VCE IC = = 2500 V 1000 A ABB StakPak H Series Press-pack IGBT 5SNR 10H2500 Doc. No. 5SYA1580-02 May. 04 * High SOA * Fails into stable shorted state * High tolerance to uneven mounting pressure * Designed for series connection * Explosion resistant package * Modular design concept, available for a wide range of current ratings Maximum Rated Values1) Parameter2) Collector-emitter voltage Symbol Conditions min VCES Unit 2500 V 1000 A DC collector current IC Repetitive peak collector current ICM 2000 A VGES 20 V Tc = 25 C, (IGBT) 10000 W Tc = 75 C 1000 A 2000 A 12.4 kA 10 s Gate-emitter voltage Total power dissipation Ptot Tc = 75 C max DC forward current IF Repetitive peak forward current IFM Surge current IFSM VR = 0 V, tp = 10 ms, Tvj = 125 C, half-sinewave IGBT short circuit SOA tpsc VCC = 1500 V, VCEM 2500 V, VGE 15V Junction temperature Tvj 5 125 C Storage temperature Tstg -40 70 C FM 40 75 kN Mounting force 2) 1) Maximum rated values indicate limits beyond which damage to the device may occur per IEC 60747-9 2) For detailed mounting instructions refer to ABB document no. 5SYA 2037-02 ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. 5SNR 10H2500 IGBT Characteristic Values3) Parameter Symbol Collector-emitter saturation voltage VCEsat min 2.60 V Tvj = 125C 2.70 3.00 V 18 50 mA 500 nA 8.5 V Tvj = 125 C Gate leakage current IGES VCE = 0 V, VGE = 20 V, Tvj = 125 C VGE(TO) IC = 180 mA, VCE = VGE, Tvj = 25 C Input capacitance Cies Output capacitance Coes Reverse transfer capacitance Cres Turn-on delay time td(on) Rise time Turn-off delay time Fall time Turn-on energy Turn-off energy Short circuit current tr td(off) tf Unit 2.20 VCE = 2500 V, VGE = 0 V, Qge max Tvj = 25C ICES Total gate charge typ IC = 1000 A, VGE = 15 V Collector cut-off current Gate-emitter threshold voltage 3) Conditions 5 7 IC = 1000 A, VCE = 1250 V, VGE = -15 to 15 V 9.3 C 158 nF 12.8 nF 2.6 nF Tvj = 25C 0.6 s Tvj = 125C 0.7 s Tvj = 25C 0.5 s Tvj = 125C 0.5 s Tvj = 25C 2 s Tvj = 125C 2.2 s Tvj = 25C 0.5 s Tvj = 125C 0.5 s Tvj = 25C 1 J Tvj = 125C 1.5 J Tvj = 25C 1.4 J Tvj = 125C 1.8 J Tvj = 25C 6000 A Tvj = 125C 5500 A VCE = 25 V, VGE = 0 V, f = 1 MHz VCC = 1250 V, IC = 1000 A, RG = 3.9 , VGE = 15 V, L = 200 nH inductive load VCC = 1250 V, IC = 1000 A, RG = 5.6 , VGE = 15 V, L = 200 nH inductive load Eon VCC = 1250 V, IC = 1000 A, RG = 3.9 , VGE = 15 V, L = 200 nH inductive load Eoff VCC = 1250 V, IC = 1000 A, RG = 5.6 , VGE = 15 V, L = 200 nH inductive load ISC VCC = 1500 V, RGon = 3.9 , RGoff = 47 , VGE 15 V, L = 200 nH tpsc =10 s Characteristic values according to IEC 60747-9 ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. Doc. No. 5SYA1580-02 May. 04 page 2 of 9 5SNR 10H2500 Diode Characteristic Values4) Parameter Symbol Forward voltage VF Reverse recovery current Irr Reverse recovery charge Qrr Reverse recovery time trr Reverse recovery energy 4) Conditions IF = 1000 A VCC = 1250 V, IF = 1000 A, RG = 3.9 , VGE = 15 V, L = 200 nH inductive load Erec min typ max Unit Tvj = 25C 1.95 2.20 V Tvj = 125C 1.90 2.20 V Tvj = 25C 760 A Tvj = 125C 950 A Tvj = 25C 560 C Tvj = 125C 950 C Tvj = 25C 1.3 s Tvj = 125C 1.8 s Tvj = 25C 0.52 J Tvj = 125C 0.86 J Characteristic values according to IEC 60747-2 Thermal Properties Parameter Symbol Conditions min typ max Unit IGBT thermal resistance junction to case Rth(j-c) IGBT 11 K/kW Diode thermal resistance junction to case Rth(j-c) Diode 22 K/kW IGBT thermal resistance case to heatsink Rth(c-h) IGBT Heatsink flatness : 2 K/kW Diode thermal resistance case to heatsink Rth(c-h) Diode Each submodule area < 20 m 4 K/kW 125 C max Unit Operating junction temperature Complete module area < 100 m Roughness : < 1.6 m Tvjop 5 Mechanical Properties Parameter Dimensions Symbol L* W* H Conditions Typical , see outline drawing min typ 236*150*26 mm Clearance distance DC acc. IEC 60664-1 and EN50124-1 10 mm Surface creepage distance DSC acc. IEC 60664-1 and EN50124-1 23 mm Weight 1.9 kg ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. Doc. No. 5SYA1580-02 May. 04 page 3 of 9 5SNR 10H2500 Electrical configuration C (Collector) G (Gate) E (Emitter) AE (Aux. Emitter) Outline drawing 5SNR 10H2500 Collector (3x) StakPak H3 This is an electrostatic sensitive device. Please observe the international standard IEC 60747-1, chapter IX. This product has been designed and qualified for Industrial Level. ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. Doc. No. 5SYA1580-02 May. 04 page 4 of 9 5SNR 10H2500 IC [A] IF [A] 2000 2000 25 C 125 C 25 C 125 C 1500 1500 1000 1000 500 500 0 0 0.5 1.5 2.5 3.5 4.5 1.0 1.5 2.0 2.5 VF [V] VCE [V] Fig. 1 Typical IGBT on-state characteristics 4500 4500 VGE = 15 V Tvj = 25 C 4000 Tvj = 125 C 4000 3500 VGE = 15 V 3500 VGE = 14 V 3000 3000 VGE = 13 V 2500 2000 IC[A] IC[A] Typical diode on-state characteristics Fig. 2 VGE = 14 V 2500 VGE = 13 V 2000 VGE = 12 V VGE = 12 V 1500 1500 VGE = 11 V VGE = 11 V 1000 1000 VGE = 10 V VGE = 10 V 500 500 VGE = 9 V VGE = 9 V 0 0 0 2 4 6 8 10 0 VCE[V] Fig. 3 Typical IGBT output characteristics at Tvj = 25 C 2 4 6 8 10 VCE[V] Fig. 4 Typical IGBT output characteristics at Tvj = 125 C ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. Doc. No. 5SYA1580-02 May. 04 page 5 of 9 5SNR 10H2500 IC [A] Ic [A] 4000 2500 VCE = 15 V 25 C 125 C 3000 2000 VCC 1500 V VGE = +/- 15 V Rgon = 3.9 Ohm Rgoff = 5.6 Ohm Tvj = 125C 1500 2000 1000 1000 500 0 8 9 10 11 12 13 14 15 0 500 1000 1500 2000 2500 Fig. 5 Typical IGBT transfer characteristics 3000 VCE [V] VGE [V] Fig. 6 IGBT turn-off safe operating area (RBSOA) VGE [V] C [nF] Cies 2 VCC = 750 V 1009 12 8 7 6 5 4 VOSC = 50 mV VGE = 0 V f = 1 MHz 3 Coes 2 10 VCC = 1250 V 9 6 8 7 6 5 VCC = 750, 1000, 1250 V IC = 1000 A VGE = - 15 ...+ 15 V Tvj = 25C Cres 4 3 3 2 1 0 0 5 10 15 20 25 30 0 2 4 VCE [V] Fig. 7 Typical IGBT capacitances versus collector-emitter voltage Fig. 8 6 Qge [C] Typical IGBT gate charge characteristics ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. Doc. No. 5SYA1580-02 May. 04 page 6 of 9 5SNR 10H2500 Eon, Eoff [J] Eon, Eoff [J] VCC = 1250 V VGE = +/- 15 V RGon = 3.9 Ohm RGoff = 5.6 Ohm Tvj = 125C 3 VCC = 1250 V VGE = +/- 15 V ICE = 1000 A Tvj = 125C 4 3 Eon 2 2 1 Eoff Eoff 1 Eon 0 0 500 1000 1500 0 2000 0 4 8 12 16 ICE [A] Fig. 9 Typical IGBT switching energies per pulse versus on-state current tr, tdon [s] tf, tdoff [s] 4 3 tdoff 1.0 VCC = 1250 V VGE = +/- 15 V RGon = 3.9 Ohm RGoff = 5.6 Ohm Tvj = 125C RG [Ohm] Fig. 10 Typical IGBT switching energies per pulse versus gate resistor tdoff [s] tf, tr, tdon [s] 4 VCC = 1250 V ICE = 1000 A VGE = +/- 15 V Tvj = 125C 0.8 6 3 0.6 tr 2 4 tdoff 0.4 tdon tr 1 0.2 2 1 tf tf 0 400 800 1200 1600 0.0 2000 ICE [A] Fig. 11 2 tdon Typical IGBT switching times versus on-state current 0 0 0 Fig. 12 2 4 6 8 10 12 14 16 18 RG [Ohm] Typical IGBT switching times versus gate resistor ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. Doc. No. 5SYA1580-02 May. 04 page 7 of 9 5SNR 10H2500 Erec [J] Irr, Qrr [A, C] 1500 1.5 Erec [J] Irr [A], Qrr [C], 2500 2.0 2000 1.6 Qrr 1000 1.0 Irr Qrr 1500 1.2 Erec 1000 500 Erec Irr 0.8 0.5 VCC = 1250 V VGE = +/- 15 V RGon = 3.9 Ohm Tvj = 125C 0 0.0 0 400 800 1200 1600 Typical diode reverse recovery characteristics versus forward current 0.4 0 2000 0.0 0 IF [A] Fig. 13 VCC = 1250 V ICE = 1000 A VGE = +/- 15 V Tvj = 125C 500 Fig. 14 2 4 6 8 10 12 RG [Ohm] Typical diode reverse recovery characteristics versus gate resistor ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. Doc. No. 5SYA1580-02 May. 04 page 8 of 9 5SNR 10H2500 Analytical function for transient thermal impedance: ZthIC [K/kW] 2 n Zth (j - c)(t) = Ri(1 - e - t/ i ) 1019 Diode 8 7 6 5 i =1 4 3 IGBT 2 IGBT 1009 8 7 6 5 i 1 2 3 4 Ri(K/kW) 4.569 4.611 0.945 0.804 i(ms) 580.8 53.11 3.286 0.609 Ri(K/kW) 9.137 9.223 1.889 1.607 i(ms) 580.8 53.11 3.286 0.609 4 DIODE Fm = 40...75 kN 3 Double Side Cooling 2 10-3 2 3 4 5 6 7 89 10-2 2 3 4 5 6 7 89 10-1 2 3 4 5 6 7 89 100 2 3 4 5 6 7 89 101 t [s] Fig.15 Maximum thermal impedance of IGBT and diode versus time Environmental class according to IEC 60721 Mode Class Document - no. Storage IE 11 5 SZK 9101-01 Transportation IE 23 5 SZK 9102-01 Operation IE 33 5 SZK 9103-01 ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice. ABB Switzerland Ltd Semiconductors Fabrikstrasse 3 CH-5600 Lenzburg, Switzerland Telephone +41 (0)58 586 1419 Fax +41 (0)58 586 1306 Email abbsem@ch.abb.com Internet www.abb.com/semiconductors Doc. No. 5SYA1580-02 May. 04