BAP64-05W,215 - NXP SEMICONDUCTORS

BAP64-05W

Silicon PIN diode

Rev. 3.2 — 1 February 2019 Product data sheet

323

1 Product profile

1.1 General description

Two planar PIN diodes in common cathode configuration in a SOT323 small plastic SMD

package.

1.2 Features and benefits

•High voltage, current controlled

•RF resistor for RF attenuators and switches

•Low diode capacitance

•Low diode forward resistance

•Low series inductance

•For applications up to 3 GHz

•AEC-Q101 qualified

1.3 Applications

•RF attenuators and switches

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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2 Pinning information

Table 1. Discrete pinning

Pin Description Simplified outline Symbol

1 anode (a1)

2 anode (a2)

3 common cathode

1 2

top view

sym136

3 Ordering information

Table 2. Ordering information

PackageType number

Name Description Version

BAP64-05W - plastic surface-mounted package; 3 leads SOT323

4 Marking

Table 3. Marking

Type number Marking Description

% = t: made in MalaysiaBAP64-05W 5W%

% = W: made in China

Table 4. Marking

Type number Marking code

BAP64-05W 5W-

5 Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Values are specified per diode.

Symbol Parameter Conditions Min Max Unit

VRreverse voltage - 100 V

IFforward current - 100 mA

Ptot total power dissipation Tsp ≤ 90 °C - 240 mW

Tstg storage temperature -65 +150 °C

Tjjunction temperature -65 +150 °C

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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6 Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction to solder point 250 K/W

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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7 Characteristics

Table 7. Characteristics

Values are specified per diode; Tj = 25 °C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF = 50 mA - 0.95 1.1 V

VR = 60 V - - 10 µAIRreverse current

VR = 20 V - - 1 µA

see Figure 1; f = 1 MHz;

VR = 0 V - 0.52 - pF

VR = 1 V - 0.37 - pF

Cddiode capacitance

VR = 20 V - 0.23 0.35 pF

see Figure 2; f = 100 MHz; [1]

IF = 0.5 mA - 20 40 Ω

IF = 1 mA - 10 20 Ω

IF = 10 mA - 2.0 3.8 Ω

rDdiode forward resistance

IF = 100 mA - 0.7 1.35 Ω

τLcharge carrier life time when switched from IF = 10 mA to

IR = 6 mA; RL = 100 Ω; measured at

IR = 3 mA

- 1.55 - µs

LSseries inductance - 1.2 - nH

[1] Guaranteed on AQL basis: inspection level S4, AQL 1.0.

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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7.1 Graphical data

aaa-017759

0 4 8 12 16 20

100

200

300

400

500

VR (V)

(fF)(fF)

f = 1 MHz; Tj = 25 °C.

Figure 1. Diode capacitance as a function of reverse

voltage; typical values

aaa-017777

10-1 1 10 102

10-1

102

IF (mA)

(Ω)(Ω)

f = 100 MHz; Tj = 25 °C.

Figure 2. Forward resistance as a function of forward

current; typical values

aaa-017760

0.5 1 1.5 2 2.5 3

-25

-20

-15

-10

-5

f (GHz)

ISLISL

(dB)(dB)

Tamb = 25 °C

Diode zero biased and inserted in series with a 50 Ω

stripline circuit

Figure 3. Isolation of the diode as a function of

frequency; typical values

aaa-017761

0.5 1 1.5 2 2.5 3

-2.5

-2

-1.5

-1

-0.5

f (GHz)

Lins

(dB)(dB)

(1)(1)

(2)(2)

(3)(3)

(4)(4)

Tamb = 25 °C

1. IF = 100 mA

2. IF = 10 mA

3. IF = 1 mA

4. IF = 0.5 mA

Diode inserted in series with a 50 Ω stripline circuit and

biased via the analyzer T-network

Figure 4. Insertion loss of the diode as a function of

frequency; typical values

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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aaa-018155

10-1 1 10

100

125

150

IF (mA)

IP2

(dB)(dB)

(1)(1)

(2)(2)

Tamb = 25 °C

1. f = 900 MHz

2. f = 1800 MHz

Figure 5. Second-order intercept point as a function of forward current; typical values

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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8 Package outline

UNIT A1

max bpc D E e1HELpQ wv

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.1

1.1

0.8

0.4

0.3

0.25

0.10

2.2

1.8

1.35

1.15 0.65

1.3 2.2

2.0

0.23

0.13 0.20.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT323 SC-70

detail X

vMA

0 1 2 mm

scale

1 2

Plastic surface-mounted package; 3 leads SOT323

04-11-04

06-03-16

Figure 6. Package outline SOT323

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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9 Abbreviations

Table 8. Abbreviations

Acronym Description

AQL acceptable quality level

PIN P-type, intrinsic, N-type

SMD surface-mounted device

S4 special inspection level 4

10 Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAP64-05W v.3.2 20190201 Product data sheet - BAP64-05W v.3.1

Modifications •changed condition for reverse current for VR from 100 V to 60 V

BAP64-05W v.3.1 20181211 Product data sheet - BAP64-05W v.3

Modifications •adapted marking code

BAP64-05W v.3 20180713 Product data sheet - BAP64-05W v.2

Modifications •changed IRconditions at characteristics

•adapted the layout of the data sheet

BAP64-05W v.2 20150428 Product data sheet - BAP64-05W v.1

Modifications •The format of this data sheet has been redesigned to comply with the new identity guidelines

of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•AEC-Q101 qualified

BAP64-05W v.1 (9397

750 07192)

20000713 Product specification - -

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

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11 Legal information

11.1 Data sheet status

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product

development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

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internal review and subject to formal approval, which may result in

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Applications — Applications that are described herein for any of these

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no representation or warranty that such applications will be suitable

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accepts no liability for any assistance with applications or customer product

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respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

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products are sold subject to the general terms and conditions of commercial

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Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

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safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

NXP Semiconductors BAP64-05W

Silicon PIN diode

Product data sheet Rev. 3.2 — 1 February 2019

10 / 11

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

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11.4 Trademarks

Notice: All referenced brands, product names, service names and

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NXP Semiconductors BAP64-05W

Silicon PIN diode

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 February 2019

Document identifier: BAP64-05W

Contents

1 Product profile .................................................... 1

1.1 General description ............................................1

1.2 Features and benefits ........................................1

1.3 Applications ........................................................1

2 Pinning information ............................................ 2

3 Ordering information .......................................... 2

4 Marking .................................................................2

5 Limiting values ....................................................2

6 Thermal characteristics ......................................3

7 Characteristics .................................................... 4

7.1 Graphical data ................................................... 5

8 Package outline ...................................................7

9 Abbreviations ...................................................... 8

10 Revision history .................................................. 8

11 Legal information ................................................ 9