BAP64-05W
Silicon PIN diode
Rev. 3.2 — 1 February 2019 Product data sheet
S
O
T
323
1 Product profile
1.1 General description
Two planar PIN diodes in common cathode configuration in a SOT323 small plastic SMD
package.
1.2 Features and benefits
High voltage, current controlled
RF resistor for RF attenuators and switches
Low diode capacitance
Low diode forward resistance
Low series inductance
For applications up to 3 GHz
AEC-Q101 qualified
1.3 Applications
RF attenuators and switches
NXP Semiconductors BAP64-05W
Silicon PIN diode
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Product data sheet Rev. 3.2 — 1 February 2019
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2 Pinning information
Table 1. Discrete pinning
Pin Description Simplified outline Symbol
1 anode (a1)
2 anode (a2)
3 common cathode
1 2
3
top view
sym136
2
1
3
3 Ordering information
Table 2. Ordering information
PackageType number
Name Description Version
BAP64-05W - plastic surface-mounted package; 3 leads SOT323
4 Marking
Table 3. Marking
Type number Marking Description
% = t: made in MalaysiaBAP64-05W 5W%
% = W: made in China
Table 4. Marking
Type number Marking code
BAP64-05W 5W-
5 Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Values are specified per diode.
Symbol Parameter Conditions Min Max Unit
VRreverse voltage - 100 V
IFforward current - 100 mA
Ptot total power dissipation Tsp ≤ 90 °C - 240 mW
Tstg storage temperature -65 +150 °C
Tjjunction temperature -65 +150 °C
NXP Semiconductors BAP64-05W
Silicon PIN diode
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Product data sheet Rev. 3.2 — 1 February 2019
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6 Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-sp) thermal resistance from junction to solder point 250 K/W
NXP Semiconductors BAP64-05W
Silicon PIN diode
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Product data sheet Rev. 3.2 — 1 February 2019
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7 Characteristics
Table 7. Characteristics
Values are specified per diode; Tj = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage IF = 50 mA - 0.95 1.1 V
VR = 60 V - - 10 µAIRreverse current
VR = 20 V - - 1 µA
see Figure 1; f = 1 MHz;
VR = 0 V - 0.52 - pF
VR = 1 V - 0.37 - pF
Cddiode capacitance
VR = 20 V - 0.23 0.35 pF
see Figure 2; f = 100 MHz; [1]
IF = 0.5 mA - 20 40
IF = 1 mA - 10 20
IF = 10 mA - 2.0 3.8
rDdiode forward resistance
IF = 100 mA - 0.7 1.35
τLcharge carrier life time when switched from IF = 10 mA to
IR = 6 mA; RL = 100 Ω; measured at
IR = 3 mA
- 1.55 - µs
LSseries inductance - 1.2 - nH
[1] Guaranteed on AQL basis: inspection level S4, AQL 1.0.
NXP Semiconductors BAP64-05W
Silicon PIN diode
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Product data sheet Rev. 3.2 — 1 February 2019
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7.1 Graphical data
aaa-017759
0 4 8 12 16 20
0
100
200
300
400
500
VR (V)
Cd
Cd
(fF)(fF)
f = 1 MHz; Tj = 25 °C.
Figure 1. Diode capacitance as a function of reverse
voltage; typical values
aaa-017777
10-1 1 10 102
10-1
1
10
102
IF (mA)
rD
rD
(Ω)(Ω)
f = 100 MHz; Tj = 25 °C.
Figure 2. Forward resistance as a function of forward
current; typical values
aaa-017760
0.5 1 1.5 2 2.5 3
-25
-20
-15
-10
-5
0
f (GHz)
ISLISL
(dB)(dB)
Tamb = 25 °C
Diode zero biased and inserted in series with a 50 Ω
stripline circuit
Figure 3. Isolation of the diode as a function of
frequency; typical values
aaa-017761
0.5 1 1.5 2 2.5 3
-2.5
-2
-1.5
-1
-0.5
0
f (GHz)
Lins
Lins
(dB)(dB)
(1)(1)
(2)(2)
(3)(3)
(4)(4)
Tamb = 25 °C
1. IF = 100 mA
2. IF = 10 mA
3. IF = 1 mA
4. IF = 0.5 mA
Diode inserted in series with a 50 Ω stripline circuit and
biased via the analyzer T-network
Figure 4. Insertion loss of the diode as a function of
frequency; typical values
NXP Semiconductors BAP64-05W
Silicon PIN diode
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Product data sheet Rev. 3.2 — 1 February 2019
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aaa-018155
10-1 1 10
0
25
50
75
100
125
150
IF (mA)
IP2
IP2
(dB)(dB)
(1)(1)
(2)(2)
Tamb = 25 °C
1. f = 900 MHz
2. f = 1800 MHz
Figure 5. Second-order intercept point as a function of forward current; typical values
NXP Semiconductors BAP64-05W
Silicon PIN diode
BAP64-05W All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Product data sheet Rev. 3.2 — 1 February 2019
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8 Package outline
UNIT A1
max bpc D E e1HELpQ wv
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.1
1.1
0.8
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15 0.65
e
1.3 2.2
2.0
0.23
0.13 0.20.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT323 SC-70
wM
bp
D
e1
e
A
B
A1
Lp
Q
detail X
c
HE
E
vMA
AB
y
0 1 2 mm
scale
A
X
1 2
3
Plastic surface-mounted package; 3 leads SOT323
04-11-04
06-03-16
Figure 6. Package outline SOT323
NXP Semiconductors BAP64-05W
Silicon PIN diode
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Product data sheet Rev. 3.2 — 1 February 2019
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9 Abbreviations
Table 8. Abbreviations
Acronym Description
AQL acceptable quality level
PIN P-type, intrinsic, N-type
SMD surface-mounted device
S4 special inspection level 4
10 Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAP64-05W v.3.2 20190201 Product data sheet - BAP64-05W v.3.1
Modifications changed condition for reverse current for VR from 100 V to 60 V
BAP64-05W v.3.1 20181211 Product data sheet - BAP64-05W v.3
Modifications adapted marking code
BAP64-05W v.3 20180713 Product data sheet - BAP64-05W v.2
Modifications changed IRconditions at characteristics
adapted the layout of the data sheet
BAP64-05W v.2 20150428 Product data sheet - BAP64-05W v.1
Modifications The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
AEC-Q101 qualified
BAP64-05W v.1 (9397
750 07192)
20000713 Product specification - -
NXP Semiconductors BAP64-05W
Silicon PIN diode
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Product data sheet Rev. 3.2 — 1 February 2019
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11 Legal information
11.1 Data sheet status
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product
development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
11.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
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Applications — Applications that are described herein for any of these
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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products are sold subject to the general terms and conditions of commercial
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Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
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authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
NXP Semiconductors BAP64-05W
Silicon PIN diode
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Product data sheet Rev. 3.2 — 1 February 2019
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11.4 Trademarks
Notice: All referenced brands, product names, service names and
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NXP Semiconductors BAP64-05W
Silicon PIN diode
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 February 2019
Document identifier: BAP64-05W
Contents
1 Product profile .................................................... 1
1.1 General description ............................................1
1.2 Features and benefits ........................................1
1.3 Applications ........................................................1
2 Pinning information ............................................ 2
3 Ordering information .......................................... 2
4 Marking .................................................................2
5 Limiting values ....................................................2
6 Thermal characteristics ......................................3
7 Characteristics .................................................... 4
7.1 Graphical data ................................................... 5
8 Package outline ...................................................7
9 Abbreviations ...................................................... 8
10 Revision history .................................................. 8
11 Legal information ................................................ 9