WS512K32N-35G2TM - White Microelectronics

1White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

WS512K32-XXX

512Kx32 SRAM MODULE, SMD 5962-94611

FEATURES

nAccess Times of 15*, 17, 20, 25, 35, 45, 55ns

nPackaging

 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP

(Package 400).

 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140")

(Package 502)1, Package to be developed.

 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880") square

(Package 509) 4.57mm (0.180") height.

Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).

 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square

(Package 519) 3.57mm (0.140") height.

Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3).

 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square

(Package 524) 4.06mm (0.160") height.

nOrganized as 512Kx32, User Configurable as 1Mx16 or 2Mx8

FIG. 1 PIN CONFIGURATION FOR WS512K32N-XH1X

PIN DESCRIPTION

I/O0-31 Data Inputs/Outputs

A0-18 Address Inputs

WE1-4 Write Enables

CS1-4 Chip Selects

OE Output Enable

VCC Power Supply

GND Ground

NC Not Connected

TOP VIEW

BLOCK DIAGRAM

nCommercial, Industrial and Military Temperature Ranges

nTTL Compatible Inputs and Outputs

n5 Volt Power Supply

nLow Power CMOS

nBuilt-in Decoupling Caps and Multiple Ground Pins for Low

Noise Operation

nWeight

WS512K32-XH1X - 13 grams typical

WS512K32-XG2TX1 - 8 grams typical

WS512K32-XG1UX - 5 grams typical

WS512K32-XG1TX - 5 grams typical

WS512K32-XG4TX1 - 20 grams typical

* 15ns Access Time available only in Commercial and Industrial Temperature.

This speed is not fully characterized and is subject to change without notice.

Note 1: Package Not Recommended For New Design

November 2001 Rev. 9

WS512K32-XXX

White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

PIN DESCRIPTION

FIG. 2 PIN CONFIGURATION FOR WS512K32-XG4TX1

TOP VIEW

BLOCK DIAGRAM

I/O0-31 Data Inputs/Outputs

A0-18 Address Inputs

WE Write Enables

CS1-4 Chip Selects

OE Output Enable

VCC Power Supply

GND Ground

NC Not Connected

FIG. 3 PIN CONFIGURATION FOR WS512K32-XG2TX1, WS512K32-XG1TX

AND WS512K32-XG1UX

TOP VIEW

The White 68 lead CQFP fills

the same fit and function as the

JEDEC 68 lead CQFJ or 68

PLCC. But the CQFJ has the

TCE and lead inspection

advantage of the CQFP form.

PIN DESCRIPTION

BLOCK DIAGRAM

I/O0-31 Data Inputs/Outputs

A0-18 Address Inputs

WE1-4 Write Enables

CS1-4 Chip Selects

OE Output Enable

VCC Power Supply

GND Ground

NC Not Connected

Note 1: Package Not Recommended For New Design

3White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

WS512K32-XXX

Parameter Symbol Min Max Unit

Operating Temperature TA-55 +125 °C

Storage Temperature TSTG -65 +150 °C

Signal Voltage Relative to GND VG-0.5 Vcc+0.5 V

Junction Temperature TJ150 °C

Supply Voltage VCC -0.5 7.0 V

TRUTH TABLE

RECOMMENDED OPERATING CONDITIONS

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Min Max Unit

Supply Voltage VCC 4.5 5.5 V

Input High Voltage VIH 2.2 VCC + 0.3 V

Input Low Voltage VIL -0.5 +0.8 V

Operating Temp (Mil) TA-55 +125 °C

CAPACITANCE

(TA = +25°C)

Parameter

Symbol

Conditions Max Unit

OE capacitance COE

= 0 V, f = 1.0 MHz

50 pF

WE1-4 capacitance CWE

= 0 V, f = 1.0 MHz

HIP (PGA) 20

CQFP G4T 5 0

CQFP G2T/G1U/G1T 20

CS1-4 capacitance CCS

= 0 V, f = 1.0 MHz

20 pF

Data I/O capacitance CI/O

I/O

= 0 V, f = 1.0 MHz

20 pF

Address input capacitance CAD

= 0 V, f = 1.0 MHz

50 pF

This parameter is guaranteed by design but not tested.

Parameter Symbol Conditions Units

Min Max

Input Leakage Current ILI VCC = 5.5, VIN = GND to VCC 10 µA

Output Leakage Current ILO CS = VIH, OE = VIH, VOUT = GND to VCC 10 µA

Operating Supply Current x 32 Mode ICC x 32 CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 660 mA

Standby Current ISB CS = VIH, OE = VIH, f = 5MHz, Vcc = 5.5 80 mA

Output Low Voltage VOL IOL = 8mA for 15 - 35ns, 0.4 V

IOL = 2.1mA for 45 - 55ns, Vcc = 4.5

Output High Voltage VOH IOH = -4.0mA for 15 - 35ns, 2.4 V

IOH = -1.0mA for 45 - 55ns, Vcc = 4.5

NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V

DC CHARACTERISTICS

(VCC

= 5.0V, VSS = 0V, TA = -55°C to +125°C)

DATA RETENTION CHARACTERISTICS

(TA = -55°C to +125°C)

Parameter Symbol Conditions Units

Min Max

Data Retention Supply Voltage VDR CS £ VCC -0.2V 2.0 5.5 V

Data Retention Current ICCDR1 VCC = 3V 28 mA

Low Power Data Retention ICCDR2 VCC = 3V 16 mA

Current (WS512K32L-XXX)

CS OE WE Mode Data I/O Power

H X X Standby High Z Standby

L L H Read Data Out Active

L H H Out Disable High Z Active

L X L Write Data In Active

WS512K32-XXX

White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

AC CHARACTERISTICS

(VCC

= 5.0V, VSS = 0V, TA

= -55°C to +125°C)

FIG. 4

AC TEST CIRCUIT

NOTES:

VZ is programmable from -2V to +7V.

IOL & IOH programmable from 0 to 16mA.

Tester Impedance Z0 = 75 ý.

VZ is typically the midpoint of VOH and VOL.

IOL & IOH are adjusted to simulate a typical resistive load circuit.

ATE tester includes jig capacitance.

AC CHARACTERISTICS

(VCC

= 5.0V, VSS = 0V, TA

= -55°C to +125°C)

AC TEST CONDITIONS

Parameter Typ Unit

Input Pulse Levels VIL = 0, VIH = 3.0 V

Input Rise and Fall 5 ns

Input and Output Reference Level 1.5 V

Output Timing Reference Level 1.5 V

Parameter Symbol -15* -17 -20 -25 -35 -45 -55 Units

Write Cycle Min Max Min Max Min Max Min Max Min Max Min Max Min Max

Write Cycle Time tWC 15 17 20 25 35 45 55 ns

Chip Select to End of Write tCW 13 15 15 17 25 35 50 ns

Address Valid to End of Write tAW 13 15 15 17 25 35 50 ns

Data Valid to End of Write tDW 10 11 12 13 20 25 25 ns

Write Pulse Width tWP 13 15 15 17 25 35 40 ns

Address Setup Time tAS 22222 22ns

Address Hold Time tAH 00000 55ns

Output Active from End of Write tOW122344 55ns

Write Enable to Output in High Z tWHZ18 9 11 13 15 20 20 ns

Data Hold Time tDH 00000 00ns

* 15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice.

1. This parameter is guaranteed by design but not tested.

2. The Address Setup Time of minimum 2ns is for the G2T, G1U and H1 packages. tAS minimum for the G4T package is 0ns.

Parameter Symbol -15* -17 -20 -25 -35 -45 -55 Units

Read Cycle Min Max Min Max Min Max Min Max Min Max Min Max Min Max

Read Cycle Time tRC 15 17 20 25 35 45 55 ns

Address Access Time tAA 15 17 20 25 35 45 55 ns

Output Hold from Address Change tOH 0000000ns

Chip Select Access Time tACS 15 17 20 25 35 45 55 ns

Output Enable to Output Valid tOE 8 9 10 12 25 25 25 ns

Chip Select to Output in Low Z tCLZ12222444ns

Output Enable to Output in Low Z tOLZ10000000ns

Chip Disable to Output in High Z tCHZ112 12 12 12 15 20 20 ns

Output Disable to Output in High Z tOHZ112 12 12 12 15 20 20 ns

* 15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice.

1. This parameter is guaranteed by design but not tested.

5White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

WS512K32-XXX

WS32K32-XHX

FIG. 5

TIMING WAVEFORM - READ CYCLE

FIG. 7

WRITE CYCLE - CS CONTROLLED

FIG. 6

WRITE CYCLE - WE CONTROLLED

WS512K32-XXX

White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1

PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

Note 1: Package Not Recommended For New Design

7White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

WS512K32-XXX

PACKAGE 509: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2T)1

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

The White 68 lead G2T CQFP

fills the same fit and function as

the JEDEC 68 lead CQFJ or 68

PLCC. But the G2T has the TCE

and lead inspection advantage

of the CQFP form.

Note 1: Package Not Recommended For New Design

WS512K32-XXX

White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

PACKAGE 519: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G1U)

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

The White 68 lead G1U CQFP

fills the same fit and function as

the JEDEC 68 lead CQFJ or 68

PLCC. But the G1U has the TCE

and lead inspection advantage

of the CQFP form.

9White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

WS512K32-XXX

PACKAGE 524: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G1T)

ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES

The White 68 lead G1T CQFP

fills the same fit and function as

the JEDEC 68 lead CQFJ or 68

PLCC. But the G1T has the TCE

and lead inspection advantage

of the CQFP form.

WS512K32-XXX

White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

ORDERING INFORMATION

LEAD FINISH:

Blank = Gold plated leads

A = Solder dip leads

DEVICE GRADE:

Q = MIL-STD-883 Compliant

M = Military Screened -55°C to +125°C

I = Industrial -40°C to 85°C

C = Commercial 0°C to +70°C

PACKAGE TYPE:

H1 = Ceramic Hex-In-line Package, HIP (Package 400)

G2T1 = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)

G4T1 = 40mm Low Profile CQFP (Package 502)

G1U = 23.9mm Low Profile CQFP (Package 519)

G1T = 23.9mm Low Profile CQFP (Package 524)

ACCESS TIME (ns)

IMPROVEMENT MARK:

Blank = Standard Power

N = No Connect at pin 21 and 39 in HIP for Upgrades

L = Low Power Data Retention

ORGANIZATION, 512Kx32

User configurable as 1Mx16 or 2Mx8

SRAM

WHITE ELECTRONIC DESIGNS CORP.

W S 512K 32 X - XXX X X X

Note 1: Package Not Recommended For New Design

11 White Electronic Designs Corporation  (602) 437-1520  www.whiteedc.com

WS512K32-XXX

DEVICE TYPE SPEED PACKAGE SMD NO.

512K x 32 SRAM Module 55ns 66 pin HIP (H1) 5962-94611 05HTX

512K x 32 SRAM Module 45ns 66 pin HIP (H1) 5962-94611 06HTX

512K x 32 SRAM Module 35ns 66 pin HIP (H1) 5962-94611 07HTX

512K x 32 SRAM Module 25ns 66 pin HIP (H1) 5962-94611 08HTX

512K x 32 SRAM Module 20ns 66 pin HIP (H1) 5962-94611 09HTX

512K x 32 SRAM Module 17ns 66 pin HIP (H1) 5962-94611 10HTX

512K x 32 SRAM Module 55ns 68 lead CQFP Low Profile (G4T)15962-94611 05HYX

512K x 32 SRAM Module 45ns 68 lead CQFP Low Profile (G4T)15962-94611 06HYX

512K x 32 SRAM Module 35ns 68 lead CQFP Low Profile (G4T)15962-94611 07HYX

512K x 32 SRAM Module 25ns 68 lead CQFP Low Profile (G4T)15962-94611 08HYX

512K x 32 SRAM Module 20ns 68 lead CQFP Low Profile (G4T)15962-94611 09HYX

512K x 32 SRAM Module 17ns 68 lead CQFP Low Profile (G4T)15962-94611 10HYX

512K x 32 SRAM Module 55ns 68 lead CQFP (G2T)15962-94611 05HMX

512K x 32 SRAM Module 45ns 68 lead CQFP (G2T)15962-94611 06HMX

512K x 32 SRAM Module 35ns 68 lead CQFP (G2T)15962-94611 07HMX

512K x 32 SRAM Module 25ns 68 lead CQFP (G2T)15962-94611 08HMX

512K x 32 SRAM Module 20ns 68 lead CQFP (G2T)15962-94611 09HMX

512K x 32 SRAM Module 17ns 68 lead CQFP (G2T)15962-94611 10HMX

512K x 32 SRAM Module 55ns 68 lead CQFP (G1U) 5962-94611 05H9X

512K x 32 SRAM Module 45ns 68 lead CQFP (G1U) 5962-94611 06H9X

512K x 32 SRAM Module 35ns 68 lead CQFP (G1U) 5962-94611 07H9X

512K x 32 SRAM Module 25ns 68 lead CQFP (G1U) 5962-94611 08H9X

512K x 32 SRAM Module 20ns 68 lead CQFP (G1U) 5962-94611 09H9X

512K x 32 SRAM Module 17ns 68 lead CQFP (G1U) 5962-94611 10H9X

Note 1: Package Not Recommended For New Design