KIT ATION EVALU E L B AVAILA 19-3531; Rev 0; 12/04 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch Features The MAX9996 high-linearity downconversion mixer provides 8.3dB gain, +26.5dBm IIP3, and 9.7dB NF for 1700MHz to 2200MHz UMTS/WCDMA, DCS, and PCS base-station receiver applications. With a 1900MHz to 2400MHz LO frequency range, this particular mixer is ideal for high-side LO injection receiver architectures. Low-side LO injection is supported by the MAX9994, which is pin-for-pin and functionally compatible with the MAX9996. In addition to offering excellent linearity and noise performance, the MAX9996 also yields a high level of component integration. This device includes a doublebalanced passive mixer core, an IF amplifier, a dualinput LO selectable switch, and an LO buffer. On-chip baluns are also integrated to allow for single-ended RF and LO inputs. The MAX9996 requires a nominal LO drive of 0dBm, and supply current is guaranteed to be below 240mA. 1700MHz to 2200MHz RF Frequency Range 1900MHz to 2400MHz LO Frequency Range (MAX9996) 1400MHz to 2000MHz LO Frequency Range (MAX9994) 40MHz to 350MHz IF Frequency Range 8.3dB Conversion Gain +26.5dBm Input IP3 +12.6dBm Input 1dB Compression Point 9.7dB Noise Figure 72dBc 2LO-2RF Spurious Rejection at PRF = -10dBm Integrated LO Buffer Integrated RF and LO Baluns for Single-Ended Inputs Low -3dBm to +3dBm LO Drive Built-In SPDT LO Switch with 43dB LO1 to LO2 Isolation and 50ns Switching Time Pin Compatible with MAX9984/MAX9986 815MHz to 995MHz Mixers Functionally Compatible with MAX9993 External Current-Setting Resistors Provide Option for Operating Mixer in Reduced Power/Reduced Performance Mode Lead-Free Package Available The MAX9994/MAX9996 are pin compatible with the MAX9984/MAX9986 815MHz to 995MHz mixers, making this entire family of downconverters ideal for applications where a common PC board layout is used for both frequency bands. The MAX9996 is also functionally compatible with the MAX9993. The MAX9996 is available in a compact, 20-pin, thin QFN package (5mm x 5mm) with an exposed paddle. Electrical performance is guaranteed over the extended -40C to +85C temperature range. Ordering Information Applications UMTS/WCDMA Base Stations PART TEMP RANGE PIN-PACKAGE DCS1800/PCS1900 EDGE Base Stations cdmaOneTM and cdma2000(R) Base Stations PHS/PAS Base Stations Predistortion Receivers Fixed Broadband Wireless Access MAX9996ETP -40C to +85C 20 Thin QFN-EP* T2055-3 5mm x 5mm MAX9996ETP-T -40C to +85C 20 Thin QFN-EP* T2055-3 5mm x 5mm MAX9996ETP+D -40C to +85C 20 Thin QFN-EP* T2055-3 5mm x 5mm MAX9996ETP+TD -40C to +85C 20 Thin QFN-EP* T2055-3 5mm x 5mm Wireless Local Loop Private Mobile Radios Military Systems Microwave Links PKG CODE *EP = Exposed paddle. + = Lead free. D = Dry pack. T = Tape-and-reel. Digital and Spread-Spectrum Communication Systems cdma2000 is a registered trademark of Telecommunications Industry Association. cdmaOne is a trademark of CDMA Development Group. Pin Configuration/Functional Diagram and Typical Application Circuit appear at end of data sheet. ________________________________________________________________ Maxim Integrated Products For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 1 MAX9996 General Description MAX9996 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch ABSOLUTE MAXIMUM RATINGS JA .................................................................................+38C/W JC .................................................................................+13C/W Operating Temperature Range (Note A) ....TC = -40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C VCC to GND ...........................................................-0.3V to +5.5V IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V) TAP ........................................................................-0.3V to +1.4V LO1, LO2, LEXT to GND........................................-0.3V to +0.3V RF, LO1, LO2 Input Power .............................................+12dBm RF (RF is DC shorted to GND through a balun) .................50mA Continuous Power Dissipation (TA = +70C) 20-Pin Thin QFN-EP (derate 26.3mW/C above +70C)...........2.1W Note A: TC is the temperature on the exposed paddle of the package. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS (MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through inductive chokes, R1 = 806, R2 = 549, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, TC = +25C, unless otherwise noted.) PARAMETER SYMBOL Supply Voltage VCC Supply Current ICC LO_SEL Input-Logic Low VIL LO_SEL Input-Logic High VIH CONDITIONS MIN TYP MAX UNITS 4.75 5.00 5.25 V 206 240 mA 0.8 V 2 V AC ELECTRICAL CHARACTERISTICS (MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1900MHz to 2400MHz, fIF = 200MHz, fLO > fRF, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 2100MHz, fIF = 200MHz, TC = +25C, unless otherwise noted.) (Notes 1, 2) PARAMETER RF Frequency Range LO Frequency Range SYMBOL fRF fLO IF Frequency Range fIF Conversion Gain GC Input Third-Order Intercept Point Input IP3 Variation Over Temperature 2 MIN TYP MAX UNITS MHz (Note 3) 1700 2200 (Note 3) 1900 2400 MAX9994 1400 2000 40 PRF < +2dBm, TA = +25C 7.0 8.3 MHz 350 MHz 9.0 dB TC = -40C to +85C 0.75 dB P1dB (Note 4) 12.6 dBm IIP3 Two tones: fRF1 = 2000MHz, fRF2 = 2001MHz, PRF = -5dBm/tone, fLO = 2200MHz, PLO = 0dBm, TA = +25C 26.5 dBm 0.5 dB Gain Variation Over Temperature Input Compression Point CONDITIONS TC = -40C to +85C 23.5 _______________________________________________________________________________________ SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch (MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50 sources, PLO = -3dBm to +3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1900MHz to 2400MHz, fIF = 200MHz, fLO > fRF, TC = -40C to +85C, unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 2100MHz, fIF = 200MHz, TC = +25C, unless otherwise noted.) (Notes 1, 2) PARAMETER Noise Figure SYMBOL NF Noise Figure Under-Blocking CONDITIONS MIN TYP Single sideband 9.7 dB 19 dB -3 2LO-2RF Spurious Response at IF 3x3 UNITS PRF = 5dBm, fRF = 2000MHz, fLO = 2190MHz, fBLOCK = 2100MHz (Note 5) LO Drive 2x2 MAX 3LO-3RF +3 PRF = -10dBm 72 PRF = -5dBm 67 PRF = -10dBm 87 PRF = -5dBm 77 dBm dBc LO2 selected, 1900MHz < fLO < 2100MHz 49 LO1 selected, 1900MHz < fLO < 2100MHz 43 Maximum LO Leakage at RF Port PLO = +3dBm -20 dBm Maximum LO Leakage at IF Port PLO = +3dBm -30 dBm 40 dB 50 ns 15 dB LO1 to LO2 Isolation Minimum RF-to-IF Isolation LO Switching Time 50% of LOSEL to IF settled to within 2 RF Port Return Loss LO1/2 port selected, LO2/1 and IF terminated 16 LO1/2 port unselected, LO2/1 and IF terminated 26 LO driven at 0dBm, RF terminated into 50, differential 200 20 dB LO Port Return Loss IF Port Return Loss Note 1: Note 2: Note 3: Note 4: Note 5: dB dB Guaranteed by design and characterization. All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit. Operation outside this range is possible, but with degraded performance of some parameters. Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm. Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021. _______________________________________________________________________________________ 3 MAX9996 AC ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.) CONVERSION GAIN vs. RF FREQUENCY TC = +85C TC = +25C MAX9996 toc02 9 PLO = -3dBm, 0dBm, +3dBm 8 7 1700 1900 2100 INPUT IP3 vs. RF FREQUENCY 27 INPUT IP3 (dBm) 25 TC = -25C 2100 2300 1500 TC = +85C 1700 1900 2100 2300 RF FREQUENCY (MHz) INPUT IP3 vs. RF FREQUENCY INPUT IP3 vs. RF FREQUENCY 26 24 1900 28 MAX9996 toc05 TC = +25C 1700 28 MAX9996 toc04 27 VCC = 4.75V, 5.0V, 5.25V RF FREQUENCY (MHz) RF FREQUENCY (MHz) 28 8 6 1500 2300 26 27 INPUT IP3 (dBm) 1500 9 7 6 6 INPUT IP3 (dBm) 10 25 PLO = -3dBm, 0dBm, +3dBm 24 VCC = 4.75V, 5.0V MAX9996 toc06 8 CONVERSION GAIN vs. RF FREQUENCY 11 CONVERSION GAIN (dB) 9 7 10 CONVERSION GAIN (dB) CONVERSION GAIN (dB) MAX9996 toc01 TC = -25C 10 11 MAX9996 toc03 CONVERSION GAIN vs. RF FREQUENCY 11 26 25 VCC = 5.25V 24 23 23 23 22 22 21 1900 2100 1500 2300 RF FREQUENCY (MHz) 9 TC = -25C PLO = 0dBm PLO = -3dBm 11 NOISE FIGURE (dB) TC = +25C 10 8 1500 2300 1700 1900 2100 2300 RF FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY TC = +85C 11 2100 12 MAX9996 toc07 12 1900 RF FREQUENCY (MHz) NOISE FIGURE vs. RF FREQUENCY 13 1700 NOISE FIGURE vs. RF FREQUENCY 12 VCC = 5.25V 11 NOISE FIGURE (dB) 1700 MAX9996 toc08 1500 10 PLO = +3dBm 9 8 10 MAX9996 toc09 22 NOISE FIGURE (dB) MAX9996 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch VCC = 5.0V VCC = 4.75V 9 8 7 7 6 1500 1700 1900 2100 RF FREQUENCY (MHz) 4 2300 7 1500 1700 1900 2100 RF FREQUENCY (MHz) 2300 1500 1700 1900 2100 RF FREQUENCY (MHz) _______________________________________________________________________________________ 2300 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 65 60 55 75 50 70 65 60 PLO = -3dBm 55 45 1900 2100 2300 RF FREQUENCY (MHz) 85 80 75 70 TC = +25C 65 1900 2100 PRF = -5dBm 90 TC = -25C 60 1500 2100 80 75 70 PLO = -3dBm, 0dBm, +3dBm 65 PRF = -5dBm 90 80 75 70 VCC = 5.0V 65 VCC = 5.25V 1700 1900 2100 2300 1500 INPUT P1dB (dBm) 14 TC = +25C TC = -25C 1900 2100 2300 INPUT P1dB vs. RF FREQUENCY 15 MAX9996 toc17 15 1700 RF FREQUENCY (MHz) INPUT P1dB vs. RF FREQUENCY 13 12 85 RF FREQUENCY (MHz) MAX9996 toc16 TC = +85C VCC = 4.75V 55 INPUT P1dB vs. RF FREQUENCY 14 2300 60 RF FREQUENCY (MHz) 15 2100 3LO-3RF RESPONSE vs. RF FREQUENCY 85 1500 2300 1900 95 VCC = 5.25V 14 INPUT P1dB (dBm) 1900 1700 RF FREQUENCY (MHz) 55 1700 VCC = 4.75V 55 2300 60 55 1500 60 3LO-3RF RESPONSE vs. RF FREQUENCY 3LO-3RF RESPONSE (dBc) 3LO-3RF RESPONSE (dBc) TC = +85C 1700 95 MAX9996 toc13 PRF = -5dBm 90 VCC = 5.0V 65 RF FREQUENCY (MHz) 3LO-3RF RESPONSE vs. RF FREQUENCY 95 VCC = 5.25V 70 45 1500 3LO-3RF RESPONSE (dBc) 1700 MAX9996 toc14 1500 75 50 50 45 INPUT P1dB (dBm) MAX9996 toc11 PLO = 0dBm TC = -25C PRF = -5dBm 80 MAX9996 toc15 70 PLO = +3dBm 13 PLO = -3dBm, 0dBm, +3dBm 12 MAX9996 toc18 TC = +25C 2LO-2RF RESPONSE vs. RF FREQUENCY 85 2LO-2RF RESPONSE (dBc) TC = +85C 75 PRF = -5dBm 80 2LO-2RF RESPONSE (dBc) 2LO-2RF RESPONSE (dBc) MAX9996 toc10 PRF = -5dBm 80 2LO-2RF RESPONSE vs. RF FREQUENCY 85 MAX9996 toc12 2LO-2RF RESPONSE vs. RF FREQUENCY 85 13 VCC = 5.0V 12 VCC = 4.75V 11 11 10 11 10 1500 1700 1900 2100 RF FREQUENCY (MHz) 2300 10 1500 1700 1900 2100 RF FREQUENCY (MHz) 2300 1500 1700 1900 2100 2300 RF FREQUENCY (MHz) _______________________________________________________________________________________ 5 MAX9996 Typical Operating Characteristics (continued) (MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.) Typical Operating Characteristics (continued) (MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.) LO SWITCH ISOLATION vs. LO FREQUENCY TC = +25C 35 40 PLO = -3dBm, 0dBm, +3dBm 35 30 30 1900 2100 2300 LO LEAKAGE AT IF PORT vs. LO FREQUENCY 2300 2500 1700 -40 -45 PLO = +3dBm -35 -40 PLO = 0dBm -45 -50 TC = +25C -60 -25 1900 2100 2300 2500 -35 -40 VCC = 4.75V PLO = -3dBm -50 -55 1700 1900 2100 2300 2500 1700 1900 2100 2300 LO FREQUENCY (MHz) LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY LO LEAKAGE AT RF PORT vs. LO FREQUENCY -30 MAX9996 toc26 -15 -20 -25 2100 2300 LO FREQUENCY (MHz) 2500 2500 -15 VCC = 5.25V -20 VCC = 4.75V -25 VCC = 5.0V PLO = -3dBm, 0dBm, +3dBm -30 -30 1900 -10 LO LEAKAGE AT RF PORT (dBm) TC = -25C, +25C, +85C -10 LO LEAKAGE AT RF PORT (dBm) MAX9996 toc25 -20 1700 VCC = 5.0V LO FREQUENCY (MHz) -15 -25 VCC = 5.25V -30 LO FREQUENCY (MHz) -10 2500 -45 -60 1700 2300 -20 -55 TC = +85C 2100 LO LEAKAGE AT IF PORT vs. LO FREQUENCY LO LEAKAGE (dBm) -35 1900 LO FREQUENCY (MHz) -30 LO LEAKAGE (dBm) LO LEAKAGE (dBm) 2100 -25 -50 6 1900 -20 -30 -55 35 LO LEAKAGE AT IF PORT vs. LO FREQUENCY MAX9996 toc22 TC = -25C -25 VCC = 4.75V, 5.0V, 5.25V LO FREQUENCY (MHz) LO FREQUENCY (MHz) -20 40 30 1700 2500 45 MAX9996 toc27 1700 MAX9996 toc21 MAX9996 toc20 45 MAX9996 toc24 TC = +85C LO SWITCH ISOLATION (dB) 40 50 MAX9996 toc23 LO SWITCH ISOLATION (dB) TC = -25C 45 LO SWITCH ISOLATION vs. LO FREQUENCY 50 LO SWITCH ISOLATION (dB) 50 MAX9996 toc19 LO SWITCH ISOLATION vs. LO FREQUENCY LO LEAKAGE AT RF PORT (dBm) MAX9996 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch 1700 1900 2100 2300 LO FREQUENCY (MHz) 2500 1700 1900 2100 2300 LO FREQUENCY (MHz) _______________________________________________________________________________________ 2500 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch RF-TO-IF ISOLATION vs. RF FREQUENCY 45 TC = +25C TC = -25C 35 50 45 40 PLO = -3dBm, 0dBm, +3dBm 1700 1900 2100 2300 45 40 VCC = 4.75V, 5.0V, 5.25V 30 1500 1700 1900 2100 1500 2300 1900 2100 RF FREQUENCY (MHz) RF FREQUENCY (MHz) RF PORT RETURN LOSS vs. RF FREQUENCY IF PORT RETURN LOSS vs. IF FREQUENCY LO SELECTED RETURN LOSS vs. LO FREQUENCY 10 15 20 PLO = -3dBm, 0dBm, +3dBm 30 15 20 25 30 VCC = 4.75V, 5.0V, 5.25V 35 40 35 50 2100 2300 100 150 RF FREQUENCY (MHz) 200 250 300 PLO = +3dBm 20 PLO = -3dBm 25 PLO = 0dBm 30 1500 350 1700 IF FREQUENCY (MHz) 5 2100 2300 2500 SUPPLY CURRENT vs. TEMPERATURE (TC) 230 MAX9996 toc34 0 1900 LO FREQUENCY (MHz) LO UNSELECTED RETURN LOSS vs. LO FREQUENCY VCC = 5.25V 220 SUPPLY CURRENT (mA) 10 15 PLO = -3dBm, 0dBm, +3dBm 20 15 40 50 2500 10 25 30 MAX9996 toc35 1900 LO UNSELECTED RETURN LOSS (dB) 1700 5 35 45 40 MAX9996 toc33 10 LO SELECTED RETURN LOSS (dB) IF PORT RETURN LOSS (dB) 5 2300 0 MAX9996 toc32 0 MAX9996 toc31 5 1500 1700 RF FREQUENCY (MHz) 0 25 50 35 30 1500 RF PORT RETURN LOSS (dB) 55 35 30 MAX9996 toc30 55 RF-TO-IF ISOLATION (dB) 50 60 MAX9996 toc29 55 RF-TO-IF ISOLATION (dB) TC = +85C RF-TO-IF ISOLATION (dB) 60 MAX9996 toc28 60 40 RF-TO-IF ISOLATION vs. RF FREQUENCY RF-TO-IF ISOLATION vs. RF FREQUENCY 210 200 190 VCC = 5.0V VCC = 4.75V 180 35 170 40 1500 1700 1900 2100 LO FREQUENCY (MHz) 2300 2500 -30 -10 10 30 50 70 90 TEMPERATURE (C) _______________________________________________________________________________________ 7 MAX9996 Typical Operating Characteristics (continued) (MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.) SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch MAX9996 Pin Description PIN NAME FUNCTION 1, 6, 8, 14 VCC 2 RF Single-Ended 50 RF Input. This port is internally matched and DC shorted to GND through a balun. Requires an external DC-blocking capacitor. 3 TAP Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the Typical Application Circuit. 4, 5, 10, 12, 13, 17 GND Ground 7 LOBIAS 9 LOSEL 11 LO1 15 LO2 Local Oscillator Input 2. Drive LOSEL high to select LO2. 16 LEXT External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor carries approximately 100mA DC current. 18, 19 IF-, IF+ Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the Typical Application Circuit). 20 IFBIAS IF Bias Resistor Connection for IF Amplifier. Connect an 806 resistor from IFBIAS to GND. EP GND Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical Application Circuit. Bias Resistor for Internal LO Buffer. Connect a 549 1% resistor from LOBIAS to the power supply. Local Oscillator Select. Logic control input for selecting LO1 or LO2. Local Oscillator Input 1. Drive LOSEL low to select LO1. Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias. Detailed Description The MAX9996 high-linearity downconversion mixer provides 8.3dB of conversion gain and 26.5dBm of IIP3, with a typical 9.7dB noise figure. The integrated baluns and matching circuitry allow for 50 single-ended interfaces to the RF and the two LO ports. A single-pole, double-throw (SPDT) switch provides 50ns switching time between the two LO inputs with 43dB of LO-to-LO isolation. Furthermore, the integrated LO buffer provides a high drive level to the mixer core, reducing the LO drive required at the MAX9996's inputs to a -3dBm to +3dBm range. The IF port incorporates a differential output, which is ideal for providing enhanced IIP2 performance. Specifications are guaranteed over broad frequency ranges to allow for use in UMTS, cdma2000, and 2G/2.5G/3G DCS1800 and PCS1900 base stations. The MAX9996 is specified to operate over a 1700MHz to 2200MHz RF frequency range, a 1900MHz to 2400MHz LO frequency range, and a 40MHz to 350MHz IF frequency range. Operation beyond these ranges is possible; see the Typical Operating Characteristics for additional details. 8 This device can operate in low-side LO injection applications with an extended LO range, but performance degrades as f LO continues to decrease. The MAX9994--a variant of the MAX9996--provides better low-side performance since it is tuned for a lower LO range of 1400MHz to 2000MHz. RF Input and Balun The MAX9996 RF input is internally matched to 50, requiring no external matching components. A DCblocking capacitor is required because the input is internally DC shorted to ground through the on-chip balun. Input return loss is typically 15dB over the entire 1700MHz to 2200MHz RF frequency range. LO Inputs, Buffer, and Balun The MAX9996 can be used for either high-side or lowside injection applications with a 1900MHz to 2400MHz LO frequency range. For a device with a 1400MHz to 2000MHz LO frequency range, refer to the MAX9994 data sheet. As an added feature, the MAX9996 includes an internal LO SPDT switch that can be used for frequency-hopping applications. The switch selects one of the two single-ended LO ports, allowing the external oscillator to settle on a particular frequency before it is _______________________________________________________________________________________ SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch High-Linearity Mixer The core of the MAX9996 is a double-balanced, highperformance passive mixer. Exceptional linearity is provided by the large LO swing from the on-chip LO buffer. When combined with the integrated IF amplifiers, the cascaded IIP3, 2LO-2RF rejection, and NF performance is typically 26.5dBm, 72dBc, and 9.7dB, respectively. Differential IF Output Amplifier The MAX9996 mixer has a 40MHz to 350MHz IF frequency range. The differential, open-collector IF output ports require external pullup inductors to VCC. Note that these differential outputs are ideal for providing enhanced 2LO-2RF rejection performance. Singleended IF applications require a 4:1 balun to transform the 200 differential output impedance to a 50 singleended output. After the balun, the IF return loss is better than 15dB. Applications Information Input and Output Matching The RF and LO inputs are internally matched to 50. No matching components are required. Return loss at the RF port is typically 15dB over the entire input range (1700MHz to 2200MHz) and return loss at the LO ports is typically better than 16dB (1900MHz to 2400MHz). RF and LO inputs require only DC-blocking capacitors for interfacing. The IF output impedance is 200 (differential). For evaluation, an external low-loss 4:1 (impedance ratio) balun transforms this impedance down to a 50 singleended output (see the Typical Application Circuit). Bias Resistors Bias currents for the LO buffer and the IF amplifier are optimized by fine tuning resistors R1 and R2. If reduced current is required at the expense of performance, contact the factory for details. If the 1% bias resistor values are not readily available, substitute standard 5% values. LEXT Inductor LEXT serves to improve the LO-to-IF and RF-to-IF leakage. The inductance value can be adjusted by the user to optimize the performance for a particular frequency band. Since approximately 100mA flows through this inductor, it is important to use a low-DCR wire-wound coil. If the LO-to-IF and RF-to-IF leakage are not critical parameters, the inductor can be replaced by a short circuit to ground. Layout Considerations A properly designed PC board is an essential part of any RF/microwave circuit. Keep RF signal lines as short as possible to reduce losses, radiation, and inductance. For the best performance, route the ground pin traces directly to the exposed pad under the package. The PC board exposed pad MUST be connected to the ground plane of the PC board. It is suggested that multiple vias be used to connect this pad to the lower level ground planes. This method provides a good RF/thermal conduction path for the device. Solder the exposed pad on the bottom of the device package to the PC board. The MAX9996 Evaluation Kit can be used as a reference for board layout. Gerber files are available upon request at www.maxim-ic.com. Power-Supply Bypassing Proper voltage-supply bypassing is essential for highfrequency circuit stability. Bypass each VCC pin and TAP with the capacitors shown in the Typical Application Circuit; see Table 1. Place the TAP bypass capacitor to ground within 100 mils of the TAP pin. _______________________________________________________________________________________ 9 MAX9996 switched in. LO switching time is typically less than 50ns, which is more than adequate for virtually all GSM applications. If frequency hopping is not employed, set the switch to either of the LO inputs. The switch is controlled by a digital input (LOSEL): logic-high selects LO2, logic-low selects LO1. To avoid damage to the part, voltage must be applied to VCC before digital logic is applied to LOSEL. LO1 and LO2 inputs are internally matched to 50, requiring only a 22pF DCblocking capacitor. A two-stage internal LO buffer allows a wide input power range for the LO drive. All guaranteed specifications are for an LO signal power from -3dBm to +3dBm. The on-chip low-loss balun, along with an LO buffer, drives the double-balanced mixer. All interfacing and matching components from the LO inputs to the IF outputs are integrated on-chip. be soldered to a ground plane on the PC board, either directly or through an array of plated via holes. Exposed Pad RF/Thermal Considerations The exposed paddle (EP) of the MAX9996's 20-pin thin QFN-EP package provides a low thermal-resistance path to the die. It is important that the PC board on which the MAX9996 is mounted be designed to conduct heat from the EP. In addition, provide the EP with a low-inductance path to electrical ground. The EP MUST Chip Information TRANSISTOR COUNT: 1414 PROCESS: SiGe BiCMOS Table 1. Component List Referring to the Typical Application Circuit COMPONENT VALUE DESCRIPTION L1, L2 470nH Wire-wound high-Q inductors (0805) L3 10nH Wire-wound high-Q inductor (0603) C1 4pF Microwave capacitor (0603) C4 10pF Microwave capacitor (0603) C2, C6, C7, C8, C10, C12 22pF Microwave capacitors (0603) C3, C5, C9, C11 0.01F Microwave capacitors (0603) C13, C14 150pF Microwave capacitors (0603) C15 150pF Microwave capacitor (0402) R1 806 1% resistor (0603) R2 549 1% resistor (0603) R3 7.15 1% resistor (1206) T1 4:1 balun IF balun U1 MAX9996 Maxim IC IFBIAS IF+ IF- GND LEXT Pin Configuration/Functional Diagram 20 19 18 17 16 VCC 1 15 LO2 RF 2 10 MAX9996 14 VCC GND 5 11 LO1 6 7 8 9 10 GND 12 GND LOSEL GND 4 VCC 13 GND LOBIAS TAP 3 VCC MAX9996 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch ______________________________________________________________________________________ SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch VCC T1 3 IF OUTPUT 6 R3 L1 2 L2 C14 C3 C2 GND IF- IF+ 19 20 VCC 18 17 RF C5 TAP C4 GND 16 C12 1 15 C1 RF INPUT 4 L3 IFBIAS VCC 1 C15 R1 LEXT C13 MAX9996 2 14 3 13 4 12 5 11 LO2 LO2 INPUT VCC VCC C11 GND GND C10 LOSEL LOBIAS VCC 9 LO1 LO1 INPUT 10 GND 8 7 6 VCC GND R2 VCC C6 LOSEL INPUT C7 C8 VCC C9 ______________________________________________________________________________________ 11 MAX9996 Typical Application Circuit Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) QFN THIN.EPS MAX9996 SiGe High-Linearity, 1700MHz to 2200MHz Downconversion Mixer with LO Buffer/Switch D2 D MARKING b C L 0.10 M C A B D2/2 D/2 k L XXXXX E/2 E2/2 C L (NE-1) X e E DETAIL A PIN # 1 I.D. E2 PIN # 1 I.D. 0.35x45 e (ND-1) X e DETAIL B e L L1 C L C L L L e e 0.10 C A C 0.08 C A1 A3 PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm 21-0140 -DRAWING NOT TO SCALE- COMMON DIMENSIONS A1 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 A3 b D E L1 0 0.02 0.05 0 0.20 REF. 0.20 REF. 0.02 0.05 0 0.20 REF. 0.02 0.05 0.20 REF. 0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 e k L 0.02 0.05 0.65 BSC. 0.80 BSC. 0.50 BSC. 0.50 BSC. 0.25 - 0.25 - 0.25 - 0.25 0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 - - - - - N ND NE 16 4 4 20 5 5 JEDEC WHHB WHHC - - 1 2 EXPOSED PAD VARIATIONS PKG. 20L 5x5 28L 5x5 32L 5x5 16L 5x5 SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. A G - - - 28 7 7 WHHD-1 - - 32 8 8 WHHD-2 NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. D2 L E2 PKG. CODES MIN. NOM. MAX. MIN. NOM. MAX. 0.15 T1655-1 T1655-2 T1655N-1 3.00 3.00 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.10 3.20 3.10 3.20 T2055-2 T2055-3 T2055-4 3.00 3.00 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.10 3.20 3.10 3.20 ** ** ** ** T2055-5 T2855-1 T2855-2 T2855-3 T2855-4 T2855-5 T2855-6 T2855-7 T2855-8 T2855N-1 T3255-2 T3255-3 T3255-4 T3255N-1 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 ** ** 0.40 DOWN BONDS ALLOWED NO YES NO NO YES NO Y ** NO NO YES YES NO ** ** 0.40 ** ** ** ** ** NO YES Y N NO YES NO NO ** ** ** ** ** SEE COMMON DIMENSIONS TABLE 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3 AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. PACKAGE OUTLINE, 16, 20, 28, 32L THIN QFN, 5x5x0.8mm 21-0140 -DRAWING NOT TO SCALE- G 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. 12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Maxim Integrated: MAX9996ETP+ MAX9996ETP+D MAX9996ETP+T MAX9996ETP+TD