ZALM-301-1
APEX LT SERIES TRANSCEIVER MODULES
DESCRIPTION
Apex modules provide a cost-effective RF transceiver solution for 2.4GHz
ZigBee and IEEE 802.15.4 data links and wireless networks.
The ZALM-301-1 Apex LT module is based on EmberTM EM260
ZigBee network processor. Also onboard are a 100mW Power Amplier
and SPI-based microprocessor interface, providing you with the exibility
to choose an external microprocessor based on your application’s needs.
The APEX LT provide over 4000 feet of range and is designed to deliver
constant RF output power across the 2.1 to 3.6V voltage input, ensuring
consistent performance over the entire life of the battery.
Integrated Transceiver Modules for ZigBee/IEEE 802.15.4
Evaluation Kit available: ZAXM-201-KIT-1
The information in this document is subject to change without notice, please conrm data is current.
Document No: 0003-00-07-00-000 (Issue C)
Date Published: April 29, 2010
DATA SHEET
• 1 - 100mW output power, software congured
• Designed for EmberZNet networks
• Miniature footprint: 1.00” x 1.275”
• Integrated PCB trace antenna
• Optional MMCX connector for external antenna
• 16 RF channels (Channel 16 operates at reduced power levels)
• Over 4000 feet of range
• Integrated hardware support for Ember InSight Development
Environment
• Non-intrusive debug interface (SIF)
• AES 128 bit encryption
• Low power consumption
• Constant RF output power over 2.1– 3.6 V voltage range
• FCC, IC, and CE certied
• RoHS compliant
FEATURES
APEX LT MODULE
ZALM-301-1 • Ember™EM260platform
• IntegratedIEEE802.15.4
PHY and MAC
• Dedicatednetworkprocessor
• SPIorUARTinterfaceto
applicationmicrocontroller
• HandlesallZigBeeprocessing&
timingintensivetasks
APPLICATIONS
Home&
BuildingAutomation
•Security
•HVACcontrol
•Lightingcontrol
•Thermostats
Industrial Controls
•Foodprocessingcontrols
•TrafcManagement
•SensorNetworks
•AssetManagement
•Barcodereader
•PatientMonitoring
•Glucosemonitor
AutomatedMeter
Reading
•Inmeterapplications
•Thermostats
•In-homedisplayunits
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
ORDERINGINFORMATION
PartNumber OrderNumber Description Mins/Mults Status
APEX LT
ZALM-301
ZALM-301-1 Apex Lite 100mW transceiver module PCB Trace Antenna 160 pcs / 160 pcs
Not Recommended
For New Design
ZALM-301-1-B Apex Lite 100mW transceiver module PCB Trace Antenna Bulk (1 tray) 32 pcs / 32 pcs
ZALM-301-1C Apex Lite 100mW transceiver MMCX connector installed 5,120 pcs / 160 pcs
ZALM-301-1C-B Apex Lite 100mW transceiver MMCX connector installed Bulk (1 tray) N/A Discontinued
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
APEXLTMODULEBLOCKDIAGRAM
24 MHz
XTAL
Radio
Micro
processor
RF Front End
(Renesas PA &
Renesas Switch)
ANT
Castellation Edge
Connector
PWR
Reg
APEX LT
Ember EM260
ZigbeeTM SOC
EVALUATION KIT
CEL provides Apex Evaluation Kits to assist users in evaluating
Apex and Apex LT modules. The key components of the Apex
Evaluation Kit are the interface board and the CEL’s Apex radio
module.
Apex LT module combines an Ember EM260 (Apex LT)
transceiver IC with an NEC high gain Power Amplier and a high
performance NEC RFIC switch.
The interface board features a serial communication interface, a
power management module, peripherals such as potentiometer
and accelerometer, and GPIO headers. The Evaluation Kit also
contains four AA batteries and two USB cables.
For more detail information regarding Apex Evaluation Kit, refer to
the ApexModuleEvaluationKitUserGuide document. (http://
www.cel.com/pdf/misc/apexseries_ug.pdf)
Kit Contents:
•EvaluationBoards(2)
•ZigBeeModules(2)
•USBCables(2)
•AABatteries(4)
•TechnicalInformationCD(1)
OrderNumber Description
ZAXM-201-KIT-1* Engineering Evaluation Kit
• To evaluate the ZALM-301-1 module, please utilize the
ZAXM-201-KIT-1
PartNumber OrderNumber Description Mins/Mults Status
APEX LT
ZALM-301
ZALM-301-1 Apex Lite 100mW transceiver module PCB Trace Antenna 160 pcs / 160 pcs
Not Recommended
For New Design
ZALM-301-1-B Apex Lite 100mW transceiver module PCB Trace Antenna Bulk (1 tray) 32 pcs / 32 pcs
ZALM-301-1C Apex Lite 100mW transceiver MMCX connector installed 5,120 pcs / 160 pcs
ZALM-301-1C-B Apex Lite 100mW transceiver MMCX connector installed Bulk (1 tray) N/A Discontinued
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
IntroductionandOverview
Description.............................................................................................................................................................................................. 1
Features.................................................................................................................................................................................................. 1
Applications............................................................................................................................................................................................ 1
OrderingInformation............................................................................................................................................................................. 1
ApexLTModuleBlockDiagram............................................................................................................................................................ 3
Evaluation Kit......................................................................................................................................................................................... 3
SystemLevelFunction
Apex LT Module Microprocessor........................................................................................................................................................... 5
Antenna................................................................................................................................................................................................... 5
ModesofOperation(TX,RX,Sleep)...................................................................................................................................................... 7
Processor ACTIVE.................................................................................................................................................................................. 7
Processor IDLE....................................................................................................................................................................................... 7
PowerAmplierRegulatorControlLine................................................................................................................................................ 8
SIF Interface............................................................................................................................................................................................ 8
HostProtocolInterfaceCommands...................................................................................................................................................... 8
ElectricalSpecication
AbsoluteMaximumRatings................................................................................................................................................................... 9
Recommended(OperatingCondition).................................................................................................................................................. 9
DCCharacteristics.................................................................................................................................................................................. 9
RFCharacteristics.................................................................................................................................................................................. 10
PinSignal&Interfaces
PinSignalsI/OConguration................................................................................................................................................................ 10
ApexLTI/OPinAssignment.................................................................................................................................................................. 11
ApexLTModuleDimensions................................................................................................................................................................. 12
PCBCopperPatternLayout................................................................................................................................................................... 13
PCB Stencil Pattern................................................................................................................................................................................ 13
PCB Keep-Out Areas.............................................................................................................................................................................. 14
Processing 15
AgencyCertications 17
Shipment,Storage&Handling 18
References&RevisionHistory 19
TABLE OF CONTENTS
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
APEX LT MODULE MICROPROCESSOR
APEX LT modules provide a connection to the Ember Serial API over the SPI allowing the application development to be
completed on a host microprocessor of your choice. In addition to the SPI signals, two additional signals (nHOST_INT and
nWAKE) provide a handshake mechanism. The module provides a slave device with all transactions initiated by the host.
Please consult the EM260 datasheet for details on the SPI Protocol including:
• Physical Interface Conguration
• SPI Transactions
• SPI Protocol Timing Parameters & Waveforms
• Data Formatting
• SPI Commands & Responses
• Handling Resets and Power Cycling
• Transaction Examples
ANTENNA
APEX and APEX LT modules include an integrated PCB trace antenna.
An optional MMCX connector can be specied, enabling connection to
a 50-ohm external antenna of the user’s choice. See Ordering
Information.
The PCB antenna employs an F-Antenna topology that is compact and
supports an omni-directional radiation pattern.To maximize antenna efciency, an adequate ground plane must be provided
on the host PCB. If positioned correctly, the ground plane on the host board under the module can contribute signicantly
to antenna performance.
The position of the module on the host board and overall design of the product enclosure contribute to antenna perfor-
mance. Poor design effects radiation patterns and can result in reection, diffraction, and/or scattering of the transmitted
signal. Measured radiation patterns of these modules are available from California Eastern Labs and can be used to
benchmark design performance.
Here are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module.
• Never place the antenna close to metallic objects.
• In the overall design, ensure that wiring and other components are not placed near the antenna.
• Do not place the antenna in a metallic or metallized plastic enclosure.
• Keep plastic enclosures 1cm or more from the antenna in any direction.
TOP VIEW
TOP VIEW TOP VIEW
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
Orientation of EUT Peak Gain was in the Horizontal Position. The receiver antenna was in the Horizontal Position.
-30
-25
-20
-15
-10
-5
0
5
30
210
60
240
90
270
120
300
150
330
1800
Horizontal Polarization Gain (dBi)
min: -8.9 max: +1.8 avg: -2.7
Vertical Polarization Gain (dBi)
min: -26.1 max: -7.3 avg: -14.7
Frequency = 2405 MHz
Horizontal Polarization Gain (dBi)
min: -15.2 max: +1.4 avg: -3.1
Vertical Polarization Gain (dBi)
min: -22.1 max: -8.7 avg: -13.9
Frequency = 2480 MHz
Frequency = 2440 MHz
Vertical Polarization Gain (dBi)
min: -24.7 max: -9.6 avg: -14.8
Horizontal Polarization Gain (dBi)
min: -8.1 max: +0.4 avg: -3.4
-30
-25
-20
-15
-10
-5
0
5
30
210
60
240
90
270
120
300
150
330
1800
-30
-25
-20
-15
-10
-5
0
5
30
210
60
240
90
270
120
300
150
330
1800
ANTENNA (Continued)
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
MODES OF OPERATION
The Apex LT supports three power modes: Processor ACTIVE, processor IDLE, and DEEP SLEEP.
Processor ACTIVE
In this mode all operations are running normally.
Processor IDLE
While in idle mode, code execution halts until any interrupt occurs. All modules of the EM260 including the radio continue to
operate normally. The EmberZNet stack automatically invokes idle as appropriate.
Deep Sleep
To achieve the lowest power consumption, the module can be set in DEEP SLEEP mode. In this mode most of the function-
alities of the modules are turned off with the exception of the critical functions such as GPIO pads and RAM that is powered
by the high voltage supply (DCC_PADS).
The module can be taken out of DEEP SLEEP in 3 ways:
• Conguring the sleep timer to generate an interrupt after some periods of time.
• Issuing external interrupt signal.
• Issuing commands through the SIF interface.
In DEEP SLEEP the current consumption of the module will drop to 5.0μA (5.5μA with optional 32.768kHz oscillator en-
abled).
For more detail information on modes of operation refer to Ember EM260 datasheet available at Ember’s website
(www.ember.com)
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
POWERAMPLIFIERREGULATORCONTROLLINE
The APEX LT module includes a separate 1.8V regulator for a power amplier bias that enables consistent module out-
put performance over the wide 2.1 – 3.6V voltage range. To prevent excessive sleep currents, this regulator should be
disabled when the module is in sleep mode. An external pull up resistor option is provided on each module (R6) that allows
the regulator to be constantly enabled. This option increases the sleep current of the module to a point well above the
specied values.
SPECIFICATIONS—VPA_EN(APEXLT)
Parameter Min Typ Max Unit
Regulator enable voltage 0.95 V
Regulator disable voltage 0.4 V
Enable line current (VEN = 0) 0.1 μA
Enable line current (VEN = VDD) 10 μA
Turn on Time 250 μsec
On the APEX LT module the VPA_EN control must be provided by the host microprocessor. In normal operation, the VPA_
EN line must be set high. It must be set low when the module is put into sleep mode in conjunction with putting the EM260
into deep sleep. Upon module wake-up, a 250µsec turn-on time must be provided prior to any transmission, allowing the
module’s regulator to settle. Note that this 250µsec requirement applies only to the external power amplier, the wake-up
time for the EM260 is separate from this value.
If the application does not put the module to sleep or if sleep current is not an issue, the power amplier regulator may
be permanently enabled by tying the control line high. In this setup, the sleep current will increase by 80μA over the 5μA
Standby Current gure provided in Electrical Specications.
SIF INTERFACE
The APEX LT module provide access to the SIF module programming and debug interface.
Consult the EM260 datasheet for further details on the following SIF features:
• Production Testing
• Firmware Download
• Product Control and Characterization
HOST PROTOCOL INTERFACE COMMANDS
For information on Host Protocol Interface Commands and for other software-related documents refer to Ember’s website:
http://www.ember.com/products_documentation.html
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
ABSOLUTEMAXIMUMRATINGS
Rating Value Unit
Power Supply Voltage 3.6 Vdc
Voltage on Any Digital Pin VDD + 0.3,
Max 3.6 Vdc
RF Input Power +10 dBm
Storage Temperature Range -45 to 125 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED(OPERATINGCONDITIONS)
Characteristic Min Typ Max Unit
Power Supply Voltage (VDD) 2.1 3.6 V
Input Frequency 2405 2480 MHz
Ambient Temperature Range -40 25 85 °C
Logic Input Low Voltage 0 20% VDD V
Logic Input High Voltage 80% VDD VDD V
DC CHARACTERISTICS (@ 25°C, VDD = 3.3V unless otherwise noted)
Parameter Min Typ Max Unit
Logic Input Low 0 0.2 x VDD V
Logic Input High 0.8 x VDD VDD V
Logic Output Low 0 0.18 x VDD V
Logic Output High 0.82 x VDD VDD V
PowerConsumption
Transmit Mode (100mW output):
APEX LT 170 mA
Receive Mode:
APEX LT 37 mA
Standby Mode:
10mW 5 μA
100mW 5 μA
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
RF CHARACTERISTICS (@ 25°C, VDD = 3.3V unless otherwise noted)
Parameter Min Typ Max Unit
GeneralCharcteristics
RF Frequency Range 2400 2483.5 MHz
RF Data Rate 250 kbps
Transmitter
Nominal Output Power 20 dBm
Programmable Output Power Range 32 dB
Error Vector Magnitude 15 35 %
Receiver
Receiver Sensitivity (1% PER) – normal mode -92 -96 dBm
Receiver Sensitivity (1% PER) – boost mode* -93 -97 dBm
Saturation (Maximum Input Level) (1% PER) 0 dBm
802.15.4 Adjacent Channel Rejection:
APEX LT 30 dB
802.15.4 Alternate Channel Rejection 40 dB
802.11 g Rejection (±10 MHz):
APEX LT 30 dB
*Boost Mode is an optional software-selectable high performance mode designed to increase receiver sensitivity.
Note: Refer to Ember EM260 datasheet for additional details.
PINSIGNALSI/OPORTCONFIGURATION
The APEX LT module has a 28 edge I/O interfaces for connection
to the user’s host board. Figure 1 shows the layout of the 28 edge castellations.
PIN 1
PIN 10
PIN 28
PIN 19
Figure 1 (Top View)
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
APEXLTI/OPINASSIGNMENTS
Pin # Name Type Description
1GROUND GND Ground
2GROUND GND Ground
3GROUND GND Ground
4GROUND GND Ground
5 VDD PI Power Supply Input
6 nRESET DI Reset, active low
7MOSI DI SPI Data, Master Out/Slave In (from Host to APEX LT)
8MISO DO SPI Data, Master In/Slave Out (from APEX LT to Host)
9 SCLK DI SPI Clock (from Host to APEX LT)
10 VPA_EN DI APEX LT Enable, active high (see section of “Power Amplier Regulator
Control Line”)
11 nRTS DO UART RTS
12 nSSEL_INT/nCTS DI SPI Slave Select (from Host to APEX LT)/UART CTS
13 PTI_EN DO PTI Frame signal
14 PTI_DATA DO PTI Data signal
15 TXD DO UART TXD
16 nHOST_INT/RXD DO/DI Host Interrupt Signal (from APEX LT to Host) or UART RXD
17 nWAKE DI Wake Interrupt Signal (from host to APEX LT)
18 GROUND GND Ground
19 SIF_CLK DI SIF Interface clock
20 SIF_MISO DO SIF Interface master in/slave out
21 SIF_MOSI DI SIF Interface master out/slave in
22 nSIF_LOAD DI/DO SIF Interface load strobe
23 SDBG DO Spare Debug Signal
24 LINK_ACTIVITY DO Link and Activity signal
25 GROUND GND Ground
26 GROUND GND Ground
27 GROUND GND Ground
28 GROUND GND Ground
UnusedI/OpinsshouldbeleftunconnectedandthepinstatesetviatheHostProtocol.
DI = Digital Input PI = Power Input
DO = Digital Output GND = Ground
AI = Analog Input
AO = Analog Output
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
DIMENSIONS: ZALM-301-1 Apex LT
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
DIMENSIONS:ZALM-301-1CApexLTwithOptionalMMCXConnector
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
TOP VIEW
0.062
1.275
1.000
0.909
RF Shield
0.195
MAX
PCB Trace Antenna
PIN 19: SIF_CLK
SIF_MISO
SIF_MOSI
nSIF_LOAD
SDBG
LINK_ACTIVITY
GROUND
GROUND
GROUND
PIN 28: GROUND
PIN 10: VPA_EN
SCLK
MISO
MOSI
nRESET
VDD
GROUND
GROUND
GROUND
PIN 1: GROUND
PIN 18: GROUND
nWAKE
nHOST_INT/RXD
TXD
PTI_DATA
PTI_EN
nSSEL_INT/nCTS
PIN 11: nRTS
TOP VIEW
PIN 19: SIF_CLK
SIF_MISO
SIF_MOSI
nSIF_LOAD
SDBG
LINK_ACTIVITY
GROUND
GROUND
GROUND
PIN 28: GROUND
PIN 10: VPA_EN
SCLK
MISO
MOSI
nRESET
VDD
GROUND
GROUND
GROUND
PIN 1: GROUND
PIN 18: GROUND
nWAKE
nHOST_INT/RXD
TXD
PTI_DATA
PTI_EN
nSSEL_INT/nCTS
PIN 11: nRTS
0.062
1.275
1.000
0.909
RF Shield
0.195
0.205
0.410
Optional MMCX Connector
for external antenna
Overall Height
w/MMCX Connector
J2 J2
MAX
MAX
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
PCB COPPER PATTERN LAYOUT: Apex LT
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
0.850
0.090
0.050
0.240
0.025
0.025
0.970
0.100 Pitch Typ0.040 0.125 Typ 28 Pads
0.070 Typ 28 Pads
Recommended Host PCB Board Edge
0.040
PIN 128
PCB PASTE STENCIL PATTERN: Apex LT
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
0.900
0.100 Pitch Typ0.065 0.100 Typ 28 Pads
0.070 Typ 28 Pads
0.065
PIN 128
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
PCB Keep-out areas: Apex LT
Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.
For optimum antenna performance, the APEX LT modules should be mounted with the PCB trace antenna overhanging
the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the
module, up to the PCB edge. The installation of an uninterrupted ground plane on a layer directly beneath the module will
also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.
1.275
1.000
1.200
0.190
0.315 0.050
If optional MMCX connector is specified, edge
of host board must be notched as shown
Edge of Host PCB
Recommended overhang
for PCB Antenna = 0.230
If module does not overhang edge
of host PCB, no components, copper
or traces are allowed in this area
Component Keep Out Area:
No components within 0.100 inches of module
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
PROCESSING
RecommendedReowProle
ParametersValues
Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max
Minimum Soak Temperature 150ºC
Maximum Soak Temperature 200ºC
Soak Time 60-120 sec
TLiquidus 217ºC
Time above TL 60-150 sec
Tpeak 260 + 0ºC
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp down rate 6ºC/sec max
Achieve the brightest possible solder llets with a good shape and low contact angle.
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate
IPC specication. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is
not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads.
• Proper solder joints on all pads.
• Excessive solder or contacts to neighboring pads, or vias.
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
RepeatingReowSoldering
Only a single reow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Hand Soldering
Hand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/
reference document IPC-7711.
Rework
The Apex LT Module can be unsoldered from the host board. Use of a hot air re-work tool and hot plate for pre-heating from
underneath is recommended. Avoid overheating.
!Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate
warranty coverage.
AdditionalGrounding
Attempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover
is done at the customers own risk. The numerous ground pins at the module perimeter should be sufcient for optimum
immunity to external RF interference.
PROCESSING (Continued)
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
AGENCYCERTIFICATIONS
FCCPart15.247ModuleCertied(Mobile)
The APEX LT modules comply with Part 15 of the Federal Communications Commission rules and regulations.
To meet the FCC Certication requirements, the user must meet these regulations:
• The text on the FCC ID label provided with the module must be placed on the outside of the nal product.
• The modules may only use the antennas that have been tested and approved with these modules:
— The on-board PCB trace antenna
— Nearson S131CL-5-RMM-2450S antenna.
To meet the Section 15.209 emission requirements in the restricted frequency bands of Section 15.205, the transceiver
transmitter power for the APEX LT (EM260) module needs to be reduced from the typical maximum setting on the upper
two channels (2475 MHz and 2480 MHz). Maximum values are TBD.
Per Section 2.109, the APEX LT module has been certied by the FCC for use with other products without additional
certication. Any modications to this product may violate the rules of the Federal Communications Commission and make
operation of the product unlawful.
Per Sections 15.107 and 15.109, the user’s end product must be tested for unintentional radiators compliance.
Per Section 47 C.F.R. Sec.15.105(b), the APEX LT modules is certied as mobile devices for the FCC radiation exposure
limits set forth for an uncontrolled environment. The antennas used with these modules must be installed to provide a
separation distance of at least 8 inches (20cm) from all persons. If the module is to be used in a handheld application, the
user is responsible for passing additional FCC part 2.1091 rules (SAR) and FCC Guidelines for Human Exposure to Radio
Frequency Electromagnetic Fields, OET Bulletin and Supplement C.
ICCertication—Canada
The APEX LT module is IC certied. The labeling requirements for Industry Canada are similar to those of the FCC. A
visible label on the outside of the nal product must display the IC labeling. The user is responsible for the end product to
comply with IC ICES-003 (Unintentional radiators).
CECertication—Europe
The APEX module is CE certied. The CE marking must be afxed legibly and indelibly to a visible location on the user’s
product.
FCC Approved Antennas
•IntegratedPCBtraceantenna
•NearsonS131CL-5-RMM-2450S–A 2.4GHz Dipole antenna with a 5 inch cable and a right angle MMCX connector.
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
SHIPMENT,HANDLING,ANDSTORAGE
Shipment
The Apex LT Module is delivered in trays of 32. Each package consist of 5 trays and therefore the total module quantity per
package is 160.
Handling
The Apex LT Module is designed and packaged to be processed in an automated assembly line.
!Warning The Apex LT Module contain a highly sensitive electronic circuitry. Handling without proper ESD protection
may destroy or damage the module permanently.
!Warning According to JEDEC ISP, the Apex LT Module is moisture sensitive devices. Appropriate handling instructions
and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake.
MoistureSensitivityLevel(MSL)
MSL 3, per J-STD-033
NOT RECOMMENDED
FOR NEW DESIGN
ZALM-300 Series
REFERENCES&REVISIONHISTORY
References
ReferenceDocuments
Apex Module Evaluation Kit User Guide
Ember EM260 Datasheet (June 29, 2007)
RevisionHistory
Previous Versions ChangestoCurrentVersion Page
0002/3-00-07-00-000
(Issue A) May 7, 2008 Initial preliminary datasheet. N/A
0003-00-07-00-000
(Issue B) January 22, 2009 Datasheet Unication for ZigBee product line N/A
0003-00-07-00-000
(Issue C) April 29, 2010 The following corrections/changes were made: On page 11, the module height
was changed from 0.162” to 0.195”. On page 6, the deep sleep mode current
consumption was changed to 5.0μA.
6, 11
Disclaimer
• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most
up-to-date specications of CEL products. Not all products and/or types are available in every country. Please
check with an CEL sales representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.
• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software and information in the design of a customer’s •equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.
• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and
acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to
property or injury (including death) to persons arising from defects in CEL products, customers must incorporate
sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.
NOT RECOMMENDED
FOR NEW DESIGN
