STPS2L30A - STMICROELECTRONICS

April 2008 Rev 6 1/10

STPS2L30

Low drop power Schottky rectifier

Features

■Low cost device with low drop forward voltage

for less power dissipation

■Optimized conduction/reverse losses trade-off

which lead to the highest yield in the

applications

■Surface mount miniature packages

■Avalanche capability specified

Description

Single Schottky rectifier suited to switched mode

power supplies and high frequency DC to DC

converters, freewheel diode and integrated circuit

latch up protection.

Packaged in SMA and low profile SMA and SMB,

this device is especially intended for use in

parallel with MOSFETs in synchronous

rectification.

Table 1. Device summary

IF(AV) 2 A

VRRM 30 V

Tj (max) 150 °C

VF(max) 0.375 V

SMA

STPS2L30A

SMB flat

STPS2L30UF

SMA flat

STPS2L30AF

www.st.com

Characteristics STPS2L30

2/10

1 Characteristics

To evaluate the conduction losses use the following equation:

P = 0.24 x IF(AV) + 0.068 IF2(RMS)

Table 2. Absolute ratings (limiting values)

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 30 V

IF(AV) Average forward current

SMA flat TL = 130 °C δ = 0.5

2ASMA TL = 120 °C δ = 0.5

SMB flat TL = 135 °C δ = 0.5

IFSM Surge non repetitive forward current tp =10 ms sinusoidal 75 A

PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1500 W

Tstg Storage temperature range -65 to + 150 °C

TjOperating junction temperature (1) 150 °C

1. condition to avoid thermal runaway for a diode on its own heatsink

dPtot

dTj

--------------- 1

Rth j a–()

--------------------------

Table 3. Thermal resistance

Symbol Parameter Value Unit

Rth(j-l) Junction to lead

SMA flat 20

°C/WSMA 30

SMB flat 15

Table 4. Static electrical characteristics

Symbol Parameter Test Conditions Min. Typ. Max. Unit

IR(1) Reverse leakage current Tj = 25 °C VR = VRRM

200 µA

Tj = 100 °C 6 15 mA

VF(1) Forward voltage drop

Tj = 25 °C IF = 2 A 0.45

Tj = 125 °C 0.325 0.375

Tj = 25 °C IF = 4 A 0.53

Tj = 125 °C 0.43 0.51

1. Pulse test: tp = 380 µs, δ < 2%

STPS2L30 Characteristics

3/10

Figure 1. Average forward power dissipation

versus average forward current

Figure 2. Average forward current versus

ambient temperature (δ = 0.5) SMA

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6

P (W)

F(AV)

δ=tp/T tp

I (A)

F(AV)

δ= 1

δ= 0.05

δ= 0.1 δ= 0.2 δ= 0.5

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

0 25 50 75 100 125 150

I (A)

F(AV)

T (°C)

amb

R =120°C/W

th(j-a)

R=R

th(j-a) th(j-l)

SMA

δ=tp/T tp

Figure 3. Average forward current

versus ambient temperature

(δ = 0.5) SMB flat

Figure 4. Average forward current

versus ambient temperature

(δ = 0.5) SMA flat

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

0 25 50 75 100 125 150

I (A)

F(AV)

T (°C)

amb

R=R

th(j-a) th(j-l)

δ=tp/T tp

SMB flat

R =120°C/W

th(j-a)

I (A)

F(AV)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

0 25 50 75 100 125 150

Rth(j-a)=Rth(j-l)

δ=tp/T tp

Rth(j-a)=200 °C/W

SMA-Flat

T (°C)

amb

Figure 5. Non repetitive surge peak forward

current versus overload duration

(maximum values) SMA

Figure 6. Non repetitive surge peak forward

current versus overload duration

(maximum values) SMB flat

1.E-03 1.E-02 1.E-01 1.E+00

δ=0.5

I (A)

t(s)

T =25°C

T =75°C

T =125°C

SMA

1.E-03 1.E-02 1.E-01 1.E+00

I (A)

T =25°C

T =75°C

T =125°C

SMB flat

(non exposed pad)

δ=0.5 t(s)

Characteristics STPS2L30

4/10

Figure 7. Non repetitive surge peak forward

current versus overload duration

(maximum values) SMA flat

Figure 8. Normalized avalanche power

derating versus pulse duration

I (A)

1.E-03 1.E-02 1.E-01 1.E+00

Ta=25 °C

Ta=75 °C

Ta=125 °C

δ=0.5

SMA-Flat

t(s)

0.001

0.01

0.10.01 1

0.1

10 100 1000

t (µs)

P(t)

P (1µs)

ARM p

ARM

Figure 9. Normalized avalanche power

derating versus junction

temperature

Figure 10. Relative variation of thermal

impedance, junction to ambient,

versus pulse duration - SMA

0.2

0.4

0.6

0.8

1.2

25 50 75 100 125 150

T (°C)

P(T)

P (25°C)

ARM j

ARM

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Z/R

th(j-a) th(j-a)

δ=tp/T tp

t (s)

Single pulse

SMA

Figure 11. Relative variation of thermal

impedance junction to lead

versus pulse duration - SMB flat

Figure 12. Relative variation of thermal

impedance junction to ambient

versus pulse duration - SMA flat

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01

Z/R

th(j-l) th(j-l)

SMB flat

t (s)

Single pulse

Z/R

th(j-a) th(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Single pulse

SMA-Flat

t (s)

STPS2L30 Characteristics

5/10

Figure 13. Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 14. Junction capacitance versus

reverse voltage applied (typical

values)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

0 5 10 15 20 25 30

I (mA)

V (V)

T =125°C

T =150°C

T =100°C

T =25°C

100

1000

1 10 100

C(pF)

V (V)

F=1MHz

V =30mV

T =25°C

OSC RMS

Figure 15. Forward voltage drop versus

forward current (high level)

Figure 16. Forward voltage drop versus

forward current ( low level)

I (A)

0.1

1.0

10.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

=25 °C

(maximum values)

=125 °C

(maximum values)

=125 °C

(maximum values)

=125 °C

(typical values)

V (V)

I (A)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6

=25 °C

(maximum values)

=125 °C

(maximum values)

=125 °C

(maximum values)

=125 °C

(typical values)

V (V)

Figure 17. Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

board FR4, copper

thickness = 35 µm) (SMA, SMB flat)

Figure 18. Thermal resistance junction to

ambient versus copper surface

under each lead (epoxy printed

board FR4, copper

thickness = 35 µm) (SMA flat)

100

110

120

130

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

R (°C/W)

th(j-a)

S (Cm²)

SMB flat)

SMA

R (°C/W)

th(j-a)

100

120

140

160

180

200

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMA-Flat

S (Cm²)

Package Information STPS2L30

6/10

2 Package Information

●Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at www.st.com.

Figure 19. SMA footprint (dimensions in mm)

Table 5. SMA dimensions

Ref.

Dimensions

Millimeters Inches

Min. Max. Min. Max.

A1 1.90 2.45 0.075 0.094

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.90 0.089 0.114

E 4.80 5.35 0.189 0.211

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

2.63

5.43

1.4

1.64

1.4

STPS2L30 Package Information

7/10

Figure 20. SMA flat (non exposed pad) footprint dimensions

Table 6. SMA flat (non exposed pad) dimensions

Ref.

Dimensions

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.90 1.10 0.035 0.043

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.006 0.016

D 2.25 2.95 0.088 0.116

E 4.80 5.60 0.189 0.220

E1 3.95 4.60 0.156 0.181

L 0.75 1.50 0.030 0.059

L1 0.50 0.019

L2 0.50 0.019

L 2x

L2 2x

L1 2x

EE1

1.20

(0.047)

1.20

(0.047)

3.12

(0.123)

5.52

(0.217)

1.52

(0.060)

millimeters

(inches)

Package Information STPS2L30

8/10

Figure 21. SMB flat footprint (dimensions in mm)

Table 7. SMB flat dimensions

Ref.

Dimensions

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.90 1.10 0.035 0.043

b(1)

1. Applies to plated leads

1.95 2.20 0.077 0.087

c(1) 0.15 0.40 0.006 0.016

D 3.30 3.95 0.130 0.156

E 5.10 5.60 0.200 0.220

E1 4.05 4.60 0.189 0.181

L 0.75 1.50 0.029 0.059

L1 0.40 0.016

L2 0.60 0.024

EE1

1.20 1.203.44

5.84

2.07

STPS2L30 Ordering information

9/10

3 Ordering information

4 Revision history

Table 8. Ordering information

Order code Marking Package Weight Base qty Delivery mode

STPS2L30A G30 SMA 0.068 g 5000 Tape and reel

STPS2L30UF FG30 SMB flat 0.050 g 5000 Tape and reel

STPS2L30AF F30 SMA flat 0.035 g 10000 Tape and reel

Table 9. Document revision history

Date Revision Changes

Jul-2003 3A Last update.

Aug-2004 4 SMA package dimensions update. Reference A1 max.

changed from 2.70mm (0.106inc.) to 2.03mm (0.080).

31-Jan-2007 5 Reformatted to current standard. Added ECOPACK

statement. Added SMB flat package.

23-Apr-2008 6 Reformatted to current standards. Added SMA flat package.

STPS2L30

10/10

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