108116674 - Agere Systems, Inc.

Preliminary Data Sheet

June 1998

A2300-Type Analog Integrated

DFB Laser Module with Predistortion

■

Features

■

High-performance, multiquantum-well (MQW),

distributed-feedback (DFB), semiconductor laser.

■

14-pin, hermetic, butterﬂy-type package provides

internal isolation and thermoelectric cooling/

heating functions.

■

Stable, accurate, PIN photodetector for laser back-

facet optical output power monitoring/control.

■

Operation at the low dispersion, 1310 nm

wavelength.

■

Stable performance over the wide temperature

range of –20

C to +65

■

Multiple product options available:

— 77/110 NTSC or 42 CENELEC test channel

— Simulated system testing available in a variety

of ﬁber link budget losses.

■

Superior signal quality and system performance

compared to present coaxial-based analog

systems.

■

Only positive supply voltages required.

■

Input return loss >16 dB.

■

Wide, 1.5 dB bandwidth: 50 MHz—860 MHz.

Applications

■

Video surveillance

■

CATV

■

Wireless/personal communications networks and

systems

The Integrated DFB Laser Module with Predistortion provides

superior performance in analog transmission systems operat-

ing at 1310 nm wavelength.

22 Lucent Technologies Inc.

Preliminary Data Sheet

June 1998

DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Description

The Lucent Technologies Microelectronics Group

Optoelectronics unit is now offering a board-level

solution for 1310 nm, cooled, internally isolated,

directly modulated laser modules used in analog CATV

optical transmitter applications. Expertise in the design

and fabrication of analog laser modules for 1310 nm

transmission, as well as in the design of predistortion

circuits, allows Lucent to offer a broader range of

performance in a highly competitive market.

The new off ering features board-integrated functionality

as a standard product, which reduces the time,

resources, and e xpense typically required f or individual

component speciﬁcations, circuit designs, and

manufacturing.

The A2300-Type Analog Integ rated, DFB Laser Module

contains a high-performance, Indium-Gallium-

Arsenide-Phosphide, multiquantum-well, distributed-

f eedback laser chip designed for 1310 nm, single-mode

ﬁber-optic applications. A 14-pin, butterﬂy-type,

hermetic, metal/ceramic package houses the laser chip

as well as an integral thermoelectric cooling/heating

device, a thermistor, an integral optical isolator, and a

laser back-facet optical monitor. The module is also

equipped with a 900

Hytrel

* jacketed, 8.8

m core,

single-mode ﬁber.

The integral thermoelectric cooler (TEC) provides

stable thermal characteristics for the laser chip, as well

as the optical isolator and back-facet monitor . The TEC

allows for heating and cooling of these internal optical

components and can maintain their temperature at a

constant 25

C over the entire ambient operating

temperature range of –20

C to +65

C . The thermistor

monitors the internal module temperatures and

provides feedback control for the TEC. This gives the

A2300-Type Laser superior, stable optical

characteristics.

When used in a ﬁber-optic system, reﬂected light

entering the laser module is attenuated a minimum of

25 dB by the optical isolator. The internal PIN

photodiode monitors the optical power emitted from the

rear facet of the laser diode, and when used in

conjunction with e xterior module circuitry, it can monitor

and control the optical output power launched into the

ﬁber.

Lucent Technologies analog laser modules feature the

capability to have enhanced performance and value

through the addition of the Optoelectronics unit’s

exclusive predistortion circuit. The predistortion circuit

provides both CSO and CTB correction enhancements

to the laser module perf ormance, for 110 NTSC as w ell

as 42 CENELEC channels. While maintaining

extremely low electrical power dissipation and low

insertion loss, the predistortion circuit allows 860 MHz

of RF bandwidth.

Every A2300-type module is tested to meet the

customer’ s analog perf ormance speciﬁcations, ov er the

speciﬁed ﬁber link budget loss and test channel plan.

This measurement method ensures proper system

performance of the product. Lucent Technologies

Optoelectronics unit components and products are

qualiﬁed to the rigorous requirements of Bellcore

standards, ensuring that the optoelectronic

perf ormance will meet the needs of the application ov er

the lifetime of the product.

Hytrel

is a registered trademark of E.I. DuPont de Nemours and

Company.

Lucent Technologies Inc. 3

Preliminary Data Sheet

June 1998 DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Handling Precautions

The minimum ﬁber bend radius is 1.25 in. To avoid

degradation in performance, mount the module board

as follows:

Place the module on a ﬂat heat sink surface. The sur-

face ﬁnish should be better than 32

in. (0.8

m), and

the surface ﬂatness must be better than 0.001 in.

(25.4

m). The use of thermal conductive grease is

optional; however, thermal performance can be

improved if conductive grease is applied between the

heat sink surfaces.

Power Sequencing

Adopt the f ollo wing sequence for turn-on as a matter of

good practice to avoid the possibility of damage to the

laser module from power supply switching transients.

1. All ground connections.

2. Most negative supply.

3. Most positive supply.

4. All remaining connections.

Reverse the above order for the proper turn-off

sequence.

Electrostatic Discharge

CAUTION:This device is susceptible to dama ge as

a result of electrostatic discharge. Take

proper precautions during both

handling and testing. Follow guidelines

such as JEDEC Publication No. 108-A

(Dec. 1988).

Lucent employs a human-body model (HBM) for ESD-

susceptibility testing and protection-design evaluation.

ESD voltage thresholds are dependent on the critical

parameters used to deﬁne the model. A standard HBM

(resistance = 1.5 k

Ω

, capacitance = 100 pF) is widely

used and, therefore, can be used for comparison

purposes. The HBM ESD threshold presented here

was obtained using these circuit parameters:

Parameter Value Unit

Human-body Model 400 V

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are

absolute stress ratings only. Functional operation of the device is not implied at these or any other conditions in

excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for

extended periods can adversely affect device reliability.

* 2000 hours maximum.

Parameter Symbol Min Max Unit

Laser Reverse Voltage — — 2 V

Laser dc Forward Current — — 150 mA

Module Board dc Supply Voltage — 11.9 12.1 V

RF Modulation per Channel (75

Ω

) — — 0 dBm

Operating Temperature Range T

–20 65

Storage Case Temperature Range T

stg

–40 85*

4 Lucent Technologies Inc.

Preliminary Data Sheet

June 1998

DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Characteristics

Minimum and maximum v alues are testing requirements. Typical values are f or inf ormational purposes only and are

not part of the testing requirements. Each device is provided with recommended operating conditions to achieve

speciﬁed performance. T

= 25

C, unless noted otherwise. Module board supply voltage is +12 Vdc.

* The laser threshold current is the current at which the ﬁrst derivative of the laser light vs. forward current is at one-half of its maximum.

†The thermistor thermal characteristic will be monotonic.

Table 2. Optical Characteristics

Table 1. Electrical Characteristics

Parameter Symbol Test Conditions Min Typ Max Unit

Laser Forward Voltage V

At rated power — 1.3 1.8 V

Laser Operating Current I

— — 50 100 mA

Threshold Current I

* — 10 40 mA

Monitor Reverse-bias Voltage V

MON

—3—10V

Monitor Current I

MON

At I

0.2 — 2.0 mA

Monitor Dark Current I

= 0, V

MON

= 5 V — — 0.10

Thermistor Current I

— 10 — 100

Thermistor Resistance R

= 25

C, I

≤

0.1 mA 9.5 — 10.5 k

Ω

Thermistor Thermal

Characteristic

∆

–20

≤

†

— –4.4 — %/

Thermistor Temperature

Coefﬁcient B — 3700 3900 4100 K

TEC Current I

TEC

∆

T = 40

C — — 1.0 A

TEC Voltage V

TEC

∆

T = 40

C — — 1.8 V

TEC Cooling Capacity

∆

T—40——

Parameter Symbol Test Conditions Min Typ Max Unit

Optical Output Power P

— 3.0 — 20.0 mW

Center W av elength

— 1290 1310 1330 nm

Optical Isolation — –20

C to +65

C25——dB

Side-mode Suppression Ratio SMSR Modulated 30 — — dB

Lucent Technologies Inc. 5

Preliminary Data Sheet

June 1998 DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Pin Function Information

The electrical connector is a 10-pin type

Molex

* Part No. 22-01-310. The RF connector is a 75

Ω

female, SMB-

type

Molex

is a registered trademark of Molex, Inc.

† Pin 10 is marked on connector; connector type is unidirectional.

Table 3. Pin Descriptions

Pin Number Connection Function

1 Monitor-Photodiode Cathode +5 Vdc, 5 mA max.

2 Reference Ground Photodiode anode GND.

3 TE Cooler (+) Current into pin cools; 1.2 Adc max.

4 TE Cooler (–) Current into pin heats; 1.2 Adc max.

5 Thermistor 10 k

Ω

2% @ 25

C. T

of –4.4% per

C , Type B.

6 Laser Bias Laser requires a sink current into this pin, 100 mAdc max.

7 dc Circuit Bias +12 Vdc

5%; 225 mAdc max.; 100 mV

P-P

max. ripple.

8 No Connection NA

9 Power Ground GND return.

†

No Connection NA

6 Lucent Technologies Inc.

Preliminary Data Sheet

June 1998

DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Outline Diagrams

Dimensions are in inches.

Transmitter Assembly Board

1-954 (F)

BOTTOM VIEW

FEMALE, 75 Ω, SMB

THERMAL COMPOUND

APPLIED PRIOR

TOP VIEW

Molex

dc CONNECTOR

FIBER CONNECTOR

(SC-TYPE SHOWN)

TO MOUNTING

Lucent Technologies Inc. 7

Preliminary Data Sheet

June 1998 DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Outline Diagrams

(continued)

Dimensions are in inches.

Transmitter Assembly Board Dimensions, Top View

1. Plated heat sink mounting holes.

2. Unplated board mounting holes.

1-955 (F)

0.100

0.250

1.616

1.366

4.800

4.555

1.399

1.275

2.081

0.125 1.217

1.047

1.930

1.760

3.937

0.150 DIA.

7 PLCS. NOTE 1

R 0.032 TYP.

6 PLCS.

0.138 DIA.

NOTE 2

0.110 DIA.

NOTE 2

0.138 DIA.

NOTE 2

8 Lucent Technologies Inc.

Preliminary Data Sheet

June 1998

DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Outline Diagrams (continued)

Dimensions are in inches.

Laser Assembly Heat Sink

0.000

0.110

0.25

0.375

0.725

0.85

0.990

1.10

0.000

0.25

1.15

1.212

1.275

1.40

32 0.001

0.790

0.565

0.000

0.125

0.188

0.000

(1.10)

0.550

0.000

(1.40)

0.700

TAP #8-32 (Ø 0.164)

C-SINK (82°) TO Ø 0.200

0.005

1-953 (F)

Lucent Technologies Inc. 9

Preliminary Data Sheet

June 1998 DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Part Numbering for the A2300-Type Laser

A 2 3 0 0 R P M Field Description

Alpha character indicating product type

A = Analog

2 = Laser 2000

Wavelength indicator

3 = 1.3 µm typical devices

Link loss series and power range

00 → 5 dB link loss (00 through 09)

10 → 7 dB link loss (10 through 19)

20 → 9 dB link loss (20 through 29)

30 → 9 dB link loss; high power (30 through 39)

40 → 11 dB link loss (40 through 49)

50 → 11 dB link loss; high power (50 through 59)

60 → 13 dB link loss (60 through 69)

70 → 13 dB link loss; high power (70 through 79)

Alpha character indicating standard connector options

B = SC-APC; 2.15 m ± 0.2 m

R = FC-APC; 2.15 m ± 0.2 m

D = SC-PC; 2.15 m ± 0.2 m

Package type

P = Predistorted laser

Product conﬁguration

M = Integrated module board

10 Lucent Technologies Inc.

Preliminary Data Sheet

June 1998

DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Laser Safety Information

Class IIIb Laser Product

This product complies with 21 CFR 1040.10 and 1040.11.

Single-mode connector

Wavelength = 1.3 µm

Maximum power = 40 mW

Because of size constraints, laser safety labeling is not afﬁxed to the module but is contained on the shipping

carton.

Product is not shipped with power supply.

CAUTION: Use of controls, adjustments, and procedures other than those speciﬁed herein may result in

hazardous laser radiation exposure.

DANGER

INVISIBLE RADIATION IS EMITTED FROM THE END OF THE FIBER OR CONNECTOR.

AVOID DIRECT EXPOSURE TO THE BEAM.

DO NOT VIEW WITH OPTICAL INSTRUMENTS.

DANGER

INVISIBLE LASER RADIATION

AVOID DIRECT EXPOSURE TO BEAM.

Indium Gallium Arsenide Phosphide Laser

40 mW max. Output @ 1.3 µm

Class IIIb Laser Product

40 mW Max. Output @ 1.3 µm

Lucent Technologies Inc. 11

Preliminary Data Sheet

June 1998 DFB Laser Module with Predistortion

A2300-Type Analog Integrated

Ordering Information

Table 4. Analog Product Availability, Integrated Laser/Predistorter

* 7 dB is all ﬁber; NTSC: 11 dB and 13 dB include a minimum 9 dB of ﬁber loss; CENELEC: 11 dB and 13 dB include a minimum 7 dB of ﬁber

loss.

L2000 Part

Number Comcode Tested

Loss* Optical Power Channel

Capacity CNR

(dBc) CSO

(dBc) CTB

(dBc)

A2317DPM 108239294 7 dB 6 dBm—8 dBm 77 NTSC 52 –63 –68

A2318DPM 108239302 7 dB 6 dBm—8 dBm 110 NTSC 50 –63 –68

A2319DPM 108239310 7 dB 6 dBm—8 dBm 42 CENELEC 52 –63 –67

A2356DPM 108239328 11 dB 10 dBm—12 dBm 77 NTSC 52 –63 –68

A2359DPM 108239336 11 dB 10 dBm—12 dBm 110 NTSC 50 –63 –68

A2355BPM 108116641 11 dB >11 dBm 42 CENELEC 52 –63 –67

A2377DPM 108239344 13 dB >10 dBm 77 NTSC 52 –63 –68

A2378DPM 108239351 13 dB >10 dBm 110 NTSC 51 –63 –68

A2358BPM 108116674 13 dB >12 dBm 42 CENELEC 53 –63 –67

Preliminary Data Sheet

June 1998

DFB Laser Module with Predistortion

A2300-Type Analog Integrated

For additional information, contact your Microelectronics Group Account Manager or the following:

INTERNET: http://www.lucent.com/micro, or for Optoelectronics information, http://www.lucent.com/micro/opto

E-MAIL: docmaster@micro.lucent.com

N. AMERICA: Microelectronics Group, Lucent Technologies Inc., 555 Union Boulevard, Room 30L-15P-BA, Allentown, PA 18103

1-800-372-2447, FAX 610-712-4106 (In CANADA: 1-800-553-2448, FAX 610-712-4106)

ASIA PACIFIC: Microelectronics Group, Lucent Technologies Singapore Pte. Ltd., 77 Science Park Drive, #03-18 Cintech III, Singapore 118256

Tel. (65) 778 8833, FAX (65) 777 7495

CHINA: Microelectronics Group, Lucent Technologies (China) Co., Ltd., A-F2, 23/F, Zao Fong Universe Building, 1800 Zhong Shan Xi Road,

Shanghai 200233 P. R. China

Tel. (86) 21 6440 0468, ext. 316, FAX (86) 21 6440 0652

JAPAN: Microelectronics Group, Lucent Technologies Japan Ltd., 7-18, Higashi-Gotanda 2-chome, Shinagawa-ku, Tokyo 141, Japan

Tel. (81) 3 5421 1600, FAX (81) 3 5421 1700

EUROPE: Data Requests: MICROELECTRONICS GROUP DATALINE: Tel. (44) 1189 324 299, FAX (44) 1189 328 148

Technical Inquiries: OPTOELECTRONICS MARKETING: (44) 1344 865 900 (Bracknell UK)

Lucent Technologies Inc. reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or application. No

rights under any patent accompany the sale of any such product(s) or information.

Printed in U.S.A.

June 1998

DS98-211LWP Printed On

Recycled Paper