RS1A THRU RS1K
Features
Mechanical Data
· For surface mounted applications in order optimize
board space
· Low profile package
· Built-in strain relief, ideal for automated placement
· Fast switching speed
· Plastic package has Unerwrites Laboratory
Flammability Classification 94V-0
· Low forward voltage drop
· Glass passivated chip junction
· High temperature soldering : 250℃/10 seconds,
at terminals
Maximum Ratings And Electrical Characteristics
· Case : JEDEC SMA(DO-214AC) molded plastic body
· Terminals : Solder plated solderable per
MIL-STD-750, method 2026
· Polarity : Color band denotes cathode end
· Mounting Position : Any
· Weight : 0.002 ounce, 0.064 gram
(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive
load. For capacitive load, derate by 20%)
CURRENT 1.0 Ampere
VOLTAGE 50 to 800 Volts
Notes:
(1) Test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A.
(2) Measured at 1MHz and applied reverse voltage of 4.0 Volts.
(3) Thermal resistance from junction to ambient and from junction to lead mounted on PCB mounted on
0.2×0.2"(5.0×5.0mm) copper pad areas
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Volts
Peak forward surge current 8.3ms single
half sine-wave superimposed on rated load
(JEDEC method) at TL=90℃
VDC
Maximum average forward rectified current
at TL=90℃
Maximum instantaneous forward voltage
at 1.0A
VRRM Volts
Symbols Units
150
VF
VRMS
1.0
Amps30.0IFSM
TJ
TSTG
50
-55 to +150 ℃
Volts
Amp
Maximum DC reverse current
at rated DC blocking voltage
Typical thermal resistance (Note 3)
Operating junction and storage
temperature range
50
RS1A
35
50
5.0
35.0
Volts
μA
℃/W
I(AV)
IR
RθJL
TA=25℃
TA=125℃
100
RS1B
70
100
200
RS1D
140
200
400
RS1G
280
400
600
RS1J
420
600
800
RS1K
560
800
Typical junction capacitance (Note 2) pF10.0
CJ
105.0
RθJA
Maximum reverse recovery time (Note 1) ns250
trr
1.30
500
7.0
Dimensions in inches and (millimeters)
0.058(1.47)
0.052(1.32)
0.110(2.79)
0.100(2.54)
0.012(0.31)
0.006(0.15)
0.177(4.50)
0.157(3.99)
0.090(2.29)
0.078(1.98)
0.060(1.52)
0.030(0.76)
0.005(0.127)
MAX.
0.208(5.28)
0.194(4.93)
DO-214AC (SMA)
FIG.1-FORWARD CURRENT DERATING CURVE
LEAD TEMPERATURE ( ℃)
AVERAGE FORWARD CURRENT (A)
0
0.5
1.2
1.0
1000 20 160140120806040 180
P.C.B.MOUNTED ON 0.2X0.2"
(5.0X5.0mm)
COPPER PAD AREAS
RESISTIVE OR INDUCTIVE LOAD
FIG.3-TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
20
0.01
0.1
10
1
INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
INSTANTANEOUS FORWARD CURRENT(AMPERES)
PULSE WIDTH=300ms
1% DUTY CYCLE
TJ=25℃
TJ=125℃
1.80.6 0.8 1.61.2 1.41.00.4
FIG.5-TYPICAL REVERSE CHARACTERISTICS
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS REVERSE CURRENT
MICROAMPERES
1000 20 806040
0.01
0.1
10
1
20
TJ=25℃
TJ=125℃
TJ=100℃
FIG.6-TYPICAL TRANSIENT THERMAL IMPEDANCE
100.01 0.1 1
100
10
1
t,PULSE DURATION,sec
TRANSIENT THERMAL IMPEDANCE (℃/W)
MOUNTED ON 0.2X0.2"
(5X5mm) COPPER PAD
AREA
FIG.4-TYPICAL JUNCTION CAPACITANCE
REVERSE VOLTAGE. (V)
JUNCTION CAPACITANCE (pF)
1
10
30
10
1 100
TJ=25℃
f=1.0MHz
Vsig=50mVp-p
FIG.2-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
NUMBER OF CYCLES AT 60Hz
PEAK FORWARD SURGE CURRENT(AMPERES)
20
30
10
50
0
40
1 10020104 6040862
TL=90℃
8.3m SINGLE HALF SINE WAVE
(JEDEC Method)
RATINGS AND CHARACTERISTIC CURVES RS1A THRU RS1K
