ASMT-Mxx9
Moonstone® 1W Power LED Light Source
Data Sheet
Description
The Moonstone® 1W Power LED Light Source is a high
performance energy ecient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to the
motherboard.
It is available in various color temperatures ranging from
2600K to 10000K.
The package is compatible with reow soldering. To
facilitate easy pick and place assembly, the LEDs are also
available in EIA-compliant tape and reel.
The 1W Power LED light source can be mounted onto
metal core PCB enabling optimum heat dissipation and
ease of installation.
Features
x Available in Cool White & Warm White color
x Energy ecient
x Exposed pad for excellent heat transfer
x Suitable for reow soldering process
x High current operation
x Long operation life
x Wide viewing angle
x Silicone encapsulation
x Non-ESD sensitive (threshold >16kV)
x MSL 4 products
Applications
x Sign backlight, billboard illumination or backlight
x Exit sign or emergency sign lightings
x Commercial lightings
x Accent and marker lightings
x Pathway lighting
x Task lighting
x Reading lights
x Decorative lighting
x Garden lighting
x Architectural lighting
x Portable (ash light, bicycle head light)
2
Package Dimension for Moonstone®
Figure 1. Moonstone® package outline drawing.
Notes:
1. All dimensions in millimeters.
2. Tolerance is ±0.1 mm unless otherwise specied.
Package Dimension for Moonstone® on MCPCB
Figure 2. MCPCB I package outline drawing. Figure 3. MCPCB II package outline drawing.
∅ 3.00
∅ 5.00
24.00
2.30
1.30
4.60
19.00
4.00
16.00
20.00 14.00
2.50
1.40
R 1.60
∅ 19.00
60 °
19.90
3.00
3.30
4.90
1.60
Cathode
Anode1
2
3Heat Sink
Notes:
1. All dimensions in mm.
2. Tolerance = ±0.10mm unless otherwise specied.
3. Terminal nish: Ag plating.
4. Metal slug is connected to anode.
Metal Slug
Cathode
Anode1
2
3
10.00
8.50
3
12
8.50
Ø 5.26
Ø 8.00
5.080.81
2.00 5.25
1.30
10.60
1.27
3.30
Heat Sink
LED
ZENER
+
−
3
Part Numbering System
Note:
1. Please refer to Page 7 for selection details.
ASMT-M x x
1x
2x5x6
Packaging option
Color Bin Selection
Maximum -Flux Bin Selection
Minimum -Flux Bin Selection
Moonstone® Type
0 – Non-diffused
B – Diffused
A – Non-diffused on MCPCB I
C – Diffused on MCPCB I
K – Non-diffused on MCPCB II
L – Diffused on MCPCB II
Color
W – Cool White
Y – Warm White
9 – N x34
Device Selection Guide (Tj = 25qC) for Moonstone®
Part Number Color
Luminous Flux, ΦV [1,2] (lm)
Test Current
(mA)
Dice
Technology
Electrically
Isolated
Metal Slug Min. Typ. Max.
ASMT-MW09-NLM00 Cool White 73.0 90.0 124.0 350 InGaN No
ASMT-MW09-NMM00 95.0 100.0 124.0 350 InGaN No
ASMT-MY09-NKM00 Warm White 56.0 75.0 124.0 350 InGaN No
ASMT-MY09-NLM00 73.0 80.0 124.0 350 InGaN No
ASMT-MWB9-NLM00 Cool White
Diused
73.0 87.0 124.0 350 InGaN No
ASMT-MYB9-NKM00 Warm White
Diused
56.0 72.0 124.0 350 InGaN No
Device Selection Guide (Tj = 25qC) for Moonstone® on MCPCB
Part Number Color
Luminous Flux, ΦV [1,2] (lm)
Test Current
(mA)
Dice
Technology
Electrically
Isolated
Metal Slug Min. Typ. Max.
ASMT-MWK9-NLM00 Cool White 73.0 90.0 124.0 350 InGaN No
ASMT-MYK9-NKM00 Warm White 56.0 75.0 124.0 350 InGaN No
Notes:
1. ΦV is the total luminous ux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is ±10 %.
4
Absolute Maximum Ratings
Parameter ASMT-Mxx9 Units
DC Forward Current [1] 500 mA
Power Dissipation 2100 mW
LED Junction Temperature 125 °C
Operating Metal Slug Temperature Range at 350 mA -40 to +110 °C
Operating Metal Slug Temperature Range at 500 mA -40 to +105°C
Storage Temperature Range -40 to +120 °C
Soldering Temperature Refer to Figure 14
Reverse Voltage [2] Not recommended
Notes:
1. Derate linearly based on Figure 11.
2. Not designed for reverse bias operation.
Optical Characteristics at 350 mA (TJ = 25 °C)
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle,
2T½ [2] (°)
Luminous Eciency
(lm/W)
Min. Max. Typ. Typ.
ASMT-MW09-NLM00 Cool White 4000 10000 110 71
ASMT-MWK9-NLM00 4000 10000 110 71
ASMT-MW09-NMM00 4000 10000 110 79
ASMT-MY09-NKM00 Warm White 2600 4000 110 60
ASMT-MY09-NKM00 2600 4000 110 60
ASMT-MY09-NLM00 2600 4000 110 63
ASMT-MWB9-NLM00 Cool White
Diused
4000 1000 110 69
ASMT-MYB9-NKM00 Warm White
Diused
2600 4000 110 57
Notes:
1. T½ is the o-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (TJ = 25°C)
Dice Type
Forward Voltage, VF (Volts)
Thermal Resistance,
RTj-ms(°C/W) [1]
Thermal Resistance,
RTj-b(°C/W) [2]
Min. Typ. Max. Typ. Typ.
InGaN 3.2 3.6 4.0 10 14
Notes:
1. RTj-ms is the thermal resistance from LED junction to metal slug.
2. RTj-b is the thermal resistance from LED junction to MCPCB.
5
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
350 400 450 500 550 600 650 700 750 800
WAVELENGTH - nm
RELATIVE INTENSITY
0
50
100
150
200
250
300
350
400
450
500
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 50 100 150 200 250 300 350 400 450 500
IF - FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX - lm
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - °
RELATIVE INTENSITY
-0.004
-0.003
-0.002
-0.001
0.000
0.001
0.002
-0.003 -0.002 -0.001 0.000 0.001 0.002
X - COORDINATES
Y - COORDINATES
50mA
500mA
350mA
250mA
150mA
-0.004
-0.003
-0.002
-0.001
0.000
0.001
0.002
-0.002 -0.001 0.000 0.001 0.002 0.003
X - COORDINATES
Y - COORDINATES
50mA
500mA
350mA
250mA
150mA
Cool White
Warm White
Figure 4. Relative intensity vs. wavelength Figure 5. Forward voltage vs. forward current.
Figure 6. Relative luminous ux vs. forward current. Figure 7. Radiation pattern.
Figure 8. Chromaticity coordinate shift vs. forward current (Cool White). Figure 9. Chromaticity coordinate shift vs. forward current (Warm White).
6
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
10.70±0.10
8.40±0.10
3.1±0.10
5.08±0.10
1.00±0.10
17.00±0.20
0
100
200
300
400
500
600
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - °C
MAX. ALLOWABLE DC CURRENT - mA
0
100
200
300
400
500
600
0 20 40 60 80 100 120 140
Tms - METAL SLUG TEMPERATURE - °C
MAX. ALLOWABLE DC CURRENT - mA
RTj-ms = 10°C/W
RTj-a = 30°C/W
RTj-a = 50°C/W
RTj-a = 40°C/W
0
0.2
0.4
0.6
0.8
1
1.2
-40 -20 0 20 40 60 80 100 120
TJ - JUNCTION TEMPERATURE -°C TJ - JUNCTION TEMPERATURE -°C
RELATIVE LIGHT OUTPUT
(NORMALISED TO 25°C)
Cool White
Warm White
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
-40 -20 0 20 40 60 80 100 120
FORWARD VOLTAGE SHIFT - V
(NORMALISED TO 25°C)
Cool White &
Warm White
Figure 10. Relative light output vs. junction temperature. Figure 11. Forward voltage shift vs. junction temperature.
Figure 12. Maximum forward current vs. ambient temperature Figure 13. Maximum forward current vs. metal slug temperature
Figure 14. Recommended soldering prole. Figure 15 Recommended soldering land pattern.
Note:
For detail information on reow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
7
Option Selection Details
ASMT - M x1 x2 9 - N x3 x4 x5 x6
x3 = Minimum ux bin
x4 = Maximum ux bin
x5 = Color Bin Selection
x6 = Packaging Option
Color Bin Selections [x5]
Individual reel or tube will contain parts from one color bin selection only.
Cool White
Selection Bin ID
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
G G only
H H only
L A and G only
M B and H only
N A and C only
P B and D only
Q E and C only
R F and D only
S G and H only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
2 G, H, A and B only
4 C, D, E and F only
Warm White
Selection Bin ID
0 Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
N A and C only
P B and D only
Q E and C only
R F and D only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
4 C, D, E and F only
Flux Bin Limit [x3 x4]
Bin ID
Luminous Flux (lm) @ IF = 350mA
Min Max
K56.0 73.0
L 73.0 95.0
M95.0 124.0
Tolerance: ±10%
8
Color Bin Limit
Cool Color Limits
White (Chromaticity Coordinates)
Bin A X 0.367 0.362 0.329 0.329
Y 0.400 0.372 0.345 0.369
Bin B X 0.362 0.356 0.329 0.329
Y 0.372 0.330 0.302 0.345
Bin C X 0.329 0.329 0.305 0.301
Y 0.369 0.345 0.322 0.342
Bin D X 0.329 0.329 0.311 0.305
Y 0.345 0.302 0.285 0.322
Bin E X 0.303 0.307 0.283 0.274
Y 0.333 0.311 0.284 0.301
Bin F X 0.307 0.311 0.290 0.283
Y 0.311 0.285 0.265 0.284
Bin G X 0.388 0.379 0.362 0.367
Y 0.417 0.383 0.372 0.400
Bin H X 0.379 0.369 0.356 0.362
Y 0.383 0.343 0.330 0.372
Tolerance: ± 0.01
Figure 16. Color bins (Cool White) Figure 17. Color bins (Warm White)
Packaging option [x6]
Selection Option
0 Tube (for Moonstone® only)
Tray (for Moonstone® on MCPCB only)
1 Tape & reel
Warm Color Limits
White (Chromaticity Coordinates)
Bin A X 0.452 0.488 0.470 0.438
Y 0.434 0.447 0.414 0.403
Bin B X 0.438 0.470 0.452 0.424
Y 0.403 0.414 0.384 0.376
Bin C X 0.407 0.418 0.452 0.438
Y 0.393 0.422 0.434 0.403
Bin D X 0.395 0.407 0.438 0.424
Y 0.362 0.393 0.403 0.376
Bin E X 0.381 0.387 0.418 0.407
Y 0.377 0.404 0.422 0.393
Bin F X 0.373 0.381 0.407 0.395
Y 0.349 0.377 0.393 0.362
Tolerance: ± 0.01
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
B
C
ED
A
F
7k
10k
4.0k
G
H
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
B
C
E
D
A
F
3.0k
3.5k
4.0k
2.6k
5.6k
4.5k
Black Body Curve
Black Body Curve
Y - COORDINATE
X - COORDINATE
Y - COORDINATE
Example
ASMT-MW09-NLMZ1
ASMT-MW09-Nxxxx - Cool White, Non-diused
x3 = L - Minimum Flux Bin L
x4 = M - Maximum Flux Bin M
x5 = Z - Color Bin A and B only
x6 = 1 - Tape and Reel Option
9
535.00
1.00
5.45
5.80
4.65
5.50
10.10
37.00
8.30
TOP VIEW
SIDE VIEW
Quantity per tube = 25 pcs
Figure 18. Tube dimensions
Figure 19. Carrier tape dimensions
Dim Value
AO 8.80±0.10
BO 16.45±0.10
KO 3.60±0.1
E 1.75±0.10
F 11.50±0.10
W 24.0±0.10
P 16.0±0.10
Q'ty/Reel 250 units
All dimensions in mm.
Packing Tube - Option 0
Tape and Reel - Option 1
A
A
B
Ao
B
P
SECTION B
SECTION A
Ko
W
F
E
Bo
2.5
10
Figure 20. Carrier tape leader and trailer dimensions
Figure 21. Reel dimensions
END
MINIMUM OF 160 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
START
*Note: Tape & Reel Packaging only applicable as per this datasheet only.
R10.00
60.0º
∅268.00
330.00 ± 1.00
∅99.50 ± 1.00
2.30 2.30
24.0 +1.00
-0.00
∅
13.50 ± 0.50
2.50 ± 0.50
R10.50 ± 0.50
120.0º
∅
11
Packing Tray - Option 0 (for Moonstone® on MCPCB only)
Figure 22. Tray dimensions.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1449EN - September 28, 2010
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly or
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
Moisture Sensitivity
This product is qualied as Moisture Sensitive Level 4 per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reow the LEDs per the original MSL
rating.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 72 hours.
C. Control for unnished reel
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
oor life of 72 hours.
E. Baking is required if
– HIC “10%” indicator is not blue and “5%” indicator is
pink.
– The LEDs are exposed to condition of >30°C/60% RH
at any time.
– The LEDs oor life exceeded 72hrs.
Recommended baking condition: 60±5°C for 20hrs.