General Description
The MAX9996 high-linearity downconversion mixer pro-
vides 8.3dB gain, +26.5dBm IIP3, and 9.7dB NF for
1700MHz to 2200MHz UMTS/WCDMA, DCS, and PCS
base-station receiver applications. With a 1900MHz to
2400MHz LO frequency range, this particular mixer is
ideal for high-side LO injection receiver architectures.
Low-side LO injection is supported by the MAX9994,
which is pin-for-pin and functionally compatible with the
MAX9996.
In addition to offering excellent linearity and noise per-
formance, the MAX9996 also yields a high level of com-
ponent integration. This device includes a double-
balanced passive mixer core, an IF amplifier, a dual-
input LO selectable switch, and an LO buffer. On-chip
baluns are also integrated to allow for single-ended RF
and LO inputs. The MAX9996 requires a nominal LO
drive of 0dBm, and supply current is guaranteed to be
below 240mA.
The MAX9994/MAX9996 are pin compatible with the
MAX9984/MAX9986 815MHz to 995MHz mixers, mak-
ing this entire family of downconverters ideal for appli-
cations where a common PC board layout is used for
both frequency bands. The MAX9996 is also functional-
ly compatible with the MAX9993.
The MAX9996 is available in a compact, 20-pin, thin
QFN package (5mm x 5mm) with an exposed paddle.
Electrical performance is guaranteed over the extended
-40°C to +85°C temperature range.
Applications
UMTS/WCDMA Base Stations
DCS1800/PCS1900 EDGE Base Stations
cdmaOne™ and cdma2000®Base Stations
PHS/PAS Base Stations
Predistortion Receivers
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
Microwave Links
Digital and Spread-Spectrum Communication
Systems
Features
♦1700MHz to 2200MHz RF Frequency Range
♦1900MHz to 2400MHz LO Frequency Range
(MAX9996)
♦1400MHz to 2000MHz LO Frequency Range
(MAX9994)
♦40MHz to 350MHz IF Frequency Range
♦8.3dB Conversion Gain
♦+26.5dBm Input IP3
♦+12.6dBm Input 1dB Compression Point
♦9.7dB Noise Figure
♦72dBc 2LO-2RF Spurious Rejection at
PRF = -10dBm
♦Integrated LO Buffer
♦Integrated RF and LO Baluns for Single-Ended
Inputs
♦Low -3dBm to +3dBm LO Drive
♦Built-In SPDT LO Switch with 43dB LO1 to LO2
Isolation and 50ns Switching Time
♦Pin Compatible with MAX9984/MAX9986 815MHz
to 995MHz Mixers
♦Functionally Compatible with MAX9993
♦External Current-Setting Resistors Provide Option
for Operating Mixer in Reduced Power/Reduced
Performance Mode
♦Lead-Free Package Available
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
________________________________________________________________ Maxim Integrated Products 1
Pin Configuration/Functional Diagram and Typical
Application Circuit appear at end of data sheet.
19-3531; Rev 0; 12/04
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
EVALUATION KIT
AVAILABLE
Ordering Information
*EP = Exposed paddle.
+ = Lead free. D = Dry pack. T = Tape-and-reel.
PART TEMP RANGE PIN-PACKAGE PKG
CODE
MAX9996ETP - 40° C to + 85° C 20 Thi n QFN - E P *
5m m × 5m m T2055- 3
MAX9996ETP-T - 40° C to + 85° C 20 Thi n QFN - E P *
5m m × 5m m T2055- 3
MAX9996ETP+D - 40° C to + 85° C 20 Thi n QFN - E P *
5m m × 5m m T2055- 3
M AX 9996E TP + TD - 40° C to + 85° C 20 Thi n QFN - E P *
5m m × 5m m T2055- 3
cdma2000 is a registered trademark of Telecommunications
Industry Association.
cdmaOne is a trademark of CDMA Development Group.
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signal applied, IF+ and IF- outputs pulled up to VCC through
inductive chokes, R1= 806Ω, R2= 549Ω, TC= -40°C to +85°C, unless otherwise noted. Typical values are at VCC = +5V, TC=
+25°C, unless otherwise noted.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VCC to GND...........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS, LOSEL, IFBIAS to GND...-0.3V to (VCC + 0.3V)
TAP ........................................................................-0.3V to +1.4V
LO1, LO2, LEXT to GND........................................-0.3V to +0.3V
RF, LO1, LO2 Input Power .............................................+12dBm
RF (RF is DC shorted to GND through a balun) .................50mA
Continuous Power Dissipation (TA= +70°C)
20-Pin Thin QFN-EP (derate 26.3mW/°C above +70°C)...........2.1W
θJA .................................................................................+38°C/W
θJC .................................................................................+13°C/W
Operating Temperature Range (Note A) ....TC= -40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Note A: TCis the temperature on the exposed paddle of the package.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Supply Voltage VCC 4.75 5.00 5.25 V
Supply Current ICC 206 240 mA
LO_SEL Input-Logic Low VIL 0.8 V
LO_SEL Input-Logic High VIH 2V
AC ELECTRICAL CHARACTERISTICS
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ωsources, PLO = -3dBm to
+3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1900MHz to 2400MHz, fIF = 200MHz, fLO > fRF, TC= -40°C to +85°C,
unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 2100MHz, fIF = 200MHz,
TC= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RF Frequency Range fRF (Note 3) 1700 2200 MHz
(Note 3) 1900 2400
LO Frequency Range fLO MAX9994 1400 2000 MHz
IF Frequency Range fIF 40 350 MHz
Conversion Gain GCPRF < +2dBm, TA = +25°C 7.0 8.3 9.0 dB
Gain Variation Over Temperature TC = -40°C to +85°C±0.75 dB
Input Compression Point P1dB (Note 4) 12.6 dBm
Input Third-Order Intercept Point IIP3
Two tones:
fRF1 = 2000MHz, fRF2 = 2001MHz,
PRF = -5dBm/tone, fLO = 2200MHz,
PLO = 0dBm, TA = +25°C
23.5 26.5 dBm
Input IP3 Variation Over
Temperature TC = -40°C to +85°C±0.5 dB
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 3
Note 1: Guaranteed by design and characterization.
Note 2: All limits include external component losses. Output measurements taken at IF output of the Typical Application Circuit.
Note 3: Operation outside this range is possible, but with degraded performance of some parameters.
Note 4: Compression point characterized. It is advisable not to operate continuously the mixer RF input above +12dBm.
Note 5: Measured with external LO source noise filtered so the noise floor is -174dBm/Hz. This specification reflects the effects of all
SNR degradations in the mixer, including the LO noise as defined in Maxim Application Note 2021.
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX9996 Typical Application Circuit, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ωsources, PLO = -3dBm to
+3dBm, PRF = -5dBm, fRF = 1700MHz to 2200MHz, fLO = 1900MHz to 2400MHz, fIF = 200MHz, fLO > fRF, TC= -40°C to +85°C,
unless otherwise noted. Typical values are at VCC = +5V, PRF = -5dBm, PLO = 0dBm, fRF = 1900MHz, fLO = 2100MHz, fIF = 200MHz,
TC= +25°C, unless otherwise noted.) (Notes 1, 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Noise Figure NF Single sideband 9.7 dB
Noise Figure Under-Blocking P
R F = 5d Bm , fR F = 2000M H z,
fL O = 2190M H z, fB LOC K = 2100M H z ( N ote 5) 19 dB
LO Drive -3 +3 dBm
PRF = -10dBm 72
2 x 2 2LO-2RF PRF = -5dBm 67
PRF = -10dBm 87
Spurious Response at IF
3 x 3 3LO-3RF PRF = -5dBm 77
dBc
LO2 selected, 1900MHz < fLO < 2100MHz 49
LO1 to LO2 Isolation LO1 selected, 1900MHz < fLO < 2100MHz 43 dB
Maximum LO Leakage at RF Port PLO = +3dBm -20 dBm
Maximum LO Leakage at IF Port PLO = +3dBm -30 dBm
Minimum RF-to-IF Isolation 40 dB
LO Switching Time 50% of LOSEL to IF settled to within 2°50 ns
RF Port Return Loss 15 dB
LO1/2 port selected,
LO2/1 and IF terminated 16
LO Port Return Loss
LO1/2 port unselected,
LO2/1 and IF terminated 26
dB
IF Port Return Loss LO driven at 0dBm, RF terminated into 50Ω,
differential 200Ω20 dB
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
4 _______________________________________________________________________________________
Typical Operating Characteristics
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
6
7
9
8
10
11
1500 1700 1900 2100 2300
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc01
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
TC = +85°CTC = +25°C
TC = -25°C
6
7
9
8
10
11
1500 1700 1900 2100 2300
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc02
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
PLO = -3dBm, 0dBm, +3dBm
6
7
9
8
10
11
1500 1700 1900 2100 2300
CONVERSION GAIN vs. RF FREQUENCY
MAX9996 toc03
RF FREQUENCY (MHz)
CONVERSION GAIN (dB)
VCC = 4.75V, 5.0V, 5.25V
21
23
22
25
24
27
26
28
1500 1700 1900 2100 2300
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc04
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
TC = +25°C
TC = -25°CTC = +85°C
23
22
25
24
27
26
28
1500 1700 1900 2100 2300
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc05
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
PLO = -3dBm, 0dBm, +3dBm
23
22
25
24
27
26
28
1500 1700 1900 2100 2300
INPUT IP3 vs. RF FREQUENCY
MAX9996 toc06
RF FREQUENCY (MHz)
INPUT IP3 (dBm)
VCC = 5.25V
VCC = 4.75V, 5.0V
7
6
9
8
11
12
10
13
1500 1700 1900 2100 2300
NOISE FIGURE vs. RF FREQUENCY
MAX9996 toc07
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
TC = +85°C
TC = +25°C
TC = -25°C
7
8
10
11
9
12
1500 1700 1900 2100 2300
NOISE FIGURE vs. RF FREQUENCY
MAX9996 toc08
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
PLO = +3dBm
PLO = -3dBm
PLO = 0dBm
7
8
10
11
9
12
1500 1700 1900 2100 2300
NOISE FIGURE vs. RF FREQUENCY
MAX9996 toc09
RF FREQUENCY (MHz)
NOISE FIGURE (dB)
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 5
45
50
70
80
60
65
75
55
85
1500 1700 1900 2100 2300
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX9996 toc10
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
TC = +25°C
TC = -25°C
TC = +85°C
PRF = -5dBm
45
50
70
80
60
65
75
55
85
1500 1700 1900 2100 2300
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX9996 toc11
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
PLO = +3dBm
PLO = -3dBm
PLO = 0dBm
PRF = -5dBm
45
50
70
80
60
65
75
55
85
1500 1700 1900 2100 2300
2LO-2RF RESPONSE vs. RF FREQUENCY
MAX9996 toc12
RF FREQUENCY (MHz)
2LO-2RF RESPONSE (dBc)
PRF = -5dBm
VCC = 4.75V
VCC = 5.0V
VCC = 5.25V
70
80
60
65
75
55
95
90
85
1500 1700 1900 2100 2300
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX9996 toc13
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
PRF = -5dBm
TC = +25°C
TC = +85°C
TC = -25°C
70
80
60
65
75
55
95
90
85
1500 1700 1900 2100 2300
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX9996 toc14
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
PRF = -5dBm
PLO = -3dBm, 0dBm, +3dBm 70
80
60
65
75
55
95
90
85
1500 1700 1900 2100 2300
3LO-3RF RESPONSE vs. RF FREQUENCY
MAX9996 toc15
RF FREQUENCY (MHz)
3LO-3RF RESPONSE (dBc)
PRF = -5dBm
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
13
11
12
14
10
15
1500 1700 1900 2100 2300
INPUT P1dB vs. RF FREQUENCY
MAX9996 toc16
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
TC = +85°C
TC = -25°C
TC = +25°C
13
11
12
14
10
15
1500 1700 1900 2100 2300
INPUT P1dB vs. RF FREQUENCY
MAX9996 toc17
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
PLO = -3dBm, 0dBm, +3dBm
13
11
12
14
10
15
1500 1700 1900 2100 2300
INPUT P1dB vs. RF FREQUENCY
MAX9996 toc18
RF FREQUENCY (MHz)
INPUT P1dB (dBm)
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
6 _______________________________________________________________________________________
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
45
35
40
30
50
1700 1900 2100 2300 2500
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX9996 toc20
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
PLO = -3dBm, 0dBm, +3dBm
45
35
40
30
50
1700 1900 2100 2300 2500
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX9996 toc19
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
TC = -25°C
TC = +25°C
TC = +85°C
45
35
40
30
50
1700 1900 2100 2300 2500
LO SWITCH ISOLATION
vs. LO FREQUENCY
MAX9996 toc21
LO FREQUENCY (MHz)
LO SWITCH ISOLATION (dB)
VCC = 4.75V, 5.0V, 5.25V
-30
-50
-40
-60
-20
-35
-55
-45
-25
1700 1900 2100 2300 2500
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX9996 toc22
LO FREQUENCY (MHz)
LO LEAKAGE (dBm)
TC = -25°C
TC = +85°C
TC = +25°C
-30
-50
-40
-60
-20
-35
-55
-45
-25
1700 1900 2100 2300 2500
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX9996 toc23
LO FREQUENCY (MHz)
LO LEAKAGE (dBm)
PLO = -3dBm
PLO = 0dBm
PLO = +3dBm
-30
-50
-40
-20
-35
-55
-45
-25
1700 1900 2100 2300 2500
LO LEAKAGE AT IF PORT
vs. LO FREQUENCY
MAX9996 toc24
LO FREQUENCY (MHz)
LO LEAKAGE (dBm)
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
-20
-30
-10
-25
-15
1700 1900 2100 2300 2500
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX9996 toc25
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
TC = -25°C, +25°C, +85°C
-20
-30
-10
-25
-15
1700 21001900 2300 2500
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX9996 toc26
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
PLO = -3dBm, 0dBm, +3dBm
-20
-30
-10
-25
-15
1700 1900 2100 2300 2500
LO LEAKAGE AT RF PORT
vs. LO FREQUENCY
MAX9996 toc27
LO FREQUENCY (MHz)
LO LEAKAGE AT RF PORT (dBm)
VCC = 5.25V
VCC = 5.0V
VCC = 4.75V
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 7
40
30
60
35
50
45
55
1500 1700 1900 2100 2300
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX9996 toc28
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
TC = +85°C
TC = +25°C
TC = -25°C
40
30
60
35
50
45
55
1500 1700 1900 2100 2300
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX9996 toc29
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
PLO = -3dBm, 0dBm, +3dBm
40
30
60
35
50
45
55
1500 1700 1900 2100 2300
RF-TO-IF ISOLATION
vs. RF FREQUENCY
MAX9996 toc30
RF FREQUENCY (MHz)
RF-TO-IF ISOLATION (dB)
VCC = 4.75V, 5.0V, 5.25V
30
40
0
35
20
25
10
15
5
1500 1700 1900 2100 2300 2500
RF PORT RETURN LOSS
vs. RF FREQUENCY
MAX9996 toc31
RF FREQUENCY (MHz)
RF PORT RETURN LOSS (dB)
PLO = -3dBm, 0dBm, +3dBm 30
50
0
40
45
35
20
25
10
15
5
50 150 200100 250 300 350
IF PORT RETURN LOSS
vs. IF FREQUENCY
MAX9996 toc32
IF FREQUENCY (MHz)
IF PORT RETURN LOSS (dB)
VCC = 4.75V, 5.0V, 5.25V
30
0
40
35
20
25
10
15
5
1500 1700 1900 2100 2300 2500
LO SELECTED RETURN LOSS
vs. LO FREQUENCY
MAX9996 toc33
LO FREQUENCY (MHz)
LO SELECTED RETURN LOSS (dB)
PLO = +3dBm
PLO = -3dBm
PLO = 0dBm
30
0
40
35
20
25
10
15
5
1500 1700 1900 2100 2300 2500
LO UNSELECTED RETURN LOSS
vs. LO FREQUENCY
MAX9996 toc34
LO FREQUENCY (MHz)
LO UNSELECTED RETURN LOSS (dB)
PLO = -3dBm, 0dBm, +3dBm
190
230
170
180
210
220
200
-30 -10 10 30 50 70 90
SUPPLY CURRENT
vs. TEMPERATURE (TC)
MAX9996 toc35
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
VCC = 5.25V
VCC = 5.0V VCC = 4.75V
Typical Operating Characteristics (continued)
(MAX9996 Typical Application Circuit, VCC = +5.0V, PLO = 0dBm, PRF = -5dBm, fLO > fRF, fIF = 200MHz, unless otherwise noted.)
MAX9996
Detailed Description
The MAX9996 high-linearity downconversion mixer pro-
vides 8.3dB of conversion gain and 26.5dBm of IIP3,
with a typical 9.7dB noise figure. The integrated baluns
and matching circuitry allow for 50Ωsingle-ended inter-
faces to the RF and the two LO ports. A single-pole, dou-
ble-throw (SPDT) switch provides 50ns switching time
between the two LO inputs with 43dB of LO-to-LO isola-
tion. Furthermore, the integrated LO buffer provides a
high drive level to the mixer core, reducing the LO drive
required at the MAX9996’s inputs to a -3dBm to +3dBm
range. The IF port incorporates a differential output,
which is ideal for providing enhanced IIP2 performance.
Specifications are guaranteed over broad frequency
ranges to allow for use in UMTS, cdma2000, and
2G/2.5G/3G DCS1800 and PCS1900 base stations. The
MAX9996 is specified to operate over a 1700MHz to
2200MHz RF frequency range, a 1900MHz to 2400MHz
LO frequency range, and a 40MHz to 350MHz IF fre-
quency range. Operation beyond these ranges is pos-
sible; see the Typical Operating Characteristics for
additional details.
This device can operate in low-side LO injection appli-
cations with an extended LO range, but performance
degrades as fLO continues to decrease. The
MAX9994—a variant of the MAX9996—provides better
low-side performance since it is tuned for a lower LO
range of 1400MHz to 2000MHz.
RF Input and Balun
The MAX9996 RF input is internally matched to 50Ω,
requiring no external matching components. A DC-
blocking capacitor is required because the input is
internally DC shorted to ground through the on-chip
balun. Input return loss is typically 15dB over the entire
1700MHz to 2200MHz RF frequency range.
LO Inputs, Buffer, and Balun
The MAX9996 can be used for either high-side or low-
side injection applications with a 1900MHz to 2400MHz
LO frequency range. For a device with a 1400MHz to
2000MHz LO frequency range, refer to the MAX9994
data sheet. As an added feature, the MAX9996 includes
an internal LO SPDT switch that can be used for fre-
quency-hopping applications. The switch selects one of
the two single-ended LO ports, allowing the external
oscillator to settle on a particular frequency before it is
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
8 _______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1, 6, 8, 14 VCC Power-Supply Connection. Bypass each VCC pin to GND with capacitors as shown in the Typical
Application Circuit.
2RF
Single-Ended 50Ω RF Input. This port is internally matched and DC shorted to GND through a balun.
Requires an external DC-blocking capacitor.
3 TAP Center Tap of the Internal RF Balun. Bypass to GND with capacitors close to the IC, as shown in the
Typical Application Circuit.
4, 5, 10, 12,
13, 17 GND Ground
7 LOBIAS Bias Resistor for Internal LO Buffer. Connect a 549Ω ±1% resistor from LOBIAS to the power supply.
9 LOSEL Local Oscillator Select. Logic control input for selecting LO1 or LO2.
11 LO1 Local Oscillator Input 1. Drive LOSEL low to select LO1.
15 LO2 Local Oscillator Input 2. Drive LOSEL high to select LO2.
16 LEXT External Inductor Connection. Connect a low-ESR, 10nH inductor from LEXT to GND. This inductor
carries approximately 100mA DC current.
18, 19 IF-, IF+ Differential IF Outputs. Each output requires external bias to VCC through an RF choke (see the
Typical Application Circuit).
20 IFBIAS IF Bias Resistor Connection for IF Amplifier. Connect an 806Ω resistor from IFBIAS to GND.
EP GND Exposed Ground Paddle. Solder the exposed paddle to the ground plane using multiple vias.
switched in. LO switching time is typically less than
50ns, which is more than adequate for virtually all GSM
applications. If frequency hopping is not employed, set
the switch to either of the LO inputs. The switch is con-
trolled by a digital input (LOSEL): logic-high selects
LO2, logic-low selects LO1. To avoid damage to the
part, voltage must be applied to VCC before digital logic
is applied to LOSEL. LO1 and LO2 inputs are internally
matched to 50Ω, requiring only a 22pF DC-
blocking capacitor.
A two-stage internal LO buffer allows a wide input
power range for the LO drive. All guaranteed specifica-
tions are for an LO signal power from -3dBm to +3dBm.
The on-chip low-loss balun, along with an LO buffer,
drives the double-balanced mixer. All interfacing and
matching components from the LO inputs to the IF out-
puts are integrated on-chip.
High-Linearity Mixer
The core of the MAX9996 is a double-balanced, high-
performance passive mixer. Exceptional linearity is pro-
vided by the large LO swing from the on-chip LO
buffer. When combined with the integrated IF ampli-
fiers, the cascaded IIP3, 2LO-2RF rejection, and NF
performance is typically 26.5dBm, 72dBc, and 9.7dB,
respectively.
Differential IF Output Amplifier
The MAX9996 mixer has a 40MHz to 350MHz IF fre-
quency range. The differential, open-collector IF output
ports require external pullup inductors to VCC. Note that
these differential outputs are ideal for providing
enhanced 2LO-2RF rejection performance. Single-
ended IF applications require a 4:1 balun to transform
the 200Ωdifferential output impedance to a 50Ωsingle-
ended output. After the balun, the IF return loss is bet-
ter than 15dB.
Applications Information
Input and Output Matching
The RF and LO inputs are internally matched to 50Ω.
No matching components are required. Return loss at
the RF port is typically 15dB over the entire input range
(1700MHz to 2200MHz) and return loss at the LO ports
is typically better than 16dB (1900MHz to 2400MHz).
RF and LO inputs require only DC-blocking capacitors
for interfacing.
The IF output impedance is 200Ω(differential). For
evaluation, an external low-loss 4:1 (impedance ratio)
balun transforms this impedance down to a 50Ωsingle-
ended output (see the Typical Application Circuit).
Bias Resistors
Bias currents for the LO buffer and the IF amplifier are
optimized by fine tuning resistors R1 and R2. If
reduced current is required at the expense of perfor-
mance, contact the factory for details. If the ±1% bias
resistor values are not readily available, substitute stan-
dard ±5% values.
LEXT Inductor
LEXT serves to improve the LO-to-IF and RF-to-IF leak-
age. The inductance value can be adjusted by the user to
optimize the performance for a particular frequency
band. Since approximately 100mA flows through this
inductor, it is important to use a low-DCR wire-wound coil.
If the LO-to-IF and RF-to-IF leakage are not critical
parameters, the inductor can be replaced by a short
circuit to ground.
Layout Considerations
A properly designed PC board is an essential part of
any RF/microwave circuit. Keep RF signal lines as short
as possible to reduce losses, radiation, and induc-
tance. For the best performance, route the ground pin
traces directly to the exposed pad under the package.
The PC board exposed pad MUST be connected to the
ground plane of the PC board. It is suggested that mul-
tiple vias be used to connect this pad to the lower level
ground planes. This method provides a good RF/ther-
mal conduction path for the device. Solder the exposed
pad on the bottom of the device package to the PC
board. The MAX9996 Evaluation Kit can be used as a
reference for board layout. Gerber files are available
upon request at www.maxim-ic.com.
Power-Supply Bypassing
Proper voltage-supply bypassing is essential for high-
frequency circuit stability. Bypass each VCC pin and
TAP with the capacitors shown in the Typical Application
Circuit; see Table 1. Place the TAP bypass capacitor to
ground within 100 mils of the TAP pin.
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
_______________________________________________________________________________________ 9
MAX9996
Exposed Pad RF/Thermal Considerations
The exposed paddle (EP) of the MAX9996’s 20-pin thin
QFN-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on
which the MAX9996 is mounted be designed to con-
duct heat from the EP. In addition, provide the EP with a
low-inductance path to electrical ground. The EP MUST
be soldered to a ground plane on the PC board, either
directly or through an array of plated via holes.
Chip Information
TRANSISTOR COUNT: 1414
PROCESS: SiGe BiCMOS
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
10 ______________________________________________________________________________________
COMPONENT VALUE DESCRIPTION
L1, L2 470nH Wire-wound high-Q inductors (0805)
L3 10nH Wire-wound high-Q inductor (0603)
C1 4pF Microwave capacitor (0603)
C4 10pF Microwave capacitor (0603)
C2, C6, C7, C8, C10, C12 22pF Microwave capacitors (0603)
C3, C5, C9, C11 0.01µF Microwave capacitors (0603)
C13, C14 150pF Microwave capacitors (0603)
C15 150pF Microwave capacitor (0402)
R1 806Ω±1% resistor (0603)
R2 549Ω±1% resistor (0603)
R3 7.15Ω±1% resistor (1206)
T1 4:1 balun IF balun
U1 MAX9996 Maxim IC
Table 1. Component List Referring to the Typical Application Circuit
Pin Configuration/Functional Diagram
MAX9996
1
2
3
4
5
15
14
13
12
11
678910
20 19 18 17 16
GND
LOSEL
LOBIAS
TAP
RF
VCC
VCC
VCC
VCC
GND
GND
LO2
GND
LEXT
IFBIAS
IF-
IF+
GND
LO1
GND
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
______________________________________________________________________________________ 11
Typical Application Circuit
MAX9996
1
2
3
4
5
15
14
13
12
11
678910
20 19 18 17 16
GND
C4
C11
C6 C7
R2
C3
C14
C13
C15
C5
C1
RF
INPUT
C10
C12
LO1
INPUT
LO2
INPUT
IF
OUTPUT
LOSEL
LOBIAS
C2
C8
C9
TAP
RF
VCC
VCC
VCC
LOSEL
INPUT
VCC
VCC
VCC
VCC
R1
R3
L2
L1
L3
1
3
2
6
4
T1
VCC
VCC
GND
GND
LO2
GND
LEXT
IFBIAS
IF-
IF+
GND
LO1
GND
MAX9996
SiGe High-Linearity, 1700MHz to 2200MHz
Downconversion Mixer with LO Buffer/Switch
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2004 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages.)
QFN THIN.EPS
D2
(ND-1) X e
e
D
C
PIN # 1
I.D.
(NE-1) X e
E/2
E
0.08 C
0.10 C
A
A1 A3
DETAIL A
E2/2
E2
0.10 M C A B
PIN # 1 I.D.
b
0.35x45∞
D/2 D2/2
L
C
L
C
e e
L
CC
L
k
LL
DETAIL B
L
L1
e
XXXXX
MARKING
G1
2
21-0140
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
L
COMMON DIMENSIONS
3.353.15
T2855-1 3.25 3.353.15 3.25
MAX.
3.20
EXPOSED PAD VARIATIONS
3.00T2055-2 3.10
D2
NOM.MIN.
3.203.00 3.10
MIN.
E2
NOM. MAX.
NE
ND
PKG.
CODES
1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES.
3. N IS THE TOTAL NUMBER OF TERMINALS.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL
CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE
OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1
IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE.
5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm
FROM TERMINAL TIP.
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY.
7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION.
8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1,
T2855-3 AND T2855-6.
NOTES:
SYMBOL
PKG.
N
L1
e
E
D
b
A3
A
A1
k
10. WARPAGE SHALL NOT EXCEED 0.10 mm.
JEDEC
T1655-1 3.203.00 3.10 3.00 3.10 3.20
0.70 0.800.75
4.90
4.90
0.25
0.25
0
--
4
WHHB
4
16
0.350.30
5.10
5.105.00
0.80 BSC.
5.00
0.05
0.20 REF.
0.02
MIN. MAX.NOM.
16L 5x5
3.10
T3255-2 3.00 3.20 3.00 3.10 3.20
2.70
T2855-2 2.60 2.602.80 2.70 2.80
L0.30 0.500.40
------
WHHC
20
5
5
5.00
5.00
0.30
0.55
0.65 BSC.
0.45
0.25
4.90
4.90
0.25
0.65
--
5.10
5.10
0.35
20L 5x5
0.20 REF.
0.75
0.02
NOM.
0
0.70
MIN.
0.05
0.80
MAX.
---
WHHD-1
28
7
7
5.00
5.00
0.25
0.55
0.50 BSC.
0.45
0.25
4.90
4.90
0.20
0.65
--
5.10
5.10
0.30
28L 5x5
0.20 REF.
0.75
0.02
NOM.
0
0.70
MIN.
0.05
0.80
MAX.
---
WHHD-2
32
8
8
5.00
5.00
0.40
0.50 BSC.
0.30
0.25
4.90
4.90
0.50
--
5.10
5.10
32L 5x5
0.20 REF.
0.75
0.02
NOM.
0
0.70
MIN.
0.05
0.80
MAX.
0.20 0.25 0.30
DOWN
BONDS
ALLOWED
NO
YES3.103.00 3.203.103.00 3.20T2055-3
3.103.00 3.203.103.00 3.20T2055-4
T2855-3 3.15 3.25 3.35 3.15 3.25 3.35
T2855-6 3.15 3.25 3.35 3.15 3.25 3.35
T2855-4 2.60 2.70 2.80 2.60 2.70 2.80
T2855-5 2.60 2.70 2.80 2.60 2.70 2.80
T2855-7 2.60 2.70 2.80 2.60 2.70 2.80
3.203.00 3.10T3255-3 3.203.00 3.10
3.203.00 3.10T3255-4 3.203.00 3.10
NO
NO
NO
NO
NO
NO
NO
NO
YES
YES
YES
YES
3.203.00T1655-2 3.10 3.00 3.10 3.20 YES
NO3.203.103.003.10T1655N-1 3.00 3.20
3.353.15T2055-5 3.25 3.15 3.25 3.35 Y
3.35
3.15T2855N-1 3.25 3.15 3.25 3.35 N
3.35
3.15T2855-8 3.25 3.15 3.25 3.35 Y
3.203.10T3255N-1 3.00 NO
3.203.103.00
L
0.40
0.40
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
**
SEE COMMON DIMENSIONS TABLE
±0.15
11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY.
G
2
2
21-0140
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY.
