02

—

6.06

MachXO3L/LF-9400

—

5.55

—

6.13

tSUPLL

Clock to Data Setup – PIO Input

MachXO3L/LF-1300

0.36

—

0.36

—

MachXO3L/LF-2100

0.36

—

0.36

—

MachXO3L/LF-4300

0.35

—

0.35

—

MachXO3L/LF-6900

0.34

—

0.34

—

MachXO3L/LF-9400

0.33

—

0.33

—

tHPLL

Clock to Data Hold – PIO Input

MachXO3L/LF-1300

0.42

—

0.49

—

MachXO3L/LF-2100

0.42

—

0.49

—

MachXO3L/LF-4300

0.43

—

0.50

—

MachXO3L/LF-6900

0.46

—

0.54

—

MachXO3L/LF-9400

0.47

—

0.55

—

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 61

Parameter

Description

Device

–6

–5

Units

Min.

Max.

Min.

Max.

tSU_DELPLL

Clock to Data Setup – PIO Input

MachXO3L/LF-1300

2.87

—

3.18

—

MachXO3L/LF-2100

2.87

—

3.18

—

MachXO3L/LF-4300

2.96

—

3.28

—

MachXO3L/LF-6900

3.05

—

3.35

—

MachXO3L/LF-9400

3.06

—

3.37

—

tH_DELPLL

Clock to Data Hold – PIO Input

MachXO3L/LF-1300

–0.83

—

–0.83

—

MachXO3L/LF-2100

–0.83

—

–0.83

—

MachXO3L/LF-4300

–0.87

—

–0.87

—

MachXO3L/LF-6900

–0.91

—

–0.91

—

MachXO3L/LF-9400

–0.93

—

–0.93

—

Generic DDRX1 Inputs with Clock and Data Aligned at Pin Using PCLK Pin for Clock Input – GDDRX1_RX.SCLK.Aligned8, 9

tDVA

Input Data Valid After CLK

All MachXO3L/LF

devices,

all sides

—

0.317

—

0.344

tDVE

Input Data Hold After CLK

0.742

—

0.702

—

fDATA

DDRX1 Input Data Speed

—

300

—

250

Mbps

fDDRX1

DDRX1 SCLK Frequency

—

150

—

125

MHz

Generic DDRX1 Inputs with Clock and Data Centered at Pin Using PCLK Pin for Clock Input – GDDRX1_RX.SCLK.Centered8, 9

tSU

Input Data Setup Before CLK

All MachXO3L/LF

devices,

all sides

0.566

—

0.560

—

tHO

Input Data Hold After CLK

0.778

—

0.879

—

fDATA

DDRX1 Input Data Speed

—

300

—

Mbps

fDDRX1

DDRX1 SCLK Frequency

—

150

—

125

MHz

Generic DDRX2 Inputs with Clock and Data Aligned at Pin Using PCLK Pin for Clock Input – GDDRX2_RX.ECLK.Aligned8, 9

tDVA

Input Data Valid After CLK

MachXO3L/LF devices,

bottom side only

—

0.316

—

0.342

tDVE

Input Data Hold After CLK

0.710

—

0.675

—

fDATA

DDRX2 Serial Input Data Speed

—

664

—

554

Mbps

fDDRX2

DDRX2 ECLK Frequency

—

332

—

277

MHz

fSCLK

SCLK Frequency

—

166

—

139

MHz

Generic DDRX2 Inputs with Clock and Data Centered at Pin Using PCLK Pin for Clock Input – GDDRX2_RX.ECLK.Centered8, 9

tSU

Input Data Setup Before CLK

MachXO3L/LF devices,

bottom side only

0.233

—

0.219

—

tHO

Input Data Hold After CLK

0.287

—

0.287

—

fDATA

DDRX2 Serial Input Data Speed

—

664

—

554

Mbps

fDDRX2

DDRX2 ECLK Frequency

—

332

—

277

MHz

fSCLK

SCLK Frequency

—

166

—

139

MHz

Generic DDR4 Inputs with Clock and Data Aligned at Pin Using PCLK Pin for Clock Input – GDDRX4_RX.ECLK.Aligned8

tDVA

Input Data Valid After ECLK

MachXO3L/LF devices,

bottom side only

—

0.307

—

0.320

tDVE

Input Data Hold After ECLK

0.782

—

0.699

—

fDATA

DDRX4 Serial Input Data Speed

—

800

—

630

Mbps

fDDRX4

DDRX4 ECLK Frequency

—

400

—

315

MHz

fSCLK

SCLK Frequency

—

100

—

MHz

Generic DDR4 Inputs with Clock and Data Centered at Pin Using PCLK Pin for Clock Input – GDDRX4_RX.ECLK.Centered8

tSU

Input Data Setup Before ECLK

MachXO3L/LF devices,

bottom side only

0.233

—

0.219

—

tHO

Input Data Hold After ECLK

0.287

—

0.287

—

fDATA

DDRX4 Serial Input Data Speed

—

800

—

630

Mbps

fDDRX4

DDRX4 ECLK Frequency

—

400

—

315

MHz

fSCLK

SCLK Frequency

—

100

—

MHz

MachXO3 Family

Data Sheet

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62 FPGA-DS-02032-2.4

Parameter

Description

Device

–6

–5

Units

Min.

Max.

Min.

Max.

7:1 LVDS Inputs (GDDR71_RX.ECLK.7:1)9

tDVA

Input Data Valid After ECLK

MaxhXO3L/LF devices,

bottom side only

—

0.290

—

0.320

tDVE

Input Data Hold After ECLK

0.739

—

0.699

—

fDATA

DDR71 Serial Input Data Speed

—

756

—

630

Mbps

fDDR71

DDR71 ECLK Frequency

—

378

—

315

MHz

fCLKIN

7:1 Input Clock Frequency

(SCLK) (minimum limited by

PLL)

—

108

—

MHz

MIPI D-PHY Inputs with Clock and Data Centered at Pin Using PCLK Pin for Clock Input - GDDRX4_RX.ECLK.Centered10, 11, 12

tSU15

Input Data Setup Before ECLK

All MachXO3L/LF

devices,

bottom side only

0.200

—

0.200

—

tHO

Input Data Hold After ECLK

0.200

—

0.200

—

fDATA14

MIPI D-PHY Input Data Speed

—

900

—

900

Mbps

fDDRX414

MIPI D-PHY ECLK Frequency

—

450

—

450

MHz

fSCLK14

SCLK Frequency

—

112.5

—

112.5

MHz

Generic DDR Outputs with Clock and Data Aligned at Pin Using PCLK Pin for Clock Input – GDDRX1_TX.SCLK.Aligned8

tDIA

Output Data Invalid After CLK

Output

All MachXO3L/LF

devices,

all sides

—

0.520

—

0.550

tDIB

Output Data Invalid Before CLK

Output

—

0.520

—

0.550

fDATA

DDRX1 Output Data Speed

—

300

—

250

Mbps

fDDRX1

DDRX1 SCLK frequency

—

150

—

125

MHz

Generic DDR Outputs with Clock and Data Centered at Pin Using PCLK Pin for Clock Input – GDDRX1_TX.SCLK.Centered8

tDVB

Output Data Valid Before CLK

Output

All MachXO3L/LF

devices,

all sides

1.210

—

1.510

—

tDVA

Output Data Valid After CLK

Output

1.210

—

1.510

—

fDATA

DDRX1 Output Data Speed

—

300

—

250

Mbps

fDDRX1

DDRX1 SCLK Frequency

(minimum limited by PLL)

—

150

—

125

MHz

Generic DDRX2 Outputs with Clock and Data Aligned at Pin Using PCLK Pin for Clock Input – GDDRX2_TX.ECLK.Aligned8

tDIA

Output Data Invalid After CLK

Output

MachXO3L/LF devices,

top side only

—

0.200

—

0.215

tDIB

Output Data Invalid Before CLK

Output

—

0.200

—

0.215

fDATA

DDRX2 Serial Output Data

Speed

—

664

—

554

Mbps

fDDRX2

DDRX2 ECLK frequency

—

332

—

277

MHz

fSCLK

SCLK Frequency

—

166

—

139

MHz

Generic DDRX2 Outputs with Clock and Data Centered at Pin Using PCLK Pin for Clock Input – GDDRX2_TX.ECLK.Centered8, 9

tDVB

Output Data Valid Before CLK

Output

MachXO3L/LF devices,

top side only

0.535

—

0.670

—

tDVA

Output Data Valid After CLK

Output

0.535

—

0.670

—

fDATA

DDRX2 Serial Output Data

Speed

—

664

—

554

Mbps

fDDRX2

DDRX2 ECLK Frequency

(minimum limited by PLL)

—

332

—

277

MHz

fSCLK

SCLK Frequency

—

166

—

139

MHz

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 63

Parameter

Description

Device

–6

–5

Units

Min.

Max.

Min.

Max.

Generic DDRX4 Outputs with Clock and Data Aligned at Pin Using PCLK Pin for Clock Input – GDDRX4_TX.ECLK.Aligned8, 9

tDIA

Output Data Invalid After CLK

Output

MachXO3L/LF devices,

top side only

—

0.200

—

0.215

tDIB

Output Data Invalid Before CLK

Output

—

0.200

—

0.215

fDATA

DDRX4 Serial Output Data

Speed

—

800

—

630

Mbps

fDDRX4

DDRX4 ECLK Frequency

—

400

—

315

MHz

fSCLK

SCLK Frequency

—

100

—

MHz

Generic DDRX4 Outputs with Clock and Data Centered at Pin Using PCLK Pin for Clock Input – GDDRX4_TX.ECLK.Centered8, 9

tDVB

Output Data Valid Before CLK

Output

MachXO3L/LF devices,

top side only

0.455

—

0.570

—

tDVA

Output Data Valid After CLK

Output

0.455

—

0.570

—

fDATA

DDRX4 Serial Output Data

Speed

—

800

—

630

Mbps

fDDRX4

DDRX4 ECLK Frequency

(minimum limited by PLL)

—

400

—

315

MHz

fSCLK

SCLK Frequency

—

100

—

MHz

7:1 LVDS Outputs – GDDR71_TX.ECLK.7:18, 9

tDIB

Output Data Invalid Before CLK

Output

MachXO3L/LF devices,

top side only

—

0.160

—

0.180

tDIA

Output Data Invalid After CLK

Output

—

0.160

—

0.180

fDATA

DDR71 Serial Output Data

Speed

—

756

—

630

Mbps

fDDR71

DDR71 ECLK Frequency

—

378

—

315

MHz

fCLKOUT

7:1 Output Clock Frequency

(SCLK) (minimum limited by

PLL)

—

108

—

MHz

MIPI D-PHY Outputs with Clock and Data Centered at Pin Using PCLK Pin for Clock Input – GDDRX4_TX.ECLK.Centered10, 11, 12

tDVB

Output Data Valid Before CLK

Output

All MachXO3L/LF

devices, top side only

0.200

—

0.200

—

tDVA

Output Data Valid After CLK

Output

0.200

—

0.200

—

fDATA

MIPI D-PHY Output Data Speed

—

900

—

900

Mbps

FDDRX4

MIPI D-PHY ECLK Frequency

(minimum limited by PLL)

—

450

—

450

MHz

fSCLK

SCLK Frequency

—

112.5

—

112.5

MHz

Notes:

1. Exact performance may vary with device and design implementation. Commercial timing numbers are shown at 85 °C and 1.14

V. Other operating conditions, including industrial, can be extracted from the Diamond software.

2. General I/O timing numbers based on LVCMOS 2.5, 8 mA, 0pf load, fast slew rate.

3. Generic DDR timing numbers based on LVDS I/O (for input, output, and clock ports).

4. 7:1 LVDS (GDDR71) uses the LVDS I/O standard (for input, output, and clock ports).

5. For Generic DDRX1 mode tSU = tHO = (tDVE - tDVA - 0.03 ns)/2.

6. The tSU_DEL and tH_DEL values use the SCLK_ZERHOLD default step size. Each step is 105 ps (–6), 113 ps (–5), 120 ps (–4).

7. This number for general purpose usage. Duty cycle tolerance is +/–10%.

8. Duty cycle is +/– 5% for system usage.

9. Performance is calculated with 0.225 UI.

10. Performance is calculated with 0.20 UI.

11. Performance for Industrial devices are only supported with VCC between 1.16 V to 1.24 V.

12. Performance for Industrial devices and –5 devices are not modeled in the Diamond design tool.

MachXO3 Family

Data Sheet

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64 FPGA-DS-02032-2.4

13. The above timing numbers are generated using the Diamond design tool. Exact performance may vary with the device selected.

14. Above 800 Mbps is only supported with WLCSP and csfBGA packages

15. Between 800 Mbps to 900 Mbps:

 VIDTH exceeds the MIPI D-PHY Input DC Conditions (Over recommended operating conditions.

 Table 3.16) and can be calculated with the equation tSU or tH = -0.0005*VIDTH + 0.3284

 Example calculations

 tSU and tHO = 0.28 with VIDTH = 100 mV

 tSU and tHO = 0.25 with VIDTH = 170 mV

 tSU and tHO = 0.20 with VIDTH = 270 mV

Data

tDVA

tDVE

(4-6 bits)

CLK

01234560

Figure 3.6.Receiver GDDR71_RX. Waveforms

tDIA

tDIB

CLK

Data

(4-6 bits) 01234560

Figure 3.7. Transmitter GDDR71_TX. Waveforms

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 65

3.18. sysCLOCK PLL Timing

Over recommended operating conditions.

Table 3.22. sysCLOCK PLL Timing

Parameter

Descriptions

Conditions

Min.

Max.

Units

fIN

Input Clock Frequency (CLKI, CLKFB)

—

400

MHz

fOUT

Output Clock Frequency (CLKOP, CLKOS, CLKOS2)

—

1.5625

400

MHz

fOUT2

Output Frequency (CLKOS3 cascaded from CLKOS2)

—

0.0122

400

MHz

fVCO

PLL VCO Frequency

—

200

800

MHz

fPFD

Phase Detector Input Frequency

—

400

MHz

AC Characteristics

tDT

Output Clock Duty Cycle

Without duty trim

selected3

tDT_TRIM7

Edge Duty Trim Accuracy

—

–75

tPH4

Output Phase Accuracy

—

–6

tOPJIT1, 8

Output Clock Period Jitter

fOUT > 100 MHz

—

150

ps p-p

fOUT < 100 MHz

—

0.007

UIPP

Output Clock Cycle-to-cycle Jitter

fOUT > 100 MHz

—

180

ps p-p

fOUT < 100 MHz

—

0.009

UIPP

Output Clock Phase Jitter

fPFD > 100 MHz

—

160

ps p-p

fPFD < 100 MHz

—

0.011

UIPP

Output Clock Period Jitter (Fractional-N)

fOUT > 100 MHz

—

230

ps p-p

fOUT < 100 MHz

—

0.12

UIPP

Output Clock Cycle-to-cycle Jitter (Fractional-N)

fOUT > 100 MHz

—

230

ps p-p

fOUT < 100 MHz

—

0.12

UIPP

tSPO

Static Phase Offset

Divider ratio = integer

–120

120

Output Clock Pulse Width

At 90% or 10%3

0.9

—

tLOCK2, 5

PLL Lock-in Time

—

tUNLOCK

PLL Unlock Time

—

tIPJIT6

Input Clock Period Jitter

fPFD 20 MHz

—

1,000

ps p-p

fPFD < 20 MHz

—

0.02

UIPP

tHI

Input Clock High Time

90% to 90%

0.5

—

tLO

Input Clock Low Time

10% to 10%

0.5

—

tSTABLE5

STANDBY High to PLL Stable

—

tRST

RST/RESETM Pulse Width

—

tRSTREC

RST Recovery Time

—

tRST_DIV

RESETC/D Pulse Width

—

tRSTREC_DIV

RESETC/D Recovery Time

—

tROTATE-SETUP

PHASESTEP Setup Time

—

tROTATE_WD

PHASESTEP Pulse Width

—

VCO

Cycles

Notes:

1. Period jitter sample is taken over 10,000 samples of the primary PLL output with a clean reference clock. Cycle-to-cycle jitter is

taken over 1000 cycles. Phase jitter is taken over 2000 cycles. All values per JESD65B.

2. Output clock is valid after tLOCK for PLL reset and dynamic delay adjustment.

3. Using LVDS output buffers.

MachXO3 Family

Data Sheet

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66 FPGA-DS-02032-2.4

4. CLKOS as compared to CLKOP output for one phase step at the maximum VCO frequency. See MachXO3 sysCLOCK PLL Design

and Usage Guide (TN1282) for more details.

5. At minimum fPFD. As the fPFD increases the time will decrease to approximately 60% the value listed.

6. Maximum allowed jitter on an input clock. PLL unlock may occur if the input jitter exceeds this specification. Jitter on the input

clock may be transferred to the output clocks, resulting in jitter measurements outside the output specifications listed in this

table.

7. Edge Duty Trim Accuracy is a percentage of the setting value. Settings available are 70 ps, 140 ps, and 280 ps in addition to the

default value of none.

8. Jitter values measured with the internal oscillator operating. The jitter values will increase with loading of the PLD fabric and in

the presence of SSO noise.

3.19. NVCM/Flash Download Time

Table 3.23. NVCM/Flash Download Time

Symbol

Parameter

Device

Typ.

Units

tREFRESH

POR to Device I/O Active

LCMXO3L/LF-640

1.9

LCMXO3L/LF-1300

1.9

LCMXO3L/LF-1300 256-Ball Package

1.4

LCMXO3L/LF-2100

1.4

LCMXO3L/LF-2100 324-Ball Package

2.4

LCMXO3L/LF-4300

2.4

LCMXO3L/LF-4300 400-Ball Package

3.8

LCMXO3L/LF-6900

3.8

LCMXO3L/LF-9400C

5.2

Notes:

 Assumes sysMEM EBR initialized to an all zero pattern if they are used.

 The NVCM/Flash download time is measured starting from the maximum voltage of POR trip point.

 The worst case can be up to 1.75 times the Typ value.

3.20. JTAG Port Timing Specifications

Table 3.24. JTAG Port Timing Specifications

Symbol

Parameter

Min.

Max.

Units

fMAX

TCK clock frequency

—

MHz

tBTCPH

TCK [BSCAN] clock pulse width high

—

tBTCPL

TCK [BSCAN] clock pulse width low

—

tBTS

TCK [BSCAN] setup time

—

tBTH

TCK [BSCAN] hold time

—

tBTCO

TAP controller falling edge of clock to valid output

—

tBTCODIS

TAP controller falling edge of clock to valid disable

—

tBTCOEN

TAP controller falling edge of clock to valid enable

—

tBTCRS

BSCAN test capture register setup time

—

tBTCRH

BSCAN test capture register hold time

—

tBUTCO

BSCAN test update register, falling edge of clock to valid output

—

tBTUODIS

BSCAN test update register, falling edge of clock to valid disable

—

tBTUPOEN

BSCAN test update register, falling edge of clock to valid enable

—

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 67

Figure 3.8. JTAG Port Timing Waveforms

MachXO3 Family

Data Sheet

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68 FPGA-DS-02032-2.4

3.21. sysCONFIG Port Timing Specifications

Table 3.25. sysCONFIG Port Timing Specifications

Symbol

Parameter

Min.

Max.

Units

All Configuration Modes

tPRGM

PROGRAMN low pulse accept

—

tPRGMJ

PROGRAMN low pulse rejection

—

tINITL

INITN low time

LCMXO3L/LF-640/

LCMXO3L/LF-1300

—

LCMXO3L/LF-1300 256-

Ball Package/

LCMXO3L/LF-2100

—

LCMXO3L/LF-2100 324-

Ball Package/ LCMXO3-

4300

—

105

LCMXO3L/LF-4300 400-

Ball Package/ LCMXO3-

6900

—

130

LCMXO3L/LF-9400C

—

175

tDPPINIT

PROGRAMN low to INITN low

—

150

tDPPDONE

PROGRAMN low to DONE low

—

150

tIODISS

PROGRAMN low to I/O disable

—

120

Slave SPI

fMAX

CCLK clock frequency

—

MHz

tCCLKH

CCLK clock pulse width high

7.5

—

tCCLKL

CCLK clock pulse width low

7.5

—

tSTSU

CCLK setup time

—

tSTH

CCLK hold time

—

tSTCO

CCLK falling edge to valid output

—

tSTOZ

CCLK falling edge to valid disable

—

tSTOV

CCLK falling edge to valid enable

—

tSCS

Chip select high time

—

tSCSS

Chip select setup time

—

tSCSH

Chip select hold time

—

Master SPI

fMAX

MCLK clock frequency

—

133

MHz

tMCLKH

MCLK clock pulse width high

3.75

—

tMCLKL

MCLK clock pulse width low

3.75

—

tSTSU

MCLK setup time

—

tSTH

MCLK hold time

—

tCSSPI

INITN high to chip select low

100

200

tMCLK

INITN high to first MCLK edge

0.75

MachXO3 Family

Data Sheet

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FPGA-DS-02032-2.4 69

3.22. I2C Port Timing Specifications

Table 3.26. I2C Port Timing Specification

Symbol

Parameter

Min.

Max.

Units

fMAX

Maximum SCL clock frequency

—

400

kHz

Notes:

 MachXO3L/LF supports the following modes:

 Standard-mode (Sm), with a bit rate up to 100 kb/s (user and configuration mode)

 Fast-mode (Fm), with a bit rate up to 400 kb/s (user and configuration mode)

 Refer to the I2C specification for timing requirements.

3.23. SPI Port Timing Specifications

Table 3.27. SPI Port Timing Specifications

Symbol

Parameter

Min.

Max.

Units

fMAX

Maximum SCK clock frequency

—

MHz

Note: Applies to user mode only. For configuration mode timing specifications, refer to sysCONFIG Port Timing Specifications table in

this data sheet.

3.24. Switching Test Conditions

Figure 3.9 shows the output test load used for AC testing. The specific values for resistance, capacitance, voltage, and

other test conditions are shown in Table 3.28.

DUT

Test Point

Figure 3.9. Output Test Load, LVTTL and LVCMOS Standards

Table 3.28. Test Fixture Required Components, Non-Terminated Interfaces

Test Condition

Timing Ref.

LVTTL and LVCMOS settings (L -> H, H -> L)



0 pF

LVTTL, LVCMOS 3.3 = 1.5 V

—

LVCMOS 2.5 = VCCIO/2

—

LVCMOS 1.8 = VCCIO/2

—

LVCMOS 1.5 = VCCIO/2

—

LVCMOS 1.2 = VCCIO/2

—

LVTTL and LVCMOS 3.3 (Z -> H)

188

0 pF

1.5

VOL

LVTTL and LVCMOS 3.3 (Z -> L)

1.5

VOH

Other LVCMOS (Z -> H)

VCCIO/2

VOL

Other LVCMOS (Z -> L)

VCCIO/2

VOH

LVTTL + LVCMOS (H -> Z)

VOH – 0.15

VOL

LVTTL + LVCMOS (L -> Z)

VOL – 0.15

VOH

Note: Output test conditions for all other interfaces are determined by the respective standards.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

70 FPGA-DS-02032-2.4

4. Signal Descriptions

Table 4.1. Signal Descriptions

Signal Name

I/O

Descriptions

General Purpose

P[Edge] [Row/Column

Number]_[A/B/C/D]

I/O

[Edge] indicates the edge of the device on which the pad is located. Valid edge designations

are L (Left), B (Bottom), R (Right), T (Top).

[Row/Column Number] indicates the PFU row or the column of the device on which the PIO

Group exists. When Edge is T (Top) or (Bottom), only need to specify Row Number. When

Edge is L (Left) or R (Right), only need to specify Column Number.

[A/B/C/D] indicates the PIO within the group to which the pad is connected.

Some of these user-programmable pins are shared with special function pins. When not used

as special function pins, these pins can be programmed as I/Os for user logic.

During configuration of the user-programmable I/Os, the user has an option to tri-state the

I/Os and enable an internal pull-up, pull-down or buskeeper resistor. This option also applies

to unused pins (or those not bonded to a package pin). The default during configuration is for

user-programmable I/Os to be tri-stated with an internal pull-down resistor enabled. When

the device is erased, I/Os will be tri-stated with an internal pull-down resistor enabled. Some

pins, such as PROGRAMN and JTAG pins, default to tri-stated I/Os with pull-up resistors

enabled when the device is erased.

—

No connect.

GND

—

GND – Ground. Dedicated pins. It is recommended that all GNDs are tied together.

VCC

—

VCC – The power supply pins for core logic. Dedicated pins. It is recommended that all VCCs are

tied to the same supply.

VCCIOx

—

VCCIO – The power supply pins for I/O Bank x. Dedicated pins. It is recommended that all VCCIOs

located in the same bank are tied to the same supply.

PLL and Clock Functions (Used as user-programmable I/O pins when not used for PLL or clock pins)

[LOC]_GPLL[T, C]_IN

—

Reference Clock (PLL) input pads: [LOC] indicates location. Valid designations are L (Left PLL)

and R (Right PLL). T = true and C = complement.

[LOC]_GPLL[T, C]_FB

—

Optional Feedback (PLL) input pads: [LOC] indicates location. Valid designations are L (Left

PLL) and R (Right PLL). T = true and C = complement.

PCLK [n]_[2:0]

—

Primary Clock pads. One to three clock pads per side.

Test and Programming (Dual function pins used for test access port and during sysCONFIG™)

TMS

Test Mode Select input pin, used to control the 1149.1 state machine.

TCK

Test Clock input pin, used to clock the 1149.1 state machine.

TDI

Test Data input pin, used to load data into the device using an 1149.1 state machine.

TDO

Output pin – Test Data output pin used to shift data out of the device using 1149.1.

JTAGENB

Optionally controls behavior of TDI, TDO, TMS, TCK. If the device is configured to use the

JTAG pins (TDI, TDO, TMS, TCK) as general purpose I/O, then:

If JTAGENB is low: TDI, TDO, TMS and TCK can function a general purpose I/O.

If JTAGENB is high: TDI, TDO, TMS and TCK function as JTAG pins.

For more details, refer to MachXO3 Programming and Configuration Usage Guide (TN1279).

Configuration (Dual function pins used during sysCONFIG)

PROGRAMN

Initiates configuration sequence when asserted low. This pin always has an active pull-up.

INITN

I/O

Open Drain pin. Indicates the FPGA is ready to be configured. During configuration, a pull-up

is enabled.

DONE

I/O

Open Drain pin. Indicates that the configuration sequence is complete, and the start-up

sequence is in progress.

MCLK/CCLK

I/O

Input Configuration Clock for configuring an FPGA in Slave SPI mode. Output Configuration

Clock for configuring an FPGA in SPI and SPIm configuration modes.

Slave SPI active low chip select input.

CSSPIN

I/O

Master SPI active low chip select output.

SI/SPISI

I/O

Slave SPI serial data input and master SPI serial data output.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 71

Signal Name

I/O

Descriptions

SO/SPISO

I/O

Slave SPI serial data output and master SPI serial data input.

SCL

I/O

Slave I2C clock input and master I2C clock output.

SDA

I/O

Slave I2C data input and master I2C data output.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

72 FPGA-DS-02032-2.4

4.1. Pin Information Summary

Table 4.2. MachXO3L/LF-640 and MachXO3L/LF-1300

MachXO3L/

LF-640

MachXO3L/LF-1300

CSFBGA121

WLCSP36

CSFBGA121

CSFBGA256

CABGA256

General Purpose I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose Single Ended I/O

100

206

Differential I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose Differential I/O

103

Dual Function I/O

Number 7:1 or 8:1 Gearboxes

Number of 7:1 or 8:1 Output Gearbox Available (Bank 0)

Number of 7:1 or 8:1 Input Gearbox Available (Bank 2)

High-speed Differential Outputs

Bank 0

VCCIO Pins

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

VCC

GND

Reserved for Configuration

Total Count of Bonded Pins

121

256

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 73

Table 4.3. MachXO3L/LF-2100

MachXO3L/LF-2100

WLCSP49

CSFBGA121

CSFBGA256

CSFBGA324

CABGA256

CABGA324

General Purpose I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose Single Ended I/O

100

206

268

206

279

Differential I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose Differential I/O

103

131

103

140

Dual Function I/O

Number 7:1 or 8:1 Gearboxes

Number of 7:1 or 8:1 Output Gearbox Available

(Bank 0)

Number of 7:1 or 8:1 Input Gearbox Available

(Bank 2)

High-speed Differential Outputs

Bank 0

VCCIO Pins

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

VCC

GND

Reserved for Configuration

Total Count of Bonded Pins

121

256

324

256

324

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

74 FPGA-DS-02032-2.4

Table 4.4. MachXO3L/LF-4300

MachXO3L/LF-4300

WLCSP81

CSFBGA121

CSFBGA256

CSFBGA324

CABGA256

CABGA324

CABGA400

General Purpose I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose

Single Ended I/O

100

206

268

206

279

335

Differential I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose

Differential I/O

103

131

103

140

168

Dual Function I/O

Number 7:1 or 8:1 Gearboxes

Number of 7:1 or 8:1 Output

Gearboxes Available (Bank 0)

Number of 7:1 or 8:1 Input

Gearboxes Available (Bank 2)

High-speed Differential Outputs

Bank 0

VCCIO Pins

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

VCC

GND

Reserved for Configuration

Total Count of Bonded Pins

121

256

324

256

324

400

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 75

Table 4.5. MachXO3L/LF-6900

MachXO3L/LF-6900

CSFBGA256

CSFBGA324

CABGA256

CABGA324

CABGA400

General Purpose I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose Single Ended I/O

206

281

206

279

335

Differential I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose Differential I/O

103

140

103

140

168

Dual Function I/O

Number 7:1 or 8:1 Gearboxes

Number of 7:1 or 8:1 Output Gearbox Available (Bank 0)

Number of 7:1 or 8:1 Input Gearbox Available (Bank 2)

High-speed Differential Outputs

Bank 0

VCCIO Pins

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

VCC

GND

Reserved for Configuration

Total Count of Bonded Pins

256

324

256

324

400

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

76 FPGA-DS-02032-2.4

Table 4.6. MachXO3L/LF-9400C

MachXO3L/LF-9400C

CSFBGA256

CABGA256

CABGA400

CABGA484

General Purpose I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose Single Ended I/O

206

335

383

Differential I/O per Bank

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

Total General Purpose Differential I/O

103

168

192

Dual Function I/O

Number 7:1 or 8:1 Gearboxes

Number of 7:1 or 8:1 Output Gearbox Available (Bank 0)

Number of 7:1 or 8:1 Input Gearbox Available (Bank 2)

High-speed Differential Outputs

Bank 0

VCCIO Pins

Bank 0

Bank 1

Bank 2

Bank 3

Bank 4

Bank 5

VCC

GND

Reserved for Configuration

Total Count of Bonded Pins

256

400

484

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 77

5. MachXO3 Part Number Description

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

78 FPGA-DS-02032-2.4

6. Ordering Information

MachXO3L/LF devices have top-side markings as shown in the examples below, on the 256-Ball caBGA package with

MachXO3-6900 device in Commercial Temperature in Speed Grade 5. Notice that for the MachXO3LF device, LMXO3LF

is used instead of LCMXO3LF as in the Part Number.

LCMXO3L-6900C

5BG256C

Datecode

LMXO3LF-6900C

5BG256C

Datecode

Note: LCMXO3LF is marked

with LMXO3LF

Note: Markings are abbreviated for small packages. MachXO3L WLSC packages (UWG) are dual speed grade marked 5C-5I.

6.1. MachXO3L Ultra Low Power Commercial and Industrial Grade Devices,

Halogen Free (RoHS) Packaging

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-640E-5MG121C

640

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3L-640E-6MG121C

640

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3L-640E-5MG121I

640

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3L-640E-6MG121I

640

1.2 V

Halogen-Free csfBGA

121

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-1300E-5UWG36CTR

1300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-1300E-5UWG36CTR50

1300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-1300E-5UWG36CTR1K

1300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-1300E-5UWG36ITR

1300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3L-1300E-5UWG36ITR50

1300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3L-1300E-5UWG36ITR1K

1300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3L-1300E-5MG121C

1300

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3L-1300E-6MG121C

1300

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3L-1300E-5MG121I

1300

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3L-1300E-6MG121I

1300

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3L-1300E-5MG256C

1300

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-1300E-6MG256C

1300

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-1300E-5MG256I

1300

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-1300E-6MG256I

1300

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-1300C-5BG256C

1300

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-1300C-6BG256C

1300

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-1300C-5BG256I

1300

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3L-1300C-6BG256I

1300

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-2100E-5UWG49CTR

2100

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-2100E-5UWG49CTR50

2100

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-2100E-5UWG49CTR1K

2100

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-2100E-5UWG49ITR

2100

1.2 V

Halogen-Free WLCSP

IND

LCMXO3L-2100E-5UWG49ITR50

2100

1.2 V

Halogen-Free WLCSP

IND

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 79

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-2100E-5UWG49ITR1K

2100

1.2 V

Halogen-Free WLCSP

IND

LCMXO3L-2100E-5MG121C

2100

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3L-2100E-6MG121C

2100

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3L-2100E-5MG121I

2100

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3L-2100E-6MG121I

2100

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3L-2100E-5MG256C

2100

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-2100E-6MG256C

2100

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-2100E-5MG256I

2100

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-2100E-6MG256I

2100

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-2100E-5MG324C

2100

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3L-2100E-6MG324C

2100

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3L-2100E-5MG324I

2100

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3L-2100E-6MG324I

2100

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3L-2100C-5BG256C

2100

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-2100C-6BG256C

2100

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-2100C-5BG256I

2100

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3L-2100C-6BG256I

2100

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3L-2100C-5BG324C

2100

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3L-2100C-6BG324C

2100

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3L-2100C-5BG324I

2100

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3L-2100C-6BG324I

2100

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-4300E-5UWG81CTR

4300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-4300E-5UWG81CTR50

4300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-4300E-5UWG81CTR1K

4300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3L-4300E-5UWG81ITR

4300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3L-4300E-5UWG81ITR50

4300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3L-4300E-5UWG81ITR1K

4300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3L-4300E-5MG121C

4300

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3L-4300E-6MG121C

4300

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3L-4300E-5MG121I

4300

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3L-4300E-6MG121I

4300

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3L-4300E-5MG256C

4300

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-4300E-6MG256C

4300

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-4300E-5MG256I

4300

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-4300E-6MG256I

4300

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-4300E-5MG324C

4300

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3L-4300E-6MG324C

4300

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3L-4300E-5MG324I

4300

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3L-4300E-6MG324I

4300

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3L-4300C-5BG256C

4300

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-4300C-6BG256C

4300

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-4300C-5BG256I

4300

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3L-4300C-6BG256I

4300

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3L-4300C-5BG324C

4300

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3L-4300C-6BG324C

4300

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3L-4300C-5BG324I

4300

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

80 FPGA-DS-02032-2.4

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-4300C-6BG324I

4300

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3L-4300C-5BG400C

4300

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3L-4300C-6BG400C

4300

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3L-4300C-5BG400I

4300

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

LCMXO3L-4300C-6BG400I

4300

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-6900E-5MG256C

6900

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-6900E-6MG256C

6900

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-6900E-5MG256I

6900

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-6900E-6MG256I

6900

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-6900E-5MG324C

6900

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3L-6900E-6MG324C

6900

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3L-6900E-5MG324I

6900

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3L-6900E-6MG324I

6900

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3L-6900C-5BG256C

6900

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-6900C-6BG256C

6900

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-6900C-5BG256I

6900

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3L-6900C-6BG256I

6900

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3L-6900C-5BG324C

6900

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3L-6900C-6BG324C

6900

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3L-6900C-5BG324I

6900

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3L-6900C-6BG324I

6900

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3L-6900C-5BG400C

6900

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3L-6900C-6BG400C

6900

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3L-6900C-5BG400I

6900

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

LCMXO3L-6900C-6BG400I

6900

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-9400E-5MG256C

9400

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-9400E-6MG256C

9400

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3L-9400E-5MG256I

9400

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-9400E-6MG256I

9400

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3L-9400E-5BG256C

9400

1.2 V

Halogen-Free caBGA

256

COM

LCMXO3L-9400E-6BG256C

9400

1.2 V

Halogen-Free caBGA

256

COM

LCMXO3L-9400E-5BG256I

9400

1.2 V

Halogen-Free caBGA

256

IND

LCMXO3L-9400E-6BG256I

9400

1.2 V

Halogen-Free caBGA

256

IND

LCMXO3L-9400E-5BG400C

9400

1.2 V

Halogen-Free caBGA

400

COM

LCMXO3L-9400E-6BG400C

9400

1.2 V

Halogen-Free caBGA

400

COM

LCMXO3L-9400E-5BG400I

9400

1.2 V

Halogen-Free caBGA

400

IND

LCMXO3L-9400E-6BG400I

9400

1.2 V

Halogen-Free caBGA

400

IND

LCMXO3L-9400E-5BG484C

9400

1.2 V

Halogen-Free caBGA

484

COM

LCMXO3L-9400E-6BG484C

9400

1.2 V

Halogen-Free caBGA

484

COM

LCMXO3L-9400E-5BG484I

9400

1.2 V

Halogen-Free caBGA

484

IND

LCMXO3L-9400E-6BG484I

9400

1.2 V

Halogen-Free caBGA

484

IND

LCMXO3L-9400C-5BG256C

9400

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-9400C-6BG256C

9400

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3L-9400C-5BG256I

9400

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 81

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3L-9400C-6BG256I

9400

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3L-9400C-5BG400C

9400

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3L-9400C-6BG400C

9400

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3L-9400C-5BG400I

9400

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

LCMXO3L-9400C-6BG400I

9400

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

LCMXO3L-9400C-5BG484C

9400

2.5 V/3.3 V

Halogen-Free caBGA

484

COM

LCMXO3L-9400C-6BG484C

9400

2.5 V/3.3 V

Halogen-Free caBGA

484

COM

LCMXO3L-9400C-5BG484I

9400

2.5 V/3.3 V

Halogen-Free caBGA

484

IND

LCMXO3L-9400C-6BG484I

9400

2.5 V/3.3 V

Halogen-Free caBGA

484

IND

6.2. MachXO3LF Ultra Low Power Commercial and Industrial Grade Devices,

Halogen Free (RoHS) Packaging

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-640E-5MG121C

640

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3LF-640E-6MG121C

640

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3LF-640E-5MG121I

640

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3LF-640E-6MG121I

640

1.2 V

Halogen-Free csfBGA

121

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-1300E-5UWG36CTR

1300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-1300E-5UWG36CTR50

1300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-1300E-5UWG36CTR1K

1300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-1300E-5UWG36ITR

1300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-1300E-5UWG36ITR50

1300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-1300E-5UWG36ITR1K

1300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-1300E-5MG121C

1300

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3LF-1300E-6MG121C

1300

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3LF-1300E-5MG121I

1300

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3LF-1300E-6MG121I

1300

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3LF-1300E-5MG256C

1300

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-1300E-6MG256C

1300

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-1300E-5MG256I

1300

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-1300E-6MG256I

1300

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-1300C-5BG256C

1300

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-1300C-6BG256C

1300

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-1300C-5BG256I

1300

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-1300C-6BG256I

1300

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-2100E-5UWG49CTR

2100

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-2100E-5UWG49CTR50

2100

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-2100E-5UWG49CTR1K

2100

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-2100E-5UWG49ITR

2100

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-2100E-5UWG49ITR50

2100

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-2100E-5UWG49ITR1K

2100

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-2100E-5MG121C

2100

1.2 V

Halogen-Free csfBGA

121

COM

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

82 FPGA-DS-02032-2.4

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-2100E-6MG121C

2100

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3LF-2100E-5MG121I

2100

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3LF-2100E-6MG121I

2100

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3LF-2100E-5MG256C

2100

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-2100E-6MG256C

2100

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-2100E-5MG256I

2100

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-2100E-6MG256I

2100

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-2100E-5MG324C

2100

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3LF-2100E-6MG324C

2100

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3LF-2100E-5MG324I

2100

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3LF-2100E-6MG324I

2100

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3LF-2100C-5BG256C

2100

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-2100C-6BG256C

2100

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-2100C-5BG256I

2100

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-2100C-6BG256I

2100

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-2100C-5BG324C

2100

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3LF-2100C-6BG324C

2100

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3LF-2100C-5BG324I

2100

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3LF-2100C-6BG324I

2100

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-4300E-5UWG81CTR

4300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-4300E-5UWG81CTR50

4300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-4300E-5UWG81CTR1K

4300

1.2 V

Halogen-Free WLCSP

COM

LCMXO3LF-4300E-5UWG81ITR

4300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-4300E-5UWG81ITR50

4300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-4300E-5UWG81ITR1K

4300

1.2 V

Halogen-Free WLCSP

IND

LCMXO3LF-4300E-5MG121C

4300

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3LF-4300E-6MG121C

4300

1.2 V

Halogen-Free csfBGA

121

COM

LCMXO3LF-4300E-5MG121I

4300

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3LF-4300E-6MG121I

4300

1.2 V

Halogen-Free csfBGA

121

IND

LCMXO3LF-4300E-5MG256C

4300

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-4300E-6MG256C

4300

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-4300E-5MG256I

4300

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-4300E-6MG256I

4300

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-4300E-5MG324C

4300

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3LF-4300E-6MG324C

4300

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3LF-4300E-5MG324I

4300

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3LF-4300E-6MG324I

4300

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3LF-4300C-5BG256C

4300

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-4300C-6BG256C

4300

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-4300C-5BG256I

4300

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-4300C-6BG256I

4300

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-4300C-5BG324C

4300

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3LF-4300C-6BG324C

4300

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3LF-4300C-5BG324I

4300

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3LF-4300C-6BG324I

4300

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3LF-4300C-5BG400C

4300

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 83

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-4300C-6BG400C

4300

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3LF-4300C-5BG400I

4300

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

LCMXO3LF-4300C-6BG400I

4300

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-6900E-5MG256C

6900

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-6900E-6MG256C

6900

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-6900E-5MG256I

6900

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-6900E-6MG256I

6900

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-6900E-5MG324C

6900

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3LF-6900E-6MG324C

6900

1.2 V

Halogen-Free csfBGA

324

COM

LCMXO3LF-6900E-5MG324I

6900

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3LF-6900E-6MG324I

6900

1.2 V

Halogen-Free csfBGA

324

IND

LCMXO3LF-6900C-5BG256C

6900

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-6900C-6BG256C

6900

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-6900C-5BG256I

6900

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-6900C-6BG256I

6900

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-6900C-5BG324C

6900

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3LF-6900C-6BG324C

6900

2.5 V/3.3 V

Halogen-Free caBGA

324

COM

LCMXO3LF-6900C-5BG324I

6900

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3LF-6900C-6BG324I

6900

2.5 V/3.3 V

Halogen-Free caBGA

324

IND

LCMXO3LF-6900C-5BG400C

6900

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3LF-6900C-6BG400C

6900

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3LF-6900C-5BG400I

6900

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

LCMXO3LF-6900C-6BG400I

6900

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-9400E-5MG256C

9400

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-9400E-6MG256C

9400

1.2 V

Halogen-Free csfBGA

256

COM

LCMXO3LF-9400E-5MG256I

9400

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-9400E-6MG256I

9400

1.2 V

Halogen-Free csfBGA

256

IND

LCMXO3LF-9400E-5BG256C

9400

1.2 V

Halogen-Free caBGA

256

COM

LCMXO3LF-9400E-6BG256C

9400

1.2 V

Halogen-Free caBGA

256

COM

LCMXO3LF-9400E-5BG256I

9400

1.2 V

Halogen-Free caBGA

256

IND

LCMXO3LF-9400E-6BG256I

9400

1.2 V

Halogen-Free caBGA

256

IND

LCMXO3LF-9400E-5BG400C

9400

1.2 V

Halogen-Free caBGA

400

COM

LCMXO3LF-9400E-6BG400C

9400

1.2 V

Halogen-Free caBGA

400

COM

LCMXO3LF-9400E-5BG400I

9400

1.2 V

Halogen-Free caBGA

400

IND

LCMXO3LF-9400E-6BG400I

9400

1.2 V

Halogen-Free caBGA

400

IND

LCMXO3LF-9400E-5BG484C

9400

1.2 V

Halogen-Free caBGA

484

COM

LCMXO3LF-9400E-6BG484C

9400

1.2 V

Halogen-Free caBGA

484

COM

LCMXO3LF-9400E-5BG484I

9400

1.2 V

Halogen-Free caBGA

484

IND

LCMXO3LF-9400E-6BG484I

9400

1.2 V

Halogen-Free caBGA

484

IND

LCMXO3LF-9400C-5BG256C

9400

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-9400C-6BG256C

9400

2.5 V/3.3 V

Halogen-Free caBGA

256

COM

LCMXO3LF-9400C-5BG256I

9400

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-9400C-6BG256I

9400

2.5 V/3.3 V

Halogen-Free caBGA

256

IND

LCMXO3LF-9400C-5BG400C

9400

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

84 FPGA-DS-02032-2.4

Part Number

LUTs

Supply Voltage

Speed

Package

Leads

Temp.

LCMXO3LF-9400C-6BG400C

9400

2.5 V/3.3 V

Halogen-Free caBGA

400

COM

LCMXO3LF-9400C-5BG400I

9400

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

LCMXO3LF-9400C-6BG400I

9400

2.5 V/3.3 V

Halogen-Free caBGA

400

IND

LCMXO3LF-9400C-5BG484C

9400

2.5 V/3.3 V

Halogen-Free caBGA

484

COM

LCMXO3LF-9400C-6BG484C

9400

2.5 V/3.3 V

Halogen-Free caBGA

484

COM

LCMXO3LF-9400C-5BG484I

9400

2.5 V/3.3 V

Halogen-Free caBGA

484

IND

LCMXO3LF-9400C-6BG484I

9400

2.5 V/3.3 V

Halogen-Free caBGA

484

IND

  MachXO3 Family 
   Data Sheet 
© 2014-2019 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.  
All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice. 
FPGA-DS-02032-2.4    85 
References 
A variety of technical notes for the MachXO3 family are available on the Lattice web site. 
 MachXO3 sysCLOCK PLL Design and Usage Guide (TN1282)   
 Implementing High-Speed Interfaces with MachXO3 Devices (TN1281)   
 MachXO3 sysIO Usage Guide (TN1280)   
 MachXO3 Programming and Configuration Usage Guide (TN1279)   
 PCB Layout Recommendations for BGA Packages (FPGA-TN-02024)  
 Minimizing System Interruption During Configuration Using TransFR Technology (TN1087)   
 Boundary Scan Testability with Lattice sysIO Capability (AN8066)    
 MachXO3 Device Pinout File 
 Thermal Management (FPGA-TN-02044) 
 Lattice Design Tools 
 

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

86 FPGA-DS-02032-2.4

Revision History

Revision 2.4, February 2019

Section

Change Summary

Architecture

Updated Figure 2.12. Output Register Block Diagram (PIO on the Left, Top and Bottom

Edges) caption.

Revision 2.3, November 2018

Section

Change Summary

Architecture

Clarified PCI support in the following sections and tables:

 Programmable I/O Cells (PIC)Programmable I/O Cells (PIC)

 sysI/O Buffer

 Table 2.11. Supported Input Standards

 Table 2.12. Supported Output Standards

References

Updated PCB Layout Recommendations for BGA Packages document number to FPGA-TN-

02024.

Revision 2.2, October 2018

Section

Change Summary

Introduction

 Added Device Options to Table 1.1. MachXO3L/LF Family Selection Guide.

 Updated footnotes.

Architecture

General update to Table 2.11. Supported Input Standards

Ordering Information

 Corrected BG256 packages for 1300 LUT parts.

 Added information on dual marking for MachXO3L WLCS packages.

All

Minor formatting changes.

Revision 2.1, March 2018

Section

Change Summary

DC and Switching Characteristics

Removed extraneous TJAUTO specification from Table 3.2 Recommended Operating

Conditions.

Ordering Information

Restored MachXO3LF Ultra Low Power Commercial and Industrial Grade Devices, Halogen

Free (RoHS) Packaging section back to the Ordering Information section.

Revision History

Restored Revision History contents for Revision 1.6 and prior back to this Revision History

section.

Revision 2.0, January 2018

Section

Change Summary

All

 Applied new company template.

 Changed document number fron DS1047 to FPGA-DS-02032.

 Fixed various reference links.

DC and Switching Characteristics

 Added Programming/Erase Specifications section. Clarified Write/Erase cycle.

 Removed unnecessary C2 Dedicated Input Capacitance specification from the DC

Electrical Characteristics section.

 Added note to the NVCM/Flash Download Time section to clarify maximum tREFRESH

time.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 87

Revision 1.9, October 2017

Section

Change Summary

Introduction

 Updated Features section. Changed Advanced Packaging feature to “0.5 mm pitch: 640

to 9.4K LUT densities....”

 Updated Table 1.1, MachXO3L Family Selection Guide.

 Added footnotes to MachXO3L-6900/MachXO3LF-6900 and MachXO3L-

9400/MachXO3LF-9400 LUTs.

 Added UFM (kbits, MachXO3LF only) feature.

 Moved footnotes from packages to corresponding I/O values in 256- ball caBGA, 400-

ball caBGA and 484-ball caBGA.

 Updated footnote 2.

 Added footnotes 3 and 4.

Architecture

 Updated User Flash Memory (UFM) section. Changed feature to “Non-volatile storage

up to 448 kbits”.

 Updated Standby Mode and Power Saving Options section. Updated the title of TN1289

reference.

DC and Switching Characteristics

 Updated Absolute Maximum Ratings section. Added footnote 6.

 Updated Static Supply Current – C/E Devices section.

 Updated the title of TN1289 reference in footnote 1.

 Removed footnote 7. Updated Programming and Erase Supply Current – C/E Devices

section. Updated the title of TN1289 reference in footnote 1

Ordering Information

 Updated the MachXO3L Ultra Low Power Commercial and Industrial Grade Devices,

Halogen Free (RoHS) Packaging section. Added MachXO3L-9600E part numbers.

 Updated the MachXO3LF Ultra Low Power Commercial and Industrial Grade Devices,

Halogen Free (RoHS) Packaging section. Added MachXO3LF-9600E part numbers.

Revision 1.8, February 2017

Section

Change Summary

Architecture

 Updated Supported Standards section.

 Corrected “MDVS” to “MLDVS” in Table 2.11, Supported Input Standards.

DC and Switching Characteristics

 Updated ESD Performance section. Added reference to the MachXO2 Product Family

Qualification Summary document.

 Updated Static Supply Current – C/E Devices section. Added footnote 7.

 Updated MachXO3L/LF External Switching Characteristics – C/E Devices section.

 Populated values for MachXO3L/LF-9400.

 Under 7:1 LVDS Outputs – GDDR71_TX.ECLK.7:1, corrected “tDVB” to “tDIB” and

“tDVA” to “tDIA” and revised their descriptions.

 Added Figure 3-6, Receiver GDDR71_RX Waveforms and Figure 3-7, Transmitter

GDDR71_TX Waveforms.

Pinout Information

 Updated the Pin Information Summary section. Added MachXO3L/LF- 9600C packages.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

88 FPGA-DS-02032-2.4

Revision 1.7, May 2016

Section

Change Summary

DC and Switching Characteristics

 Updated Absolute Maximum Ratings section. Modified I/O Tri-state Voltage Applied

and Dedicated Input Voltage Applied footnotes.

 Updated sysI/O Recommended Operating Conditions section.

 Added standards.

 Added VREF (V)

 Added footnote 4.

 Updated sysI/O Single-Ended DC Electrical Characteristics section.

 Added I/O standards.

Ordering Information

 Updated MachXO3L Ultra Low Power Commercial and Industrial Grade Devices,

Halogen Free (RoHS) Packaging section. Added LCMXO3L- 9400C part numbers.

 Updated MachXO3LF Ultra Low Power Commercial and Industrial Grade Devices,

Halogen Free (RoHS) Packaging section. Added LCMXO3L- 9400C part numbers.

Revision 1.6, April 2016

Section

Change Summary

Introduction

 Updated Features section.

 Revised logic density range and I/O to LUT ratio under Flexible Architecture.

 Revised 0.8 mm pitch information under Advanced Packaging.

 Added MachXO3L-9400/MachXO3LF-9400 information to Table 1-1, MachXO3L/LF

Family Selection Guide.

 Updated Introduction section.

 Changed density from 6900 to 9400 LUTs.

 Changed caBGA packaging to 19 x 19 mm.

Architecture

 Updated Architecture Overview section.

 Changed statement to “All logic density devices in this family...”

 Updated Figure 2-2 heading and notes.

 Updated sysCLOCK Phase Locked Loops (PLLs) section.

 Changed statement to “All MachXO3L/LF devices have one or more sysCLOCK PLL.”

 Updated Programmable I/O Cells (PIC) section.

 Changed statement to “All PIO pairs can implement differential receivers.”

 Updated sysI/O Buffer Banks section. Updated Figure 2-5 heading.

 Updated Device Configuration section. Added Password and Soft Error Correction.

DC and Switching Characteristics

 Updated Static Supply Current – C/E Devices section. Added LCMXO3L/LF-9400C and

LCMXO3L/LF-9400E devices.

 Updated Programming and Erase Supply Current – C/E Devices section.

 Added LCMXO3L/LF-9400C and LCMXO3L/LF-9400E devices.

 Changed LCMXO3L/LF-640E and LCMXO3L/LF-1300E Typ. values.

 Updated MachXO3L/LF External Switching Characteristics – C/E Devices section. Added

MachXO3L/LF-9400 devices.

 Updated NVCM/Flash Download Time section. Added LCMXO3L/LF-9400C device.

 Updated sysCONFIG Port Timing Specifications section.

 Added LCMXO3L/LF-9400C device.

 Changed tINITL units to from ns to us.

 Changed tDPPINIT and tDPPDONE Max. values are per PCN#03A-16.

Pinout Information

Updated Pin Information Summary section. Added LCMXO3L/LF-9400C device.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 89

Section

Change Summary

Ordering Information

 Updated MachXO3 Part Number Description section.

 Added 9400 = 9400 LUTs.

 Added BG484 package.

 Updated MachXO3L Ultra Low Power Commercial and Industrial Grade Devices,

Halogen Free (RoHS) Packaging section. Added LCMXO3L-9400C part numbers.

 Updated MachXO3LF Ultra Low Power Commercial and Industrial Grade Devices,

Halogen Free (RoHS) Packaging section. Added LCMXO3L-9400C part numbers.

Revision 1.5, September 2015

Section

Change Summary

DC and Switching Characteristics

 Updated the MIPI D-PHY Emulation section. Revised Table 3-5, MIPI DPHY Output DC

Conditions.

 Revised RL Typ. value.

 Revised RH description and values.

 Updated the Maximum sysI/O Buffer Performance section. Revised MIPI Max. Speed

value.

 Updated the MachXO3L/LF External Switching Characteristics – C/E Devices section.

Added footnotes 14 and 15.

Revision 1.4, August 2015

Section

Change Summary

Architecture

Updated the Device Configuration section. Added JTAGENB to TAP dual purpose pins.

Ordering Information

Updated the top side markings section to indicate the use of LMXO3LF for the LCMXO3LF

device.

Revision 1.3, March 2015

Section

Change Summary

All

General update. Added MachXO3LF devices.

Revision 1.2, August 2015

Section

Change Summary

Introduction

Updated Table 1-1, MachXO3L Family Selection Guide. Revised XO3L-2100 and XO3L-4300

I/O for 324-ball csfBGA package.

Architecture

Updated the Dual Boot section. Corrected information on where the primary bitstream and

the golden image must reside.

DC and Switching Characteristics

 Updated the BLVDS section. Changed output impedance nominal values in Table 3-2,

BLVDS DC Condition.

 Updated the LVPECL section. Changed output impedance nominal value in Table 3-3,

LVPECL DC Condition.

 Updated the sysCONFIG Port Timing Specifications section. Updated INITN low time

values.

Pinout Information

 Changed General Purpose I/O Bank 5 values for MachXO3L-2100 and MachXO3L-4300

CSFBGA 324 package.

 Changed Number 7:1 or 8:1 Gearboxes for MachXO3L-640 and MachXO3L-1300.

 Removed DQS Groups (Bank 1) section.

 Changed VCCIO Pins Bank 1 values for MachXO3L-1300, MachXO3L-2100, MachXO3L-

4300 and MachXO3L-6900 CSFBGA 256 package.

 Changed GND values for MachXO3L-1300, MachXO3L-2100, MachXO3L-4300 and

MachXO3L-6900 CSFBGA 256 package.

 Changed NC values for MachXO3L-2100 and MachXO3L-4300 CSFBGA 324 package.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

90 FPGA-DS-02032-2.4

Revision 1.1, July 2014

Section

Change Summary

DC and Switching Characteristics

 Updated the Static Supply Current – C/E Devices section. Added devices.

 Updated the Programming and Erase Supply Current – C/E Device section. Added

devices.

 Updated the sysI/O Single-Ended DC Electrical Characteristics section. Revised footnote

 Added the NVCM Download Time section.

 Updated the Typical Building Block Function Performance – C/E Devices section. Added

information to footnote.

Pinout Information

Updated the Pin Information Summary section.

Ordering Information

 Updated the MachXO3L Part Number Description section. Added packages.

 Updated the Ordering Information section. General update.

Revision 1.0, June 2014

Section

Change Summary

Introduction

 Updated Features section.

 Updated Table 1-1, MachXO3L Family Selection Guide. Changed fcCSP packages to

csfBGA. Adjusted 121-ball csfBGA arrow.

 Introduction section general update.

Architecture

General update.

DC and Switching Characteristics

 Updated sysI/O Recommended Operating Conditions section. Removed VREF (V)

column. Added standards.

 Updated Maximum sysI/O Buffer Performance section. Added MIPI I/O standard.

 Updated MIPI D-PHY Emulation section. Changed Low Speed to Low Power. Updated

Table 3-4, MIPI DC Conditions.

 Updated Table 3-5, MIPI D-PHY Output DC Conditions.

 Updated Maximum sysI/O Buffer Performance section.

 Updated MachXO3L External Switching Characteristics – C/E Device section.

Revision 00.3, May 2014

Section

Change Summary

Introduction

 Updated Features section.

 Updated Table 1-1, MachXO3L Family Selection Guide. Moved 121-ball fcCSP arrow.

 General update of Introduction section.

Architecture

General update.

Pinout Information

Updated Pin Information Summary section. Updated or added data on WLCSP49, WLCSP81,

CABGA324, and CABGA400 for specific devices.

Ordering Information

 Updated MachXO3L Part Number Description section. Updated or added data on

WLCSP49, WLCSP81, CABGA324, and CABGA400 for specific devices.

 Updated Ultra Low Power Commercial and Industrial Grade Devices, Halogen Free

(RoHS) Packaging section. Added part numbers.

 Revision 00.2, February 2014

 DC and Switching Characteristics section:

 Updated MachXO3L External Switching Characteristics – C/E Devices table. Removed

LPDDR and DDR2 parameters.

MachXO3 Family

Data Sheet

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.4 91

Revision 00.2, February 2014

Section

Change Summary

DC and Switching Characteristics

Updated MachXO3L External Switching Characteristics – C/E Devices table. Removed LPDDR

and DDR2 parameters.

Revision 00.1, February 2014

Section

Change Summary

All

Initial release.