M29F800FT55M3F2 - Micron Technology, Inc.

Micron Parallel NOR Flash Embedded

Memory

Top/Bottom Boot Block 5V Supply

M29F200FT/B, M29F400FT/B, M29F800FT/B, M29F160FT/B

Features

• Supply voltage

– VCC = 5V

• Access time: 55ns

• Program/erase controller

– Embedded byte/word program algorithms

• Erase suspend and resume modes

• Low power consumption

– Standby and automatic standby

• 100,000 PROGRAM/ERASE cycles per block

• Electronic signature

– Manufacturer code: 0x01h

• Top device codes

– M29F200FT: 0x2251

– M29F400FT: 0x2223

– M29F800FT: 0x22D6

– M29F160FT: 0x22D2

• Bottom device codes

– M29F200FB: 0x2257

– M29F400FB: 0x22AB

– M29F800FB: 0x2258

– M29F160FB: 0x22D8

• RoHS-compliant packages

– TSOP48

– SO44 (16Mb not available for this package)

• Automotive device grade 3

– Temperature: –40 to +125°C

• Automotive device grade 6

– Temperature: –40 to +85°C

• Automotive grade certified (AEC-Q100)

M29FxxxFT/B

Features

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 1Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

Part Numbering Information

Devices are shipped from the factory with memory content bits erased to 1. Part numbers can be verified at

www.micron.com. Feature and specification comparison by device type is available at www.micron.com/products.

Contact the factory for devices not found.

Table 1: Part Number Information

Part Number

Category Category Details

Device Type M29F = 5V

Density 200 = 2Mb

400 = 4Mb

800 = 8Mb

160 = 16Mb (not available in SO 44 package)

Technology F = 110nm

Configuration T = Top boot

B = Bottom boot

Speed 55 = 55ns device speed in conjunction with temperature range = 3, which denotes Auto Grade –

40 to 125 °C parts

5A = 55ns access time (Auto Grade) only in conjunction with the Grade 6 option

Package M = SO 44

N = TSOP 48 12mm x 20mm AL 42

Temperature Range 6 = –40°C to +85°C

3 = –40°C to +125°C

Shipping Options blank = standard packing (Tray)

E = RoHS-compliant package, standard packing (tray)

T = Tape and reel packing (24mm)

F = RoHS-compliant package, tape and reel packing (24mm)

Fab Location 2 = Fab 13 (Singapore)

M29FxxxFT/B

Features

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 2Micron Technology, Inc. reserves the right to change products or specifications without notice.

Contents

General Description ......................................................................................................................................... 6

Signal Assignments ......................................................................................................................................... 15

TSOP Pin Assignments ................................................................................................................................ 15

Small-Outline Pin Assignments ................................................................................................................... 19

Signal Descriptions ......................................................................................................................................... 22

Bus Operations ............................................................................................................................................... 24

Read .......................................................................................................................................................... 24

Write .......................................................................................................................................................... 24

Output Disable ........................................................................................................................................... 24

Standby ..................................................................................................................................................... 24

Automatic Standby ..................................................................................................................................... 24

Command Interface ....................................................................................................................................... 25

READ/RESET Command ............................................................................................................................ 25

AUTO SELECT Command ........................................................................................................................... 25

PROGRAM Command ................................................................................................................................ 26

UNLOCK BYPASS Command ...................................................................................................................... 26

UNLOCK BYPASS PROGRAM Command ..................................................................................................... 27

UNLOCK BYPASS RESET Command ............................................................................................................ 27

CHIP ERASE Command .............................................................................................................................. 27

BLOCK ERASE Command ........................................................................................................................... 27

ERASE SUSPEND Command ....................................................................................................................... 28

ERASE RESUME Command ........................................................................................................................ 28

READ CFI QUERY Command ...................................................................................................................... 28

16-Bit Mode Commands ......................................................................................................................... 29

8-Bit Mode Commands ........................................................................................................................... 30

Block Protection Operations ........................................................................................................................... 31

Programmer Technique .............................................................................................................................. 31

In-System Technique .................................................................................................................................. 31

Status Register ................................................................................................................................................ 33

Data Polling Bit .......................................................................................................................................... 33

Toggle Bit ................................................................................................................................................... 34

Error Bit ..................................................................................................................................................... 35

Erase Timer Bit ........................................................................................................................................... 35

Alternative Toggle Bit .................................................................................................................................. 36

Common Flash Interface (CFI) ........................................................................................................................ 37

Maximum Ratings and Operating Conditions .................................................................................................. 41

DC Electrical Specifications ............................................................................................................................ 43

AC Read Characteristics .................................................................................................................................. 44

AC Write Characteristics ................................................................................................................................. 46

Reset Specifications ........................................................................................................................................ 48

PROGRAM/ERASE Specifications .................................................................................................................... 49

Package Dimensions ....................................................................................................................................... 50

Revision History ............................................................................................................................................. 52

Rev. A – 02/13 ............................................................................................................................................. 52

M29FxxxFT/B

Features

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 3Micron Technology, Inc. reserves the right to change products or specifications without notice.

List of Figures

Figure 1: Logic Diagram ................................................................................................................................... 6

Figure 2: Block Addresses, M29F160 (x8) .......................................................................................................... 7

Figure 3: Block Addresses, M29F160 (x16) ......................................................................................................... 8

Figure 4: Block Addresses, M29F800 (x8) .......................................................................................................... 9

Figure 5: Block Addresses, M29F800 (x16) ....................................................................................................... 10

Figure 6: Block Addresses, M29F400 (x8) ........................................................................................................ 11

Figure 7: Block Addresses – x16 ...................................................................................................................... 12

Figure 8: Block Addresses, M29F200 (x8) ........................................................................................................ 13

Figure 9: Block Addresses, M29F200 (x16) ....................................................................................................... 14

Figure 10: M29F160F ..................................................................................................................................... 15

Figure 11: M29F800F ..................................................................................................................................... 16

Figure 12: M29F400F ..................................................................................................................................... 17

Figure 13: M29F200F ..................................................................................................................................... 18

Figure 14: M29F800 ....................................................................................................................................... 19

Figure 15: M29F400 ....................................................................................................................................... 20

Figure 16: M29F200 ....................................................................................................................................... 21

Figure 17: Data Polling Flowchart ................................................................................................................... 34

Figure 18: Data Toggle Flowchart ................................................................................................................... 35

Figure 19: AC Measurement I/O Waveform ..................................................................................................... 41

Figure 20: AC Measurement Load Circuit ....................................................................................................... 42

Figure 21: Read Mode AC Waveforms ............................................................................................................. 44

Figure 22: Write AC Waveforms, Write Enable Controlled ................................................................................ 46

Figure 23: Write AC Waveforms, Chip Enable Controlled ................................................................................. 47

Figure 24: Reset/Block Temporary Unprotect AC Waveforms ........................................................................... 48

Figure 25: 48-Lead TSOP – 12mm x 20mm ...................................................................................................... 50

Figure 26: 44-Lead Small-Outline – 500 Mil ..................................................................................................... 51

M29FxxxFT/B

Features

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 4Micron Technology, Inc. reserves the right to change products or specifications without notice.

List of Tables

Table 1: Part Number Information ................................................................................................................... 2

Table 2: Signal Descriptions ........................................................................................................................... 22

Table 3: Bus Operations ................................................................................................................................. 24

Table 4: Read Electronic Signature ................................................................................................................. 26

Table 5: 16-Bit Mode Commands (BYTE# = HIGH) .......................................................................................... 29

Table 6: 8-Bit Mode Commands (BYTE# = LOW) ............................................................................................. 30

Table 7: Programmer Technique Block Protection ........................................................................................... 32

Table 8: Status Register Bits ........................................................................................................................... 33

Table 9: Query Structure Overview ................................................................................................................. 37

Table 10: CFI Query Identification String ........................................................................................................ 37

Table 11: CFI Query System Interface Information .......................................................................................... 38

Table 12: Device Geometry Definition ............................................................................................................ 38

Table 13: Primary Algorithm-Specific Extended Query Table ........................................................................... 39

Table 14: Security Code Area .......................................................................................................................... 40

Table 15: Absolute Maximum Ratings ............................................................................................................. 41

Table 16: Operating and AC Measurement Conditions .................................................................................... 41

Table 17: Device Capacitance ........................................................................................................................ 42

Table 18: DC Characteristics .......................................................................................................................... 43

Table 19: Read AC Characteristics .................................................................................................................. 44

Table 20: Write AC Characteristics, Write Enable Controlled ............................................................................ 46

Table 21: Write AC Characteristics, Chip Enable Controlled ............................................................................. 47

Table 22: Reset/Block Temporary Unprotect AC Characteristics ...................................................................... 48

Table 23: Program/Erase Times and PROGRAM/ERASE Endurance Cycles ....................................................... 49

M29FxxxFT/B

Features

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 5Micron Technology, Inc. reserves the right to change products or specifications without notice.

General Description

This description applies specifically to the M29F 16Mb (2 Meg x 8 or 1 Meg x 16) nonvo-

latile memory device, but also applies to lower densities. The device enables READ,

ERASE, and PROGRAM operations using a single, low-voltage (4.5–5.5V) supply. On

power-up, the device defaults to read mode and can be read in the same way as a ROM

or EPROM.

The device is divided into blocks that can be erased independently, preserving valid da-

ta while old data is erased. Each block can be protected independently to prevent acci-

dental PROGRAM or ERASE operations from modifying the memory. PROGRAM and

ERASE commands are written to the command interface. An on-chip program/erase

controller simplifies the process of programming or erasing the device by managing the

operations required to update the memory contents.

The end of a PROGRAM or ERASE operation can be detected and any error conditions

identified. The command set required to control the memory is consistent with JEDEC

standards.

The blocks are asymmetrically arranged. The first or last 64KB have been divided into

four additional blocks. The 16KB boot block can be used for small initialization code to

start the microprocessor. The two 8KB parameter blocks can be used for parameter

storage. The remaining 32KB is a small main block where the application may be stored.

CE#, OE#, and WE# control the bus operation of the memory. They enable simple con-

nection to most microprocessors, often without additional logic. Devices are offered in

48-pin TSOP (12mm x 20mm) and 44-pin small-outline packages. The device is sup-

plied with all the bits erased (set to 1).

Figure 1: Logic Diagram

A[19:0]

WE#

DQ[7:0]

DQ[14:8]

VCC

CE#

VSS

OE#

RST#

DQ15/A–1

RY/BY#

BYTE#

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 6Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 2: Block Addresses, M29F160 (x8)

1FFFFFh

1FC000h

01FFFFh

010000h

00FFFFh

000000h

1F7FFFh

1F0000h

1E0000h

1EFFFFh

Total of 31

64 KB blocks

1FFFFFh

1F0000h

003FFFh

000000h

1EFFFFh

01FFFFh

1E0000h

010000h

Total of 31

64 KB blocks

00FFFFh

008000h

1FBFFFh

1FA000h

1F9FFFh

1F8000h

007FFFh

006000h

005FFFh

004000h

16KB

64KB

Top boot block addresses (x8)

32KB

64KB

16KB

64KB

Bottom boot block addresses (x8)

32KB

64KB

8KB

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 7Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 3: Block Addresses, M29F160 (x16)

FFFFFh

FE000h

0FFFFh

08000h

07FFFh

00000h

FBFFFh

F8000h

F0000h

F7FFFh

Total of 31

32 Kword blocks

FFFFFh

F8000h

01FFFh

00000h

F7FFFh

0FFFFh

F0000h

08000h

Total of 31

32 Kword blocks

07FFFh

04000h

FDFFFh

FD000h

FCFFFh

FC000h

03FFFh

03000h

02FFFh

02000h

8 Kword

32 Kword

16 Kword

32 Kword

8 Kword

32 Kword

16 Kword

32 Kword

4 Kword

Top boot block addresses (x16) Bottom boot block addresses (x16)

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 8Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 4: Block Addresses, M29F800 (x8)

16 KByte

FFFFFh

FC000h

64 KByte

1FFFFh

10000h

64 KByte

0FFFFh

00000h

Top Boot Block Addresses (x8)

32 KByte

F7FFFh

F0000h

64 KByte

E0000h

EFFFFh

Total of 15

64 KByte Blocks

16 KByte

FFFFFh

F0000h

64 KByte

03FFFh

00000h

Bottom Boot Block Addresses (x8)

32 KByte

EFFFFh

1FFFFh

64 KByte

E0000h

10000h

Total of 15

64 KByte Blocks

0FFFFh

08000h

8 KByte

FBFFFh

FA000h

F9FFFh

F8000h

8 KByte

07FFFh

06000h

05FFFh

04000h

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 9Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 5: Block Addresses, M29F800 (x16)

8 Kword

7FFFFh

7E000h

32 Kword

0FFFFh

08000h

32 Kword

07FFFh

00000h

16 Kword

7BFFFh

78000h

32 Kword

70000h

77FFFh

Total of 15

32 Kword blocks

8 Kword

7FFFFh

78000h

32 Kword

01FFFh

00000h

16 Kword

77FFFh

0FFFFh

32 Kword

70000h

08000h

Total of 15

32 Kword blocks

07FFFh

04000h

4 Kword

7DFFFh

7D000h

7CFFFh

7C000h

4 Kword

03FFFh

03000h

02FFFh

02000h

Top boot block addresses (x16) Bottom boot block addresses (x16)

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 10 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 6: Block Addresses, M29F400 (x8)

7FFFFh

7C000h

1FFFFh

10000h

0FFFFh

00000h

77FFFh

70000h

60000h

6FFFFh

Total of 7

64KB blocks

7FFFFh

70000h

03FFFh

00000h

6FFFFh

1FFFFh

60000h

10000h

Total of 7

64KB blocks

0FFFFh

08000h

FBFFFh

7A000h

79FFFh

78000h

07FFFh

06000h

05FFFh

04000h

16KB

64KB

Top boot block addresses (x8)

32KB

64KB

16KB

64KB

Bottom boot block addresses (x8)

32KB

64KB

8KB

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 11 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 7: Block Addresses – x16

3FFFFh

3E000h

0FFFFh

08000h

07FFFh

00000h

3BFFFh

38000h

30000h

37FFFh

Total of 7

32 Kword blocks

3FFFFh

38000h

01FFFh

00000h

37FFFh

0FFFFh

30000h

08000h

Total of 7

32 Kword blocks

07FFFh

04000h

3DFFFh

3D000h

3CFFFh

3C000h

03FFFh

03000h

02FFFh

02000h

8 Kword

32 Kword

Top boot block addresses (x16)

16 Kword

32 Kword

8 Kword

32 Kword

Bottom boot block addresses (x16)

16 Kword

32 Kword

4 Kword

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 12 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 8: Block Addresses, M29F200 (x8)

16KB

3FFFFh

3C000h

64KB

1FFFFh

10000h

64KB

0FFFFh

00000h

Top boot block addresses (x8)

32KB

37FFFh

30000h

64KB

20000h

3FFFFh

Total of 3

64KB blocks

16KB

2FFFFh

20000h

64KB

03FFFh

00000h

Bottom boot block addresses (x8)

32KB

2FFFFh

1FFFFh

64KB

20000h

10000h

Total of 3

64KB blocks

0FFFFh

08000h

8KB

3BFFFh

3A000h

39FFFh

38000h

8KB

07FFFh

06000h

05FFFh

04000h

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 13 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 9: Block Addresses, M29F200 (x16)

8 Kword

1FFFFh

1E000h

32 Kword

0FFFFh

08000h

32 Kword

07FFFh

00000h

Top boot block addresses (x16)

16 Kword

3BFFFh

18000h

32 Kword

10000h

17FFFh

Total of 3

32 Kword blocks

8 Kword

1FFFFh

18000h

32 Kword

01FFFh

00000h

Bottom boot block addresses (x16)

16 Kword

17FFFh

0FFFFh

32 Kword

10000h

08000h

Total of 3

32 Kword blocks

07FFFh

04000h

4 Kword

1DFFFh

1D000h

3CFFFh

1C000h

4 Kword

03FFFh

03000h

02FFFh

02000h

M29FxxxFT/B

General Description

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 14 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Signal Assignments

TSOP Pin Assignments

Figure 10: M29F160F

DQ3

DQ9

DQ2

DQ0

WE#

R/B#

DQ6

DQ13

A17

A10 DQ14

DQ12

DQ10

DQ15A–1

VCC

DQ4

DQ5

DQ7

AI06850_160

24 25

DQ8

A19

A18

DQ1

DQ11

OE#

A12

A13

A16

A11

BYTE#

A15

A14

VSS

CE#

RP#

VSS

M29FxxxFT/B

Signal Assignments

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 15 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 11: M29F800F

DQ3

DQ9

DQ2

DQ0

WE#

R/B#

DQ6

DQ13

A17

A10 DQ14

DQ12

DQ10

DQ15A–1

VCC

DQ4

DQ5

DQ7

AI06850_800

24 25

DQ8

A18

DQ1

DQ11

OE#

A12

A13

A16

A11

BYTE#

A15

A14

VSS

CE#

RP#

VSS

M29FxxxFT/B

Signal Assignments

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 16 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 12: M29F400F

DQ3

DQ9

DQ2

DQ0

WE#

R/B#

DQ6

DQ13

A17

A10 DQ14

DQ12

DQ10

DQ15A–1

VCC

DQ4

DQ5

DQ7

AI06850_400

24 25

DQ8

DQ1

DQ11

OE#

A12

A13

A16

A11

BYTE#

A15

A14

VSS

CE#

RP#

VSS

M29FxxxFT/B

Signal Assignments

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 17 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 13: M29F200F

DQ3

DQ9

DQ2

DQ0

WE#

R/B#

DQ6

DQ13

A10 DQ14

DQ12

DQ10

DQ15A–1

VCC

DQ4

DQ5

DQ7

AI06850_400

24 25

DQ8

DQ1

DQ11

OE#

A12

A13

A16

A11

BYTE#

A15

A14

VSS

CE#

RP#

VSS

M29FxxxFT/B

Signal Assignments

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 18 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Small-Outline Pin Assignments

Figure 14: M29F800

DQ3

DQ9

DQ2

DQ0

DQ6

DQ13

A17

DQ12

DQ10

DQ15A–1

VCC

DQ4

DQ5

DQ14

DQ7

AI02906_800

22 23

DQ8

DQ1

DQ11

OE#

WE#

BYTE#

A10

A16

A12

A13

A11

A15

A14

VSS

RP#

R/B#

VSS

CE#

A18

M29FxxxFT/B

Signal Assignments

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 19 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 15: M29F400

DQ3

DQ9

DQ2

DQ0

DQ6

DQ13

A17

DQ12

DQ10

DQ15A–1

VCC

DQ4

DQ5

DQ14

DQ7

AI02906_400

22 23

DQ8

DQ1

DQ11

OE#

WE#

BYTE#

A10

A16

A12

A13

A11

A15

A14

VSS

RP#

R/B#

VSS

CE#

M29FxxxFT/B

Signal Assignments

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 20 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 16: M29F200

DQ3

DQ9

DQ2

DQ0

DQ6

DQ13

DQ12

DQ10

DQ15A–1

VCC

DQ4

DQ5

DQ14

DQ7

AI02906_200

22 23

DQ8

DQ1

DQ11

OE#

WE#

BYTE#

A10

A16

A12

A13

A11

A15

A14

VSS

RP#

R/B#

VSS

CE#

M29FxxxFT/B

Signal Assignments

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 21 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Signal Descriptions

The signal description table below is a comprehensive list of signals for this device fami-

ly. All signals listed may not be supported on this device. See Signal Assignments for in-

formation specific to this device.

Table 2: Signal Descriptions

Name Type Description

A[MAX:0] Input Address: Selects the cells in the array to access during READ operations. During WRITE oper-

ations, they control the commands sent to the command interface of the program/erase con-

troller.

CE# Input Chip enable: Activates the device, enabling READ and WRITE operations to be performed.

When CE# is HIGH, all other pins are ignored.

OE# Input Output enable: Controls the bus READ operation.

WE# Input Write enable: Controls the bus WRITE operation of the command interface.

BYTE# Input Byte/word organization select: Switches between x8 and x16 bus modes. When BYTE# is

LOW, the device is in x8 mode; when HIGH, the device is in x16 mode.

RST# Input Reset: Applies a hardware reset to the device, which is achieved by holding RST# LOW for at

least tPLPX. After RST# goes HIGH, the device is ready for READ and WRITE operations (after

tPHEL or tRHEL, whichever occurs last).

Holding RST# at VID will temporarily unprotect the protected blocks. PROGRAM and ERASE

operations on all blocks will then be possible. The transition from VIH to VID must be slower

than tPHPHH.

DQ[7:0] I/O Data I/O: Outputs the data stored at the selected address during a READ operation. During

WRITE operations, they represent the commands sent to the command interface of the pro-

gram/erase controller.

DQ[14:8] I/O Data I/O: Outputs the data stored at the selected address during a READ operation when

BYTE# is HIGH. When BYTE# is LOW, these pins are not used and are High-Z. During WRITE

operations, these bits are not used. When reading the status register, these bits should be ig-

nored.

DQ15/A-1 I/O Data I/O or address input: When the device operates in x16 bus mode, this pin behaves as

data I/O, together with DQ[14:8]. When the device operates in x8 bus mode, this pin behaves

as the least significant bit of the address.

Except where stated explicitly otherwise, DQ15 = data I/O (x16 mode); A-1 = address input (x8

mode).

RY/BY# Output Ready busy: Open-drain output that can be used to identify when the device is performing

a PROGRAM or ERASE operation. During PROGRAM or ERASE operations, RY/BY# is LOW,

and is High-Z during read mode, auto select mode, and erase suspend mode. After a hard-

ware reset, READ and WRITE operations cannot begin until RY/BY# goes High-Z (see RESET

AC Specifications for more details).

The use of an open-drain output enables the RY/BY# pins from several devices to be connec-

ted to a single pull-up resistor to VCCQ. A low value will then indicate that one (or more) of

the devices is (are) busy.

M29FxxxFT/B

Signal Descriptions

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 22 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 2: Signal Descriptions (Continued)

Name Type Description

VCC Supply Supply voltage: Provides the power supply for READ, PROGRAM, and ERASE operations.

The command interface is disabled when VCC < VLKO. This prevents WRITE operations from

accidentally damaging the data during power-up, power-down, and power surges. If the pro-

gram/erase controller is programming or erasing during this time, then the operation aborts

and the contents being altered will be invalid.

A 0.1μF capacitor should be connected between VCC and VSS to decouple the current surges

from the power supply. The PCB track widths must be sufficient to carry the currents required

during PROGRAM and ERASE operations (see DC Characteristics).

VSS Supply Ground: Reference for all voltage measurements. All VSS pins must be connected to the sys-

tem ground.

NC – Not connected: Not connected internally.

M29FxxxFT/B

Signal Descriptions

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 23 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Bus Operations

Table 3: Bus Operations

Notes 1 through 2 apply to entire table

Operation CE# OE# WE#

8-Bit Mode 16-Bit Mode

A[MAX:0],

DQ15/A-1 DQ[14:8] DQ[7:0] A[MAX:0]

DQ15/A-1,

DQ[14:0]

READ L L H Cell address High-Z Data output Cell address Data output

WRITE L H L Command address High-Z Data input Command address Data input

OUTPUT

DISABLE

X H H X High-Z High-Z X High-Z

STANDBY H X X X High-Z High-Z X High-Z

Notes: 1. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.

2. Typically glitches of less than 5ns on Chip Enable or Write Enable are ignored by the

memory and do not affect bus operations.

Read

Bus READ operations read from the memory cells or specific registers in the command

interface. A valid bus READ operation involves setting the desired address on the ad-

dress inputs, taking CE# and OE# LOW, and holding WE# HIGH. The data I/Os will out-

put the value. (See AC Characteristics for details about when the output becomes valid.)

Write

Bus WRITE operations write to the command interface. A valid bus WRITE operation

begins by setting the desired address on the address inputs. The address inputs are

latched by the command interface on the falling edge of CE# or WE#, whichever occurs

last. The data I/Os are latched by the command interface on the rising edge of CE# or

WE#, whichever occurs first. OE# must remain HIGH during the entire bus WRITE oper-

ation. (See AC Characteristics for timing requirement details.)

Output Disable

Data I/Os are High-Z when OE# is HIGH.

Standby

When CE# is HIGH, the device enters standby, and data I/Os are High-Z. To reduce the

supply current to the standby supply current (ICC2), CE# must be held within VCC ±0.2V.

(See DC Characteristics.) During PROGRAM or ERASE operations the device will contin-

ue to use the program/erase supply current (ICC3) until the operation completes.

Automatic Standby

If CMOS levels (VCC ±0.2V) are used to drive the bus, and the bus is inactive for 150ns or

more, the device enters automatic standby, and the internal supply current is reduced

to that of the standby supply current, ICC2. The data I/Os will output data if a READ op-

eration is in progress.

M29FxxxFT/B

Bus Operations

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 24 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Command Interface

All WRITE operations are interpreted by the command interface. Commands consist of

one or more sequential WRITE operations. Failure to observe a valid sequence will re-

sult in the memory returning to read mode. The long command sequences are imposed

to maximize data security.

The address used for the commands changes depending on whether the memory is in

16-bit or 8-bit mode.

READ/RESET Command

The READ/RESET command returns the device to read mode, where it behaves like a

ROM or EPROM, unless otherwise stated. It also resets the errors in the status register.

Either one or three WRITE operations can be used to issue the READ/RESET command.

The READ/RESET command can be issued, between WRITE cycles, before the start of a

PROGRAM or ERASE operation, to return the device to read mode. Once the PROGRAM

or ERASE operation has started, the READ/RESET command is no longer accepted. The

READ/RESET command will not abort an ERASE operation when issued while in erase

suspend.

AUTO SELECT Command

The AUTO SELECT command is used to read the electronic signature, including the

manufacturer code, the device code and the block protection status. Three consecutive

WRITE operations are required to issue the AUTO SELECT command. Once the com-

mand is issued, the memory remains in auto select mode until a READ/RESET com-

mand is issued. READ CFI QUERY and READ/RESET commands are accepted in auto

Select mode, while all other commands are ignored.

Note: These operations are intended for use by programming equipment and are not

typically used in applications. They require VID to be applied to some of the pins.

From the auto select mode the manufacturer code can be read using a READ operation

with A0 = VIL and A1 = VIL. The other address bits may be set to either VIL or VIH. The

manufacturer code for Micron is 0001h.

The device code can be read using a READ operation with A0 = VIH and A1 = VIL. The

other address bits may be set to either VIL or VIH.

The block protection status of each block can be read using a READ operation with A0 =

VIL, A1 = VIH, and A12-A19 specifying the address of the block. The other address bits

may be set to either VIL or VIH. If the addressed block is protected then 01h is output on

Data Inputs/Outputs DQ0-DQ7, otherwise 00h is output. See Block Protection Opera-

tions for information on the block protection status; the Programmer Technique Block

Protection table includes block protection bus READ information.

M29FxxxFT/B

Command Interface

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 25 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 4: Read Electronic Signature

Notes 1 applies to entire table.

Operation CE# OE# WE#

8-Bit Mode 16-Bit Mode

A[MAX:0],

DQ15/A-1 DQ[14:8] DQ[7:0] A[MAX:0]

DQ15/A-1,

DQ[14:0]

READ

MANUFACTURER

CODE

L L H A0 = VIL,

A1 = VIL,

A9 = VID,

Others =

VIL/VID

High-Z 0x01 A0 = VIL,

A1 = VIL,

A9 = VID,

Others =

VIL/VID

0x0001

READ DEVICE

CODE

L L H A0 = VIH,

A1 = VIL,

A9 = VID,

Others =

VIL/VIH

High-Z 0x51 (M29F200FT)

0x57 (M29F200FB)

0x23 (M29F400FT)

0xAB(M29F400FB)

0xD6 (M29F800FT)

0x58 (M29F800FB)

0xD2 (M29F160FT)

0xD8 (M29F160FB)

A0 = VIH,

A1 = VIL,

A9 = VID,

Others =

VIL/VIH

0x2251 (M29F200FT)

0x2257 (M29F200FB)

0x2223 (M29F400FT)

0x22AB (M29F400FB)

0x22D6 (M29F800FT)

0x2258 (M29F800FB)

0x22D2 (M29F160FT)

0x22D8(M29F160FB)

Note: 1. H = Logic level HIGH (VIH); L = Logic level LOW (VIL); X = HIGH or LOW.

PROGRAM Command

The PROGRAM command can be used to program a value to one address at a time. The

command requires four bus WRITE operations. The final WRITE operation latches the

address and data, and starts the program/erase controller.

If the address falls in a protected block, then the PROGRAM command is ignored, the

data remains unchanged. The status register is never read and no error condition is giv-

en.

During the PROGRAM operation, the memory will ignore all commands. It is not possi-

ble to issue any command to abort or pause the operation. Typical program times are

given in READ CFI QUERY Command. READ operations during the PROGRAM opera-

tion will output the status register on the data I/Os. (See Registers.)

After the PROGRAM operation has completed, the memory returns to read mode, un-

less an error has occurred. When an error occurs, the memory continues to output the

status register. A READ/RESET command must be issued to reset the error condition

and return to read mode.

Note that the PROGRAM command cannot change a bit set at 0 back to 1. One of the

ERASE commands must be used to set all the bits in a block, or in the whole device,

from 0 to 1.

UNLOCK BYPASS Command

The UNLOCK BYPASS command is used in conjunction with the UNLOCK BYPASS

PROGRAM command to program the memory. When the access time to the device is

long (as with some EPROM programmers), considerable time saving can be made by

using these commands. Three WRITE operations are required to issue the UNLOCK BY-

PASS command.

M29FxxxFT/B

Command Interface

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 26 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Once the UNLOCK BYPASS command has been issued, the memory will only accept the

UNLOCK BYPASS PROGRAM command and the UNLOCK BYPASS RESET command.

The memory can be read as though in read mode.

UNLOCK BYPASS PROGRAM Command

The UNLOCK BYPASS PROGRAM command can be used to program one address in

memory at a time. The command requires two WRITE operations, the final write opera-

tion latches the address and data, and starts the program/erase controller.

The PROGRAM operation using the UNLOCK BYPASS PROGRAM command behaves

identically to the PROGRAM operation using the PROGRAM command. A protected

block cannot be programmed; the operation cannot be aborted and the status register

is read. Errors must be reset using the READ/RESET command, which leaves the device

in unlock bypass mode. (See the PROGRAM command for details.)

UNLOCK BYPASS RESET Command

The UNLOCK BYPASS RESET command can be used to return to read/reset mode from

unlock bypass mode. Two WRITE operations are required to issue the UNLOCK BYPASS

RESET command. The READ/RESET command does not exit from unlock bypass mode.

CHIP ERASE Command

The CHIP ERASE command can be used to erase the entire chip. Six WRITE operations

are required to issue the CHIP ERASE command and start the program/erase controller.

If any blocks are protected then these are ignored and all the other blocks are erased. If

all of the blocks are protected, the CHIP ERASE operation appears to start but will ter-

minate within about 100µs, leaving the data unchanged. No error condition is given

when protected blocks are ignored.

During an ERASE operation, the memory will ignore all commands. It is not possible to

issue any command to abort the operation. Typical chip erase times are given in READ

CFI QUERY Command. All READ operations during the CHIP ERASE operation will out-

put the status register on the data I/Os. (See Registers for more details.)

After the CHIP ERASE operation has completed, the memory will return to read mode,

unless an error has occurred. When an error occurs, the memory will continue to out-

put the status register. A READ/RESET command must be issued to reset the error con-

dition and return to read mode.

The CHIP ERASE command sets all of the bits in unprotected blocks to 1. All previous

data is lost.

BLOCK ERASE Command

The BLOCK ERASE command can be used to erase a list of one or more blocks. Six

WRITE operations are required to select the first block in the list. Each additional block

in the list can be selected by repeating the sixth WRITE operation, using the address of

the additional block. The BLOCK ERASE operation starts the program/erase controller

about 50µs after the last WRITE operation. Once the program/erase controller starts, it

is not possible to select any more blocks. Each additional block must therefore be selec-

ted within 50µs of the last block. The 50µs timer restarts when an additional block is se-

lected. The status register can be read after the sixth WRITE operation. See Status Regis-

M29FxxxFT/B

Command Interface

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 27 Micron Technology, Inc. reserves the right to change products or specifications without notice.

ter for details on how to identify whether the program/erase controller has started the

BLOCK ERASE operation.

If any selected blocks are protected, then these are ignored and all the other selected

blocks are erased. If all of the selected blocks are protected, the BLOCK ERASE opera-

tion appears to start but will terminate within about 100µs, leaving the data unchanged.

No error condition is given when protected blocks are ignored.

During the BLOCK ERASE operation, the device will ignore all commands except the

ERASE SUSPEND command. All READ operations during the BLOCK ERASE operation

will output the status register on the data I/Os.

After the BLOCK ERASE operation has completed, the device will return to read mode,

unless an error has occurred. When an error occurs, the device will continue to output

the status register. A READ/RESET command must be issued to reset the error condi-

tion and return to read mode.

The BLOCK ERASE command sets all of the bits in the unprotected selected blocks to 1.

All previous data in the selected blocks is lost.

ERASE SUSPEND Command

The ERASE SUSPEND command may be used to temporarily suspend a BLOCK ERASE

operation and return the device to read mode. The command requires one WRITE oper-

ation.

The program/erase controller will suspend within the erase suspend latency time of the

ERASE SUSPEND command being issued. Once the program/erase controller has stop-

ped, the device will be set to read mode and the erase will be suspended. If the ERASE

SUSPEND command is issued during the period when the device is waiting for an addi-

tional block (before the program/erase controller starts), then the erase is suspended

immediately and will start immediately when the ERASE SUSPEND command is issued.

It is not possible to select any further blocks to erase after the erase resume.

During erase suspend, it is possible to read and program cells in blocks that are not be-

ing erased; both READ and PROGRAM operations behave as normal on these blocks. If

any attempt is made to program in a protected block or in the suspended block then the

PROGRAM command is ignored and the data remains unchanged. The status register is

not read and no error condition is given. Reading from blocks that are being erased will

output the status register.

It is also possible to issue the AUTO SELECT, READ CFI QUERY, and UNLOCK BYPASS

commands during an erase suspend. The READ/RESET command must be issued to re-

turn the device to read array mode before the RESUME command will be accepted.

ERASE RESUME Command

The ERASE RESUME command must be used to restart the program/erase controller

from erase suspend. An erase can be suspended and resumed more than once.

READ CFI QUERY Command

The READ CFI QUERY command reads data from the CFI. This command is valid when

the device is in read array mode, or when the device is in auto select mode. One WRITE

cycle is required to issue the READ CFI QUERY command. Once the command is issued,

subsequent READ operations then read from the CFI. The READ/RESET command

M29FxxxFT/B

Command Interface

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 28 Micron Technology, Inc. reserves the right to change products or specifications without notice.

must be issued to return the device to the previous mode (read array or auto select

mode). A second READ/RESET command would be needed if the device is to be placed

in read array from auto select mode.

16-Bit Mode Commands

Table 5: 16-Bit Mode Commands (BYTE# = HIGH)

Command Length

WRITE Operations

1st 2nd 3rd 4th 5th 6th

Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data

READ/RESET 1 X F0

3 555 AA 2AA 55 X F0

AUTO SELECT 3 555 AA 2AA 55 555 90

PROGRAM 4 555 AA 2AA 55 555 A0 PA PD

UNLOCK BYPASS 3 555 AA 2AA 55 555 20

UNLOCK BYPASS

PROGRAM

2 X A0 PA PD

UNLOCK BYPASS

RESET

2 X 90 X 00

CHIP ERASE 6 555 AA 2AA 55 555 80 555 AA 2AA 55 555 10

BLOCK ERASE 6+ 555 AA 2AA 55 555 80 555 AA 2AA 55 BA 30

ERASE SUSPEND 1 X B0

ERASE RESUME 1 X 30

READ CFI QUERY 1 55 98

Notes: 1. X = "Don’t Care;" PA = Program address; PD = Program data; BA = Any address in the

block. All values in the table are in hexadecimal.

2. Command interface: Only uses A-1, A[10;0], and DQ[7;0] to verify the commands;

A[19:11], DQ[14:8], and DQ15 are "Don’t Care." DQ15/A-1 is A-1 when BYTE is LOW or

DQ15 when BYTE is HIGH.

3. Read/Reset: After a READ/RESET command, read the memory as normal until another

command is issued.

4. Auto Select: After an AUTO SELECT command, read manufacturer ID, device ID, or

block protection status.

5. Program, Unlock Bypass Program, Chip Erase, Block Erase: After issuing these

commands, read the status register until the program/erase controller completes and

the device returns to read mode. Add additional blocks during a BLOCK ERASE com-

mand with additional bus WRITE operations until the timeout bit is set.

6. Unlock Bypass: After the UNLOCK BYPASS command, issue an UNLOCK BYPASS PRO-

GRAM or UNLOCK BYPASS RESET command.

7. Unlock Bypass Reset: After the UNLOCK BYPASS RESET command, read the memory as

normal until another command is issued.

8. Erase Suspend: After the ERASE SUSPEND command, read non-erasing blocks as nor-

mal. Issue AUTO SELECT and PROGRAM commands on non-erasing blocks as normal.

9. Erase Resume: After the ERASE RESUME command, the suspended ERASE operation re-

sumes. Read the status register until the program/erase controller completes and the de-

vice returns to read mode.

M29FxxxFT/B

Command Interface

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 29 Micron Technology, Inc. reserves the right to change products or specifications without notice.

10. CFI Query: Command is valid when device is ready to read array data or when device is

in auto select mode.

8-Bit Mode Commands

Table 6: 8-Bit Mode Commands (BYTE# = LOW)

Command Length

WRITE Operations

1st 2nd 3rd 4th 5th 6th

Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data

READ/RESET 1 X F0

3 AAA AA 555 55 X F0

AUTO SELECT 3 AAA AA 555 55 AAA 90

PROGRAM 4 AAA AA 555 55 AAA A0 PA PD

UNLOCK BYPASS 3 AAA AA 555 55 AAA 20

UNLOCK BYPASS

PROGRAM

2 X A0 PA PD

UNLOCK BYPASS

RESET

2 X 90 X 00

CHIP ERASE 6 AAA AA 555 55 AAA 80 AAA AA 555 55 AAA 10

BLOCK ERASE 6+ AAA AA 555 55 AAA 80 AAA AA 555 55 BA 30

ERASE SUSPEND 1 X B0

ERASE RESUME 1 X 30

READ CFI QUERY 1 AA 98

Notes: 1. X = "Don’t Care;" PA = Program address; PD = Program data; BA = Any address in the

block. All values in the table are in hexadecimal.

2. Command interface: Only uses A-1, A[10;0], and DQ[7;0] to verify the commands;

A[19:11], DQ[14:8], and DQ15 are "Don’t Care." DQ15/A-1 is A-1 when BYTE is LOW or

DQ15 when BYTE is HIGH.

3. Read/Reset: After a READ/RESET command, read the memory as normal until another

command is issued.

4. Auto Select: After an AUTO SELECT command, read manufacturer ID, device ID, or

block protection status.

5. Program, Unlock Bypass Program, Chip Erase, Block Erase: After issuing these

commands, read the status register until the program/erase controller completes and

the device returns to read mode. Add additional blocks during a BLOCK ERASE com-

mand with additional bus WRITE operations until the timeout bit is set.

6. Unlock Bypass: After the UNLOCK BYPASS command, issue an UNLOCK BYPASS PRO-

GRAM or UNLOCK BYPASS RESET command.

7. Unlock Bypass Reset: After the UNLOCK BYPASS RESET command, read the memory as

normal until another command is issued.

8. Erase Suspend: After the ERASE SUSPEND command, read non-erasing blocks as nor-

mal. Issue AUTO SELECT and PROGRAM commands on non-erasing blocks as normal.

9. Erase Resume: After the ERASE RESUME command, the suspended ERASE operation re-

sumes. Read the status register until the program/erase controller completes and the de-

vice returns to read mode.

10. CFI Query: Command is valid when device is ready to read array data or when device is

in auto select mode.

M29FxxxFT/B

Command Interface

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 30 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Block Protection Operations

Block protection can be used to prevent any operation from modifying the data stored

in the Flash memory. Each Block can be protected individually. Once protected, Pro-

gram and Erase operations on the block fail to change the data. Block protection status

of the device is read using the AUTO SELECT command.

Two techniques for controlling block protection are explained here: Programmer tech-

nique and In-System technique.

Note: A third technique for controlling block protection, Temporary Unprotection, is

described in the Signal Descriptions table, RP pin (Reset/Block Temporary Unprotec-

tion).

Unlike the Command Interface of the Program/Erase Controller, the techniques for pro-

tecting and unprotecting blocks could change between different Flash memory suppli-

ers.

Programmer Technique

The Programmer technique uses high (VID) voltage levels on some of the bus pins.

These cannot be achieved using a standard microprocessor bus, therefore the techni-

que is recommended only for use in Programming Equipment.

To protect a block, follow the Programmer Equipment Block Protect flowchart. During

the Block Protect algorithm, the A19-A12 Address Inputs indicate the address of the

block to be protected. The block will be correctly protected only if A19-A12 remain valid

and stable, and if Chip Enable is kept Low, VIL, all along the Protect and Verify phases.

The Chip Unprotect algorithm is used to unprotect all the memory blocks at the same

time. This algorithm can only be used if all of the blocks are protected first. To unprotect

the chip follow the Programmer Equipment Chip Unprotect flowchart and the Program-

mer Technique Block Protection table, which give a summary of each operation.

The timing on these flowcharts is critical. Care should be taken to ensure that, where a

pause is specified, it is followed as closely as possible. Do not abort the procedure be-

fore reaching the end. Chip Unprotect can take several seconds and a user message

should be provided to show that the operation is progressing.

In-System Technique

The In-System technique requires a high voltage level on the Reset/Blocks Temporary

Unprotect pin, RP. This can be achieved without violating the maximum ratings of the

components on the microprocessor bus, therefore this technique is suitable for use af-

ter the Flash memory has been fitted to the system.

To protect a block follow the In-System Equipment Block Protect flowchart . To unpro-

tect the whole chip it is necessary to protect all of the blocks first, then all the blocks can

be unprotected at the same time. To unprotect the chip follow the In-System Equip-

ment Chip Unprotect flowchart.

The timing on these flowcharts is critical. Care should be taken to ensure that, where a

pause is specified, it is followed as closely as possible. Do not allow the microprocessor

to service interrupts that will upset the timing and do not abort the procedure before

reaching the end. Chip Unprotect can take several seconds and a user message should

be provided to show that the operation is progressing.

M29FxxxFT/B

Block Protection Operations

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 31 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 7: Programmer Technique Block Protection

Operation CE# OE# WE# Address Inputs A[19:0]

Data Inputs/Outputs

DQ15A–1, DQ14:0]

Block Protect VIL VID VIL

Pulse

A9 = VID, A12-A19 Block Address

Others = X

Chip Unprotect VID VID VIL

Pulse

A9 = VID, A12 = VIH, A15 = VIH

Others = X

Block Protection Verify VIL VIL VIH A0 = VIL, A1 = VIH, A6 = VIL, A9 = VID,

A12-A19 Block Address

Others = X

Pass = XX01h

Retry = XX00h

Block Unprotection Verify VIL VIL VIH A0 = VIL, A1 = VIH, A6 = VIH,

A9 = VID, A12-A19 Block Address

Others = X

Retry = XX01h

Pass = XX00h

Note: 1. BYTE = VIH or VIL

M29FxxxFT/B

Block Protection Operations

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 32 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Status Register

Bus Read operations from any address always read the Status Register during Program

and Erase operations. It is also read during Erase Suspend when an address within a

block being erased is accessed.

Table 8: Status Register Bits

Operation Address DQ7 DQ6 DQ5 DQ3 DQ2 RB#

Program Any Address DQ7# Toggle 0 – – 0

Program During Erase

Suspend

Any Address DQ7# Toggle 0 – – 0

Program Error Any Address DQ7# Toggle 1 – – 0

Chip Erase Any Address 0 Toggle 0 1 Toggle 0

Block Erase before time-

out

Erasing Block 0 Toggle 0 0 Toggle 0

Non-Erasing Block 0 Toggle 0 0 No Toggle 0

Block Erase Erasing Block 0 Toggle 0 1 Toggle 0

Non-Erasing Block 0 Toggle 0 1 No Toggle 0

Erase Suspend Erasing Block 1 No Toggle 0 – Toggle 1

Non-Erasing Block Data read as normal 1

Erase Error Good Block Ad-

dress

0 Toggle 1 1 No Toggle 0

Faulty Block Ad-

dress

0 Toggle 1 1 Toggle 0

Note: 1. Unspecified data bits should be ignored.

Data Polling Bit

The Data Polling Bit (DQ7) can be used to identify whether the Program/Erase Control-

ler has successfully completed its operation or if it has responded to an Erase Suspend.

The Data Polling Bit is output on DQ7 when the Status Register is read.

During Program operations the Data Polling Bit outputs the complement of the bit be-

ing programmed to DQ7. After successful completion of the Program operation the

memory returns to Read mode and Bus Read operations from the address just program-

med output DQ7, not its complement.

During Erase operations the Data Polling Bit outputs ’0’, the complement of the erased

state of DQ7. After successful completion of the Erase operation the memory returns to

Read Mode.

In Erase Suspend mode the Data Polling Bit will output a ’1’ during a Bus Read opera-

tion within a block being erased. The Data Polling Bit will change from a ’0’ to a ’1’

when the Program/Erase Controller has suspended the Erase operation.

The Data Polling Flowchart, gives an example of how to use the Data Polling Bit. A Valid

Address is the address being programmed or an address within the block being erased.

M29FxxxFT/B

Status Register

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 33 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 17: Data Polling Flowchart

Read DQ5 and DQ7

at valid address

Start

Read DQ7

at valid address

Fail Pass AI03598

DQ7

= data

Yes

DQ5

= 1

DQ7

= data

Yes

Toggle Bit

The Toggle Bit (DQ6) can be used to identify whether the Program/Erase Controller has

successfully completed its operation or if it has responded to an Erase Suspend. The

Toggle Bit is output on DQ6 when the Status Register is read.

During Program and Erase operations the Toggle Bit changes from ’0’ to ’1’ to ’0’, etc.,

with successive Bus Read operations at any address. After successful completion of the

operation the memory returns to Read mode.

During Erase Suspend mode the Toggle Bit will output when addressing a cell within a

block being erased. The Toggle Bit will stop toggling when the Program/Erase Controller

has suspended the Erase operation.

If any attempt is made to erase a protected block, the operation is aborted, no error is

signalled and DQ6 toggles for approximately 100µs. If any attempt is made to program a

protected block or a suspended block, the operation is aborted, no error is signalled and

DQ6 toggles for approximately 1µs.

The Data Toggle Flowchart, gives an example of how to use the Data Toggle Bit.

M29FxxxFT/B

Status Register

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 34 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 18: Data Toggle Flowchart

Read DQ6

Start

Read DQ6

twice

Fail Pass

AI01370C

DQ6

= toggle

Yes

DQ5 = 1

Yes

DQ6

= toggle

Read

DQ5 and DQ6

Error Bit

The Error Bit (DQ5) can be used to identify errors detected by the Program/Erase Con-

troller. The Error Bit is set to ’1’ when a Program, Block Erase or Chip Erase operation

fails to write the correct data to the memory. If the Error Bit is set a Read/Reset com-

mand must be issued before other commands are issued. The Error bit is output on

DQ5 when the Status Register is read.

Note that the Program command cannot change a bit set to ’0’ back to ’1’ and attempt-

ing to do so will set DQ5 to ‘1’. A Bus Read operation to that address will show the bit is

still ‘0’. One of the Erase commands must be used to set all the bits in a block or in the

whole memory from ’0’ to ’1’

Erase Timer Bit

The Erase Timer Bit (DQ3) can be used to identify the start of Program/Erase Controller

operation during a Block Erase command. Once the Program/Erase Controller starts

erasing the Erase Timer Bit is set to ’1’. Before the Program/Erase Controller starts the

Erase Timer Bit is set to ’0’ and additional blocks to be erased may be written to the

Command Interface. The Erase Timer Bit is output on DQ3 when the Status Register is

read.

M29FxxxFT/B

Status Register

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 35 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Alternative Toggle Bit

The Alternative Toggle Bit (DQ2) can be used to monitor the Program/Erase controller

during Erase operations. The Alternative Toggle Bit is output on DQ2 when the Status

During Chip Erase and Block Erase operations the Toggle Bit changes from ’0’ to ’1’

to ’0’, etc., with successive Bus Read operations from addresses within the blocks being

erased. A protected block is treated the same as a block not being erased. Once the op-

eration completes the memory returns to Read mode.

During Erase Suspend the Alternative Toggle Bit changes from ’0’ to ’1’ to ’0’, etc. with

successive Bus Read operations from addresses within the blocks being erased. Bus

Read operations to addresses within blocks not being erased will output the memory

cell data as if in Read mode.

After an Erase operation that causes the Error Bit to be set the Alternative Toggle Bit can

be used to identify which block or blocks have caused the error. The Alternative Toggle

Bit changes from ’0’ to ’1’ to ’0’, etc. with successive Bus Read Operations from address-

es within blocks that have not erased correctly. The Alternative Toggle Bit does not

change if the addressed block has erased correctly.

M29FxxxFT/B

Status Register

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 36 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Common Flash Interface (CFI)

The Common Flash Interface is a JEDEC approved, standardized data structure that can

be read from the Flash memory device. It allows a system software to query the device

to determine various electrical and timing parameters, density information and func-

tions supported by the memory. The system can interface easily with the device, ena-

bling the software to upgrade itself when necessary.

When the CFI Query Command is issued the device enters CFI Query mode and the da-

ta structure is read from the memory. Addresses used to retrieve the data are shown in

the following tables:

The CFI data structure also contains a security area where a 64-bit unique security

number is written. This area can be accessed only in Read mode by the final user. It is

impossible to change the security number after it has been written by Micron. Issue a

Read command to return to Read mode.

Table 9: Query Structure Overview

Address

Sub-section Name Descriptionx16 x8

10h 20h CFI Query Identification String Command set ID and algorithm data offset

1Bh 36h System Interface Information Device timing & voltage information

27h 4Eh Device Geometry Definition Flash device layout

40h 80h Primary Algorithm-specific Extended Query

table

Additional information specific to the Pri-

mary Algorithm (optional)

61h C2h Security Code Area 64 bit unique device number

Note: 1. Query data are always presented on the lowest order data outputs.

Table 10: CFI Query Identification String

Address

Data Description Valuex16 x8

10h 20h 0051h "Q"

11h 22h 0052h Query Unique ASCII String "QRY" "R"

12h 24h 0059h "Y"

13h 26h 0002h Primary Algorithm Command Set and Control Interface ID

code 16 bit ID code defining a specific algorithm

AMD

Compatible

14h 28h 0000h

15h 2Ah 0040h Address for Primary Algorithm extended Query table (see

the Device Geometry table.)

P = 40h

16h 2Ch 0000h

17h 2Eh 0000h Alternate Vendor Command Set and Control Interface ID

Code second vendor - specified algorithm supported

18h 30h 0000h

19h 32h 0000h Address for Alternate Algorithm extended Query table NA

1Ah 34h 0000h

Note: 1. Query data are always presented on the lowest order data outputs (DQ7-DQ0) only.

DQ8-DQ15 are ‘0’.

M29FxxxFT/B

Common Flash Interface (CFI)

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 37 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 11: CFI Query System Interface Information

Address

Data Description Valuex16 x8

1Bh 36h 0045h VCC Logic Supply Minimum Program/Erase voltage

bit 7 to 4 BCD value in volts

bit 3 to 0 BCD value in 100 mV

4.5V

1Ch 38h 0055h VCC Logic Supply Maximum Program/Erase voltage

bit 7 to 4 BCD value in volts

bit 3 to 0 BCD value in 100 mV

5.5V

1Dh 3Ah 0000h VPP [Programming] Supply Minimum Program/Erase voltage NA

1Eh 3Ch 0000h VPP [Programming] Supply Maximum Program/Erase voltage NA

1Fh 3Eh 0003h Typical timeout per single Byte/Word program = 2n µs 8µs

20h 40h 0000h Typical timeout for minimum size write buffer program = 2n µs NA

21h 42h 000Ah Typical timeout per individual block erase = 2n ms 1 s

22h 44h 0000h Typical timeout for full chip erase = 2n ms NA

23h 46h 0004h Maximum timeout for Byte/Word program = 2n times typical 256µs

24h 48h 0000h Maximum timeout for write buffer program = 2n times typical NA

25h 4Ah 0003h Maximum timeout per individual block erase = 2n times typical 8 s

26h 4Ch 0000h Maximum timeout for chip erase = 2n times typical NA

Table 12: Device Geometry Definition

Address

Data Description Valuex16 x8

27h 4Eh 0015h Device Size = 2n in number of Bytes 2MB

0014h 1MB

0013h 512KB

0012h 256KB

28h

29h

50h

52h

0002h

0000h

Flash Device Interface Code description x8, x16

Async.

2Ah

2Bh

54h

56h

0000h

Maximum number of Bytes in multi-Byte program or page = 2nNA

2Ch 58h 0004h Number of Erase Block Regions within the device.

It specifies the number of regions within the device containing

contiguous Erase Blocks of the same size.

2Dh

2Eh

5Ah

5Ch

0000h

Region 1 Information

Number of identical size erase block = 0000h+1

2Fh

30h

5Eh

60h

0040h

0000h

Region 1 Information

Block size in Region 1 = 0040h * 256 Byte

16KB

31h

32h

62h

64h

0001h

0000h

Region 2 Information

Number of identical size erase block = 0001h+1

33h

34h

66h

68h

0020h

0000h

Region 2 Information

Block size in Region 2 = 0020h * 256 Byte

8KB

M29FxxxFT/B

Common Flash Interface (CFI)

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 38 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 12: Device Geometry Definition (Continued)

Address

Data Description Valuex16 x8

35h

36h

6Ah

6Ch

0000h

Region 3 Information

Number of identical size erase block = 0000h+1

37h

38h

6Eh

70h

0080h

0000h

Region 3 Information

Block size in Region 3 = 0080h * 256 Byte

32KB

39h

3Ah

72h

74h

001Eh

0000h

Region 4 Information (2 MByte)

Number of identical-size erase block = 001Eh+1

39h

3Ah

72h

74h

000Eh

0000h

Region 4 Information (1 MByte)

Number of identical-size erase block = 000Eh+1

39h

3Ah

72h

74h

0006h

0000h

Region 4 Information (512 KByte)

Number of identical-size erase block = 0006h+1

39h

3Ah

72h

74h

0002h

0000h

Region 4 Information (256 KByte)

Number of identical-size erase block = 0002h+1

3Bh

3Ch

76h

78h

0000h

0001h

Region 4 Information

Block size in Region 4 = 0100h * 256 Byte

64KB

Table 13: Primary Algorithm-Specific Extended Query Table

Address

Data Description Valuex16 x8

40h 80h 0050h Primary Algorithm extended Query table unique ASCII string “PRI” "P"

41h 82h 0052h "R"

42h 84h 0049h "I"

43h 86h 0031h Major version number, ASCII "1"

44h 88h 0030h Minor version number, ASCII "0"

45h 8Ah 0000h Address Sensitive Unlock (bits 1 to 0)

00 = required, 01= not required

Silicon Revision Number (bits 7 to 2)

Yes

46h 8Ch 0002h Erase Suspend

00 = not supported, 01 = Read only, 02 = Read and Write

47h 8Eh 0001h Block Protection

00 = not supported, x = number of blocks in per group

48h 90h 0001h Temporary Block Unprotect

00 = not supported, 01 = supported

Yes

49h 92h 0002h

0004h

0008h

0160h

Block Protect /Unprotect

02 = M29F200

04 = M29F400

08 = M29F800

10 = M29F160

4Ah 94h 0000h Simultaneous Operations, 00 = not supported No

4Bh 96h 0000h Burst Mode, 00 = not supported, 01 = supported No

M29FxxxFT/B

Common Flash Interface (CFI)

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 39 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 13: Primary Algorithm-Specific Extended Query Table (Continued)

Address

Data Description Valuex16 x8

4Ch 98h 0000h Page Mode, 00 = not supported, 01 = 4 page Word, 02 = 8 page Word No

Table 14: Security Code Area

Address

Data Descriptionx16 x8

61h C3h, C2h XXXX 64 bit: unique device number

62h C5h, C4h XXXX

63h C7h, C6h XXXX

64h C9h, C8h XXXX

M29FxxxFT/B

Common Flash Interface (CFI)

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 40 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Maximum Ratings and Operating Conditions

Stressing the device above the rating listed in the Absolute Maximum Ratings table may

cause permanent damage to the device. Exposure to Absolute Maximum Rating condi-

tions for extended periods may affect device reliability. These are stress ratings only and

operation of the device at these or any other conditions above those indicated in the

Operating sections of this specification is not implied.

Table 15: Absolute Maximum Ratings

Symbol Parameter Min Max Unit

TBIAS Temperature Under Bias –50 125 °C

TSTG Storage Temperature –65 150 °C

VIO Input or Output Voltage –0.6 VCC +0.6 V

VCC Supply Voltage –0.6 6 V

VID Identification Voltage –0.6 13.5 V

Notes: 1. Input or Output Voltage parameter: Minimum voltage may undershoot to –2V during

transition and for less than 20ns during transitions.

2. Input or Output Voltage parameter: Maximum voltage may overshoot to VCC +2V during

transition and for less than 20ns during transitions.

The parameters in the tables that follow, are derived from tests performed under the

Measurement Conditions shown here. Designers should check that the operating con-

ditions in their circuit match the operating conditions when relying on the quoted pa-

rameters.

Table 16: Operating and AC Measurement Conditions

Parameter Min Max Unit

VCC Supply Voltage 4.5 5.5 V

Ambient Operating Temperature –40 125 °C

Load Capacitance (CL) 30 30 pF

Input Rise and Fall Times — 5 ns

Input Pulse Voltages 0 to VCC 0 to VCC V

Input and Output Timing Reference Voltages VCC/2 VCC/2 V

Figure 19: AC Measurement I/O Waveform

AI04498

VCC

VCC/2

M29FxxxFT/B

Maximum Ratings and Operating Conditions

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 41 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 20: AC Measurement Load Circuit

CL includes JIG capacitance

25k W

VCC

25k W

VCC

0.1 µ F

Device under test

Table 17: Device Capacitance

Symbol Parameter Test Condition Min Max Unit

CIN Input Capacitance VIN = 0V 6 pF

COUT Output Capacitance VOUT = 0V 12 pF

Note: 1. Sampled only, not 100% tested.

M29FxxxFT/B

Maximum Ratings and Operating Conditions

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 42 Micron Technology, Inc. reserves the right to change products or specifications without notice.

DC Electrical Specifications

Table 18: DC Characteristics

Symbol Parameter Test Condition Min Typ Max Unit

ILI Input Leakage Current 0V ≤ VIN ≤ VCC — — ±1 µA

ILO Output Leakage Current 0V ≤ VOUT ≤ VCC — — ±1 µA

ICC1 Supply Current (Read) CE# = VIL, OE# = VIH,

f = 6MHz

— 7 20 mA

ICC2 Supply Current (Standby) CE# = VCC ±0.2V,

RP# = VCC ±0.2V

— 60 120 µA

ICC3 Supply Current (Program/Erase) Program/Erase Controller active — — 30 mA

VIL Input Low Voltage – –0.5 — 0.8 V

VIH Input High Voltage – 0.7VCC — VCC +0.3 V

VOL Output Low Voltage IOL = 1.8mA — — 0.45 V

VOH Output High Voltage IOH = –100µA VCC –0.4 — — V

VID Identification Voltage 11.5 — 12.5 V

IID Identification Current A9 = VID — — 100 µA

VLKO Program/Erase Lockout Supply

Voltage

– 1.8 — 2.3 V

Note: 1. Supply Current (Program/Erase) parameter: Sampled only, not 100% tested.

M29FxxxFT/B

DC Electrical Specifications

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 43 Micron Technology, Inc. reserves the right to change products or specifications without notice.

AC Read Characteristics

Figure 21: Read Mode AC Waveforms

tAVAV

tAVQV tAXQX

tELQX tEHQZ

tGLQV

tGLQX tGHQX

Valid

A[19:0]/

A–1

OE#

DQ[7:0]/

DQ[15:8]

CE#

tELQV tEHQX

tGHQZ

Valid

tBHQV

tELBL/tELBH tBLQZ

BYTE#

Table 19: Read AC Characteristics

Symbol Alt Parameter Test Condition

M29F160F

Unit55/5A

tAVAV tRC Address Valid to Next Address

Valid

CE# = VIL, OE# = VIL Min 55 ns

tAVQV tACC Address Valid to Output Valid CE# = VIL, OE# = VIL Max 55 ns

tELQX tLZ Chip Enable Low to Output Tran-

sition

OE# = VIL Min 0 ns

tELQV tCE Chip Enable Low to Output Valid OE# = VIL Max 55 ns

tGLQX tOLZ Output Enable Low to Output

Transition

CE# = VIL Min 0 ns

tGLQV tOE Output Enable Low to Output

Valid

CE# = VIL Max 20 ns

tEHQZ tHZ Chip Enable High to Output Hi-Z OE# = VIL Max 15 ns

tGHQZ tDF Output Enable High to Output

Hi-Z

CE# = VIL Max 15 ns

tEHQX tGHQX

tAXQX

tOH Chip Enable, Output Enable or

Address Transition to Output

Transition

– Min 0 ns

M29FxxxFT/B

AC Read Characteristics

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 44 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 19: Read AC Characteristics (Continued)

Symbol Alt Parameter Test Condition

M29F160F

Unit55/5A

tELBL

tELBH

tELFL tELFH Chip Enable to BYTE# Low or

High

– Max 3 ns

tBLQZ tFLQZ BYTE# Low to Output Hi-Z – Max 15 ns

tBHQV tFHQV BYTE# High to Output Valid – Max 20 ns

Note: 1. tELQX tGLQX tEHQZ and tGHQZ parameters: Sampled only, not 100% tested.

M29FxxxFT/B

AC Read Characteristics

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 45 Micron Technology, Inc. reserves the right to change products or specifications without notice.

AC Write Characteristics

Figure 22: Write AC Waveforms, Write Enable Controlled

CE#

OE#

WE#

A[19:0]/

A–1

DQ[7:0]/

DQ[15:8]

VCC

R/B#

Valid

tVCHEL

tWHEH

tWHWL

tELWL

tAVWL

tWHGL

tWLAX

tWHDX

tAVAV

tDVWH

tWLWH

tGHWL

tWHRL

Table 20: Write AC Characteristics, Write Enable Controlled

Symbol Alternate Parameter

M29F160F

Unit55/5A

tAVAV tWC Address Valid to Next Address Valid Min 55 ns

tELWL tCS Chip Enable Low to Write Enable Low Min 0 ns

tWLWH tWP Write Enable Low to Write Enable High Min 30 ns

tDVWH tDS Input Valid to Write Enable High Min 20 ns

tWHDX tDH Write Enable High to Input Transition Min 0 ns

tWHEH tCH Write Enable High to Chip Enable High Min 0 ns

tWHWL tWPH Write Enable High to Write Enable Low Min 15 ns

tAVWL tAS Address Valid to Write Enable Low Min 0 ns

tWLAX tAH Write Enable Low to Address Transition Min 30 ns

tGHWL Output Enable High to Write Enable Low Min 0 ns

tWHGL tOEH Write Enable High to Output Enable Low Min 0 ns

tWHRL tBUSY Program/Erase Valid to RB# Low Max 20 ns

M29FxxxFT/B

AC Write Characteristics

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 46 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 20: Write AC Characteristics, Write Enable Controlled (Continued)

Symbol Alternate Parameter

M29F160F

Unit55/5A

tVCHEL tVCS VCC High to Chip Enable Low Min 50 µs

Note: 1. tWHRL parameter: Sampled only, not 100% tested.

Figure 23: Write AC Waveforms, Chip Enable Controlled

Valid

tVCHWL

tEHWH

tEHEL

tWLEL

tAVEL

tEHGL

tELAX

tEHDX

tAVAV

tDVEH

tELEH

tGHEL

tEHRL

CE#

OE#

WE#

A[19:0]/

A–1

DQ[7:0]/

DQ[15:8]

VCC

R/B#

Table 21: Write AC Characteristics, Chip Enable Controlled

Symbol Alt Parameter

M29F160F

Unit55/5A

tAVAV tWC Address Valid to Next Address Valid Min 55 ns

tWLEL tWS Write Enable Low to Chip Enable Low Min 0 ns

tELEH tCP Chip Enable Low to Chip Enable High Min 30 ns

tDVEH tDS Input Valid to Chip Enable High Min 20 ns

tEHDX tDH Chip Enable High to Input Transition Min 0 ns

tEHWH tWH Chip Enable High to Write Enable High Min 0 ns

M29FxxxFT/B

AC Write Characteristics

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 47 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 21: Write AC Characteristics, Chip Enable Controlled (Continued)

Symbol Alt Parameter

M29F160F

Unit55/5A

tEHEL tCPH Chip Enable High to Chip Enable Low Min 15 ns

tAVEL tAS Address Valid to Chip Enable Low Min 0 ns

tELAX tAH Chip Enable Low to Address Transition Min 30 ns

tGHEL Output Enable High Chip Enable Low Min 0 ns

tEHGL tOEH Chip Enable High to Output Enable Low Min 0 ns

tEHRL tBUSY Program/Erase Valid to RB# Low Max 20 ns

tVCHWL tVCS VCC High to Write Enable Low Min 50 µs

Note: 1. tEHRL parameter: Sampled only, not 100% tested.

Reset Specifications

Figure 24: Reset/Block Temporary Unprotect AC Waveforms

R/B#

WE#, CE#,

OE#

RP#

tPLPX

tPHWL, tPHEL, tPHGL

tPLYH tPHPHH

tRHWL, tRHEL, tRHGL

Table 22: Reset/Block Temporary Unprotect AC Characteristics

Symbol Alt Parameter

M29F160F

Unit55/5A

tPHWL

tPHEL

tPHGL

tRH RP# High to Write Enable Low, Chip Enable

Low, Output Enable Low

Min 50 ns

tRHWL

tRHEL

tRHGL

tRB RB# High to Write Enable Low, Chip Enable

Low, Output Enable Low

Min 0 ns

tPLPX tRP RP# Pulse Width Min 500 ns

tPLYH tREADY RP# Low to Read Mode Max 10 µs

tPHPHH tVIDR RP# Rise Time to VID Min 500 ns

Note: 1. tPHWL tPHGL tRHWL tRHEL tRHGL tPLYH and tPHPHH parameters: Sampled only, not 100% tested.

M29FxxxFT/B

Reset Specifications

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 48 Micron Technology, Inc. reserves the right to change products or specifications without notice.

PROGRAM/ERASE Specifications

Table 23: Program/Erase Times and PROGRAM/ERASE Endurance Cycles

Parameter Min Typ Max Unit

Chip erase M29F160F — 25 120 s

M29F800F 12 60

M29F400F 6 30

M29F200F 3 15

Block erase (64KB) — 0.8 6 s

Erase suspend latency time — 20 25 µs

Program (byte or word) — 11 200 µs

Chip program (byte-by-byte) M29F160F — 24 120 s

M29F800F 12 60

M29F400F 6 30

M29F200F 4 16

Chip program (word-by-word) M29F160F — 12 60 s

M29F800F 6 30

M29F400F 3 15

M29F200F 2 8

PROGRAM/ERASE cycles (per block) 100,000 — — cycles

Data retention 20 — — years

Notes: 1. Typical values are measured at room temperature and nominal voltages; typical and

maximum values are samples, not 100% tested.

2. Chip erase, program, and chip program parameters: Maximum value measured at worst

case conditions for both temperature and VCC after 100,000 PROGRAM/ERASE cycles.

3. Block erase and erase suspend latency parameter: Maximum value measured at worst-

case conditions for both temperature and VCC.

M29FxxxFT/B

PROGRAM/ERASE Specifications

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 49 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Package Dimensions

Figure 25: 48-Lead TSOP – 12mm x 20mm

Die

0.50 TYP

0.08 MAX

0.10 MIN/

0.21 MAX 0.60 +0.10

3o2o

0.22 +0.05

0.10 +0.05

1.20 MAX

1.00 +0.05

0.80 TYP

20.00 +0.20

18.40 +0.10

12.00 +0.10

Note: 1. Drawing is not to scale.

M29FxxxFT/B

Package Dimensions

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 50 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Figure 26: 44-Lead Small-Outline – 500 Mil

1 22

8°

0.35 MIN/

0.50 MAX

0.18 MIN/

0.28 MAX

0.10 TYP 0.79 TYP

1.73 TYP

1.27 TYP

0.10 MAX

28.50 ±0.13

12.60 ±0.13

16.03 +0.25

-0.26

2.69 +0.10

-0.13 3.00 MAX

Note: 1. Drawing is not to scale.

M29FxxxFT/B

Package Dimensions

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 51 Micron Technology, Inc. reserves the right to change products or specifications without notice.

Revision History

Rev. A – 02/13

• Initial Micron brand release

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

www.micron.com/productsupport Customer Comment Line: 800-932-4992

Micron and the Micron logo are trademarks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.

Although considered final, these specifications are subject to change, as further product development and data characterization some-

times occur.

M29FxxxFT/B

Revision History

PDF: 09005aef845656da

m29fxxxf/t_2mb-16mb.pdf - Rev. A 2/13 EN 52 Micron Technology, Inc. reserves the right to change products or specifications without notice.