MA4L101-186 - M/A-COM Technology Solutions, Inc.

MA4L Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Silicon PIN Limiter Diodes V16

Features

♦ Low Insertion Loss and Noise Figure

♦ High Peak and Average Operating Power

♦ Various P1dB Compression Powers

♦ Low Flat Leakage Power

♦ Proven Reliable, Silicon Nitride Passivation

♦ RoHS Compliant

Description

M/A-COM Technology Solutions manufactures a series of

silicon PIN limiter diodes with small and medium I-region

lengths which are specifically designed for high signal

applications. The devices are designed to provide low

insertion loss, at zero bias, as well as low flat leakage

power with fast signal response/recovery times. Parts are

available as discrete die or assembled into a variety of

surface mount or ceramic pill packages. See the Table 1

Available Case Style table on page 6 for the specific ce-

ramic package styles and their availability for individual

part numbers.

Applications

The MA4L Series of PIN limiter diodes are designed for

use in passive limiter control circuits to protect sensitive

receiver components such as low noise amplifiers (LNA),

detectors, and mixers covering the 10 MHz to 18 GHz

frequency range.

Parameter Absolute Maximum

Forward Current 100mA

Operating Temperature -55°C to +125°C

Storage Temperature -55°C to +150°C

Junction Temperature +175°C

RF Peak & C.W. Incident Power Per Performance Table

Mounting Temperature +320°C for 10 sec.

Absolute Maximum Ratings1 TAMB = 25°C

(Unless otherwise specified)

Note:

1. Exceeding any of the above ratings may cause

permanent damage.

ODS Dimension mils mm

A 15 ± 2 .381 ± .51

B 7 ±1* .178 ± .025

134

Anode

A Square

Full Area Cathode

Chip Outline

*Note:

The MADL-000301-01340W, MADL-000301-13870G,

MA4L401-134 and MADL-000401-13870G, “B” dimension,

is 10 ±1 mils

MA4L Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Silicon PIN Limiter Diodes V16

Un-Packaged Die Electrical Specifications at TAMB = 25°C

Minimum

Reverse

Voltage

@10 µA

Maximum

Reverse

Voltage

@ 10 µA

Minimum

Cj0V

@ 1 MHz

Maximum

Cj0V

@ 1 MHz

Maximum

RS 10mA

@ 500 MHz

Ohms1

Nominal Characteristics

Carrier

Lifetime

IFOR =10mA

IREV = -6mA

nS1

I-Region

Thickness

µm

Contact

Diameter

mils

Thermal

Resistance

°C/W1

MA4L011-134 15 35 0.08 0.18 2.10 10 2 1.2 175

MA4L021-134 20 35 0.10 0.20 2.10 10 2 1.2 175

MA4L022-134 20 35 0.09 0.19 2.00 10 2 1.2 175

MA4L031-134 30 50 0.14 0.21 2.00 20 3 1.4 150

MA4L032-134 30 50 0.13 0.20 2.50 15 3 1.5 150

MA4L062-134 60 75 0.07 0.15 2.50 70 4 1.5 150

MA4L101-134 100 0.15 2.00 90 13 3.5 30

MA4L401-134 250 0.30 1.20 800 25 4.5 25

Part Number

MADL-000301-01340W 200 0.20 1.50 200 20 3.0 30

*Nominal High Signal Performance at TAMB = 25°C

Part Number

Incident Peak

Power for

1dB Limiting

9.4GHz

dBm

Incident Peak

Power for

10dB Limiting

9.4GHz

dBm

Incident Peak

Power for

15dB Limiting

9.4GHz

dBm

Recovery Time

(3 dB)

50W Peak Power

Maximum

Incident

Peak Power

Watts

Maximum CW

Input Power

Watts

MA4L011-134 7 30 40 10 80 2

MA4L021-134 8 31 41 15 90 3

MA4L022-134 8 31 41 15 90 3

MA4L031-134 10 33 43 25 125 4

MA4L032-134 11 34 44 25 125 4

MA4L062-134 15 38 50 75 200 5

MA4L101-134 20 45 53 100 250 6

MA4L401-134 30 52 60 250 1000 10

MADL-000301-01340W 23 46 59 50 500 7

*See page 3 for high signal performance parameter notes.

Note:

1. Test performed with the chip mounted in an ODS-30 package.

MA4L Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Silicon PIN Limiter Diodes V16

Typical High Signal Peak Power Performance in a Single Shunt 50Ω Circuit

High Signal Performance: Measured in a single shunt diode (die) configuration attached directly to the gold

plated RF ground of a 50Ω, SMA connectorized, test fixture using 2 mil thick conductive silver epoxy . Chip an-

ode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick Rogers

5880 Duroid microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz, RF pulse width =

1.0 µS, 0.001% duty cycle.

Typical Peak Power Performance for Single Shunt Limiter Diode in 50 Ohm System

at 9.4 GHz, 1uS Pulse Width, 0.001 Duty

0 1020304050

Pin ( dBm )

Pout ( dBm )

MA4L011-134, MA4L021-134, MA4L022-134

MA4L031-134, MA4L032-134

MA4L062-134

MA4L101-134

MA4L401-132

20 dB Loss

Line

10 dB Loss

Line

30 dB Loss

Line

0 dB Loss

Line

*Refer to Note 3

Frequency = 9.4GHz, Pulse Width = 1µS, Duty Cycle = .001%

MA4L Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Silicon PIN Limiter Diodes V16

Application Circuits

Typical +60dBm Peak Power, 1µS P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit

RF Output

MA4L401-134

RF Input

MA4L101-134 MA4L032-134

Coil: D.C. Return

Transmission Line: 90º @ Fo Transmission Line: 90º @ Fo

RF Output

MA4L032-134

RF Input

MA4L022-134

Coil: D.C. Return

Transmission Line: 90º @ Fo

Typical +50dBm Peak Power, 1µS P.W., 0.001% Duty Cycle, +20dBm Flat Leakage Limiter Circuit

MA4L Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Silicon PIN Limiter Diodes V16

Notes for Specification and Nominal High Signal Performance Tables:

1) Maximum Series Resistance: RS, is measured at 500 MHz in the ODS-30 package and is equivalent to the

total diode resistance: RS = Rj (Chip Junction Resistance) + RO (Package Ohmic Resistance)

2) Nominal C.W. Thermal Resistance: ӨTH is measured in a ceramic pill package, ODS-30, mounted to a

metal (infinite) heatsink. Chip only thermal resistance values are approximately 2°C/W less than the ODS-30

listed package values in the specifications table.

3) Maximum High Signal Performance: Measured with a single shunt diode (die) attached directly to the gold

plated RF housing ground with 2 mil thick conductive silver epoxy in a 50Ω, SMA, connectorized test fixture.

Chip anode contact is thermo-compression wire bonded using a 1 mil. diameter gold wire onto a 7.2 mil thick

Rogers 5880 Duroid microstrip trace. A shunt coil provides the D.C. return. Test frequency = 9.4 GHz,

RF pulse width = 1.0 µS, Duty Cycle = 0.001%.

4) Maximum C.W. Incident Power: Measured in a 50Ω, SMA, connectorized housing @ 4GHz utilizing a TWT

amplifier and the same single diode assembly configuration as stated in Note 3 above.

Die Handling and Mounting Information

Handling: All semiconductor chips should be handled with care in order to avoid damage or contamination

from perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up

tools is strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized.

Die Attach: The die have Ti-Pt-Au back and anode metal, with a final gold thickness of 1.0µm. Die can be

mounted with a gold-tin, eutectic solder perform or conductive silver epoxy. The metal RF and D.C. ground plane

mounting surface must be free of contamination and should have a surface flatness or < ± 0.002”.

• Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold / tin eutectic solder perform is

recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot

gas is applied, the temperature at the tool tip should be approximately 290°C. The chip should not be

exposed to a temperatures in excess of 320°C for more than 10 seconds.

• Eutectic Die Attachment Using Reflow Oven: Refer to Application Note M538, “Surface Mounting

Instructions”.

• Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied,

approximately 1-2 mils thick to minimize ohmic and thermal resistances. A small epoxy fillet should be visible

around the outer perimeter of the chip after placement to ensure full area coverage. Cure the conductive

silver epoxy per the manufacturer’s schedule, typically 150˚C for 1 hour.

Wire Bonding: The chip’s anode metallization stack is comprised of Ti/Pt/Au with a final gold thickness of

1.0µm. Thermo-compression wedge bonding using a .7 to 1 mil diameter gold wire is recommended, depending

on the contact diameter. The heat stage temperature should be set to approximately 200°C with a bonding tip

temperature of 125˚C and a force of 18 to 40 grams. Use of ultrasonic energy is not advised but if necessary it

should be adjusted to the minimum required to achieve a good bond. Excessive energy or force applied to the top

contact will cause the metallization to dislodge and lift off. Automatic ball bonding may also be used.

See Application Note M541, “Bonding and Handling Procedures for Chip Diode Devices” for more detailed handling and

assembly information.

MA4L Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Silicon PIN Limiter Diodes V16

Part Numbering and Ordering Inform ation

When ordering die only: Use the base part number followed by, –134.

For example: The chip versio n of base part number MA4L021 is MA4L021-134

Note: When ordering the MADL-000301-01340W or any of the chips with flying leads use the base part number only.

When ordering packaged parts: Use the base part number followed by a dash plus the desired package style suffix as

defined in Table I “Available Case Styles” below.

For example: The MA4L011- 134 die in the 186 style package becomes MA4L011-186.

Note: When ordering the MADL-000062-105600 use the base part number only.

Base Part Available Package Styles

MA4L011 30, 31, 32, 54, 134, 137,186, 1056, 1088

MADL-000011-13880G 13880G (MA4L011-134 chip with flying lead s)

MA4L021 31, 120, 134, 1056

MA4L022 30, 32, 120, 134, 137, 186, 1056

MA4L031 31, 36, 134, 186, 1056

MADL-000031-13880G 13880G (MA4L031-134 chip with flying lead s)

MA4L032 31, 32, 134, 186, 1056

MADL-000032-13880G 13880G (MA4L032-134 chip with flying leads)

MA4L062 134

MADL-000062-105600 1056 (Uses MA4L062 chip)

MADL-000062-13880G 13880G (MA4L062-134 chip with flying leads)

MA4L101 30, 134, 186

MADL-000101-13880G 13880G (MA4L101-134 chi p with flying leads)

MA4L301 31,1249, 1056

MADL-000301-01340W 134 (MA4L301 chip)

MADL-000301-13870G 13870G (MA4L301-134 chip with flying leads)

MA4L401 30, 31, 120,134, 1056

MADL-000401-13870G 13870G (MA4L401-134 chip with flying leads)

Table 1 Available Case Styles

Package dimensions can be found on the M/A-COM Technology Solutions website under Out line Drawings

31,32 137 1056 1249

30 134

Chip

120 186 1088 13870G

13880G

Chip with

Flying Leads

Note: The capacitance values in the specification table on page 2 applies to the junction capacitance of the chip. The total

capacitance for the same chip in an alternative package is computed by adding the junction capacitance of the chip plus the

parasitic capacitance of the alternative package as defined in Table 1 Associated Pack age Parasitics on page 7.

MA4L Series

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

Silicon PIN Limiter Diodes V16

Package Description

Nominal

CPKG

30 Ceramic Pill 0.18 0.60

31 Ceramic Pill 0.18 0.60

32 Ceramic Pill 0.30 0.40

134 Chip N/A N/A

137 Epoxy Encapsulated Ceramic Surface Mount with Leads 0.14 0.70

186 Ceramic Surface Mount with Leads 0.15 0.70

1056 Ceramic Surface Mount with Wrap Around Contacts 0.20 0.70

1088 Epoxy Encapsulated Ceramic Surface Mount with Leads 0.12 0.70

Package

Style

120 Ceramic Pill 0.13 0.40

1249 Epoxy Encapsulated Ceramic Surface Mount with Wrap Around Contacts 0.12 0.70

13870G Chip with Flying Leads - -

13880G Chip with Flying Leads - -

Table 1 Associated Package Parasitics