LT5557 400MHz to 3.8GHz 3.3V Active Downconverting Mixer Features Description Wide RF Frequency Range: 400MHz to 3.8GHz* n High Input IP3: 25.6dBm at 900MHz 24.7dBm at 1950MHz 23.7dBm at 2.6GHz n Conversion Gain: 3.3dB at 900MHz 2.9dB at 1950MHz n -3dBm LO Drive Level n Low LO Leakage n Low Noise Figure: 10.6dB at 900MHz 11.7dB at 1950MHz n Low Power: 3.3V/269mW n 50 Single-Ended RF and LO Ports n Very Few External Components n 16-Lead (4mm x 4mm) QFN Package The LT(R)5557 active mixer is optimized for high linearity, wide dynamic range downconverter applications. The IC includes a high speed differential LO buffer amplifier driving a double-balanced mixer. Broadband, integrated transformers on the RF and LO inputs provide single-ended 50 interfaces. The differential IF output allows convenient interfacing to differential IF filters and amplifiers, or is easily matched to drive a single-ended 50 load, with or without an external transformer. n The RF input is internally matched to 50 from 1.6GHz to 2.3GHz, and the LO input is internally matched to 50 from 1GHz to 5GHz. The frequency range of both ports is easily extended with simple external matching. The IF output is partially matched and usable for IF frequencies up to 600MHz. Applications n n n n n The LT5557's high level of integration minimizes the total solution cost, board space and system-level variation. Cellular, CDMA, WCDMA, TD-SCDMA and UMTS Infrastructure WiMAX Wireless Infrastructure Receiver Wireless Infrastructure PA Linearization 900MHz/2.4GHz/3.5GHz WLAN L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.\*Operation over a wider frequency range is possible with reduced performance. Consult factory for information and assistance. Typical Application High Signal Level Downmixer for Multi-Carrier Wireless Infrastructure Conversion Gain, IIP3, SSB NF and LO Leakage vs RF Frequency LO INPUT -3dBm (TYP) 26 24 22 100nH IF+ 1nF RF INPUT 150nH RF IF- BIAS GND EN 4.7pF VCC2 VCC1 18 16 14 12 1F 20 30 SSB NF 10 40 LO-IF 8 6 4 10 LOW SIDE LO IF = 240MHz PLO = -3dBm TA = 25C VCC = 3.3V 20 2 1700 100nH 3.3V 1nF IF OUTPUT 240MHz 0 IIP3 LO-RF 50 GC 1800 2100 2000 1900 RF FREQUENCY (MHz) LO LEAKAGE (dBm) 4.7pF GC (dB), NF (dB), IIP3 (dBm) LT5557 2200 60 5557 TA01b 5557 TA01a 5557fc 1 LT5557 Pin Configuration NC NC LO TOP VIEW NC 16 15 14 13 NC 1 12 GND NC 2 11 IF+ 17 RF 3 10 IF- 9 GND 5 6 7 8 NC NC 4 VCC1 Supply Voltage (VCC1, VCC2, IF+, IF -)...........................4V Enable Voltage..................................-0.3V to VCC + 0.3V LO Input Power (380MHz to 4.2GHz).................. +10dBm LO Input DC Voltage................................ -1V to VCC + 1V RF Input Power (400MHz to 3.8GHz).................. +15dBm Continuous RF Input Power (400MHz to 3.8GHz)........................................... +12dBm RF Input DC Voltage................................................ 0.1V Operating Temperature Range..................-40C to 85C Storage Temperature Range................... -65C to 125C Junction Temperature (TJ)..................................... 125C EN (Note 1) VCC2 Absolute Maximum Ratings UF PACKAGE 16-LEAD (4mm x 4mm) PLASTIC QFN TJMAX = 125C, JC = 8C/W, JA = 37C/W EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB CAUTION: This part is sensitive to electrostatic discharge (ESD). It is very important that proper ESD precautions be observed when handling the LT5557. Order Information LEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE -40C to 85C LT5557EUF#PBF LT5557EUF#TRPBF 5557 16-Lead (4mm x 4mm) Plastic QFN Consult LTC Marketing for parts specified with wider operating temperature ranges. Consult LTC Marketing for information on non-standard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ DC Electrical Characteristics circuit shown in Figure 1. (Note 3) PARAMETER VCC = 3.3V, EN = High, TA = 25C, unless otherwise specified. Test CONDITIONS MIN TYP MAX UNITS 2.9 3.3 3.9 V 60 92 mA mA mA mA 100 A Power Supply Requirements (VCC) Supply Voltage VCC1 (Pin 7) VCC2 (Pin 6) IF + + IF - (Pin 11 + Pin 10) Total Supply Current Enable (EN) Low = Off, High = On 25.1 3.3 53.2 81.6 Supply Current Shutdown Current EN = Low Input High Voltage (On) 2.7 V Input Low Voltage (Off) EN Pin Input Current EN = 3.3V DC 53 0.3 V 90 A Turn-ON Time 1.6 s Turn-OFF Time 1.6 s AC Electrical Characteristics Test circuit shown in Figure 1. (Notes 2, 3) PARAMETER CONDITIONS RF Input Frequency Range IF Output Frequency Range No External Matching (Midband) With External Matching (Low Band or High Band) No External Matching With External Matching Requires Appropriate IF Matching RF Input Return Loss ZO = 50, 1600MHz to 2300MHz (No External Matching) LO Input Frequency Range MIN 400 380 TYP 1600 to 2300 1000 to 4200 0.1 to 600 >12 MAX 3800 UNITS MHz MHz MHz MHz MHz dB 5557fc 2 LT5557 Ac electrical characteristics Test circuit shown in Figure 1. (Notes 2, 3) PARAMETER CONDITIONS MIN LO Input Return Loss ZO = 50, 1000MHz to 5000MHz (No External Matching) IF Output Impedance Differential at 240MHz LO Input Power 1200MHz to 4200MHz 380MHz to 1200MHz TYP MAX UNITS >10 dB 529||2.6pF -8 -5 -3 0 R||C 2 5 dBm dBm Standard Downmixer Application: VCC = 3.3V, EN = High, TA = 25C, PRF = - 6dBm (-6dBm/tone for 2-tone IIP3 tests, f = 1MHz), fLO = fRF - fIF, PLO = -3dBm (0dBm for 450MHz and 900MHz tests), IF output measured at 240MHz, unless otherwise noted. Test circuit shown in Figure 1. (Notes 2, 3, 4) PARAMETER CONDITIONS MIN Conversion Gain RF = 450MHz, IF = 70MHz, High Side LO RF = 900MHz, IF = 140MHz RF = 1750MHz RF = 1950MHz RF = 2150MHz RF = 2600MHz, IF = 360MHz RF = 3600MHz, IF = 450MHz Conversion Gain vs Temperature TA = - 40C to 85C, RF = 1950MHz Input 3rd Order Intercept TYP MAX UNITS 2.9 3.3 3.0 2.9 2.9 2.5 1.7 dB dB dB dB dB dB dB -0.0217 dB/C RF = 450MHz, IF = 70MHz, High Side LO RF = 900MHz, IF = 140MHz RF = 1750MHz RF = 1950MHz RF = 2150MHz RF = 2600MHz, IF = 360MHz RF = 3600MHz, IF = 450MHz 24.1 25.6 25.5 24.7 24.3 23.7 23.5 dBm dBm dBm dBm dBm dBm dBm Single-Sideband Noise Figure RF = 450MHz, IF = 70MHz, High Side LO RF = 900MHz, IF = 140MHz RF = 1750MHz RF = 1950MHz RF = 2150MHz RF = 2600MHz, IF = 360MHz RF = 3600MHz, IF = 450MHz 12.7 10.6 11.3 11.7 12.8 13.2 15.4 dB dB dB dB dB dB dB LO to RF Leakage fLO = 380MHz to 1600MHz fLO = 1600MHz to 4000MHz -50 -45 dBm dBm LO to IF Leakage fLO = 380MHz to 2200MHz fLO = 2200MHz to 4000MHz -42 -38 dBm dBm RF to LO Isolation fRF = 400MHz to 1700MHz fRF = 1700MHz to 3800MHz >50 >42 dB dB RF to IF Isolation fRF = 400MHz to 2300MHz fRF = 2300MHz to 3800MHz >41 >37 dB dB 2RF-2LO Output Spurious Product (fRF = fLO + fIF/2) 900MHz: fRF = 830MHz at -6dBm, fIF = 140MHz 1950MHz: fRF = 1830MHz at -6dBm, fIF = 240MHz -61 -53 dBc dBc 3RF-3LO Output Spurious Product (fRF = fLO + fIF/3) 900MHz: fRF = 806.67MHz at -6dBm, fIF = 140MHz 1950MHz: fRF = 1790MHz at -6dBm, fIF = 240MHz -83 -70 dBc dBc Input 1dB Compression RF = 450MHz, IF = 70MHz, High Side LO RF = 900MHz, IF = 140MHz RF = 1950MHz RF = 2600MHz, IF = 360MHz RF = 3600MHz, IF = 450MHz 10.0 8.8 8.8 8.6 9.1 dBm dBm dBm dBm dBm Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: 450MHz and 900MHz performance measured with external LO and RF matching. 2600MHz and 3600MHz performance measured with external RF matching. See Figure 1 and Applications Information. Note 3: The LT5557 is guaranteed functional over the -40C to 85C operating temperature range. Note 4: SSB Noise Figure measurements performed with a small-signal noise source and bandpass filter on RF input, and no other RF signal applied. 5557fc 3 LT5557 Typical Performance Characteristics VCC = 3.3V, Test circuit shown in Figure 1. Midband (no external RF/LO matching) 240MHz IF output, PRF = -6dBm (-6dBm/tone for 2-tone IIP3 tests, f = 1MHz), PLO = -3dBm, unless otherwise noted. Conversion Gain, IIP3 and NF vs RF Frequency LO Leakage and RF Isolation vs LO and RF Frequency 55 86 IIP3 18 16 14 12 SSB NF 10 -30 -40 35 LO-IF -50 8 2 1.6 1.7 1.8 1.9 2.0 2.1 RF FREQUENCY (GHz) 2.2 LO-RF -60 1.2 2.3 IIP3 IF = 240MHz GC -25 25 50 0 TEMPERATURE (C) 75 100 27 25 23 21 19 17 15 13 11 9 7 5 3 1 -50 -9 -7 -3 -1 1 -5 LO INPUT POWER (dBm) 3 5557 G07 GC (dB), NF (dB), IIP3 (dBm) IIP3 GC 3.1 3.5 3.7 3.3 SUPPLY VOLTAGE (V) 1950MHz Conversion Gain, IIP3 and NF vs Supply Voltage 1750MHz 1950MHz 2150MHz IF = 240MHz GC -25 25 50 0 TEMPERATURE (C) 75 26 24 22 20 18 16 14 12 10 8 6 4 2 0 100 26 24 22 20 18 16 14 12 10 8 6 4 2 0 2.9 IIP3 -40C 25C 85C SSB NF GC 3.1 LOW SIDE LO IF = 240MHz 3.5 3.7 3.3 SUPPLY VOLTAGE (V) 2150MHz Conversion Gain, IIP3 and NF vs LO Power -40C 25C 85C SSB NF -9 -7 LOW SIDE LO IF = 240MHz -3 -1 1 -5 LO INPUT POWER (dBm) 3.9 5557 G06 IIP3 GC 3.9 5557 G03 1950MHz Conversion Gain, IIP3 and NF vs LO Power LOW SIDE LO IF = 240MHz -40C 5557 G05 1750MHz Conversion Gain, IIP3 and NF vs LO Power SSB NF -10C 80 77 2.9 IIP3 5557 G04 -40C 25C 85C 25C 81 Conversion Gain and IIP3 vs Temperature (High Side LO) GC (dB), IIP3 (dBm) GC (dB), IIP3 (dBm) Conversion Gain and IIP3 vs Temperature (Low Side LO) 1750MHz 1950MHz 2150MHz 60C 82 5557 G02 5557 G01 27 25 23 21 19 17 15 13 11 9 7 5 3 1 -50 83 78 15 2.7 1.5 2.1 2.4 1.8 LO/RF FREQUENCY (GHz) 85C 84 79 TA = 25C PLO = -3dBm GC (dB), NF (dB), IIP3 (dBm) GC 4 25 TA = 25C IF = 240MHz 85 45 RF-LO RF-IF SUPPLY CURRENT (mA) LOW SIDE LO HIGH SIDE LO 3 5557 G08 GC (dB), NF (dB), IIP3 (dBm) 20 LO LEAKAGE (dBm) 22 6 GC (dB), NF (dB), IIP3 (dBm) 87 RF ISOLATION (dB) GC (dB), NF (dB), IIP3 (dBm) 24 27 25 23 21 19 17 15 13 11 9 7 5 3 1 Supply Current vs Supply Voltage -20 26 26 24 22 20 18 16 14 12 10 8 6 4 2 0 IIP3 -40C 25C 85C SSB NF GC -9 -7 LOW SIDE LO IF = 240MHz -3 -1 1 -5 LO INPUT POWER (dBm) 3 5557 G09 5557fc 4 LT5557 Typical Performance Characteristics VCC = 3.3V, Test circuit shown in Figure 1. Midband (no external RF/LO matching) 240MHz IF output, PRF = -6dBm (-6dBm/tone for 2-tone IIP3 tests, f = 1MHz), PLO = -3dBm, unless otherwise noted. IFOUT, 2 x 2 and 3 x 3 Spurs vs RF Input Power (Single Tone) IF Output Power, IM3 and IM5 vs RF Input Power (2 Input Tones) 10 15 -20 TA = 25C RF1 = 1949.5MHz RF2 = 1950.5MHz LO = 1710MHz -50 -60 -70 -80 TA = 25C LO = 1710MHz IF = 240MHz -15 -25 -35 -45 -55 2RF-2LO (RF = 1830MHz) -65 -75 -90 IM3 -100 -18 3RF-3LO (RF = 1790MHz) -95 -15 -12 -9 -6 -3 0 3 6 RF INPUT POWER (dBm) -85 IM5 -15 -12 -9 -6 -3 RF INPUT POWER (dBm/TONE) 0 5557 G10 Conversion Gain Distribution at 1950MHz 40 20 15 10 -65 -70 -80 12 15 10 5 0 0 3.2 LOW SIDE LO IF = 240MHz 20 3RF-3LO (RF = 1790MHz) -9 -7 -5 -1 1 -3 LO INPUT POWER (dBm) 3 5557 G12 SSB Noise Figure Distribution at 1950MHz 30 85C 25C -40C 25 5 2.9 2.8 3.0 3.1 CONVERSION GAIN (dB) -60 5557 G11 30 DISTRIBUTION (%) 25 2.7 9 35 30 2.6 2RF-2LO (RF = 1830MHz) -55 IIP3 Distribution at 1950MHz TA = 25C LOW SIDE LO IF = 240MHz 35 -50 -75 TA = 25C LOW SIDE LO IF = 240MHz 27 24 DISTRIBUTION (%) -30 -40 TA = 25C LO = 1710MHz IF = 240MHz PRF = -6dBm -45 RELATIVE SPUR LEVEL (dBc) IFOUT -10 -40 IFOUT 5 (RF = 1950MHz) -5 OUTPUT POWER (dBm) OUTPUT POWER/TONE (dBm) 0 DISTRIBUTION (%) 2 x 2 and 3 x 3 Spurs vs LO Power (Single Tone) 21 18 15 12 9 6 3 23 24 5557 G25 26 25 IIP3 (dBm) 0 28 27 11.0 5557 G26 11.2 11.4 11.6 11.8 12.0 SSB NOISE FIGURE (dB) 12.2 5557 G27 450MHz application (with external RF/LO matching) 70MHz IF output, PRF = -6dBm (-6dBm/tone for 2-tone IIP3 tests, f = 1MHz), high side LO at 0dBm, unless otherwise noted. Conversion Gain, IIP3 and NF vs RF Frequency 450MHz Conversion Gain, IIP3 and NF vs LO Power 25 HIGH SIDE LO TA = 25C IF = 70MHz 18 16 14 SSB NF 12 10 8 6 4 2 400 GC (dB), NF (dB), IIP3 (dBm) GC (dB), NF (dB), IIP3 (dBm) 22 20 -35 23 IIP3 IIP3 21 17 15 SSB NF 13 11 HIGH SIDE LO IF = 70MHz 9 7 GC 5 475 450 425 RF FREQUENCY (MHz) 500 5557 G13 1 -45 900MHz APPLICATION -50 -55 450MHz APPLICATION 3 GC LO-RF LO-IF TA = 25C PLO = 0dBm -40 -40C 25C 85C 19 LO LEAKAGE (dBm) 26 24 LO Leakage vs LO Frequency 450MHz and 900MHz Applications -6 -4 2 0 -2 LO INPUT POWER (dBm) 4 6 5557 G14 -60 400 800 600 1000 LO FREQUENCY (MHz) 1200 5557 G15 5557fc 5 LT5557 Typical Performance Characteristics 27 25 23 21 19 17 15 13 11 9 7 5 3 1 15 5 IIP3 -5 OUTPUT POWER (dBm) 28 26 IIP3 24 22 LOW SIDE LO 20 TA = 25C 18 IF = 140MHz 16 14 12 SSB NF 10 8 6 GC 4 2 800 900 750 950 1000 1050 850 RF FREQUENCY (MHz) 5557 G16 GC (dB), NF (dB), IIP3 (dBm) GC (dB), NF (dB), IIP3 (dBm) VCC = 3.3V, Test circuit shown in Figure 1. 900MHz application (with external RF/LO matching), 140MHz IF output, PRF = -6dBm (-6dBm/tone for 2-tone IIP3 tests, f = 1MHz), low side LO at 0dBm, unless otherwise noted. Conversion Gain, IIP3 and NF 900MHz Conversion Gain, IIP3 IFOUT, 2 x 2 and 3 x 3 Spurs vs RF Frequency and NF vs LO Power vs RF Input Power (Single Tone) -40C 25C 85C SSB NF LOW SIDE LO IF = 140MHz GC IFOUT (RF = 900MHz) -15 -25 -35 -45 -55 2RF-2LO (RF = 830MHz) -65 -75 3RF-3LO (RF = 806.67MHz) -85 LO INPUT POWER (dBm) TA = 25C LO = 760MHz IF = 140MHz -95 3 6 -15 -12 -9 -6 -3 0 RF INPUT POWER (dBm) 5557 G17 9 12 5557 G18 2.3GHz to 2.7GHz application (with external RF matching) 360MHz IF output, PRF = -6dBm (-6dBm/tone for 2-tone IIP3 tests, f = 1MHz), PLO = -3dBm, unless otherwise noted. 26 24 22 20 18 16 14 12 10 8 6 4 2 0 LO Leakage and RF Isolation vs LO and RF Frequency -20 IIP3 SSB NF LOW SIDE LO -7 35 -40 -3 -1 1 -5 LO INPUT POWER (dBm) -60 3 25 LO-RF -50 GC -9 45 RF-LO RF-IF -30 -40C 25C 85C LO LEAKAGE (dBm) 26 24 IIP3 22 LOW SIDE LO 20 HIGH SIDE LO 18 16 14 12 SSB NF 10 8 TA = 25C 6 GC 4 2 0 2.4 2.6 2.3 2.7 2.5 RF FREQUENCY (GHz) 5557 G19 GC (dB), NF (dB), IIP3 (dBm) 2.6GHz Conversion Gain, IIP3 and NF vs LO Power RF ISOLATION (dB) GC (dB), NF (dB), IIP3 (dBm) Conversion Gain, IIP3 and SSB NF vs RF Frequency 15 LO-IF 1.9 5557 G20 2.1 2.3 2.5 2.7 2.9 LO/RF FREQUENCY (GHz) 3.1 5 5557 G21 3.3GHz to 3.8GHz application (with external RF matching) 450MHz IF output, PRF = -6dBm (-6dBm/tone for 2-tone IIP3 tests, f = 1MHz), low side LO at -3dBm, unless otherwise noted. Conversion Gain, IIP3 and SSB 3.6GHz Conversion Gain, IIP3 and LO Leakage and RF Isolation NF vs RF Frequency SSB NF vs LO Power vs LO and RF Frequency 24 10 8 6 TA = 25C GC 0 3.3 20 18 RF-LO -40 SSB NF 16 LO LEAKAGE (dBm) 14 12 GC (dB), NF (dB), IIP3 (dBm) 16 SSB NF 55 IIP3 14 12 -40C 25C 85C 10 8 6 4 45 RF-IF RF ISOLATION (dB) GC (dB), NF (dB), IIP3 (dBm) 18 4 -30 22 20 2 6 24 IIP3 22 -50 -60 GC 35 LO-IF 25 LO-RF 2 3.4 3.7 3.6 3.5 RF FREQUENCY (GHz) 3.8 5557 G22 0 -9 -7 -1 -3 -5 LO INPUT POWER (dBm) 1 3 5557 G23 -70 2.8 3.0 3.4 3.6 3.2 LO/RF FREQUENCY (GHz) 3.8 15 5557 G24 5557fc LT5557 Pin Functions NC (Pins 1, 2, 4, 8, 13, 14, 16): Not Connected Internally. These pins should be grounded on the circuit board for the best LO-to-RF and LO-to-IF isolation. be externally connected to the VCC2 pin and decoupled with 1000pF and 1F capacitors. GND (Pins 9, 12): Ground. These pins are internally connected to the backside ground for improved isolation. They should be connected to the RF ground on the circuit board, although they are not intended to replace the primary grounding through the backside contact of the package. RF (Pin 3): Single-Ended Input for the RF Signal. This pin is internally connected to the primary side of the RF input transformer, which has low DC resistance to ground. If the RF source is not DC blocked, then a series blocking capacitor must be used. The RF input is internally matched from 1.6GHz to 2.3GHz. Operation down to 400MHz or up to 3.8GHz is possible with simple external matching. IF-, IF + (Pins 10, 11): Differential Outputs for the IF Signal. An impedance transformation may be required to match the outputs. These pins must be connected to VCC through impedance matching inductors, RF chokes or a transformer center tap. Typical current consumption is 26.6mA each (53.2mA total). EN (Pin 5): Enable Pin. When the input enable voltage is higher than 2.7V, the mixer circuits supplied through Pins 6, 7, 10 and 11 are enabled. When the input voltage is less than 0.3V, all circuits are disabled. Typical input current is 53A for EN = 3.3V and 0A when EN = 0V. The EN pin should not be left floating. Under no conditions should the EN pin voltage exceed VCC + 0.3V, even at start-up. LO (Pin 15): Single-Ended Input for the Local Oscillator Signal. This pin is internally connected to the primary side of the LO transformer, which is internally DC blocked. An external blocking capacitor is not required. The LO input is internally matched from 1GHz to 5GHz. Operation down to 380MHz is possible with simple external matching. VCC2 (Pin 6): Power Supply Pin for the Bias Circuits. Typical current consumption is 3.3mA. This pin should be externally connected to the VCC1 pin and decoupled with 1000pF and 1F capacitors. Exposed Pad (Pin 17): Circuit Ground Return for the Entire IC. This must be soldered to the printed circuit board ground plane. VCC1 (Pin 7): Power Supply Pin for the LO Buffer Circuits. Typical current consumption is 25.1mA. This pin should Block Diagram 15 LO REGULATOR LIMITING AMPLIFIERS VREF VCC1 3 EXPOSED 17 PAD GND 12 IF+ IF- RF DOUBLE-BALANCED MIXER 11 10 GND 9 BIAS EN 5 VCC1 VCC2 6 7 5557 BD 5557fc 7 LT5557 Test Circuits LOIN L4 0.062" 16 EXTERNAL MATCHING FOR LO BELOW 1GHz 2 ZO 50 LOWPASS MATCH FOR 450MHz, 900MHz AND 3.6GHz RF RFIN NC 13 NC GND NC IF GND 12 T1 C3 GND NC 2 L1 10 1 9 * * IFOUT 240MHz 6 VCC2 VCC1 NC EN 5 EN 4 3 + 11 IF- DC1131A BOARD STACK-UP (NELCO N4000-13) BIAS 0.015" NC RF 4 C5 3.9pF 14 LT5557 3 L (mm) C5 15 LO NC 1 RFIN RF GND R = 3.7 0.015" C4 6 7 8 VCC (2.9V to 3.9V) C1 C2 L5 3.6nH 5557 F01 *HIGHPASS MATCH FOR 2.6GHz RF APPLICATION RF LO RF MATCH IF LO MATCH IF MATCH L C5 L4 C4 L1 C3 450MHz High Side 70MHz 6.5mm 12pF 10nH 8.2pF 270nH 15pF 900MHz Low Side 140MHz 1.7mm 3.9pF 2.7nH 3.9pF 180nH 3.9pF - - 47nH 1.2pF - - 39nH - 2.6GHz 360MHz 3.6GHz 450MHz HIGHPASS* 2.9mm 1pF REF DES VALUE SIZE PART NUMBER REF DES VALUE C1 1000pF 0402 AVX 04025C102JAT L4, C4, C5 C2 1F 0603 AVX 0603ZD105KAT L1 82nH C3 2.2pF 0402 AVX 04025A2R2BAT T1 8:1 SIZE PART NUMBER 0402 See Applications Information 0603 Toko LLQ1608-F82NG Mini-Circuits TC8-1+ Figure 1. Standard Downmixer Test Schematic--Transformer-Based Bandpass IF Matching (240MHz IF) LOIN L4 0.018" 16 EXTERNAL MATCHING FOR LO BELOW 1GHz 1 2 RFIN ZO 50 3 4 L (mm) C5 LOWPASS MATCH FOR 450MHz, 900MHz AND 3.6GHz RF NC 15 LO 14 NC 13 NC NC GND NC IF GND NC EN 5 L1 L3 7 BIAS GND DC910A BOARD STACK-UP (FR-4) C3 C7 IFOUT 240MHz 9 L2 VCC2 VCC1 NC 6 0.018" RF GND C6 10 IF- RF EN 12 + 11 LT5557 0.062" DISCRETE IF BALUN C4 R = 4.4 8 VCC (2.9V to 3.9V) C2 C1 5557 F02 REF DES VALUE SIZE PART NUMBER REF DES C1, C3 1000pF 0402 AVX 04025C102JAT L4, C4, C5 1F 0603 AVX 0603ZD105KAT L1, L2 4.7pF 0402 AVX 04025A4R7CAT L3 C2 C6, C7 VALUE SIZE PART NUMBER 0402 See Applications Information 100nH 0603 Toko LL1608-FSLR10J 150nH 0603 Toko LL1608-FSLR15J Figure 2. Downmixer Test Schematic--Discrete IF Balun Matching (240MHz IF) 5557fc 8 LT5557 Applications Information Introduction The LT5557 consists of a high linearity double-balanced mixer, RF buffer amplifier, high speed limiting LO buffer amplifier and bias/enable circuits. The RF and LO inputs are both single ended. The IF output is differential. Low side or high side LO injection can be used. Two evaluation circuits are available. The standard evaluation circuit, shown in Figure 1, incorporates transformerbased IF matching and is intended for applications that require the highest dynamic range and the widest IF bandwidth. The second evaluation circuit, shown in Figure 2, replaces the IF transformer with a discrete IF balun for reduced solution cost and size. The discrete IF balun delivers higher conversion gain, but slightly degraded IIP3 and noise figure, and reduced IF bandwidth. band edge can be optimized with a series 3.9pF capacitor at Pin 3, which improves the 1.6GHz return loss to greater than 25dB. Likewise, the 2.3GHz match can be improved to greater than 25dB with a series 1.5nH inductor. A series 2.7nH/2.2pF network will simultaneously optimize the lower and upper band edges and expand the RF input bandwidth to 1.2GHz-2.5GHz. Measured RF input return losses for these three cases are also plotted in Figure 4a. Alternatively, the input match can be shifted as low as 400MHz or up to 3800MHz by adding a shunt capacitor (C5) to the RF input. A 450MHz input match is realized with C5 = 12pF, located 6.5mm away from Pin 3 on the evaluation board's 50 input transmission line. A 900MHz input match requires C5 = 3.9pF, located at 1.7mm. A 3.6GHz input match is realized with C5 = 1pF, located at 2.9mm. 0 The mixer's RF input, shown in Figure 3, consists of an integrated transformer and a high linearity differential amplifier. The primary terminals of the transformer are connected to the RF input (Pin 3) and ground. The secondary side of the transformer is internally connected to the amplifier's differential inputs. The DC resistance of the primary is 4.2. If the RF source has DC voltage present, then a coupling capacitor must be used in series with the RF input pin. RF PORT RETURN LOSS (dB) RF Input Port TO MIXER ZO = 50 L = L (mm) 3 RF C5 5557 F03 RFIN C5 L5 HIGHPASS MATCH FOR 2.6GHz RF AND WIDEBAND RF -15 -20 -25 SERIES 2.7nH AND 2.2pF SERIES 3.9pF 0.7 1.2 SERIES 1.5nH 1.7 2.2 2.7 3.2 FREQUENCY (GHz) 3.7 4.2 5557 F04a (4a) Series Reactance Matching 0 RF PORT RETURN LOSS (dB) RFIN -10 -30 0.2 The RF input is internally matched from 1.6GHz to 2.3GHz, requiring no external components over this frequency range. The input return loss, shown in Figure 4a, is typically 12dB at the band edges. The input match at the lower LOWPASS MATCH FOR 450MHz, 900MHz and 3.6GHz RF NO EXT MATCH -5 -5 -10 -15 450MHz L = 6.5mm C5 = 12pF 900MHz L = 1.7mm C5 = 3.9pF -20 -25 -30 0.2 0.7 1.2 3.6GHz L = 2.9mm C5 = 1pF NO EXT MATCH 1.7 2.2 2.7 3.2 FREQUENCY (GHz) 3.7 2.6GHz SERIES 3.9pF SHUNT 3.6nH 4.2 5557 F04b (4b) Series Shunt Matching Figure 3. RF Input Schematic Figure 4. RF Input Return Loss with and without External Matching 5557fc 9 LT5557 applications information This series transmission line/shunt capacitor matching topology allows the LT5557 to be used for multiple frequency standards without circuit board layout modifications. The series transmission line can also be replaced with a series chip inductor for a more compact layout. Input return losses for the 450MHz, 900MHz, 2.6GHz and 3.6GHz applications are plotted in Figure 4b. The input return loss with no external matching is repeated in Figure 4b for comparison. The 2.6GHz RF input match uses the highpass matching network shown in Figures 1 and 3 with C5 = 3.9pF and L5 = 3.6nH. The highpass input matching network is also used to create a wideband or dual-band input match. For example, with C5 = 3.3pF and L5 = 10nH, the RF input is matched from 800MHz to 2.2GHz, with optimum matching in the 800MHz to 1.1GHz and 1.6GHz to 2.2GHz bands, simultaneously. RF input impedance and S11 versus frequency (with no external matching) are listed in Table 1 and referenced to Pin 3. The S11 data can be used with a microwave circuit simulator to design custom matching networks and simulate board level interfacing to the RF input filter. LO Input Port The mixer's LO input, shown in Figure 5, consists of an integrated transformer and high speed limiting differential amplifiers. The amplifiers are designed to precisely drive the mixer for the highest linearity and the lowest noise figure. An internal DC blocking capacitor in series with the transformer's primary eliminates the need for an external blocking capacitor. The LO input is internally matched from 1GHz to 5GHz. The input match can be shifted down, as low as 750MHz, with a single shunt capacitor (C4) on Pin 15. One example is plotted in Figure 6 where C4 = 2.7pF produces a 750MHz to 1GHz match. LO input matching below 750MHz requires the series inductor (L4)/shunt capacitor (C4) network shown in Figure 5. Two examples are plotted in Figure 6, where L4 = 2.7nH/C4 = 3.9pF produces a 650MHz to 830MHz match and L4 = 10nH/C4 = 8.2pF produces a 460MHz to 560MHz match. The evaluation boards do not include pads for L4, so the circuit trace needs to be cut near Pin 15 to insert L4. A low cost multilayer chip inductor is adequate for L4. Table 1. RF Input Impedance vs Frequency S11 INPUT IMPEDANCE MAG ANGLE 50 4.6 + j2.3 0.832 174.7 300 9.1 + j11.2 0.706 153.8 450 12.0 + j14.5 0.639 145.8 600 14.7 + j17.4 0.588 138.7 900 20.5 + j23.3 0.506 123.4 1300 34.4 + j30.3 0.380 97.5 1700 59.6 + j23.8 0.229 55.8 1950 69.2 + j2.8 0.163 6.9 2200 59.2 - j18.1 0.184 -53.5 2450 41.5 - j24.5 0.274 -94.2 2700 28.3 - j21.3 0.374 -120.3 3000 19.0 - j13.5 0.481 -145.5 3300 13.9 - j5.1 0.568 -167.3 3600 10.8 + j3.4 0.645 171.9 3900 9.4 + j12.3 0.700 151.4 EXTERNAL MATCHING FOR LO < 1GHz LOIN L4 TO MIXER 15 LO C4 LIMITER REGULATOR VCC2 VREF 5557 F05 Figure 5. LO Input Schematic 0 LO PORT RETURN LOSS (dB) FREQUENCY (MHz) -10 NO EXT MATCH -20 -30 L4 = 10nH C4 = 8.2pF L4 = 2.7nH C4 = 3.9pF 0.3 L4 = 0 C4 = 2.7pF 1 5 LO FREQUENCY (GHz) 5557 G06 Figure 6. LO Input Return Loss 10 5557fc LT5557 Applications Information The optimum LO drive is -3dBm for LO frequencies above 1.2GHz, although the amplifiers are designed to accommodate several dB of LO input power variation without significant mixer performance variation. Below 1.2GHz, 0dBm LO drive is recommended for optimum noise figure, although -3dBm will still deliver good conversion gain and linearity. Custom matching networks can be designed using the port impedance data listed in Table 2. This data is referenced to the LO pin with no external matching. Table 2. LO Input Impedance vs Frequency S11 FREQUENCY (MHz) INPUT IMPEDANCE MAG ANGLE 50 10.0 - j326 0.991 -17.4 300 8.5 - j41.9 0.820 -99.2 500 11.8 - j10.1 0.632 -155.9 700 18.8 + j10.9 0.474 151.8 900 35.0 + j27.4 0.350 100.8 1200 72.9 + j19.3 0.241 31.3 1500 70.0 - j12.6 0.196 -26.1 1800 55.0 - j17.0 0.167 -64.3 2200 47.8 - j9.7 0.102 -97.2 2600 53.6 - j1.9 0.039 -26.8 3000 66.7 + j0.7 0.143 2.1 3500 82.1 - j13.9 0.263 -17.4 4000 69.0 - j30.1 0.290 -43.5 4500 43.7 - j13.2 0.154 -107.5 5000 36.4 + j19.8 0.271 111.6 The IF output impedance can be modeled as 560 in parallel with 2.6pF at low frequencies. An equivalent smallsignal model (including bondwire inductance) is shown in Figure 8. Frequency-dependent differential IF output impedance is listed in Table 3. This data is referenced to the package pins (with no external components) and includes the effects of IC and package parasitics. The IF output can be matched for IF frequencies as low as several kHz or as high as 600MHz. Table 3. IF Output Impedance vs Frequency FREQUENCY (MHz) DIFFERENTIAL OUTPUT IMPEDANCE (RIF || XIF) 1 560 || - j63.7k (2.6pF) 70 556 || - j870 (2.6pF) 140 551 || - j440 (2.6pF) 190 523 || - j320 (2.6pF) 240 529 || - j254 (2.6pF) 300 509 || - j200 (2.66pF) 360 483 || - j163 (2.7pF) 450 448 || - j125 (2.83pF) 600 396 || - j92 (2.88pF) Two methods of differential to single-ended IF matching are described: * Transformer-based bandpass * Discrete IF balun IF+ C3 IF Output Port The IF outputs, IF+ and IF-, are internally connected to the collectors of the mixer switching transistors (see Figure 7). Both pins must be biased at the supply voltage, which can be applied through the center tap of a transformer or through matching inductors. Each IF pin draws 26.6mA of supply current (53.2mA total). For optimum singleended performance, these differential outputs should be combined externally through an IF transformer or a discrete IF balun circuit. The standard evaluation board (see Figure 1) includes an IF transformer for impedance transformation and differential to single-ended transformation. A second evaluation board (see Figure 2) realizes the same functionality with a discrete IF balun circuit. 8:1 11 IF- IFOUT 50 L1 VCC 10 VCC 5557 F07 Figure 7. IF Output with External Matching 0.7nH RS IF+ 11 CS RIF || XIF IF- 10 0.7nH 5557 F08 Figure 8. IF Output Small-Signal Model 5557fc 11 LT5557 applications information Transformer-Based Bandpass IF Matching 0 IF PORT RETURN LOSS (dB0 The standard evaluation board (shown in Figure 1) uses an L-C bandpass IF matching network, with an 8:1 transformer connected across the IF pins. The L-C network maximizes mixer performance at the desired IF frequency. The transformer performs impedance transformation and provides a single-ended 50 output. The value of L1 is calculated as: -10 -20 B A L1 = 1/[(2fIF)2 * CIF] -30 where CIF is the sum of C3 and the internal IF capacitance (listed in Table 3). The value of C3 is selected such that L1 falls on a standard value, while satisfying the desired IF bandwidth. The IF bandwidth can be estimated as: D E 250 350 450 IF FREQUENCY (MHz) 550 70MHz, L1 = 270nH, C3 = 15pF 140MHz, L1 = 180nH, C3 = 3.9pF 240MHz, L1 = 82nH, C3 = 2.2pF 360MHz, L1 = 47nH, C3 = 1.2pF 450MHz, L1 = 39nH, C3 = 0pF Figure 9. IF Output Return Loss with Transformer-Based Bandpass Matching where REFF, the effective IF resistance when loaded with the transformer and inductor loss, is approximately 200. The LT5557 was characterized with IF frequencies of 70MHz, 140MHz, 240MHz, 360MHz and 450MHz. The values of L1 and C3 used for these frequencies are tabulated in Figure 1 and repeated in Figure 9. In all cases, L1 is a high-Q 0603 wire-wound chip inductor, for highest conversion gain. Low cost multilayer chip inductors can be substituted, with a slight reduction in conversion gain. The measured IF output return losses are plotted in Figure 9. 150 5557 G09 A: B: C: D: E: BWIF = 1/(2REFFCIF) Below 40MHz, the magnitude of the internal IF reactance is relatively high compared to the internal resistance. In this case, L1 (and C3) can be eliminated, and the 8:1 transformer alone is adequate for IF matching. 50 C Discrete IF Balun Matching For many applications, it is possible to replace the IF transformer with the discrete IF balun shown in Figure 2. The values of L1, L2, C6 and C7 are calculated to realize a 180 degree phase shift at the desired IF frequency and provide a 50 single-ended output, using the following equations. Inductor L3 is calculated to cancel the internal 2.6pF capacitance. L3 also supplies bias voltage to the IF+ pin. Low cost multilayer chip inductors are adequate for L1, L2 and L3. C3 is a DC blocking capacitor. L1, L2 = C6,C7 = L3 = RIF * ROUT IF 1 IF * RIF * ROUT XIF IF 5557fc 12 LT5557 Applications Information Compared to the transformer-based IF matching technique, this network delivers approximately 1dB higher conversion gain (since the IF transformer loss is eliminated), though noise figure and IIP3 are degraded slightly. The most significant performance difference, as shown in Figure 12, is the limited IF bandwidth available from the discrete approach. For low IF frequencies, the absolute bandwidth is small, whereas higher IF frequencies offer wider bandwidth. Table 5. Discrete IF Balun Element Values (ROUT = 50) IF FREQUENCY (MHz) L1, L2 C6, C7 L3 190 120nH 6.0pF 270nH || 3.3k 240 100nH 4.7pF 150nH 360 56nH 3.0pF 82nH 450 47nH 2.2pF 47nH Differential IF Output Matching IF PORT RETURN LOSS (dB) -10 360 MHz -20 240 MHz -30 190 MHz 50 150 450 MHz 550 250 350 450 IF FREQUENCY (MHz) 5557 F10 Figure 10. IF Output Return Losses with Discrete Balun Matching -10 26 24 IIP3 22 190IF 240IF 360IF 450IF GC (dB), IIP3 (dBm) 20 18 16 -20 LOW SIDE LO (-3dBm) -30 TA = 25C -40 14 12 10 -50 LO-IF 8 6 -60 GC 4 2 1700 LO-IF LEAKAGE (dBm) Discrete IF balun element values for four common IF frequencies (190MHz, 240MHz, 360MHz and 450MHz) are listed in Table 4. The 190MHz application circuit uses a 3.3k resistor in parallel with L3 as previously described. The corresponding measured IF output return losses are shown in Figure 10. Typical conversion gain, IIP3 and LO-IF leakage, versus RF input frequency for all four examples is shown in Figure 11. Typical conversion gain, IIP3 and noise figure versus IF output frequency is shown in Figure 12. 0 -70 2200 2100 2000 1900 1800 RF INPUT FREQUENCY (MHz) 5557 F11 Figure 11. Conversion Gain, IIP3 and LO-IF Leakage vs RF Input Frequency and IF Output Frequency (in MHz) Using Discrete IF Balun Matching 26 24 GC (dB), NF (dB), IIP3 (dBm) These equations give a good starting point, but it is usually necessary to adjust the component values after building and testing the circuit. The final solution can be achieved with less iteration by considering the parasitics of L3 in the above calculations. Specifically, the effective parallel resistance of L3 (calculated from the manufacturer's Q data) will reduce the value of RIF, which in turn influences the calculated values of L1 (= L2) and C6 (= C7). Also, the effective parallel capacitance of L3 (taken from the manufacturers SRF data) must be considered, since it is in parallel with XIF (from Table 3). Frequently, the calculated value for L1 does not fall on a standard value for the desired IF. In this case, a simple solution is to load the IF output with a high value external chip resistor in parallel with L3, which reduces the value of RIF, until L1 is a standard value. 22 IIP3 20 190IF 240IF 360IF 450IF 18 16 14 12 10 SSB NF 8 6 4 RF = 1950MHz LOW SIDE LO (-3dBm) TA = 25C GC 2 150 200 250 300 350 400 450 IF OUTPUT FREQUENCY (MHz) 500 5557 F12 Figure 12. Conversion Gain, IIP3 and SSB NF vs IF Output Frequency Using Discrete IF Balun Matching 5557fc 13 LT5557 applications information For fully differential IF architectures, the mixer's IF outputs can be matched directly into a SAW filter or IF amplifier, thus eliminating the IF transformer. One example is shown in Figure 13, where the mixer's 500 differential output resistance is matched into a 100 differential SAW filter using the tapped-capacitor technique. Inductors L1 and L2 form the inductive portion of the matching network, cancel the internal 2.6pF capacitance, and supply DC bias current to the mixer core. Capacitors C6 through C9 are the capacitive portion of the matching, and perform the impedance step-down. The calculations for tapped-capacitor matching are covC6 C8 L1 + IF SAW FILTER Enable Interface Figure 14 shows a simplified schematic of the EN pin interface. The voltage necessary to turn on the LT5557 is 2.7V. To disable the chip, the enable voltage must be less than 0.3V. If the EN pin is allowed to float, the chip will tend to remain in its last operating state. Thus, it is not recommended that the enable function be used in this manner. If the shutdown function is not required, then the EN pin should be connected directly to VCC. The voltage at the EN pin should never exceed the power supply voltage (VCC) by more than 0.3V. If this should occur, the supply current could be sourced through the EN pin ESD diode, potentially damaging the IC. IF AMP VCC2 LT5557 EN IF- SUPPLY DECOUPLING L2 C1 5557 F13 C7 VCC C2 5 22k C9 Figure 13. Differential IF Matching Using the Tapped-Capacitor Technique ered in the literature, and are not repeated here. Other differential matching options include lowpass, highpass and bandpass. The choice depends on the system performance goals, IF frequency, IF bandwidth and filter (or amplifier) input impedance. Contact the factory for applications assistance. 5557 F14 Figure 14. Enable Input Circuit 5557fc 14 LT5557 applications information Figure 15. Standard Evaluation Board Layout (DC1131A) Figure 16. Discrete IF Evaluation Board Layout (DC910A) 5557fc 15 LT5557 Package Description UF Package 16-Lead Plastic QFN (4mm x 4mm) (Reference LTC DWG # 05-08-1692) BOTTOM VIEW--EXPOSED PAD 4.00 0.10 (4 SIDES) 0.72 0.05 4.35 0.05 0.75 0.05 R = 0.115 TYP 15 16 PIN 1 NOTCH R = 0.20 TYP OR 0.35 x 45 CHAMFER 0.55 0.20 PIN 1 TOP MARK (NOTE 6) 1 2.15 0.10 (4-SIDES) 2.15 0.05 (4 SIDES) 2 2.90 0.05 PACKAGE OUTLINE 0.30 0.05 0.65 BSC (UF16) QFN 10-04 0.200 REF 0.00 - 0.05 0.30 0.05 0.65 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 5557fc 16 LT5557 Revision History (Revision history begins at Rev C) REV DATE DESCRIPTION PAGE NUMBER C 6/11 Revised title and Features 1 Revised Absolute Maximum Ratings, Pin Configuration, DC Electrical Characteristics, AC Electrical Characteristics, and Note 3 2, 3 Updated Related Parts list 18 5557fc Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 17 LT5557 Related Parts PART NUMBER DESCRIPTION COMMENTS Infrastructure LT5512 1kHz to 3GHz High Signal Level Active Mixer 20dBm IIP3 from 30MHz to 900MHz, Integrated LO Buffer, HF/VHF/UHF Optimized LT5514 Ultralow Distortion, IF Amplifier/ADC Driver with Digitally Controlled Gain 850MHz Bandwidth, 47dBm OIP3 at 100MHz, 10.5dB to 33dB Gain Control Range LT5515 1.5GHz to 2.5GHz Direct Conversion Quadrature Demodulator 20dBm IIP3, Integrated LO Quadrature Generator LT5516 0.8GHz to 1.5GHz Direct Conversion Quadrature Demodulator 21.5dBm IIP3, Integrated LO Quadrature Generator LT5517 40MHz to 900MHz Quadrature Demodulator 21dBm IIP3, Integrated LO Quadrature Generator LT5519 0.7GHz to 1.4GHz High Linearity Upconverting Mixer 17.1dBm IIP3 at 1GHz, Integrated RF Output Transformer with 50 Matching, Single-Ended LO and RF Ports Operation LT5520 1.3GHz to 2.3GHz High Linearity Upconverting Mixer 15.9dBm IIP3 at 1.9GHz, Integrated RF Output Transformer with 50 Matching, Single-Ended LO and RF Ports Operation LT5521 10MHz to 3700MHz High Linearity Upconverting Mixer 24.2dBm IIP3 at 1.95GHz, NF = 12.5dB, 3.15V to 5.25V Supply, Single-Ended LO Port Operation LT5522 400MHz to 2.7GHz High Signal Level Downconverting Mixer 4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz, NF = 12.5dB, 50 Single-Ended RF and LO Ports LT5525 High Linearity, Low Power Downconverting Mixer Single-Ended 50 RF and LO Ports, 17.6dBm IIP3 at 1900MHz, ICC = 28mA LT5526 High Linearity, Low Power Downconverting Mixer 3V to 5.3V Supply, 16.5dBm IIP3, 100kHz to 2GHz RF, NF = 11dB, ICC = 28mA, -65dBm LO-RF Leakage LT5527 400MHz to 3.7GHz, 5V High Signal Level Downconverting Mixer 23.5dBm IIP3 at 1.9GHz, NF = 12.5dB, Single-Ended RF and LO Ports LT5528 1.5GHz to 2.4GHz High Linearity Direct I/Q Modulator 21.8dBm OIP3 at 2GHz, -159dBm/Hz Noise Floor, 50 Interface at All Ports LT5568 600MHz to 1.2GHz High Linearity Direct I/Q Modulator 22.9dBm OIP3, -160.3dBm/Hz Noise Floor, -46dBc Image Rejection, -43dBm Carrier Leakage LTC(R)5569 300MHz to 4GHz 3.3V Dual Active Downconverting Mixer 2dB Gain, 26.8dBm IIP3, 11.7dB NF at 1950MHz RF Power Detectors LTC5505 RF Peak Detectors with >40dB Dynamic Range 300MHz to 3GHz, Temperature Compensated, -32dBm to 12dBm LTC5507 100kHz to 1000MHz RF Peak Power Detector 100kHz to 1GHz, Temperature Compensated, -34dBm to 14dBm LTC5508 300MHz to 7GHz RF Peak Power Detector 44dB Dynamic Range, Temperature Compensated, SC70 Package, -32dBm to 12dBm LTC5509 300MHz to 3GHz RF Peak Power Detector 36dB Dynamic Range, Low Power Consumption, SC70 Package, -30dBm to 6dBm LTC5530 300MHz to 7GHz Precision RF Peak Power Detector Precision VOUT Offset Control, Shutdown, Adjustable Gain, -32dBm to 10dBm LTC5531 300MHz to 7GHz Precision RF Peak Power Detector Precision VOUT Offset Control, Shutdown, Adjustable Offset, -32dBm to 10dBm LTC5532 300MHz to 7GHz Precision RF Peak Power Detector Precision VOUT Offset Control, Adjustable Gain and Offset, 35mV Offset Voltage Tolerence LTC5533 300MHz to 11GHz Dual Precision RF Peak Detector -32dBm to 12dBm, Adjustable Offset, 45dB Channel-to-Channel Isolation LT5534 50MHz to 3GHz RF Log Detector with 60dB Dynamic Range 1dB Output Variation Over Temperature, 38ns Response Time LTC5536 Precision 600MHz to 7GHz RF Peak Detector with Fast Comparator Output 25ns Response Time, Comparator Reference Input, Latch Enable Input, -26dBm to +12dBm Input Range LT5537 90dB Dynamic Range RF Log Detector LF to 1GHz, -79dBm to 12dBm, Very Low Tempco Low Voltage RF Building Block LT5546 500MHz Quadrature Demodulator with VGA and 17MHz Baseband Bandwidth 17MHz Baseband Bandwidth, 40MHz to 500MHz IF, 1.8V to 5.25V Supply, -7dB to 56dB Linear Power Gain 5557fc 18 Linear Technology Corporation LT 0611 REV C * PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 FAX: (408) 434-0507 www.linear.com LINEAR TECHNOLOGY CORPORATION 2006