MF-NSML200/12-2 - BOURNS - Datasheet.Live

MF-NSML/X Series - Low Ohmic PTC Resettable Fuses

* RoHS Directive 2015/863, Mar 31, 2015 and Annex.

** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)

and Chlorine (Cl) content is 1500 ppm or less.

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

Electrical Characteristics

Model V max.

Volts

I max.

Amps

Ihold Itrip Resistance Max. Time

To Trip

Tripped

Power

Dissipation

Amperes

at 23 °C

Ohms

at 23 °C

Amperes

at 23 °C

Seconds

at 23 °C

Watts

at 23 °C

Hold Trip RMin. R1Max. Typ.

MF-NSML150/12 12 50 1.50 3.00 0.010 0.065 8.00 5.00 1.00

MF-NSML175/12 12 50 1.75 3.50 0.006 0.050 8.00 5.00 1.00

MF-NSML200/12 12 50 2.00 4.00 0.005 0.040 8.00 5.00 1.00

MF-NSML260/12 12 50 2.60 5.20 0.004 0.030 8.00 5.00 1.00

MF-NSML300/12 12 50 3.00 6.00 0.003 0.024 8.00 5.00 1.00

MF-NSML350/12 12 50 3.50 7.00 0.002 0.022 8.00 5.00 1.00

MF-NSML380/12 12 50 3.80 7.60 0.002 0.020 8.00 5.00 1.00

MF-NSML400/12 12 50 4.00 8.00 0.002 0.018 10.0 5.00 1.00

MF-NSML450/12 12 50 4.50 9.00 0.002 0.014 22.5 2.00 1.00

Environmental Characteristics

Operating Temperature ......................................... -40 °C to +85 °C

Storage Condition

Before Opening ............................................... +40 °C max. / 70 % RH max.

After Opening................................................... +40 °C max. / 10 % RH max.

Floor Condition After Opening .............................. Consumption within 4 weeks at oor condition +30 °C max. / 60 % RH max.

Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±10 % typical resistance change

Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change

Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±30 % typical resistance change

Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change (marking still legible)

Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change (Rmin<R<R1max)

Condition A

Moisture Sensitivity Level (MSL) .......................... See Note

ESD Classication - HBM ..................................... 6

Test Procedures and Requirements

Test Test Conditions Accept/Reject Criteria

Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description

Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max

Time to Trip ........................................................... At specied current, Vmax, 23 °C ......................... T ≤ max. time to trip (seconds)

Hold Current ......................................................... 30 min. at Ihold ...................................................... No trip

Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles.......................................... No arcing or burning

Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning

Solderability .......................................................... 245 °C ±5 °C, 5 seconds ...................................... 95 % min. coverage

cUL File Number ................................................... E174545

TÜV Certicate Number ....................................... R 50391579

Features

n Surface mount packaging for automated

assembly

n Small footprint size (1206) and low proﬁle

for space-constrained mobile applications

n Ultra-low resistance

n Utilizes innovative freeXpansion™ design

n RoHS compliant* and halogen free**

n Agency recognition:

Applications

n Thermal protection for Li-ion & polymer

battery packs

n Power delivery port protection

n USB port protection

n PC motherboards - Plug & Play protection

n Mobile phones - Battery & charging

protection

n Game console port protection

WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov

MF-NSMF Series - PTC Resettable Fuses

Product Dimensions

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

MF-NSML/X Series - Low Ohmic PTC Resettable Fuses

DIMENSIONS: MM

(INCHES)

Terminal material:

ENIG-plated terminals

Recommended Pad Layout

1.6 ± 0.1

(.063 ± .004)

2.0 ± 0.1

(.079 ± .004)

1.0 ± 0.05

(.039 ± .002)

1.0 ± 0.05

(.039 ± .002)

Bottom View

D E

Top View

Side View

Thermal Derating Table - Ihold (Amps)

Model Ambient Operating Temperature

-40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C

MF-NSML150/12 2.20 2.00 1.77 1.50 1.28 1.15 1.07 0.85 0.70

MF-NSML175/12 2.57 2.33 2.07 1.75 1.49 1.34 1.24 1.00 0.80

MF-NSML200/12 2.94 2.65 2.35 2.00 1.70 1.53 1.42 1.14 0.93

MF-NSML260/12 3.82 3.46 3.07 2.60 2.21 1.95 1.85 1.48 1.20

MF-NSML300/12 4.41 3.99 3.54 3.00 2.55 2.32 2.13 1.71 1.38

MF-NSML350/12 5.25 4.66 4.13 3.50 2.98 2.71 2.49 2.00 1.65

MF-NSML380/12 5.59 5.05 4.48 3.80 3.23 2.95 2.60 2.15 1.75

MF-NSML400/12 5.80 5.25 4.65 4.00 3.40 3.10 2.65 2.20 1.80

MF-NSML450/12 6.10 5.40 4.70 4.50 3.60 3.15 2.70 2.25 1.85

MF-NSML150/12~MF-NSML260/12 = 5000 pcs. per reel

MF-NSML300/12~MF-NSML450/12 = 3500 pcs. per reel

Model A B C D E

Min. Max. Min. Max. Min. Max. Min. Min. Max.

MF-NSML150/12

MF-NSML175/12

MF-NSML200/12

3.00

(0.118)

3.50

(0.138)

1.40

(0.055)

1.80

(0.071)

0.40

(0.016)

0.70

(0.028)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-NSML260/12 3.00

(0.118)

3.50

(0.138)

1.40

(0.055)

1.80

(0.071)

0.40

(0.016)

1.00

(0.039)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-NSML300/12

MF-NSML350/12

3.00

(0.118)

3.50

(0.138)

1.40

(0.055)

1.80

(0.071)

0.40

(0.016)

1.40

(0.055)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

MF-NSML380/12

MF-NSML400/12

MF-NSML450/12

3.00

(0.118)

3.50

(0.138)

1.40

(0.055)

1.80

(0.071)

0.60

(0.024)

1.40

(0.055)

0.25

(0.010)

0.05

(0.002)

0.45

(0.018)

Prole Feature Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max.

PREHEAT:

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

Time (Tsmin to Tsmax) (ts)

150 °C

200 °C

60~180 seconds

TIME MAINTAINED ABOVE:

Temperature (TL)

Time (tL)

217 °C

60~150 seconds

Peak Temperature (Tp) 260 °C

Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds

Ramp-Down Rate 6 °C / second max.

Time 25 °C to Peak Temperature 8 minutes max.

Packaging Quantity

3312 - 2 mm SMD Trimming Potentiometer

DIMENSIONS: MM

(INCHES)

MF-NSML/X SERIES, REV. A, 01/19

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

MF-NSML/X Series - Low Ohmic PTC Resettable Fuses

Typical Part Marking

Represents total content. Layout may vary.

Solder Reow Recommendations

Notes:

• MF-NSML/X models cannot be wave soldered or hand soldered.

Please contact Bourns for soldering recommendations.

• All temperatures refer to topside of the package, measured on the

package body surface.

• If reow temperatures exceed the recommended prole, devices may

not meet the published specications.

• Compatible with Pb and Pb-free solder reow proles.

• Excess solder may cause a short circuit, especially during hand

soldering. Please refer to the Multifuse® Polymer PTC Soldering

Recommendation guidelines.

• Designed for single solder reow operations.

Asia-Pacic:

Tel: +886-2 2562-4117

Email: asiacus@bourns.com

Europe:

Tel: +36 88 520 390

Email: eurocus@bourns.com

The Americas:

Tel: +1-951 781-5500

Email: americus@bourns.com

www.bourns.com

How to Order

MF - NSML 380 / 12 - 2

Multifuse® Product

Designator

Series

NSML = 1206 Low Ohmic

Surface Mount Component

Hold Current, Ihold

150 - 450 (1.50 Amps - 4.50 Amps)

Maximum Voltage, Vmax

12 = 12 Volts

Packaging

-2 = Tape and Reel

Packaged per EIA 481

PART IDENTIFICATION:

MF-NSML150/12 = G12

MF-NSML175/12 = H12

MF-NSML200/12 = J12

MF-NSML260/12 = N12

MF-NSML300/12 = P12

MF-NSML350/12 = S12

MF-NSML380/12 = V12

MF-NSML400/12 = U12

MF-NSML450/12 = X12

MANUFACTURING DATE CODE IS

LOCATED ON PACKING LABEL.

V12

Temperature of Lead/Pad Junction

Process Materials Temperature Time

Description Interval

1. Apply solder paste to • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature

test board (8 - 10 mil thick) Alloy water soluble or no

clean solder paste

(see note 1)

• single sided epoxy glass

(G10) (UL approved)

•PC board approx. 4x4x.06 in.

2. Place test units onto board 6 units/board

3. Ramp up Convection oven (see note 2) 2.5 °C ± 0.5 °/sec.

4. Preheat (TS.ces 03 ± 09C° 091 ot C° 051)

5. Time above liquidus (TL.ces 09-06C° 022)

6. Peak temperature (TP° 5-/° 0+ C° 052)

10-20 sec. within

5 °C of peak

.ces/C° 5.0 ± C° 3erutarepmet mooRnwod pmaR.7

(see note 2)

8. Cleaning water clean profile High pressure deionized 72 °F to 160 °F As required

water 65 PSI max. (22 °C to 71 °C)

Inspect solder joint to determine if solder joint is

acceptable (i.e. exhibits wetting of joint’s surface).

Use the following criteria (ref. acceptability of printed

board assemblies, IPC-A-610):

A) Acceptable (see Figure 1)

(1) The solder connection wetting angle (solder to

component and solder to PCB termination)

does not exceed 90 °.

(2) Solder balls that do not violate minimum

electrical clearances and are attached

(soldered) to a metal surface.

B) Unacceptable (see Figure 2)

(1) Solder connection wetting angle exceeding

90 °.

(2) Incomplete reflow of solder paste.

(3) Dewetting.

If unacceptable, determine cause and correct prior to

next run.

NOTES:

1. Water soluble solder paste only above 100K.

2. Refer to ref. temperature profile. Temperature at

lead/pad junction with “K” type thermocouple.

3. Units that are board mounted for environmental

testing must see a peak temperature in the reflow

zone, as specified. This is to ensure that all test

units will see “worst case conditions”.

4. Ramp down rate to be measured from 245 °C to

150 °C.

5. Process Description 8 does not apply to open

frame trimmers.

(Derived using 6-zone Convection Oven)

TTO

RAMP-UP L

TMAX.

T MIN.

PREHEAT

Temperature

Time

CRITICAL ZONE

RAMP-DOWN

t 25 *C TO PEAK

Prole Feature Pb-Free Assembly

Average Ramp-Up Rate (Tsmax to Tp) 3 °C / second max.

PREHEAT:

Temperature Min. (Tsmin)

Temperature Max. (Tsmax)

Time (Tsmin to Tsmax) (ts)

150 °C

200 °C

60~180 seconds

TIME MAINTAINED ABOVE:

Temperature (TL)

Time (tL)

217 °C

60~150 seconds

Peak Temperature (Tp)260 °C

Time within 5 °C of Actual Peak Temperature (tp) 20~40 seconds

Ramp-Down Rate 6 °C / second max.

Time 25 °C to Peak Temperature 8 minutes max.

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

N(HUB DIA.)

(MEASURED

AT HUB)

COVER

TAPE

T1A0

(MEASURED

AT HUB)

D0P2

DIMENSIONS: MM

(INCHES)

DIMENSIONS: MM

(INCHES)

MF-NSML/X Series

Tape Dimensions per EIA 481

W 12.0 ± 0.30

(0.472 ± 0.012)

P0 4.0 ± 0.10

(0.157 ± 0.004)

P1 4.0 ± 0.10

(0.157 ± 0.004)

P2 2.0 ± 0.05

(0.079 ± 0.002)

A0 1.90 ± 0.10

(0.075 ± 0.004)

B0 3.50 ± 0.10

(0.138 ± 0.004)

B1 max. 4.5

(0.177)

D0 1.5 + 0.10/-0.0

(0.059 + 0.004/-0)

F 5.5 ± 0.05

(0.216 + 0.002)

E1 1.75 ± 0.10

(0.069 ± 0.004)

E2 typ. 10.25

(0.404)

T max. 0.6

(0.024)

T1 max. 0.1

(0.004)

K0 (MF-NSML150/12~MF-NSML260/12) 0.65 ± 0.10

(0.026 ± 0.004)

K0 (MF-NSML300/12~MF-NSML450/12) 1.10 ± 0.10

(0.043 ± 0.004)

Leader min. 390

(15.35)

Trailer min. 160

(6.30)

Reel Dimensions

A max. 185

(7.283)

N min. 50

(1.97)

W1 12.4 + 1/-0

(0.488 + 0.039/-0)

W2 max. 15.4

(0.606)

MF-NSML/X Series Tape and Reel Specications

3312 - 2 mm SMD Trimming Potentiometer

Application Notice

MFAN 12/18

Speciﬁcations are subject to change without notice.

Users should verify actual device performance in their speciﬁc applications.

The products described herein and this document are subject to speciﬁc legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.

Bourns® Multifuse® PPTC Resettable Fuses

• Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s

application, including the PPTC device characteristics stated in the applicable data sheet.

• Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such

maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or re. Circuits with

inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated

within the user’s application during the PTC selection and qualication process.

• Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature

conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions

are expected to be repetitive or prolonged.

• In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC

device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to

accommodate such thermal expansion. Rigid potting materials or xed housings or coverings that do not provide adequate

clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC

devices if the thermal expansion is inhibited.

• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may

adversely affect the performance of polymer PTC devices.

• Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating,

potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene,

which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be

thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect

on the device.

• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data

sheet and on the Multifuse® Polymer PTC Moisture/Reow Sensitivity Classication (MSL) note:

https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf

Legal Disclaimer Notice

This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and

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The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and

statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical

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the user’s sole risk.

'$42$ -#+$5$+.%3$23(-& //+(" !+$3..41-2® custom products shall be negotiated on a case-by-case basis by Bourns

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also apply to such Bourns® custom products.

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exported or re-exported to countries subject to international sanctions or embargoes. Bourns® products may not, without

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