AN-000012
Differential Analog Output MEMS Microphone Flex Evaluation Board User Guide
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: AN-000012
Revision: 1.3
Rev. Date: 09/06/2017
GENERAL DESCRIPTION
This user guide applies to the following MEMS microphone
evaluation boards:
• EV_ICS-40618-FX
• EV_ICS-40619-FX
• EV_ICS-40720-FX
• EV_ICS-40730-FX
This is a simple evaluation board that allow quick evaluation of
the performance of differential output analog MEMS
microphones. The small size and low profile of the flexible PCB
enables direct placement of the microphone into a prototype
or an existing design for an in situ evaluation. The evaluation
board consists of a top or bottom port microphone soldered to
a flexible PCB with color-coded wires attached. The only other
component on the board is a 0.1 μF supply bypass capacitor.
Table 1 describes the functions of the four connection wires.
Table 2 explains the functional differences between the four
microphones and evaluation boards.
TABLE 1. PIN FUNCTION DESCRIPTIONS
WIRE
COLOR
MICROPHONE
PIN DESCRIPTION
Red
VDD
Power Supply. 1.5 V dc to 3.6 V
dc.
White
OUTPUT+
Analog Output Signal +
Blue
OUTPUT−
Analog Output Signal −
Black
GND
Ground.
TABLE 2. MICROPHONE FUNCTIONAL
DIFFERENCES
Microphone Sensitivity
Maximum
Output
Voltage Output
Impedance Mic Port
Location
ICS-40618
1.0 V rms
355 Ω
Bottom
ICS-40619
1.0 V rms
355 Ω
Top
ICS-40720
0.79 V rms
700 Ω
Bottom
ICS-40730
0.79 V rms
430 Ω
Bottom
EVALUATION BOARD CIRCUIT
Figure 1 shows the schematic of the evaluation boards, and
Figures 2-5 show the flex board layouts. See the respective
microphone data sheets for complete descriptions and
specifications of the microphones.
Figure 1. Evaluation Board Schematic
Figure 2. EV_ICS-40618-FX Board Layout (Top View)
12 mm x 3.6 mm
Figure 3. EV_ICS-40619-FX Board Layout (Top View)
12 mm x 3.6 mm
Figure 4. EV_ICS-40720-FX Board Layout (Top View)
12 mm x 3.6 mm
Figure 5. EV_ICS-40730-FX Board Layout (Top View)
13.5 mm x 5.0 mm
V
DD
0.1µF
OUTPUT-
GND
MICROPHONE
OUTPUT+
AN-000012
Document Number: AN-000012 Page 2 of 4
Revision: 1.3
Rev Date: 09/06/2017
EVALUATION BOARD PHOTOGRAPHS
Figure 6. EV_ICS-40618-FX Top View
Figure 7. EV_ICS-40619-FX Top View
Figure 8. EV_ICS-40720-FX Top View
Figure 9. EV_ICS-40730-FX Top View
AN-000012
Document Number: AN-000012 Page 3 of 4
Revision: 1.3
Rev Date: 09/06/2017
REVISION HISTORY
REVISION DATE REV NUMBER DESCRIPTION
09/25/2014 1.0 Initial release
10/16/2015 1.1 Updated eval board guide to show ICS-40618/9 boards
6/15/2016 1.2 Updated Figure 2; updated company logo
09/06/2017 1.3 Updated eval board guide to show ICS-40730
AN-000012
Document Number: AN-000012 Page 4 of 4
Revision: 1.3
Rev Date: 09/06/2017
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use,
or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense
reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice.
InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes,
but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any
patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are
the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional
or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2017 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense
logo are trademarks of InvenSense, Inc.
©2017 InvenSense. All rights reserved.