1995 Microchip Technology Inc. DS30015M-page 125
PIC16C5X
INDEX
A
Absolute Maximum Ratings ...............................................57
ALU ...................................................................................... 7
Applications ..........................................................................3
Architectural Overview .........................................................7
Assembler .......................................................................... 54
B
Block Diagram
On-Chip Reset Circuit ................................................31
PIC16C5X Series .........................................................8
Timer0 ........................................................................23
TMR0/WDT Prescaler ................................................26
Watchdog Timer .........................................................35
Brown-Out Protection Circuit .............................................36
C
C Compiler (MP-C) ......................................................51, 55
Carry ....................................................................................7
Clocking Scheme ...............................................................11
Code Protection ...........................................................27, 37
Configuration Bits ...............................................................27
Configuration Word
PIC16C54/CR54/C55/C56/C57 .................................27
D
DC Characteristics .....................................59, 60, 61, 62, 63
Development Support ........................................................51
Development Systems .......................................................55
Development Tools ............................................................51
Device Drawings
18-Lead Ceramic Dual In-Line (CERDIP)
with Window - 300 mil ..............................................111
18-Lead Plastic Dual In-Line (PDIP) - 300 mil .........104
18-Lead Plastic Surface Mount (SOIC) - 300 mil .....107
20-Lead Plastic Surface Mount (SSOP) - 209 mil ....109
28-Lead Ceramic CERDIP Dual In-line
with Window (300 mil)) .............................................112
28-Lead Ceramic Dual In-Line (CERDIP)
with Window - 600 mil ..............................................113
28-Lead Plastic Dual In-Line (PDIP) - 300 mil .........105
28-Lead Plastic Dual In-Line (PDIP) - 600 mil .........106
28-Lead Plastic Surface Mount (SOIC) - 300 mil .....108
28-Lead Plastic Surface Mount (SSOP) - 209 mil ....110
Device Varieties ...................................................................5
Digit Carry ............................................................................7
Dynamic Data Exchange (DDE) ........................................51
E
Electrical Characteristics ....................................................57
External Power-On Reset Circuit .......................................32
F
Family of Devices .................................................................4
PIC16C5X ................................................................117
PIC17CXX ................................................................122
Features ...............................................................................1
FSR ..............................................................................20, 31
Fuzzy Logic Dev. System (
fuzzy
TECH
-MP) .............51, 55
I
I/O Interfacing .................................................................... 21
I/O Ports ............................................................................ 21
I/O Programming Considerations ...................................... 22
ID Locations ....................................................................... 37
ID locations ........................................................................ 27
INDF ............................................................................ 20, 31
Indirect Data Addressing ................................................... 20
Instruction Cycle ................................................................ 11
Instruction Flow/Pipelining ................................................. 11
Instruction Set Summary ................................................... 40
Integrated .......................................................................... 54
L
Loading of PC .................................................................... 18
Loading of PC Branch Instructions .................................... 18
M
MCLR ................................................................................ 31
Memory Organization ........................................................ 13
Data Memory ............................................................. 13
Program Memory ....................................................... 13
MPASM Assembler ..................................................... 51, 54
MP-C C Compiler .............................................................. 55
MPSIM Software Simulator ......................................... 51, 55
O
One-Time-Programmable (OTP) Devices ............................5
OPTION Register .............................................................. 17
OSC selection .................................................................... 27
Oscillator Configurations ................................................... 28
Oscillator Types
HS .............................................................................. 28
LP .............................................................................. 28
RC ............................................................................. 28
XT .............................................................................. 28
P
Packaging Information ..................................................... 101
PCL .................................................................................... 31
PIC16C5X DC and AC Characteristics .............................. 71
PICDEM-1 Low-Cost PIC16/17 Demo Board .............. 51, 53
PICDEM-2 Low-Cost PIC16CXX Demo Board ............ 51, 53
PICMASTER Probes ......................................................... 52
PICMASTER System Configuration .................................. 51
PICMASTER
RT In-Circuit Emulator .............................. 51
PICSTART
Low-Cost Development System ............. 51, 53
Pin Compatible Devices .................................................. 123
Pinout Description ......................................................... 9, 10
POROscillator Start-Up Timer (OST) .................... 27, 32, 34
PD ........................................................................ 30, 36
Power-On Reset (POR) ................................. 27, 31, 32
TO ........................................................................ 30, 36
PORTA ........................................................................ 21, 31
PORTB ........................................................................ 21, 31
PORTC ........................................................................ 21, 31
Power-Down Mode ............................................................ 37
Prescaler ........................................................................... 26
PRO MATE
Universal Programmer .......................... 51, 53
Q
Quick-Turnaround-Production (QTP) Devices ......................5
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