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FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5
July 2010
FODM452, FODM453
5-Pin Mini Flat Package High Speed Transistor
Optocoupler
Features
■
Compact 5-pin mini flat package
■
High speed-1 MBit/s
■
Superior CMR-15kV/µs at V
CM
= 1500V (FODM453)
■
Performance guaranteed over temperature (0–70°C)
■
U.L. recognized (File # E90700)
■
VDE0884 recognized (File # 136480)
– Ordering option V, e.g., FODM452V
■
260°C reflow capability for Pb-free assembly
Applications
■
Line receivers
■
Pulse transformer replacement
■
Output interface to CMOS-LSTTL-TTL
■
Wide bandwidth analog coupling
Description
The FODM452 and FODM453 optocouplers consist of
an AlGaAs LED optically coupled to a high speed photo-
detector transistor. The devices are housed in a compact
5-pin mini flat package for optimum mounting density.
The FODM453 features a high CMR rating for optimum
common mode transient immunity.
Related Resources
■
www.fairchildsemi.com/products/opto/
■
www.fairchildsemi.com/pf/FO/FODM611.html
■
www.fairchildsemi.com/pf/FO/FODM8061.html
■
www.fairchildsemi.com/pf/FO/FODM8071.html
Functional Schematic
1
3 4
5
6VCC
VO
GNDCATHODE
ANODE
Truth Table
LED Output
Off High
On Low
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 2
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Pin Definitions
Safety and Insulation Ratings for Mini-Flat Package (SO5 Pin)
As per IEC60747-5-2 (Pending Certification). This optocoupler is suitable for “safe electrical insulation” only within the
safety limit data. Compliance with the safety ratings shall be ensured by means of protective circuits.
Number Name Function Description
1 ANODE Anode
3CATHODE Cathode
4 GND Output Ground
5V
O
Output Voltage
6V
CC
Output Supply Voltage
Symbol Parameter Min. Typ. Max. Unit
Installation Classifications per DIN VDE 0110/1.89 Table 1
For rated main voltage < 150Vrms I-IV
For rated main voltage < 300Vrms I-III
Climatic Classification 40/85/21
Pollution Degree (DIN VDE 0110/1.89) 2
CTI Comparative Tracking Index 175
V
PR
Input to Output Test Voltage, Method b,
VIORM x 1.875 = V
PR
, 100% Production Test with
t
m
= 1 sec, Partial Discharge < 5 pC
1060
V
PR
Input to Output Test Voltage, Method a,
VIORM x 1.5 = V
PR
, Type and Sample Test with
t
m
= 60 sec, Partial Discharge < 5 pC
848
V
IORM
Max Working Insulation Voltage 565 V
peak
V
IOTM
Highest Allowable Over Voltage 4000 V
peak
External Creepage 5.0 mm
External Clearance 5.0 mm
Insulation thickness 0.5 mm
T
Case
Safety Limit Values, Maximum Values allowed in the event
of a failure, Case Temperature
150
°
C
R
IO
Insulation Resistance at T
S
, V
IO
= 500V 10
9
Ω
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 3
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Absolute Maximum Ratings
(T
A
= 25°C unless otherwise noted)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol Parameter Value Units
T
STG
Storage Temperature -40 to +125 °C
T
OPR
Operating Temperature -40 to +85 °C
EMITTER
I
F
(avg) DC/Average Forward Input Current 25 mA
I
F
(pk) Peak Forward Input Current (50% duty cycle, 1ms P.W.) 50 mA
I
F
(trans) Peak Transient Input Current (
≤
1µs P.W., 300pps) 1.0 A
V
R
Reverse Input Voltage 5 V
P
D
Input Power Dissipation
(No derating required over specified operating temp range)
45 mW
DETECTOR
I
O
(avg) Average Output Current 8 mA
I
O
(pk) Peak Output Current 16 mA
V
CC
Supply Voltage -0.5 to 30 V
V
O
Output Voltage -0.5 to 20 V
P
D
Output Power Dissipation
(No derating required over specified operating temp range)
100 mW
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 4
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Electrical Characteristics
(T
A
= 0 to 70°C unless otherwise specified)
Individual Component Characteristics
Transfer Characteristics
Switching Characteristics
(V
CC
= 5V)
Isolation Characteristics
*All Typicals at T
A
= 25°C
Symbol Parameter Test Conditions Min. Typ.* Max. Unit
EMITTER
V
F
Input Forward Voltage I
F
= 16mA, T
A
= 25°C 1.60 1.7 V
I
F
= 16mA 1.8
B
VR
Input Reverse Breakdown Voltage I
R
= 10µA 5.0 V
∆
V
F
/
∆
T
A
Temperature Coefficient of
Forward Voltage
I
F
= 16mA -1.8 mV/°C
DETECTOR
I
OH
Logic High Output Current I
F
= 0mA, V
O
= V
CC
= 5.5V, T
A
=25°C .001 0.5 µA
I
F
= 0 mA, V
O
= V
CC
= 15V, T
A
=25°C .001 1
I
F
= 0mA, V
O
= V
CC
= 15V 50
I
CCL
Logic Low Supply Current I
F
= 16mA, V
O
= Open, V
CC
= 15V 100 200 µA
I
CCH
Logic high supply current I
F
= 0 mA, V
O
= Open, V
CC
= 15V,
T
A
= 25°C
0.05 1 µA
I
F
= 0mA, V
O
= Open, V
CC
= 15V 2
Symbol Parameter Test Conditions Min. Typ.* Max Unit
COUPLED
CTR Current Transfer Ratio
(1)
I
F
= 16mA, V
CC
= 4.5V T
A
= 25°C V
OL
=0.4V 20 50 %
V
OL
=0.5V 15
V
OL
Logic LOW Output
Voltage
I
F
= 16mA, I
O
= 3mA, V
CC
= 4.5V, T
A
=2 5°C 0.4 V
I
F
= 16mA, I
O
= 2.4mA, V
CC
= 4.5 V 0.5
Symbol Parameter Test Conditions Device Min. Typ.* Max. Unit
T
PHL
Propagation Delay
Time to Logic LOW
R
L
= 1.9k
Ω
, I
F
= 16mA, T
A
= 25°C
(2)
(Fig. 9) 0.40 0.8 µs
R
L
= 1.9k
Ω
, IF = 16mA(2) (Fig. 9) 1.0 µs
TPLH Propagation Delay
Time to Logic HIGH
RL = 1.9kΩ, IF = 16mA, TA = 25°C(2) (Fig. 9) 0.35 0.8 µs
RL = 1.9kΩ, IF = 16mA(2) (Fig. 9) 1.0 µs
|CMH| Common Mode
Transient Immunity
at Logic HIGH
IF = 0mA, VCM = 10VP-P, RL = 1.9kΩ,
TA = 25°C(3) (Fig. 10)
FODM452 5 15 KV/µs
IF = 0mA, VCM = 1500VP-P, RL = 1.9kΩ
TA = 25°C(3) (Fig. 10)
FODM453 15 40 KV/µs
|CML| Common Mode
Transient Immunity
at Logic LOW
IF = 16mA, VCM = 10VP-P, RL = 1.9kΩ,
TA = 25°C(3) (Fig. 10)
FODM452 5 15 KV/µs
IF = 16mA, VCM = 1500VP-P, RL = 1.9kΩ,
TA = 25°C(3) (Fig. 10)
FODM453 15 40 KV/µs
BW Bandwidth RL = 100Ω3 MHz
Symbol Characteristics Test Conditions Min. Typ.* Max. Unit
VISO Withstand Insulation Test Voltage RH ≤ 50%, TA = 25°C, t = 1 min.(4) 3750 VRMS
CI-O Capacitance (Input to Output) f = 1MHz(4) 0.2 pF
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 5
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Notes:
1. Current Transfer Ratio is defined as a ratio of output collector current, IO, to the forward LED input current, IF,
times 100%.
2. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor.
3. Common mode transient immunity in logic high level is the maximum tolerable (positive) dVcm/dt on the
leading edge of the common mode pulse signal VCM, to assure that the output will remain in a logic high state
(i.e., VO > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dVcm/dt
on the trailing edge of the common mode pulse signal, VCM, to assure that the output will remain in a logic low
state (i.e., VO < 0.8V).
4. Device is considered a two terminal device: Pins 1, and 3 are shorted together and Pins 4, 5, and 6 are shorted
together.
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 6
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Typical Performance Curves
Fig. 1 Input Forward Current vs Forward Voltage
VF – FORWARD CURRENT (mA)
1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
IF – FORWARD CURRENT (mA)
0.001
0.01
0.1
1
10
100
Fig. 2 Normalized Current Transfer Ratio vs. Input Current
IF – INPUT CURRENT (mA)
110
NORMALIZED CURRENT TRANSFER RATIO
0.90
0.95
1.00
1.05
1.10
1.15
1.20
Fig. 3 Normalized Current Transfer Ratio
vs. Ambient Temperature
TA – AMBIENT TEMPERATURE
-40 -20 0 20 40 60 80 100
NORMALIZED CURRENT TRANSFER RATIO
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Fig. 4 Logic High Output Current
vs. Ambient Temperature
TA – TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100
I
OH
– LOGIC HIGH OUTPUT CURRENT (nA)
0.1
1
10
Fig. 5 DC and Pulsed Transfer Characteristics
VO – OUTPUT VOLTAGE (V)
024 6810121416
IO - OUTPUT CURRENT (mA)
Fig. 6 Propagation Delay vs. Load Resistance
RL – LOAD RESISTANCE (kΩ)
12345678910
tP – PROP
AGATION DELAY (µs)
TA = 25°CVO = 0.4V
VCC = 5V
TA = 25°C
Normalized to IF = 16mA
IF = 16mA
VO = 0.4V
VCC = 5V
Normalized to TA = 25°C
VO = VCC = 5V
IF = 0V
TA = 25°C
VCC = 5V
IF = 40mA
35mA
30mA
25mA
20mA
15mA
10mA
5mA
0
2
4
6
8
10
12
14
0.1
1
10
TA = 25°C
VCC = 5V
IF = 16mA
tPLH
tPHL
IF = 10mA
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 7
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Typical Performance Curves (Continued)
Fig. 7 Propagation Delay vs. Ambient Temperature Fig. 8 Frequency Response
1400
IF = 16mA
VCC = 5V
RL = 1.9kΩ
IF = 16mA
VCC = 5V
TA = 25°CRL = 220Ω
RL = 470Ω
RL = 100Ω
RL = 1kΩ
tPHL
tPLH
1200
1000
800
600
400
200
0
-40 -20 0 20 40
TA – AMBIENT TEMPERATURE (°C) f – FREQUENCY (MHz)
tP – PROPAGATION DELAY (ns)
NORMALIZED RESPONSE (dB)
60 80 100 0.01 0.1 1 10
5
0
-5
-10
-15
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 8
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Pulse Gen
CM
V
V
FF
B
A
+-
+5 V
O
V
-
I
F
3
+
1
Shield
Noise
5
O
4
GND
6
V
CC
V
L
R
PLH
OL
V
V
O
0
5 V
1.5 V
F
I
1.5 V
T
PHL
T
Switch at A : I = 0 mA
F
Switch at A : I = 16 mA
F
t
r
V
O
O
V
OL
V
5 V
0 V 10% 10%
90%
CM
V 10 V
I Monitor
F
3
I/f < 100µs
10% D.C.
tr = 5ns
Generator
Pulse
Z = 50
O
+I
Ω
F
1
Shield
Noise
V
O
O
5
4
GND
6
V
L
R
CC
V+5 V
0.1 µF
L
C = 1.5 µF
0.1 µF
f
t
m
R
90%
Fig. 10 Common Mode Immunity Test Circuit
Fig. 9 Switching Time Test Circuit
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 9
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Package Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
Notes:
1. No standard applies to this package.
2. All dimensions are in millimeters.
3. Dimensions are exclusive of burrs, mold flash, and tie bar extrusion.
4. Drawings filesname and revision: MKT-MFP05A.
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 10
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Footprint Drawing for PCB Layout
Device
‘A’
Device
‘B’
Pin 1
Unutilized Solder Pad
End Stacking Configuration
Dimensions in millimeters
Pin 1
0.61 1.27 1.27 1.27
2.54
1.45
5.05 7.95
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 11
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Tape and Reel Dimensions
D
D
W
Kt
d
1
0PP
A
P
0
B0
0
2
E
F
W
1
0
Reel Diameter
Devices Per Reel
Max. Component Rotation or Tilt
Cover Tape Thickness
Cover Tape Width
Pocket Hole Diameter
Pocket Dimension
Pocket Location
Sprocket Hole Location
Sprocket Hole Diameter
Sprocket Hole Pitch
Tape Thickness
Pocket Pitch
Tape Width
Symbol
Description
B
d
W
1
D
K
0
1
0
E
A
P
0
P
F
2
D
P
0
0
t
W
330mm (13")
Dimensions (mm)
12.00 +0.30 / -0.10
7.30 ±0.10
10° Max.
2500
1.50 Min.
2.30 ±0.10
0.065 ±0.010
9.20
1.75 ±0.10
8.00 ±0.10
2.00 ±0.10
5.50 ±0.10
4.40 ±0.10
1.50 +0.10 / -0.0
4.00 ±0.10
0.30 ±0.05
2.54 Pitch
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 12
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Ordering Information
Marking Information
Option
Order Entry Identifier
(example) Description
R2 FODM452R2 Tape and Reel (2500 per reel)
V FODM452V IEC60747-5-2
R2V FODM452R2V IEC60747-5-2, Tape and Reel (2500 per reel)
1
2
6
43 5
Definitions
1Fairchild logo
2Device number
3IEC60747-5-2 mark (Note: Only appears on parts ordered
with VDE option – See order entry table)
4 One digit year code, e.g., ‘7’
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
M452
MYYX
V
V
©2003 Fairchild Semiconductor Corporation www.fairchildsemi.com
FODM452, FODM453 Rev. 1.0.5 13
FODM452, FODM453 — 5-Pin Mini Flat Package High Speed Transistor Optocoupler
Reflow Profile
Profile Freature Pb-Free Assembly Profile
Temperature Min. (Tsmin) 150°C
Temperature Max. (Tsmax) 200°C
Time (tS) from (Tsmin to Tsmax) 60–120 seconds
Ramp-up Rate (tL to tP) 3°C/second max.
Liquidous Temperature (TL) 217°C
Time (tL) Maintained Above (TL) 60–150 seconds
Peak Body Package Temperature 260°C +0°C / –5°C
Time (tP) within 5°C of 260°C 30 seconds
Ramp-down Rate (TP to TL) 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max.
Time (seconds)
Temperature (°C)
Time 25°C to Peak
260
240
220
200
180
160
140
120
100
80
60
40
20
0
TL
ts
tL
tP
TP
Tsmax
Tsmin
120
Preheat Area
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
240 360
© Fairchild Semiconductor Corporation www.fairchildsemi.com
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Counterfeiting of semiconductor parts is a growing pro blem in the indu stry. All m anufactur ers of sem iconductor products a re ex periencing cou nterfeiting o f their
parts. Customers w ho inadverten tly purchase coun terfeit par ts experien ce many pr oblems such as lo ss of bra nd reputa tion, su bstandard per formance, failed
applications, and incr eased cost o f productio n and man ufacturing delays. Fairchild is taking strong mea sures to protect oursel v es and our cu stomers from the
proliferatio n of counterfeit parts. F airchild stron gly encourage s customers to pur chase Fairchild parts eith er directly from Fairchild or fr om Authorized Fair child
Distributors w ho are l isted by cou ntry on o ur web pag e cited ab ove. Produ cts customers b uy either from Fair child directly or from A uthorized Fair child Distributor s
are genuine par ts, hav e full tr aceability , meet Fairchild' s quality standards for hand ling and sto rage and prov ide access to Fa irch ild's fu ll range of up-to-da te techn ical
and product informati on. Fairchil d and o ur Author ized Distributo rs will stan d behind all warran ties and will a ppropriately address any warranty issues that may a rise.
Fairchild will not prov ide any w arranty cov erage or other assi stance fo r parts bough t from Una uthorized S ources. F airchild is c ommitted to com bat this global
problem and encourage our customers to do th eir part in stopping this p ractice by bu ying direct or from au thorized distributo rs.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative / In Design Datasheet contains the design specifications for product development. Spec ifications may change
in any manner without notice.
Preliminary First Production
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve the design.
Obsolete Not In Production Datasheet contains spec ifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I76
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