SPEC NO: DSAC0240 REV NO: V.1 DATE:NOV/12/2002 PAGE: 1 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN: F.Y.YUAN
3.2X1.6mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
Features
!3.2mmX1.6mm SMT LED, 1.1mm THICKNESS.
!LOW POWER CONSUMPTION.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE :2000PCS / REEL.
Package Dimensions
APK3216PWC WHITE
Description
The source color devices are made with InGaN
on SiC Light Emitting Diode.
SPEC NO: DSAC0240 REV NO: V.1 DATE:NOV/12/2002 PAGE: 2 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN: F.Y.YUAN
Electrical / Optical Characteristics at T)=25°°
°°
°C
Absolute Maximum Ratings at T)=25°°
°°
°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
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SPEC NO: DSAC0240 REV NO: V.1 DATE:NOV/12/2002 PAGE: 3 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN: F.Y.YUAN
White APK3216PWC
APK3216PWC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
SPEC NO: DSAC0240 REV NO: V.1 DATE:NOV/12/2002 PAGE: 4 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN: F.Y.YUAN
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
