HIGH DENSITY Pin Grid Array Socket with Heat Sink Tabs PGHS Series High temp molded insulator body compatible with IR and vapor phase soldering Precision screw machine sockets for high reliability Ultra Low Force 6-finger contact HEAT SINK MICROPROCESSOR PGA SOCKET RN Part Heat Sink Description Vendor PGHS-179CH3-US-TG IERC Motorola 68040 Burbank, CA Materials: Performance Characteristics: Body: High temp, glass-filled Ultra Low Force black polyester Insertion Force: 1.7 ounces* max per contact Contact: Beryllium Copper Withdrawal Force: .35 ounces min per contact Shell: Half Hard Brass *using .018" diameter pin Capacitance: 1 picofarad minimum Acceptable Pin Sizes: Insulation Resistance: 5000 megohms minimum Diameter: .016" - 021" (41 - .53) Dielectric Withstanding Voltage: 1000 volts AC Length: .145" (3.68) Current Rating: 1 Ampere Flammability: UL 94V-0 Mounting Information: PCB Hole: Solder Tail .040" + .002" (1.01 +.05) 54 Temperature Range: -65C to + 125C Robinson Nugent, Inc.. @ 800 East Eighth St., New Albany, Indiana 47150 Plating Description: TG= 10 pinch (254 um) minimum Gold on contact area. 200 pinch (5.08 um) minimum Tin/Lead on terminal area. 50 pinch (7.27 um) minimum Nickel on underplate.Robinson Sockets _ NMugent ] How To Order PGHS Series PGHS 179 C H 3 US TG30 Number of Contacts L Plating Code: Specify TG, TG30 Loading Pattern Lead Style Body Specification: H= High Temp MOTOROLA 68040 LA | ry | | 7 DETAIL A PGHS-179CH3-US-TG (DETAIL A") FAX 812/945-0804 @ Phone 812/948-0564