T4-LDS-0183-1, Rev. 1 (120901) ©2012 Microsemi Corporation Page 1 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
Available on
commercial
versions
VOIDLESS HERM E TICALLY SEALED SURFACE
MOUNT 1.5 WATT GLASS ZENER DIODES
Qualified per MIL-PRF-19500/406
Quali f i ed Levels:
JAN, JAN TX,
JAN TX V and JANS
DESCRIPTION
Thi s surface mount, Z ener voltag e r egulat or series i s mili tary qualifi ed t o M IL-PRF-19500/406
and is ideal for high-reliabil i ty appli cations wh ere a failure cannot be tolerated. These indus try-
recognized 1.5 watt Zen er voltag e regulat or s are her metic al ly sealed with void-less glass
construction using an internal metallurgical bond. It includes Zener selecti ons from 3.3 to 2 00
vol ts in standard 5 % toleran ce. 1% and 2% toleranc e versi ons ar e also a vailable. Microsemi
als o offers nu merous other Zener products t o meet hi gher and lower power r ating s in both
thru-h ole and su r fac e mount pac kag es.
“A” (D-5A) MELF
Package
Also available in:
DO-41 Package
(axial-lead)
1N4460 – 1N4496 and
1N6485 – 1N6491
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Sur face mount equiv alent of popular JEDEC regis tered series.
• Void-less hermetically sealed glass package.
• Triple-layer passivation.
• Extremely robust construction.
• Internal “Category 1” metallurgical bonds for 1N4462US thru 1N4496US and “Category III” for
1N6485US thru 1N6491US as well as 1N4460US and 1N4461US.
• JAN, JANTX, JANTXV and JANS qualifications are available per MIL-PRF-19500/406.
• RoHS com pliant versi ons avail able (commercial grade only).
APPLICATIONS / BENE FITS
• Regulates voltage over a broad operating current and temperature range.
• Extensive selection from 3.3 to 200 V.
• Standard voltage tolerances are plus/minus 5% with no suffix.
• Tighter tolerances available in plus or minus 2% or 1%.
• Non-sensitive to ESD per MIL-STD-750 method 1020.
• Inherently radiation hard as described in Microsemi MicroNote 050.
MAXIMUM RATINGS @ T
A
= 2 5 oC un less otherwise spec i fied
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Symbol
Value
Unit
Junct ion and Stor age Temperature
TJ & TSTG
-65 to +175
oC
Steady State Power Dissipation @ TA = 25 ºC
PD
1.5
W
Thermal Resistance Junction-to-End Cap
RӨJEC
20
oC/W
Thermal Impedance @ 10 ms
1N4462 – 1N4496
1N6485 – 1N6491
1N4460 – 1N4461
ZӨJX
Figure 3
Figure 4
Figure 4
ºC/W
Forward Voltage @ 200 mA
@ 1.0 A
VF 1.0
1.5
V
Solder Temperature @ 10 s
TSP
260
oC
T4-LDS-0183-1, Rev. 1 (120901) ©2012 Microsemi Corporation Page 2 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
• CASE: Hermetically sealed voidless hard glass with tung sten slug s.
• TERMINALS: Tin/lead (Sn/Pb) or RoHS compliant matte/tin (commercial grade only) over copper.
• MARKING: Polarity band only.
• POLARITY: Cathode indicated by band.
• TAPE & REEL option: Standard per EIA-481-B. Consult factory for quantities.
• WEIGHT: 193 milligrams.
• See Package Dimensions on last page.
JAN 1N4460 US C (e3)
Reliability Level
JAN = JAN Level
JANTX = JANTX Level
JANTXV = JANTXV Level
JANS = JA NS Level
Blank = Commercial
JEDEC type number
(See Electrical Characteristics
table)
RoHS Compliance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
Tolerance Level
Blank = 5 %
C = 2 %
D = 1%
MELF Surface Mount
SYMBOLS & DEFINITIONS
Symbol
Definition
VZ
Zener Voltage: The Zener voltage the device wi ll exhibit at a specified current (IZ) in its breakdown region.
IZ, IZT, IZK
Regulator Current: The dc regulator current (IZ), at a specified test point (IZT), near breakdow n knee (IZK).
ZZT or ZZK
Dynamic Impedance: The small signal impedance of the diode when biased to operate in its breakdown region at a
specified rms c urrent modulation (typically 10% of IZT or IZK) and superimposed on IZT o r I ZK respectively.
VF
Maximum Forw ard Voltage: The maximum forward vol tage the device will exhibit at a specified current.
IR
Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and
temperature.
IZM
Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating.
IZSM
Maximum Zener Surge Current: The non-repetitive peak value of Zener surge current at a specified wave form.
T4-LDS-0183-1, Rev. 1 (120901) ©2012 Microsemi Corporation Page 3 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
TYPE
NOMINAL
ZENER
VOLTAGE
VZ
TEST
CURRENT
IZT
MAXIMUM
DYNAMIC
IMPEDANCE
ZZT @ IZT
MAXIMUM KNEE
IMPEDANCE
ZZK @ IZK
MAXIMUM
REVERSE
CURRENT
IR @ VR
MAXIMUM
CONTINUOUS
CURRENT
IZM
(Note 1)
SURGE
CURRENT
@ 8.3 ms
square wave
IZSM
Volts
mA
Ohms
Ohms
mA
µA
Volts
mA
Amps
1N4460US
1N4461US
1N4462US
1N4463US
6.2
6.8
7.5
8.2
40.0
37.0
34.0
31.0
4
2.5
2.5
3
200
200
400
400
1.0
1.0
.5
.5
10.0
5.0
1.0
.50
3.72
4.08
4.50
4.92
230
210
191
174
2.3
2.1
1.9
1.7
1N4464US
1N4465US
1N4466US
1N4467US
9.1
10.0
11.0
12.0
28.0
25.0
23.0
21.0
4
5
6
7
500
500
550
550
.5
.25
.25
.25
.30
.30
.30
.20
5.46
8.00
8.80
9.60
157
143
130
119
1.6
1.4
1.3
1.2
1N4468US
1N4469US
1N4470US
1N4471US
13.0
15.0
16.0
18.0
19.0
17.0
15.5
14.0
8
9
10
11
550
600
600
650
.25
.25
.25
.25
.05
.05
.05
.05
10.4
12.0
12.8
14.4
110
95
90
79
1.1
.95
.90
.79
1N4472US
1N4473US
1N4474US
1N4475US
20.0
22.0
24.0
27.0
12.5
11.5
10.5
9.5
12
14
16
18
650
650
700
700
.25
.25
.25
.25
.05
.05
.05
.05
16.0
17.6
19.2
21.6
71
65
60
53
.71
.65
.60
.53
1N4476US
1N4477US
1N4478US
1N4479US
30.0
33.0
36.0
39.0
8.5
7.5
7.0
6.5
20
25
27
30
750
800
850
900
.25
.25
.25
.25
.05
.05
.05
.05
24.0
26.4
28.8
31.2
48
43
40
37
.48
.43
.40
.37
1N4480US
1N4481US
1N4482US
1N4483US
43.0
47.0
51.0
56.0
6.0
5.5
5.0
4.5
40
50
60
70
950
1000
1100
1300
.25
.25
.25
.25
.05
.05
.05
.25
34.4
37.6
40.8
44.8
33
30
28
26
.33
.30
.28
.26
1N4484US
1N4485US
1N4486US
1N4487US
62.0
68.0
75.0
82.0
4.0
3.7
3.3
3.0
80
100
130
160
1500
1700
2000
2500
.25
.25
.25
.25
.25
.25
.25
.25
49.6
54.4
60.0
65.6
23
21
19
17
.23
.21
.19
.17
1N4488US
1N4489US
1N4490US
1N4491US
91.0
100.0
110.0
120.0
2.8
2.5
2.3
2.0
200
250
300
400
3000
3100
4000
4500
.25
.25
.25
.25
.25
.25
.25
.25
72.8
80.0
88.0
96.0
16
14
13
12
.16
.14
.13
.12
1N4492US
1N4493US
1N4494US
1N4495US
130.0
150.0
160.0
180.0
1.9
1.7
1.6
1.4
500
700
1000
1300
5000
6000
6500
7000
.25
.25
.25
.25
.25
.25
.25
.25
104.0
120.0
128.0
144.0
11
9.5
8.9
7.9
.11
.095
.089
.079
1N4496US
200.0
1.2
1500
8000
.25
.25
160.0
7.2
.072
1N6485US
1N6486US
1N6487US
1N6488US
3.3
3.6
3.9
4.3
76.0
69.0
64.0
58.0
10
10
9
9
400
400
400
400
1.0
1.0
1.0
1.0
50
50
35
5.0
1.0
1.0
1.0
1.0
433
397
366
332
4.2
3.9
3.6
3.3
1N6489US
1N6490US
1N6491US
4.7
5.1
5.6
53.0
49.0
45.0
8
7
5
500
500
600
1.0
1.0
1.0
4.0
1.0
0.5
1.0
1.0
2.0
304
280
255
3.0
2.7
2.5
NOTE: 1. See “Maximum Ratings” for PD temperature conditions for end-cap pac kage where IZM is app lic able.
T4-LDS-0183-1, Rev. 1 (120901) ©2012 Microsemi Corporation Page 4 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
TEMPERATURE COEFFICIENT (%/°C)
FIGURE 1
Temperature C oefficient C haracteristics
TEC (° C) (En d Cap)
FIGURE 2
Temperature-Power Der ating Curve
ZEN ER VO LT AG E
DC Operation Maximum Rating (W)
T4-LDS-0183-1, Rev. 1 (120901) ©2012 Microsemi Corporation Page 5 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
tH (Heating time) ms
FIGURE 3
Thermal Impedance Curve for 1N4462US through 1N4496US
tH (Heating time) ms
FIGURE 4
Thermal Impedance Curve for 1N6485US through 1N6491US and 1N4460US through 1N4461US
Z
θJX
-(°C/W)
Z
θJX
-(°C/W)
T4-LDS-0183-1, Rev. 1 (120901) ©2012 Microsemi Corporation Page 6 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
NOTES:
1. Di mens ions ar e in inches.
2. Millimeters are given for general information only.
3. Di mens ions ar e pr e-solder dip.
4. In accordance wi th ASME Y14.5M, diameters are equivalent to Φx
symbology.
DIMENSIONS
Ltr
INCH
MILLIMETERS
Min
Max
Min
Max
BD
.091
.103
2.31
2.62
BL
.168
.200
4.28
5.08
ECT
.019
.028
0.48
0.71
S
.003
0.08
NOTE: If mounting requires adhesive separate from the solder, an additional 0.080 inch
diameter contact may be placed i n the center between the pads as an optional spot
for cement.
DIM
INCH
MILLIMETERS
A
0.288
7.32
B
0.070
1.78
C
0.155
3.94