Board Level Heat Sinks P/N: 411910B02500 200 400 600 800 1000 80 8 60 6 40 4 20 2 o C 10 0 CUSTOMIZED HEATSINKS * Specialized Plating * Specialized Body Configurations * Contact Applications Engineering 0 0 2 4 6 Heat Dissipated - Watts COMAIR ROTRON, INC 8929 Terman Court, San Diego, CA 92121 Ph (858) 348-6200 Fax (858) 566-4577 E-mail: sales@comairrotron.com, Web: www.comairrotron.com 8 10 (Mounting Surface to Ambient) * Multiple Holes for Device Attachment * Dual Device Cooling Heat Sink * Vertical Mounting via Solderable Pins * RoHS Compliant 0 100 Thermal Resistance - oC/ Watt FEATURES & BENEFITS Air Velocity - LFM Temp Rise Above Ambient (Mounting Surface) * Devices: TO-202 & TO-220 * Size: 12.7 x 34.9 x 25.4 mm * Material: Aluminum * Weight: 10.4 g * Type: Extruded * Finish: Black Anodized * PCB Mounting: Solderable Pins * Package: Bulk * Accessories: Hardware & Thermal Interface Material TO-202 & TO-220 PRODUCT SPECIFICATIONS