Express-HL-2002E - ADLINK Technology

Express-HL

COM Express

Basic Size Type 6 Module with

4th Generation Intel

Core™ and Celeron

Processors

Features

●

4th Generation Intel

Core™ and Celeron

Processors with

Intel

QM87 and Intel

HM86 Express Chipset

●

Up to 16GB Dual Channel DDR3L at 1600MHz

●

Three DDI ports support 3 independent displays

●

Seven PCIe x1, one PCIe x16

●

GbE, four SATA 6 Gb/s, four USB 3.0 and four USB 2.0

●

Supports Smart Embedded Management Agent (SEMA

) functions

●

Extreme Rugged operating temperature: -40°C to +85°C

(build option)

Specications

● Core System

CPU

4th Generation Intel

Core™ Processors (Mobile) - 22nm

i7-4860EQ 1.8 GHz (3.2 GHz Turbo), 47W (4C/GT3)

i7-4700EQ 2.4 GHz (3.4 GHz Turbo), 47W (4C/GT2)

i5-4400E 2.7 GHz (3.3 GHz Turbo), 37W (2C/GT2)

i5-4402E 1.6 GHz (2.7 GHz Turbo), 25W (2C/GT2)

i3-4100E 2.4 GHz (no Turbo) 3MB, 37W (2C/GT2)

i3-4102E 1.6 GHz (no Turbo) 3MB, 25W (2C/GT2)

Celeron

2000E 2.2 GHz (no Turbo) 35W (2C/GT1)

Celeron

2002E 1.5 GHz (no Turbo) 25W (2C/GT1)

Supports: Intel

VT, Intel

TXT, Intel

SSE4.2, Intel

HT Technology, Intel

Architecture, Execute Disable Bit, Intel

Turbo Boost Technology 2.0, Intel

AVX2, Intel

AES-NI, PCLMULQDQ Instruction, Intel

Secure Key and Intel

TSX.

Note: Availability of the features may vary between processor SKUs.

Memory

Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 16GB in dual

SODIMM socket

Embedded BIOS

AMI EFI with CMOS backup in 8MB SPI BIOS with Intel

AMT 9.0 support

L3 Cache

6MB for i7-4700EQ, 3MB for i5-4400E, i5-4402E, i3-4100E and i3-4102E

Expansion Busses

PCI Express x16 (Gen3) or PCI Express (2 x8 or 1 x8 with 2 x4)

6 PCI Express x1 (AB): Lanes 0/1/2/3/4/5

1 PCI Express x1 (CD): Lane 6

LPC bus, SMBus (system) , I

C (user)

SEMA Board Controller

Supports: Voltage/Current monitoring, Power sequence debug support, AT/

ATX mode control, Logistics and Forensic information, Flat Panel Control,

General Purpose I

C, Failsafe BIOS (dual BIOS), Watchdog Timer and Fan

Control

Debug Headers

40-pin multipurpose at cable connector

Use in combination with DB-40 debug module

Providing BIOS POST code LED, BMC access, SPI BIOS ashing, Power

Testpoints, Debug LEDs

60-pin XDP header for ICE debug of CPU/Chipset

● Video

GPU Feature Support

Generation 7.5 graphics core architecture, supporting

3 independent and simultaneous display combinations of DisplayPort /HDMI

/ LVDS monitors

Encode/transcode HD content

Playback of high denition content including Blu-ray Disc

Digital Display Interface

DDI1 supporting DisplayPort / HDMI / DVI

DDI2 supporting DisplayPort / HDMI / DVI

DDI3 supporting DisplayPort / HDMI / DVI

VGA

Analog VGA support with 300 MHz DAC

Analog monitor support up to QXGA (2048 x 1536)

LVDS

Single/dual channel 18/24-bit LVDS from eDP (two lanes)

● Audio

Chipset

Intel

HD Audio integrated in SOC

Audio Codec

Located on carrier Express-BASE6 (ALC886 standard supported)

● Ethernet

Intel

MAC/PHY: I217LM (Enterprise SKU) with AMT 9.0 support

Interface: 10/100/1000 GbE connection

Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Specications

● I/O Interfaces

USB: 4x USB 3.0 (USB 0,1,2,3)

4x USB 2.0 (USB 4,5,6,7)

SATA: Four ports SATA 6Gb/s (SATA0, SATA1, SATA2, SATA3)

Serial: 2 UART ports COM1/2 with console redirection

GPIO: 4 GPO and 4 GPI with interrupt

● Super I/O

Supported on carrier if needed (standard support for W83627DHG-P)

● TPM

Chipset: Atmel AT97SC3204

Type: TPM 1.2

● Power

Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V ±5%

Wide Input: ATX = 8.5~20 V / 5Vsb ±5% or AT = 8.5~20V

Management: ACPI 4.0 compliant, Smart Battery support

Power States: C1-C6, S0, S1, S4, S3, S5 , S5 ECO mode (Wake on USB S3/S4,

WOL S3/S4/S5)

ECO mode: Supports deep S5 mode for power saving

● Mechanical and Environmental

Form Factor: PICMG COM.0: Rev 2.1 Type 6

Dimension: Basic size: 125 mm x 95 mm

Operating Temperature

Standard: 0°C to +60°C

Extreme Rugged™: -40°C to +85°C (build option)

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration

IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

HALT tested

Thermal Stress, Vibration Stress, Thermal Shock and Combined Test

Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

Functional Diagram

4th Generaon

Intel® Core™

i7/i5/i3 Processor

Intel® Celeron®

“Haswell”

Sensor

eDP - LVDS

RTD2136R/N

TPM

ATMEL

AT97SC3204

Serial

NCT5104D

Mobile Intel®

QM87/HM86

Chipset

GbE

i217LM

GPIO

PCA9535

SEMA

SMBus

4x GP0

GP I2C

SPI 0

BIOS

LPC bus

FDI

SODIMM

1333/1600 MHz

1~8 GB DDR3L

PCI Express x16 (Gen3)

2 x8 or 1 x8 + 2 x4

SPI

4x GPI

DMI

Debug

header

XDP

60-pin

VGA

6x PCIe x1 (Gen2)

(port 0~5)

PCIe x1

(port 7)

HD Audio

4x SATA3 (QM87)

2x SATA3 & 2x SATA2 (HM86)

8x USB 1.1/2.0

4x USB 3.0 upgrade (QM87)

2x USB 3.0 upgrade (HM86)

UART1

UART0

SPI 1

BIOS

DDC I2C

SODIMM

1333/1600 MHz

1~8 GB DDR3L

1x PCIe x1 (Gen2)

(port 6)

SPI_CS0

SPI_CS1

SPI_CS#

DDI 1 (port B)

DP / HDMI / DVI / SDVO

DDI 2 (port C)

DP / HDMI / DVI

DDI 3 (port D)

DP / HDMI / DVI

eDP

2 lane

single / dual

18/24-bit LVDS

-40+85°C

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All products and company name listed are trademarks or trade names of their respective companies.

All specifications are subject to change without further notice.

Ordering Information

●

Express-HL-i7-4860EQ

COM Express